CN207602553U - Cooling fin, chip and circuit board - Google Patents
Cooling fin, chip and circuit board Download PDFInfo
- Publication number
- CN207602553U CN207602553U CN201721298947.0U CN201721298947U CN207602553U CN 207602553 U CN207602553 U CN 207602553U CN 201721298947 U CN201721298947 U CN 201721298947U CN 207602553 U CN207602553 U CN 207602553U
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- CN
- China
- Prior art keywords
- chip
- section
- heat sink
- circuit board
- cooling fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 title abstract 8
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 12
- 238000000034 method Methods 0.000 description 7
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of cooling fin, chip and circuit board.Wherein, cooling fin includes：Egative film and multiple risers；Wherein, the egative film includes sequentially connected first segment, second segment and third section, and the first segment and the third section tilt upward setting relative to the second segment；Multiple risers are connected with the egative film.Cooling fin in the utility model can radiate to one single chip, during use, can respectively be sticked one piece of cooling fin on every piece of chip of circuit board, the utility model can individually radiate to every piece of chip on pcb board, every piece of chip is made can be fully bonded with cooling fin, further improves heat dissipation effect；Further, since every cooling fin in the utility model only fits with chip piece, so solving the problems, such as that a monoblock cooling fin to the extruding of segment chip and then damages chip caused by order to fit with all chips in the prior art.
Description
Technical Field
The utility model relates to a chip heat dissipation technical field particularly, relates to a fin, chip and circuit board.
Background
With the continuous development of electronic technology, electronic devices are applied more and more widely. The electronic device can emit heat in the operation process, and the normal operation of the electronic device can be influenced if the temperature is not reduced in time. The conventional heat dissipation method is to integrally mount a heat sink on the entire PCB, so that the heat sink contacts with all chips on the PCB to dissipate heat and cool all chips. It can be seen that the heat dissipation method may cause poor contact between the heat sink and a part of the chip, which may result in abnormal heat dissipation of the part of the chip and affect normal operation of the chip; in addition, if a whole heat sink is contacted with all the chips due to the different heights of the chips, a part of the higher chip may be pressed, and the part of the chip may be damaged due to excessive pressure.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a fin, chip and circuit board aims at solving the unsatisfactory and easy problem of extruding the chip of current fin radiating effect.
In one aspect, the present invention provides a heat sink for a chip, the heat sink comprising: a bottom sheet and a plurality of riser sheets; the bottom plate comprises a first section, a second section and a third section which are sequentially connected, and the first section and the third section are obliquely and upwards arranged relative to the second section; the vertical pieces are connected with the bottom piece.
Further, in the heat dissipating fin, a plurality of the vertical fins are arranged in parallel; and/or a plurality of vertical sheets are arranged at equal intervals.
Furthermore, in the radiating fins, a hand grip is arranged at the top end of one of the vertical sheets.
Furthermore, in the above heat sink, a grip is disposed on a top end of one of the vertical pieces connected to the second section.
Further, in the above heat sink, the thickness of the second section is greater than the thickness of the first and third sections.
Further, in the above heat dissipating fin, the base sheet and/or the riser sheet includes: the metal body and the cladding layer of package locating outside the metal body.
Further, in the heat sink, the metal body is made of aluminum, iron, or copper, and the plating layer outside the metal body is made of nickel.
It can be seen that the radiating fin in the utility model can radiate a single chip, when in use, each chip of the circuit board can be respectively pasted with one radiating fin in the embodiment, compared with the mode that a whole radiating fin is pasted on a whole PCB in the prior art, the utility model can radiate each chip on the PCB independently, so that each chip can be fully pasted with the radiating fin, and the radiating effect is further improved; furthermore, because the utility model provides an every fin only laminates with a chip mutually, so solved among the prior art a monoblock fin and in order to laminate the extrusion to partial chip that causes and then damage the problem of chip mutually with all chips.
On the other hand, the utility model also provides a chip, which comprises a chip body and any one of the radiating fins; wherein, the heat sink is connected with the chip body.
