CN207541216U - Chip conduction test and after-treatment system - Google Patents
Chip conduction test and after-treatment system Download PDFInfo
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- CN207541216U CN207541216U CN201721431309.1U CN201721431309U CN207541216U CN 207541216 U CN207541216 U CN 207541216U CN 201721431309 U CN201721431309 U CN 201721431309U CN 207541216 U CN207541216 U CN 207541216U
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Abstract
The utility model discloses a kind of chip conduction test and after-treatment system,It includes bottom plate,Rotary disk basement,Turntable,Several test loaded tools,Cap-opening mechanism and packaging mechanism,The rotary disk basement,Cap-opening mechanism and packaging mechanism are fixedly installed in plate upper surface,A buckle is movably installed in this notch section,The support plate side is provided with one and the corresponding clamping portion of buckle,Described pcb board one end is equipped with winding displacement seat,Other end upper surface has electrical contact area,The non-defective unit carrier mechanism and substandard products carrier mechanism are arranged in parallel,The suction motor is installed on the inner surface of support base one end,The driving wheel of outer surface of the output shaft of the suction motor with being set to support base one end is connect,This driving wheel is sequentially connected by belt and driven wheel below,This driven wheel is connect with the suction screw,The suction nozzle is fixedly connected by a mounting blocks with the sliding block being set on suction screw.The utility model realizes the integration operation of detection encapsulation, and high degree of automation improves production efficiency.
Description
Technical field
The utility model is related to device testing apparatus, and in particular to a kind of chip conduction test and after-treatment system.
Background technology
As requirement of the people to information security is higher and higher, traditional numerical ciphers or nine grids password have been unable to meet
Requirement of the people to information security.Bio-identification be widely used in a new generation electronic equipment, and the stability that fingerprint has and
Uniqueness so that being widely used for fingerprint detection identification device is general.
Fingerprint chip usually all needs to be detected in situations such as quality inspection of dispatching from the factory, recovery article inspection, performance detection, usually
In the case of, it needs manually to be detected one by one, then pick out defective products, then non-defective unit is packaged.By the core of detection
Piece is often packaged in the form of braid, and common braid encapsulation is that the carrier band for being furnished with chip receptacle lattice with one is equipped on chip receptacle lattice
Sealing cover strip form, chip need to usually detect again before braid is carried out, to ensure that packaged chip is certified products, by
It is smaller in chip volume, therefore as can with automatic equipment progress chip detection and automatic rejection defective products, will effectively promote effect
Rate.
Invention content
The purpose of this utility model is to provide a kind of chip conduction test and after-treatment system, the chip conduction test
And after-treatment system realizes the integration operation of detection encapsulation, high degree of automation improves production efficiency.
In order to achieve the above objectives, the technical solution adopted in the utility model is：A kind of chip conduction test and post processing
System, including bottom plate, rotary disk basement, turntable, several test loaded tools, cap-opening mechanism and packaging mechanism, the rotary disk basement, cap-opening mechanism
Plate upper surface is fixedly installed in packaging mechanism, the turntable is rotatably set to above rotary disk basement, several surveys
Examination carrier is uniformly arranged in the circumferential direction in disk upper surface；
The test loaded tool further comprises pcb board, support plate, test board, test bench and pressing plate, and the pressing plate passes through a peace
Hilt is flexibly connected with support plate, and in the through-hole of the test bench insertion support plate, the test board is installed on support plate lower surface and position
Below test bench, the pcb board is set to support plate lower surface, and the pressing plate side has a notch section, lives in this notch section
Dynamic to be equipped with a buckle, the support plate side is provided with one and the corresponding clamping portion of buckle, this wedging position in the underface that is buckled,
It is described to snap through that a shaft is movably installed in the notch section of pressing plate and buckle rotate around the shaft, the further packet of the buckle
Pothook and press section are included, the pothook of the buckle is used for and clamping portion snapping；
Described pcb board one end is equipped with winding displacement seat, and other end upper surface has electrical contact area, and the pcb board is located at winding displacement
