CN207651486U - A kind of high definition LED display modular structure - Google Patents
A kind of high definition LED display modular structure Download PDFInfo
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- CN207651486U CN207651486U CN201721853772.5U CN201721853772U CN207651486U CN 207651486 U CN207651486 U CN 207651486U CN 201721853772 U CN201721853772 U CN 201721853772U CN 207651486 U CN207651486 U CN 207651486U
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Abstract
The utility model discloses a kind of high definition LED display modular structures, including：Substrate；LED pixel array in the M rows N row in the first face of the substrate is set；It is covered in the sealant layer in the first face of the LED pixel array and the substrate；The first light-shielding structure between the LED pixel described in adjacent rows is set, and the second light-shielding structure being arranged between the adjacent two row LED pixel.
Description
Technical field
The utility model is related to technical field of LED display more particularly to a kind of high definition LED display modular structure and its systems
Make method.
Background technology
Since 2000, China LED shows application industry stable development, and total size rises year by year, at present at
For the important component in LED industry chain, show that application product is each in social economy using LED display as the LED of representative
Field is widely applied, and LED shows that application industry has become in order to which advantage and characteristic are apparent, develop thriving emerging production
Industry.
With the driving of application market, high density, the fine definition display technology of LED display become the heat studied at present
Point.But the production method of traditional LED display, using the method as shown in 100 structures in Fig. 1, it is necessary first to by LED core
Piece encapsulation is fabricated to LED light 102, then LED light 102 is installed or pasted is welded to the corresponding position of PCB substrate 101 and (generally deposits
In installation frame), the size of the LED light of this method is larger, can not accomplish that high definition is shown, can not such as accomplish that spacing is 0.8mm
Or the display screen of more high definition；This kind of method is due to the making of LED light, the making of substrate package frame, the industry of production simultaneously
Chain is longer, and cost of manufacture is higher.
The production method of another kind display screen uses COB packing forms at present, and the COB of full color LED display is sealed
Dress, as shown in Fig. 2, first, each pixel is installed on package substrate 201, the LED chip of tri- colors of RGB is included in COB encapsulation,
Then by fluid sealant (such as resin) by chip integral sealing.The packaged chip of this scheme can have leakage as shown in Figure 3
Optical issue, as shown in figure 3,3 adjacent pixels 2021,2022,2023 (each pixel generally has 3 RGB chips), each
Corresponding region above pixel is 3041,3042,3043, in actual displayed, as pixel 2021 and pixel 2022 light shape
State, and pixel 2023 is non-illuminating state, there is several leakage problems：The light of pixel 2021 can be drained to by fluid sealant 303
The region 3042 of pixel 2022；The light of pixel 2022 can also drain to the region 3042 of pixel 2021 by fluid sealant 303；Pixel
2022 light can also drain to the region 3043 of pixel 2023 by fluid sealant 303.And leakage problem can directly result in display screen
Show that acutance is not high, to also be difficult to accomplish the display effect that spacing is 0.8mm or more high definition.
Therefore, need a kind of at least part of solution of novel high definition LED display structure above-mentioned existing in the prior art
Light leakage and be difficult to accomplish the problem of spacing is the display effect of 0.8mm or more high definition.
Utility model content
For problems of the prior art, it is aobvious to provide a kind of high definition LED for one embodiment according to the present utility model
Display screen modular structure, including：
Substrate；
LED pixel array in the M rows N row in the first face of the substrate is set；
It is covered in the sealant layer in the first face of the LED pixel array and the substrate；
The first light-shielding structure between the LED pixel described in adjacent rows is set, and
The second light-shielding structure between the adjacent two row LED pixel is set.
In one embodiment of the utility model, the first face of the substrate is provided with for carrying out the patch weldering of LED chips
Pad or pad array.
In one embodiment of the utility model, the second face connection opposite with the first face of the substrate of the substrate
Driving chip.
In one embodiment of the utility model, second face opposite with the first face of the substrate of the substrate has
It is electrically connected the pad of the LED pixel array leads.
In one embodiment of the utility model, the substrate is PCB substrate or glass substrate.
In one embodiment of the utility model, in the LED pixel array of the M rows N row, M >=2, N >=2.