Further, in the chip, a metal dielectric layer is laid on the wafer silicon of the chip body, and the second section of the bottom plate is connected with the metal dielectric layer.
Furthermore, in the chip, a nickel layer is further laid on the metal dielectric layer, and the second section of the bottom sheet is connected with the nickel layer.
Further, in the chip, the metal dielectric layer is a sealing cover for packaging wafer silicon.
Further, in the chip, the second section of the bottom plate is connected with the plastic cover of the chip body.
Since the heat sink has the above-described effects, the chip having the heat sink also has corresponding technical effects.
In another aspect, the present invention also provides a circuit board, which includes a PCB board, wherein the first surface of the PCB board is provided with any one of the above chips.
Further, the circuit board further includes any one of the heat sinks described above; the heat radiating fins are connected to a second surface, opposite to the first surface, of the PCB, and the heat radiating fins correspond to the chips in position one to one.
Further, in the above circuit board, the second section of the base sheet is connected to the PCB.
Further, in the above circuit board, a heat conducting channel is disposed on the PCB for conducting heat on a copper layer of the PCB or a pin of the chip to the heat sink.
In the circuit board provided by the utility model, a radiating fin is pasted on each chip, compared with the mode that a whole radiating fin is pasted on a whole PCB in the prior art, the embodiment can independently radiate each chip on the PCB, so that each chip can be fully attached to the radiating fin, and the radiating effect is further improved; in addition, each heat dissipation plate in the embodiment is only attached to one chip, so that the problem that in the prior art, a whole heat dissipation plate is extruded to part of the chips to be attached to all the chips, and then the chips are damaged is solved.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a schematic structural diagram of a heat sink according to an embodiment of the present invention;
fig. 2 is a side view of a heat sink according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
fig. 4 is a side view of a circuit board according to an embodiment of the present invention;
fig. 5 is a front view of a circuit board provided by an embodiment of the present invention;
fig. 6 is a bottom view of the circuit board according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
The embodiment of the heat radiating fin comprises:
referring to fig. 1 and 2, a preferred configuration of the heat sink is shown. The heat sink is used for dissipating heat of the single chip. As shown, the heat sink includes: a bottom sheet 1 and a plurality of risers 2.
The bottom sheet 1 includes a first section 11, a second section 12, and a third section 13 connected in sequence, the first section 11 and the third section 13 are disposed obliquely upward (relative to the state shown in fig. 1) relative to the second section 12, and the specific angle of the inclination can be determined according to the actual situation, which is not limited in this embodiment. The bottom sheet 121 of the second section 12 is intended to be attached to the chip.
The vertical pieces 2 may be two or more, and a plurality of vertical pieces 2 are connected to the top surface (the upper surface shown in fig. 1 and 2) of the base sheet 1. Specifically, the plurality of vertical strips 2 may be all connected to the first section 11, also may be all connected to the second section 12, and also may be all connected to the third section 13, and of course, also a plurality of vertical strips may be respectively connected to the first section 11, the second section 12, and the third section 13, and the specific setting mode of the vertical strips 2 may be determined according to the actual situation, and this embodiment does not limit the same. The plurality of vertical sheets 2 can be arranged in parallel or at equal intervals. Preferably, the vertical pieces 2 are seven pieces and are arranged in parallel at equal intervals.
When the heat dissipation device is installed, the bottom surface 121 of the second section 12 on the bottom plate 1 is attached to a chip, and heat generated in the working process of the chip is transferred to other parts of the bottom plate 1 and the vertical plate 2 through the second section 12, so that the heat dissipation of the chip is performed.
It can be seen that the heat sink in this embodiment can dissipate heat of a single chip, and when in use, one heat sink in this embodiment can be respectively attached to each chip of the circuit board, and compared with the way of attaching a whole heat sink to a whole PCB in the prior art, this embodiment can dissipate heat of each chip on the PCB independently, and each chip can be fully attached to the heat sink, thereby further improving the heat dissipation effect; in addition, each heat dissipation plate in the embodiment is only attached to one chip, so that the problem that in the prior art, a whole heat dissipation plate is extruded to part of the chips to be attached to all the chips, and then the chips are damaged is solved.
