CN207560658U - A kind of thimble cap of chip mounter - Google Patents
A kind of thimble cap of chip mounter Download PDFInfo
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- CN207560658U CN207560658U CN201721527388.6U CN201721527388U CN207560658U CN 207560658 U CN207560658 U CN 207560658U CN 201721527388 U CN201721527388 U CN 201721527388U CN 207560658 U CN207560658 U CN 207560658U
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- thimble
- thimble cap
- chip mounter
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Abstract
The utility model is related to chip mounter technical fields, and in particular to a kind of thimble cap of chip mounter, including：Thimble cap ontology (1), with for accommodating the accommodating space for the thimble seat (3) for being equipped with thimble (4), thimble seat (3) pumps in an axial direction under the action of driving force so that thimble (4) jack-up is placed on the chip on thimble cap ontology (1)；Fixed structure (2), it is molded on the side wall of thimble cap ontology (1), including at least one first fixed part (21) fixed with the different level position of the cnetre cradle on chip mounter and at least one second fixed part (22) respectively, the first fixed part (21) and the second fixed part (22) are located at the different height position of side wall of thimble cap ontology (1) respectively.The utility model provides a kind of thimble cap and thimble seat fixation, and thimble can efficiently separate chip and film, the thimble cap of the high chip mounter of chip separative efficiency.
Description
Technical field
The utility model is related to chip mounter technical fields, and in particular to a kind of thimble cap of chip mounter.
Background technology
It is more and more common with the application of smart card, not exclusively to communication, transportation industry, be deep at present enterprise,
The every field such as bank, school and medical treatment, therefore, to the demand of smart card also in up-trend year by year.And patch process is
One of smart card step essential in making.In chip mounter, mostly using thimble jack-up by the way of realize chip wafer with
The separation of film.When the suction nozzle of chip mounter moves to the surface of chip wafer, in the power plant driving thimble cap of chip mounter
Thimble rise, so that chip be jacked up, then the chip of jack-up is sucked suction nozzle, and chip is placed into the corresponding position of substrate
Fixation is put, while thimble is returned to original position.
Existing thimble cap includes two types, respectively for large-area chips and the thimble cap of small area chip.No matter
Large-area chips or small area chip, the thimble cap that they are used are by being molded over thimble cap bottom, in same
A pair of of card slot type structure of horizontal position is fixed on cnetre cradle, as shown in Figure 1, the driving device in this way during equipment use
When driving thimble seat moves upwards, since thimble cap and cnetre cradle fixation are insecure, the movement of thimble seat influences whether thimble cap
With the connectivity robustness of cnetre cradle, thimble cap is caused to float up and down, the chip being placed on thimble cap moves therewith, so that
The thimble of rising can not separate chip and film, influence the separative efficiency of chip.
Utility model content
Therefore, the technical problem to be solved by the present invention is to thimble cap of the prior art and cnetre cradle is overcome to fix
It is insecure so that thimble by chip and thin film separation, can not influence the defects of separative efficiency of chip, so as to provide a kind of thimble
Cap and thimble seat fixation, thimble can efficiently separate chip and film, the thimble of the high chip mounter of chip separative efficiency
Cap.
In order to solve the above-mentioned technical problem, the utility model provides a kind of thimble cap of chip mounter, including：
Thimble cap ontology, has the accommodating space for accommodating the thimble seat for being equipped with thimble, and the thimble seat is driving
It is pumped in an axial direction under the action of power so that thimble jack-up is placed on the chip on the thimble cap ontology；
Fixed structure is molded on the side wall of the thimble cap ontology, including respectively with the cnetre cradle on chip mounter not
Fixed at least one first fixed part in same level position and at least one second fixed part, first fixed part and described
Two fixed parts are respectively at the different height position of the side wall of the thimble cap ontology.
The thimble cap of the chip mounter, the side wall of the thimble cap ontology include the first layer and second being mutually arranged
Layer, and the minimum point of the internally positioned second layer is higher than the minimum point positioned at external first layer, first fixed part and the
Two fixed parts are molded over the lower edge of the first layer and the second layer respectively.
The thimble cap of the chip mounter, first fixed part and the second fixed part is are symmetrically arranged at described the
A pair on one layer and the second layer.