In one embodiment of the utility model, in the LED pixel array of the M rows N row, each LED pixel is at least
Contain three LED chip of red, green, blue.
In one embodiment of the utility model, first light-shielding structure and/or second light-shielding structure are base
This lighttight solidification paint or the glue containing light screening material.
In one embodiment of the utility model, the table of first light-shielding structure and/or second light-shielding structure
Face is capable of reflecting light line.
In one embodiment of the utility model, first light-shielding structure and/or second light-shielding structure embedment
The depth of the sealant layer, more than or equal to the depth of the LED pixel array surface to the sealant layer surface.
In one embodiment of the utility model, a light-shielding structure and/or second light-shielding structure run through institute
Sealant layer is stated, and touches the first face of the substrate.
In one embodiment of the utility model, a light-shielding structure intersects with second light-shielding structure, every
A LED pixel side, which is formed, to be surrounded, and the encirclement is vertical with the first face of the substrate.
In one embodiment of the utility model, section of first light-shielding structure and/or second light-shielding structure
Face shape is the combination of rectangle, V-type or rectangle and V-type.
In one embodiment of the utility model, described surround is that polygon surrounds.
In one embodiment of the utility model, the encirclement is round or oval encirclement.
Another embodiment according to the present utility model provides a kind of manufacturing method of high definition LED display modular structure,
Including：
Substrate with LED chip encapsulation welding tray array is provided；
LED chip is installed on the LED chip encapsulation welding tray array position of substrate and forms pixel array；
Sealing is carried out to the one side containing LED chip of substrate and forms sealant layer；
Slot is formed in sealant layer between adjacent rows LED pixel point between adjacent two row LED pixel point；
In the slot and the sealant layer surface forms light screening material；
Remove the light screening material on fluid sealant level surface.
In another embodiment of the utility model, the line number of the pad array and/or the pixel array is big
It is arranged in being more than or equal to 2 equal to 2 row, column numbers.
In another embodiment of the utility model, between adjacent rows LED pixel point and adjacent two row LED pixel
The method that slot is formed in sealant layer between point is paddle-tumble method or mold indent method.
In another embodiment of the utility model, in the slot and the sealant layer surface forms light screening material
Method be coating, spray painting or pressure scrape technique.
In another embodiment of the utility model, the pressure is scraped technique and is carried out under vacuum.
A kind of high definition LED display/display screen module manufacturing method provided by the utility model passes through in PCB substrate
COB encapsulation, pressure welding encapsulation or patch encapsulate to form full color LED pixel (RGB chips), next, on LED pixel surface
Sealing protection is carried out, then cutting forms groove in the sealing between LED pixel, finally fills light screening material simultaneously in a groove
Polishing polishes light screening material extra above LED pixel, forms high definition LED display/display screen module structure.High definition LED
Display screen/display screen module structure has the light-blocking member being centered around around each pixel, to reduce the leakage between LED pixel
Optical issue, the LED display based on the structure fabrication can reach the display effect that spacing is 0.8mm or more high definition, such as can be with
Accomplish within 500 microns of spacing until 100 microns.
Description of the drawings
In order to further elucidate the utility model each embodiment the above and other advantages and features, by refer to the attached drawing come
The more specific description of each embodiment of the utility model is presented.It is appreciated that these attached drawings only describe the allusion quotation of the utility model
Type embodiment, therefore be not to be regarded as being restriction on its scope.In the accompanying drawings, in order to cheer and bright, identical or corresponding portion
Part will be indicated with same or similar label.
Fig. 1 shows that a kind of prior art makes the front view of LED display modular structure 100 using LED light.
Fig. 2 shows a kind of prior arts to utilize the schematic diagram of COB chip attachment making LED display modular structure 200.
Fig. 3 shows that a kind of prior art makes the light leakage principle of LED display modular structure 200 using COB chip attachment
Schematic diagram.
Fig. 4 is showing the high definition LED display modular structure 400 of one embodiment formation according to the present utility model just
View.
Fig. 5 A show the partial cutaway schematic for the high definition LED display structure 400 cut along the positions diagram AA '；
Fig. 5 B show the partial cutaway schematic for the high definition LED display structure 400 cut along the positions diagram BB '.