In the above embodiment, in order to facilitate the lifting of the heat sink by a machine or a human, a hand 21 may be provided at the top end (the upper end shown in fig. 1 and 2) of one of the risers 2. In specific implementation, the hand 21 may be a sheet or ring connected to the top end of the vertical piece 2. Preferably, a grip 21 is provided at the top end of one of the risers 2 connected to the second section 12.
In the above embodiments, since the entire heat sink is attached to the chip through the second section 12, and the second section 12 corresponds to the mounting base of the entire heat sink, the thickness of the second section 12 is preferably greater than the thickness of the first section 11 and the third section 13, so as to ensure the stability of the entire structure.
In the above embodiments, the base sheet 1 may include a metal body and a plating layer disposed outside the metal body. Specifically, the metal body may be a metal material with good thermal conductivity, such as aluminum, iron, or copper, and the outer layer of the body is plated with a plating layer, which may be nickel or the like. The structure not only has better heat-conducting property, but also can improve the corrosion resistance, and is more beautiful.
In specific implementation, the riser 2 may also include a metal body and a plating layer wrapped outside the metal body, and the specific implementation process refers to the specific implementation process of the base plate 1, which is not described herein again in this embodiment.
In conclusion, this embodiment can dispel the heat alone to every chip on the PCB board, makes every chip all can fully laminate with the fin, has further improved the radiating effect.
Chip embodiment:
the present embodiment proposes a chip including a chip body and any one of the above-described heat sinks. Wherein, the heat sink is connected with the chip body. The specific structure of the heat sink can be found in the above description, and the detailed description of the embodiment is omitted here.
In an embodiment of the present invention, the chip has no plastic cap, and at this time, a metal medium layer can be laid on the wafer silicon of the chip body, and the second section of the bottom sheet is connected to the metal medium layer. In specific implementation, the metal dielectric layer may be one layer, or may be two or more layers, and the specific number of layers of the metal dielectric layer is not limited in this embodiment. The metal material of the metal dielectric layers may be conventional connecting metal, such as tin, etc., and the metal dielectric layers may be connected by soldering, gluing, etc. well known to those skilled in the art. In addition, the metal dielectric layer can also be manufactured into a sealing cover, and the chip body is packaged through the sealing cover. Preferably, the metal dielectric layer is three layers.
Furthermore, a nickel layer can be laid on the metal dielectric layer, and the second section 12 of the bottom sheet is connected with the nickel layer. In particular embodiments, the second section 12 of the backsheet may be soldered to the nickel layer via tin.
In another embodiment of the present invention, the chip is packaged by a plastic cap, and the heat sink is connected to the plastic cap of the chip. In specific implementation, the second section of the bottom sheet is welded with the plastic cover of the chip through tin and the like.
Since the heat sink has the above-described effects, the chip having the heat sink also has the same technical effects.
Circuit board embodiment:
referring to fig. 3 to 6, the present embodiment proposes a circuit board including the PCB board 3 and any one of the chips described above. The chips are connected to the first surface (the upper surface shown in fig. 3 and 4) of the PCB, and each chip is correspondingly provided with a heat sink 4. The specific implementation process of the chip may refer to the above description, and this embodiment is not described herein again.
It can be seen that, in the circuit board provided in the embodiment, each chip is provided with one heat dissipation fin in an attached manner, and compared with the manner that a whole heat dissipation fin is attached to a whole PCB in the prior art, each chip on the PCB can be independently cooled in the embodiment, so that each chip can be fully attached to the heat dissipation fin, and the heat dissipation effect is further improved; in addition, each heat dissipation plate in the embodiment is only attached to one chip, so that the problem that in the prior art, a whole heat dissipation plate is extruded to part of the chips to be attached to all the chips, and then the chips are damaged is solved.
Further, in the above embodiment, the heat sink 4 may be connected to a second surface (a lower surface shown in fig. 3 and 4) of the PCB 3 opposite to the first surface, and the heat sink 4 corresponds to the chip position on the first surface of the PCB one to one.