The thimble cap of the chip mounter, first fixed part and the second fixed part be respectively with the cnetre cradle not
The first groove body and the second groove body being adapted to the mounting portion of position.
The thimble cap of the chip mounter, first groove body are along the arc groove of the radian extension of the first layer, institute
The card slot that the second groove body is invagination is stated, and one end of first groove body forms opening, with institute corresponding to the cnetre cradle
It can circumferentially be screwed after stating mounting portion installation.
The thimble cap of the chip mounter, first groove body have the relatively large first end of radian and radian relatively
Small second end, the first end are openend, and the second end is fixing end.
The thimble cap of the chip mounter further includes cover, and the cover is mounted on the top of the thimble cap ontology, and
The activity space of the thimble seat is reserved between the top surface of the thimble cap ontology.
The thimble cap of the chip mounter forms the first array hole that the thimble is allowed to pass through in the cover.
The thimble cap of the chip mounter, first array hole are 15 × 15 arrangements.
The thimble cap of the chip mounter, the top of the thimble cap ontology be additionally provided with for by the cover with it is described
The fixed fastener of thimble cap ontology.
Technical solutions of the utility model have the following advantages that：
1. the thimble cap of chip mounter provided by the utility model, thimble cap passes through respectively positioned at the side wall of thimble cap ontology
The cnetre cradle at least one first fixed part and at least one second fixed part and chip mounter at different height position is not
Same level position is fixed, it is achieved thereby that the secured installation of thimble cap and cnetre cradle is fixed so that thimble seat is in uphill process
Thimble cap can also be kept being fixedly secured with cnetre cradle, so that thimble jacks up chip upwards, and then chip and film be had
Effect separation improves the separative efficiency of chip.
2. the thimble cap of chip mounter provided by the utility model, the first fixed part and the second fixed part are molded over mutually respectively
The first layer and the lower edge of the second layer being arranged, and the minimum point of the internally positioned second layer is higher than positioned at external first layer
Minimum point.In this way thimble cap can by set up separately externally and internally and in different vertical heights first fix
Portion and the second fixed part are fixedly secured with cnetre cradle, are not needed to change the structure of cnetre cradle, be ensure that while cost is reduced
The fastness of installation.
3. the thimble cap of chip mounter provided by the utility model, the first groove body is the arc extended along the radian of first layer
Slot, the first groove body have the relatively large first end of radian and the relatively small second end of radian.By thimble cap ontology with top
When punch block is installed, the mounting portion of cnetre cradle lower part first passes through the first end of the first groove body and thimble cap ontology is installed, then edge again
The extending direction rotation thimble cap ontology of first groove body, and most the mounting portion of cnetre cradle lower part is fixed on the of the first groove body at last
At two ends, at the same time the second groove body and the mounting portion on cnetre cradle top are realized and are fixed, final by inside and outside two layers of fixed structure
The secured installation for realizing thimble cap ontology and cnetre cradle is fixed.
4. the thimble cap of chip mounter provided by the utility model, the first array that thimble is allowed to pass through is formed in cover
Hole, the first array hole are 15 × 15 arrangements.This arrangement mode not only meets the core of each area in existing smart card production
The use of piece is also ad save resource, and can be used with producing line volume production.
Description of the drawings
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution of the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be the utility model some embodiments, for those of ordinary skill in the art, do not paying creativeness
Under the premise of labour, other attached drawings are can also be obtained according to these attached drawings.
Fig. 1 is the schematic diagram of the thimble cap of the chip mounter of the prior art；
Fig. 2 is the schematic diagram one of the thimble cap of chip mounter provided by the utility model；
Fig. 3 is the schematic diagram two of the thimble cap of chip mounter provided by the utility model；
Fig. 4 is the schematic diagram three of the thimble cap of chip mounter provided by the utility model.
Reference sign：
1- thimble cap ontologies；2- fixed structures；3- thimble seats；4- thimbles；5- covers；6- fasteners；11- first layers；12-
The second layer；The first fixed parts of 21-；The second fixed parts of 22-；The first array holes of 51-；211- first ends；212- second ends.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model part of the embodiment, instead of all the embodiments.Based on the embodiment in the utility model, sheet
Field those of ordinary skill all other embodiments obtained without making creative work, belong to this practicality
Novel protected range.