Fig. 6 shows the partial cutaway for the high definition LED display structure 600 that one embodiment according to the present utility model is formed
Face schematic diagram.
Fig. 7 shows the high definition LED display single pixel and its shading that other embodiment according to the present utility model is formed
The front view of structure.
Fig. 8 A to Fig. 8 F show that one embodiment according to the present utility model forms high definition LED display structure 400 and makes
Process diagrammatic cross-section.
Fig. 9 shows that one embodiment according to the present utility model forms 400 manufacturing process flow of high definition LED display structure
Figure.
Specific implementation mode
In the following description, the utility model is described with reference to each embodiment.However, those skilled in the art
It will be recognized that can in the case of neither one or multiple specific details or with it is other replacement and/or addition method, material or
Component implements each embodiment together.In other situations, be not shown or well known structure, material or operation are not described in detail in order to avoid
Keep the aspects of each embodiment of the utility model obscure.Similarly, for purposes of explanation, specific quantity, material are elaborated
And configuration, in order to provide the comprehensive understanding to the embodiments of the present invention.However, the utility model can be in no specific detail
In the case of implement.Further, it should be understood that each embodiment shown in the accompanying drawings is illustrative expression and is not drawn necessarily to scale.
In the present specification, the reference of " one embodiment " or " embodiment " is meaned to combine embodiment description
A particular feature, structure, or characteristic is included at least one embodiment of the utility model.Occur in everywhere in this specification
The phrase " in one embodiment " be not necessarily all referring to the same embodiment.
It should be noted that the embodiments of the present invention are described processing step with particular order, however this
It is to distinguish each step for convenience, and be not the sequencing for limiting each step, in the different embodiments of the utility model,
The sequencing of each step can be adjusted according to the adjusting of technique.
A kind of high definition LED display/display screen module manufacturing method provided by the utility model, this method pass through in PCB
Either patch encapsulation or flip chip bonding encapsulate to form full color LED pixel (RGB chips) for COB encapsulation, pressure welding encapsulation on substrate, connect
Get off, carries out sealing protection on LED pixel surface, then cutting forms groove in the sealing between LED pixel, finally recessed
Light screening material is filled in slot and is polished and polishes light screening material extra above LED pixel, forms high definition LED display/display screen
Modular structure.High definition LED display/display screen module the structure has the light-blocking member being centered around around each pixel, to subtract
Leakage problem between small LED pixel, it is 0.8mm or more high definition that the LED display screens based on the structure fabrication, which can reach spacing,
Display effect, such as can accomplish within 500 microns of spacing until 100 microns.
4 and Fig. 5 is aobvious the high definition LED that one embodiment according to the present utility model is formed is discussed in detail below in conjunction with the accompanying drawings
Display screen modular structure.Fig. 4 shows the high definition LED display modular structure 400 that one embodiment according to the present utility model is formed
Front view；Fig. 5 shows the partial cutaway for the high definition LED display structure 400 that one embodiment according to the present utility model is formed
Face schematic diagram.
As shown in figure 4, the high definition LED display modular structure 400 further comprises the LED pictures of substrate 401, M rows N row
Element 402, is located at every two rows pixel at the fluid sealant 504 (being not shown in Fig. 4) for being covered in LED pixel 402 and homonymy substrate surface
Between the first light-shielding structure 403, and the second light-shielding structure 404 between every two row pixel.
Fig. 5 A show the partial cutaway schematic for the high definition LED display structure 400 cut along the positions diagram AA '；
Fig. 5 B show the partial cutaway schematic for the high definition LED display structure 400 cut along the positions diagram BB '.
Substrate 401 is usually PCB package substrates, while may be the substrate of other similar materials such as glass.Substrate 401
(501) the pad or pad array 503 (being not shown in Fig. 4) being provided on one side for carrying out LED chip patch weldering, inside
Optional includes conducting wire, and the back side can be directly connected to driving chip, can also be electrically connected the lead shape of array module
At backside pads (Fig. 4, Fig. 5 are all not shown).