In specific implementation, the second section of the bottom sheet of the heat sink 4 may be connected to the second surface of the PCB 3 through tin, so as to further conduct heat on the copper layer of the PCB 3 or the pins of the chip to the heat sink through the heat conducting channel disposed on the PCB 3. In addition, a heat conducting channel may be provided on the PCB board 3 to conduct heat on the copper layer of the PCB board 3 or the pins of the chip to the heat sink 4.
It can be seen that, in this embodiment, the first surface and the second surface of the PCB board are both connected with heat dissipation fins, which can further improve the heat dissipation effect.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (16)
1. A heat sink for a chip, comprising: a bottom sheet (1) and a plurality of vertical sheets (2); wherein,
the bottom plate (1) comprises a first section (11), a second section (12) and a third section (13) which are sequentially connected, and the first section (11) and the third section (13) are obliquely and upwards arranged relative to the second section (12); the vertical sheets (2) are connected with the bottom sheet (1).
2. The heat sink as recited in claim 1,
the vertical sheets (2) are arranged in parallel; and/or
The vertical sheets (2) are arranged at equal intervals.
3. A fin as claimed in claim 1, wherein the top end of one of said risers (2) is provided with a grip (21).
4. A fin as claimed in claim 3, wherein the top end of one of said risers (2) attached to said second section (12) is provided with a grip (21).
5. A fin as claimed in claim 1, wherein the thickness of said second section (12) is greater than the thickness of said first (11) and third (13) sections.
6. A fin as claimed in any one of claims 1 to 5, characterized in that said base sheet (1) and/or said riser (2) comprise(s): the metal body and the cladding layer of package locating outside the metal body.
7. A heat sink as claimed in claim 6, wherein the metal body is aluminum, iron or copper and the coating on the outside of the metal body is nickel.
8. A chip comprising a chip body, characterized by further comprising a heat sink as claimed in any one of claims 1 to 6; wherein, the heat sink is connected with the chip body.
9. The chip according to claim 8, characterized in that a metal dielectric layer is laid on the wafer silicon of the chip body, and the second section (12) of the bottom sheet is connected with the metal dielectric layer.
10. The chip of claim 9, wherein the metal dielectric layer is further provided with a nickel layer, and the second segment (12) of the base sheet is connected with the nickel layer.
11. The chip of claim 9 or claim 10, wherein the metal dielectric layer is a cap for packaging wafer silicon.
12. A chip according to claim 8, characterized in that the second section (12) of the bottom sheet is connected to the plastic cover of the chip body.
13. A circuit board comprising a PCB board (3), characterized in that a first side of the PCB board (3) is provided with a chip according to any of claims 8-12.
14. The circuit board according to claim 13, further comprising a heat sink (4) according to any one of claims 1 to 7; wherein,
the radiating fins (4) are connected to a second surface, opposite to the first surface, of the PCB (3), and the radiating fins (4) correspond to the positions of the chips one by one.
15. A circuit board according to claim 14, characterized in that the second section (12) of the bottom sheet is connected to the PCB board (3).
16. Circuit board according to any of claims 13 to 15, provided with heat conducting channels on the PCB board (3) for conducting heat on the copper layers of the PCB board or the pins of the chip to the heat sink (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721298947.0U CN207602553U (en) | 2017-10-10 | 2017-10-10 | Cooling fin, chip and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721298947.0U CN207602553U (en) | 2017-10-10 | 2017-10-10 | Cooling fin, chip and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207602553U true CN207602553U (en) | 2018-07-10 |
Family
ID=62756641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721298947.0U Active CN207602553U (en) | 2017-10-10 | 2017-10-10 | Cooling fin, chip and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207602553U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113097162A (en) * | 2017-10-10 | 2021-07-09 | 北京比特大陆科技有限公司 | Heat dissipation sheet, chip and circuit board |
-
2017
- 2017-10-10 CN CN201721298947.0U patent/CN207602553U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113097162A (en) * | 2017-10-10 | 2021-07-09 | 北京比特大陆科技有限公司 | Heat dissipation sheet, chip and circuit board |
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