In addition, as long as technical characteristic involved in the utility model different embodiments disclosed below is each other
Not forming conflict can be combined with each other.
A kind of specific embodiment of the thimble cap of chip mounter as in Figure 2-4 is equipped with including having to be used to accommodate
The thimble cap ontology 1 of the accommodating space of the thimble seat 3 of thimble 4 and the fixed knot being molded on the side wall of the thimble cap ontology 1
Structure 2.Thimble cap ontology 1 is the hollow cylindrical configuration being small at both ends and big in the middle, and the area that chip is placed on thimble cap ontology 1 is larger
Top surface on, to ensure stationarity, thimble seat 3 is placed in the hollow cylindrical configuration, i.e., in accommodating space, the upper end of thimble seat 3
Several thimbles 4 are installed, lower end forms the connecting portion for being connect with driving mechanism.The thimble seat 3 is in driving mechanism
Driving force under the action of pump in an axial direction so that the thimble 4 jack-up be placed on the thimble cap ontology 1
Chip, so as to by the thin film separation of chip and beneath chips.Fixed structure 2 include respectively with the cnetre cradle on chip mounter not
Fixed two the first fixed parts 21 in same level position and two the second fixed parts 22, first fixed part 21 and described second
For fixed part 22 respectively at the different height position of the side wall of the thimble cap ontology 1, two the first fixed parts 21 are in same
One height and position, two the second fixed parts 22 are in another height and position.
As a kind of specific embodiment, the side wall of the thimble cap ontology 1 includes the first layer 11 being mutually arranged and the
Two layer 12, i.e. the internal diameter of first layer 11 and the second layer 12 is different, under the premise of cnetre cradle this body structure is not changed, with thimble
The different location installation of frame is fixed；And the minimum point of the internally positioned second layer 12 is higher than positioned at the minimum of external first layer 11
Point to save the space inside thimble cap ontology 1 as possible, facilitates installation, and 21 and second fixed part 22 of the first fixed part divides
It is not molded over the lower edge of the first layer 11 and the second layer 12, convenient for being fixed with cnetre cradle Fast Installation.
Specifically, 21 and second fixed part 22 of the first fixed part is is symmetrically arranged at the first layer 11 and the
A pair on two layer 12, i.e. the first fixed part of a pair 21 and a pair of second fixed part 22 are using the center of circle of place plane as symmetrical centre
The mode of being centrosymmetric is set, and which not only adds contact fixed-area of the thimble cap ontology 1 with cnetre cradle so that fix tightly
Gu it is also convenient for screwing thimble cap ontology 1 in the same direction.
As a kind of specific embodiment, 21 and second fixed part 22 of the first fixed part is respectively and the cnetre cradle
Different location mounting portion adaptation the first groove body and the second groove body, if being formed at the different vertical positions of cnetre cradle
Dry protrusion.Specifically, first groove body is the arc groove extended along the radian of the first layer 11, and extending direction is oblique
On, second groove body is the card slot of invagination, and card slot is formed, and described first by a lower edge excision part for the second layer 12
One end of groove body forms opening, can circumferentially be screwed after the mounting portion installation corresponding to the cnetre cradle.Described
One groove body has the relatively large first end 211 of radian and the relatively small second end 212 of radian, and the first end 211 is opens
Mouth end, the second end 212 are fixing end.The protrusion and the installation of the first groove body for not only having facilitated cnetre cradle in this way are fixed, but also cause
Thimble cap ontology 1 is tightened along after the extending direction rotation of the first groove body with cnetre cradle.
As a kind of specific embodiment, cover 5 is further included, the cover 5 is mounted on the upper of the thimble cap ontology 1
Portion, chip and film are placed in horizontal cover 5, and are reserved between the top surface of cover 5 and the thimble cap ontology 1 described
The activity space of thimble seat 3.Specifically, 1 top of thimble cap ontology forms the activity space of invagination, and cover 5 is fastened on thimble
On cap ontology 1, and by the fastener 6 that the top of the thimble cap ontology 1 is set by the cover 5 and the thimble cap ontology
1 fixes.In the present embodiment, fastener 5 includes being molded over the bolt hole on 1 top of thimble cap ontology and in bolt hole
Fastening bolt.