The LED pixel 402 (502) of M rows N row is connected electrically in pad or the weldering of the LED chip patch weldering of substrate 401 (501)
On point 503.It can be realized by techniques such as flip chip bonding, lead (including but not limited to gold thread, copper wire or other conducting wires) bondings.Its
In each LED pixel 402 (502) include three LED chips encapsulation compositions of RGB (RGB), in addition, each LED pixel 402
(502) it can also be compensated (as increased a green light core except including tri- chips of RGB, then including a fourth chip
Piece or red light chips) to increase color saturation or other performances.In the array of M rows N row, M >=2, the i.e. line number of array are not
Less than 2 rows；N >=2, the i.e. columns of array are also not less than 2 row.
The fluid sealant 504 for being covered in LED pixel 402 (502) and homonymy substrate surface can be resin or other are similar
Pressure injection technique, Self-leveling technique, drop adhesive process etc. may be used in light fluid sealant, sealing adhesive process.After 504 sealing of fluid sealant, need
Uniform, the smooth covering LED pixel 402 (502) of energy and homonymy substrate surface can play LED pixel 402 (502) fixed, guarantor
The effects that protecting, insulating, is even smooth.
First light-shielding structure 403 is embedded between every two rows LED pixel among fluid sealant 504.Its depth can basis
It needs to be determined that the most deep inner surface (table contacted with substrate 401 that can be extended to fluid sealant 504 from the outer surface of fluid sealant 504
Face), the material of the first light-shielding structure can be shading paint, contain the glue etc. of light screening material (such as titanium dioxide), the light screening material
The structure of formation can achieve the effect that opaque or substantially impervious light, and preferential also has reflecting effect.
Second light-shielding structure 404 is also embedded between every two row LED pixel among fluid sealant 504.Its depth also may be used
It determines as needed, the most deep inner surface that fluid sealant 504 can also be extended to from the outer surface of fluid sealant 504 is (with substrate 401
The surface of contact), the material of the second light-shielding structure is shading paint, contains the glue etc. of light screening material (such as titanium dioxide), the shading
The structure that material is formed can achieve the effect that opaque or substantially impervious light, and preferential also has reflecting effect.Second shading knot
Structure 404 and the first light-shielding structure 403, which are together formed each LED pixel 402, to be surrounded, which can be vertical with base plan
Certain angle (non-90 degree) can also be formed with substrate.
Fig. 6 show be the high definition LED display structure 600 that one embodiment according to the present utility model is formed part
Diagrammatic cross-section.The section of its first light-shielding structure unlike the high definition LED display structure 400 formed from previous embodiment
V-type is preferably shaped to or, the cross sectional shape of its second light-shielding structure can also be preferably V-type.Therefore, those skilled in the art
It should be understood that the cross sectional shape of the first light-shielding structure and/or the second light-shielding structure can be rectangle, V-type, reverse V-shaped, rectangle and V
The combination of type and other similar cross section structures are all in the scope of protection of the utility model.
Fig. 7 show the single led pixel of high definition LED display that other embodiment according to the present utility model is formed and its
The front view of light-shielding structure.Fig. 7 (a) shows that light-shielding structure forms straight-flanked ring around encirclement to LED pixel；What Fig. 7 (b) was shown
It is that light-shielding structure forms triangular loop around encirclement to LED pixel；Fig. 7 (c) shows that light-shielding structure forms six sides to LED pixel
Shape is around encirclement.In addition light-shielding structure can also form round, ellipse and other loop-likes around encirclement to LED pixel.
The mistake to form high definition LED display modular structure 400 is described in detail with reference to Fig. 8 A to Fig. 8 F and Fig. 9
Journey.Fig. 8 A to Fig. 8 F show that one embodiment according to the present utility model forms 400 manufacturing process of high definition LED display structure
Diagrammatic cross-section.Fig. 9 shows that one embodiment according to the present utility model forms 400 manufacturing process of high definition LED display structure
Flow chart.
First, in step 901, as shown in Figure 8 A, the substrate 801 with LED chip encapsulation welding tray 802 is provided.Substrate
801 be usually PCB package substrates, while may be the substrate of other similar materials such as glass.Substrate 801 is provided on one side
Pad or pad array 802 for carrying out LED chip patch weldering, internal includes optionally conducting wire, and the back side can
To be directly connected to driving chip, the lead that can also be electrically connected array module forms backside pads (not shown).
Next, in step 902, as shown in Figure 8 B, electricity is welded on the LED chip encapsulation welding tray position 802 of substrate 801
It connects LED chip and forms pixel 803.LED pixel point 803 is generally the pel array of M rows N row.Can by flip chip bonding,
The techniques such as lead (including but not limited to gold thread, copper wire or other conducting wires) bonding are realized.Each LED pixel point may include red green
Blue (RGB) three LED chip encapsulation.In addition, in addition to tri- chips of RGB, each LED pixel point can also include the 4th core
Piece, for color compensation (as increased a green light chip or red light chips), to increase color saturation or other performances.
In the array of M rows N row, M >=2, the i.e. line number of array are not less than 2 rows；N >=2, the i.e. columns of array are also not less than 2 row.
Then, in step 903, as shown in Figure 8 C, the unilateral carry out sealing containing LED core to substrate 801, in LED core
Piece and homonymy substrate surface form fluid sealant 804.Fluid sealant 804 can be resin or other similar light transmission fluid sealants, sealing work
Pressure injection technique, Self-leveling technique, drop adhesive process etc. may be used in skill.After 804 sealing of fluid sealant, it would be desirable to be able to uniform, smooth covering
LED pixel point 803 and homonymy substrate surface, the effects that fixed, protection can be played to LED pixel point 803, is insulated.
Next, in step 904, as in fig. 8d, the white space between LED pixel point 803 opens fluid sealant
Slot forms slot 805.Specific fluting includes and the second slot being opened between row pixel to opening the first slot along row LED pixel point.
The depth of slot 805 can determine as needed, the most deep inner surface that fluid sealant 804 can be extended to from the outer surface of fluid sealant 804,
The surface contacted with substrate 801.First slot and the second slot, which are together formed each LED pixel 803, to be surrounded, the encirclement and substrate
801 planes are vertical.
Then, in step 905, as illustrated in fig. 8e, the slot 805 and 804 surface of fluid sealant opened step 904 hide
Luminescent material 806 is filled.Light screening material can be shading paint, contain the glue etc. of light screening material (such as titanium dioxide).Specific filling
Method can be coating, spray painting, press and scrape.In a specific embodiment of the utility model, (one can be less than in vacuum
Atmospheric pressure) be filled under environment after carry out back pressure again after dry.The structure that the light screening material is formed can reach opaque or base
This lighttight effect, preferential also has reflecting effect.
Finally, in step 906, as shown in Figure 8 F, the more of 804 outer surface of fluid sealant are removed by the techniques such as grinding, polishing
Remaining light screening material only retains light screening material in slot 805, forms required light-shielding structure 807.The top surface of the light-shielding structure 807
It can be substantially flush with the top surface of fluid sealant 804.
Based on this kind of high definition LED display/display screen module manufacturing method provided by the utility model, by PCB bases
COB encapsulation, pressure welding encapsulation or patch encapsulate to form full color LED pixel (RGB chips) on plate, next, in LED pixel
Surface carries out sealing protection, and then cutting forms groove in the sealing between LED pixel, finally fills lightproof material in a groove
Expect and polish to polish light screening material extra above LED pixel, forms high definition LED display/display screen module structure.The height
Clear LED display/display screen module structure has the light-blocking member being centered around around each pixel, to reduce between LED pixel
Leakage problem, the LED display based on the structure fabrication can reach the display effect that spacing is 0.8mm or more high definition, such as
It can accomplish within 500 microns of spacing until 100 microns.
Although described above is each embodiments of the utility model, however, it is to be understood that they are intended only as example to be in
Existing, and without limitation.For those skilled in the relevant art it is readily apparent that various combinations, change can be made to it
Type and the spirit and scope changed without departing from the utility model.Therefore, the width and model of the utility model disclosed herein
Enclosing should not be limited by above-mentioned disclosed exemplary embodiment, and should be according only to the appended claims and its equivalent replacement
To define.