The first array hole 51 that the thimble 4 is allowed to pass through is formed in the cover 5.Portion in first array hole 51
Divide and connected with vacuum extractor, chip and film are adsorbed in cover 5 under vacuum, remaining first array hole 51
In be provided with thimble 4.In the present embodiment, first array hole 51 is 15 × 15 arrangements.
Obviously, the above embodiments are merely examples for clarifying the description, and is not intended to limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And the obvious variation thus extended out or
Among the protection domain that variation is created still in the utility model.
Claims (10)
1. a kind of thimble cap of chip mounter, which is characterized in that including：
Thimble cap ontology (1) has the accommodating space for accommodating the thimble seat (3) for being equipped with thimble (4), the thimble seat
(3) it pumps in an axial direction under the action of driving force so that the thimble (4) jack-up is placed on the thimble cap sheet
Chip on body (1)；
Fixed structure (2) is molded on the side wall of the thimble cap ontology (1), including respectively with the cnetre cradle on chip mounter
Fixed at least one first fixed part (21) in different level position and at least one second fixed part (22), described first fixes
Portion (21) and second fixed part (22) are located at the different height position of side wall of the thimble cap ontology (1) respectively.
2. the thimble cap of chip mounter according to claim 1, which is characterized in that the side wall packet of the thimble cap ontology (1)
The first layer (11) being mutually arranged and the second layer (12) are included, and the minimum point of the internally positioned second layer (12) is higher than positioned at outside
First layer (11) minimum point, first fixed part (21) and the second fixed part (22) are separately formed in the first layer
(11) and the lower edge of the second layer (12).
3. the thimble cap of chip mounter according to claim 2, which is characterized in that first fixed part (21) and second is consolidated
It is a pair being symmetrically arranged on the first layer (11) and the second layer (12) to determine portion (22).
4. the thimble cap of chip mounter according to claim 2, which is characterized in that first fixed part (21) and second is consolidated
It is respectively the first groove body and the second groove body being adapted to the mounting portion of the different location of the cnetre cradle to determine portion (22).
5. the thimble cap of chip mounter according to claim 4, which is characterized in that first groove body is along the first layer
(11) arc groove of radian extension, second groove body is the card slot of invagination, and one end of first groove body forms out
Mouthful, can circumferentially be screwed after the mounting portion installation corresponding to the cnetre cradle.
6. the thimble cap of chip mounter according to claim 5, which is characterized in that first groove body has radian relatively
Big first end (211) and the relatively small second end of radian (212), the first end (211) be openend, the second end
(212) it is fixing end.
7. the thimble cap of chip mounter according to claim 1, which is characterized in that further include cover (5), the cover (5)
Mounted on the top of the thimble cap ontology (1), and the thimble seat is reserved between the top surface of the thimble cap ontology (1)
(3) activity space.
8. the thimble cap of chip mounter according to claim 7, which is characterized in that being formed on the cover (5) allows institute
State the first array hole (51) that thimble (4) passes through.
9. the thimble cap of chip mounter according to claim 8, which is characterized in that first array hole (51) is 15 × 15
Arrangement.
10. the thimble cap of chip mounter according to claim 7, which is characterized in that the top of the thimble cap ontology (1) is also
It is provided with for by the cover (5) and the fixed fastener of the thimble cap ontology (1) (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721527388.6U CN207560658U (en) | 2017-11-15 | 2017-11-15 | A kind of thimble cap of chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721527388.6U CN207560658U (en) | 2017-11-15 | 2017-11-15 | A kind of thimble cap of chip mounter |
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| Publication Number | Publication Date |
|---|---|
| CN207560658U true CN207560658U (en) | 2018-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721527388.6U Active CN207560658U (en) | 2017-11-15 | 2017-11-15 | A kind of thimble cap of chip mounter |
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| CN (1) | CN207560658U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115605013A (en) * | 2022-12-12 | 2023-01-13 | 西北电子装备技术研究所（中国电子科技集团公司第二研究所）（Cn） | Blue membrane separation crystal taking device |
-
2017
- 2017-11-15 CN CN201721527388.6U patent/CN207560658U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115605013A (en) * | 2022-12-12 | 2023-01-13 | 西北电子装备技术研究所（中国电子科技集团公司第二研究所）（Cn） | Blue membrane separation crystal taking device |
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