Claims (14)
1. a kind of high definition LED display modular structure, including：
Substrate；
LED pixel array in the M rows N row in the first face of the substrate is set；
It is covered in the sealant layer in the first face of the LED pixel array and the substrate；
The first light-shielding structure between the LED pixel described in adjacent rows is set, and
The second light-shielding structure between the adjacent two row LED pixel is set.
2. high definition LED display modular structure as described in claim 1, which is characterized in that the first face of the substrate is arranged
It is useful for carrying out the pad or pad array of LED chip patch weldering.
3. high definition LED display modular structure as described in claim 1, which is characterized in that the substrate with the substrate
The second opposite face of first face connects driving chip.
4. high definition LED display modular structure as described in claim 1, which is characterized in that the substrate with the substrate
The second opposite face of first face has the pad for being electrically connected the LED pixel array leads.
5. high definition LED display modular structure as described in claim 1, which is characterized in that the substrate is PCB substrate or glass
Glass substrate.
6. high definition LED display modular structure as described in claim 1, which is characterized in that the LED pixel battle array of the M rows N row
In row, M >=2, N >=2.
7. high definition LED display modular structure as described in claim 1, which is characterized in that the LED pixel battle array of the M rows N row
In row, each LED pixel at least contains three LED chip of red, green, blue.
8. high definition LED display modular structure as described in claim 1, which is characterized in that first light-shielding structure and/or
The solidification paint or the glue containing light screening material that second light-shielding structure is substantially impervious light.
9. high definition LED display modular structure as described in claim 1, which is characterized in that first light-shielding structure and/or
The surface of second light-shielding structure being capable of reflection light.
10. high definition LED display modular structure as described in claim 1, which is characterized in that first light-shielding structure and/
Or second light-shielding structure is embedded to the depth of the sealant layer, is more than or equal to the LED pixel array surface to described close
The depth of sealing layer surface.
11. high definition LED display modular structure as described in claim 1, which is characterized in that a light-shielding structure and/or
Second light-shielding structure runs through the sealant layer, and touches the first face of the substrate.
12. high definition LED display modular structure as described in claim 1, which is characterized in that a light-shielding structure with it is described
Second light-shielding structure intersects, and is formed and is surrounded in each LED pixel side, and the encirclement is vertical with the first face of the substrate.
13. high definition LED display modular structure as described in claim 1, which is characterized in that first light-shielding structure and/
Or the combination that the cross sectional shape of second light-shielding structure is rectangle, V-type or rectangle and V-type.
14. high definition LED display modular structure as claimed in claim 12, which is characterized in that described surround is polygon packet
It encloses, round or ellipse is surrounded.
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| CN201721853772.5U CN207651486U (en) | 2017-12-26 | 2017-12-26 | A kind of high definition LED display modular structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107968101A (en) * | 2017-12-26 | 2018-04-27 | 上海得倍电子技术有限公司 | A kind of high definition LED display modular structure and its manufacture method |
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
| CN111463332A (en) * | 2019-01-18 | 2020-07-28 | 群创光电股份有限公司 | Electronic device with light emitting diode package |
| CN113643617A (en) * | 2021-08-13 | 2021-11-12 | 重庆御光新材料股份有限公司 | Transparent optical fiber display screen |
-
2017
- 2017-12-26 CN CN201721853772.5U patent/CN207651486U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107968101A (en) * | 2017-12-26 | 2018-04-27 | 上海得倍电子技术有限公司 | A kind of high definition LED display modular structure and its manufacture method |
| CN109243313A (en) * | 2018-10-13 | 2019-01-18 | 长春希达电子技术有限公司 | A kind of small spacing LED display panel of high contrast COB encapsulation |
| CN111463332A (en) * | 2019-01-18 | 2020-07-28 | 群创光电股份有限公司 | Electronic device with light emitting diode package |
| CN111463332B (en) * | 2019-01-18 | 2021-07-27 | 群创光电股份有限公司 | Electronic device with light emitting diode package |
| CN113643617A (en) * | 2021-08-13 | 2021-11-12 | 重庆御光新材料股份有限公司 | Transparent optical fiber display screen |
| CN113643617B (en) * | 2021-08-13 | 2023-02-28 | 重庆御光新材料股份有限公司 | Transparent optical fiber display screen |
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