Region has a wire jumper portion between seat and electrical contact area, and the testing needle is sequentially embedded in the through-hole of test bench and test board, this
Testing needle upper end and the connector of fingerprint chip to be detected are in electrical contact, testing needle lower end and the electrical contact Qu electricity Jie of the pcb board
It touches, a core board is electrically connected by grey winding displacement with winding displacement seat, this core board is for generation and processing detection signal；
The cap-opening mechanism is made of installing plate, cylinder and movable plate, and the cylinder is installed on bottom by the installing plate
Plate upper surface and positioned at turntable side, the movable plate is fixedly connected by a link block with the piston rod of cylinder, this movable plate
For the press section contact connectio being buckled with test loaded tool, the installing plate front side surface and movable plate lower section is provided with one
Stop screw, this stop screw are installed on by a fixed seat on installing plate, in this stop screw insertion fixed seat upper surface
It is connected through a screw thread in the through-hole of centre and with the center through hole of fixed seat；
The packaging mechanism further comprises adsorption mechanism, non-defective unit carrier mechanism and substandard products carrier mechanism, the non-defective unit fortune
Mounted mechanism and substandard products carrier mechanism are arranged in parallel, and the adsorption mechanism is vertically arranged with non-defective unit carrier mechanism and substandard products carrier mechanism
And above non-defective unit carrier mechanism and substandard products carrier mechanism, the adsorption mechanism further comprises support base, suction motor, inhales
Material screw and suction nozzle, the support base are installed on plate upper surface, and the suction motor is installed on the inside table of support base one end
Face, the driving wheel of the outer surface of the output shaft of the suction motor with being set to support base one end are connect, this driving wheel passes through
Belt is sequentially connected with driven wheel below, this driven wheel is connect with the suction screw, and the suction nozzle passes through a mounting blocks
It is fixedly connected with the sliding block being set on suction screw.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in said program, the number of several test loaded tools is 8.
2. in said program, the shaft both ends are set with spring.
3. in said program, the pothook and press section are vertical setting.
4. in said program, the wire jumper portion is located at pcb board close to winding displacement seat side.
Due to the utilization of above-mentioned technical proposal, the utility model has following advantages compared with prior art：
1st, the utility model chip conduction test and after-treatment system, packaging mechanism further comprise adsorption mechanism,
Non-defective unit carrier mechanism and substandard products carrier mechanism, the non-defective unit carrier mechanism and substandard products carrier mechanism are arranged in parallel, the Material sucking machine
Structure is vertically arranged with non-defective unit carrier mechanism and substandard products carrier mechanism and above non-defective unit carrier mechanism and substandard products carrier mechanism, institute
It states adsorption mechanism and further comprises support base, suction motor, suction screw and suction nozzle, the support base is installed on bottom plate upper table
Face, the suction motor are installed on the inner surface of support base one end, and the output shaft of the suction motor is with being set to support base
The driving wheel connection of the outer surface of one end, this driving wheel are sequentially connected by belt and driven wheel below, this driven wheel
It is connect with the suction screw, the suction nozzle is fixedly connected by a mounting blocks with the sliding block being set on suction screw, encapsulation
Product after detection is separately delivered post package according to non-defective unit substandard products by adsorption mechanism, realizes detection encapsulation by the setting of mechanism
Integration operation, high degree of automation, improve production efficiency.
2nd, the utility model chip conduction test and after-treatment system, pressing plate side have a notch section, this notch
A buckle is movably installed in portion, the support plate side is provided with one and the corresponding clamping portion of buckle, this wedging position is in buckle
Underface, it is described to snap through that a shaft is movably installed in the notch section of pressing plate and buckle rotate around the shaft, the buckle
Further comprise pothook and press section, the pothook of the buckle is used for clamping portion snapping, the setting spirit being buckled on pressing plate
It is living convenient, convenient for picking and placeing for chip to be measured；Secondly, cap-opening mechanism is made of installing plate, cylinder and movable plate, and the cylinder leads to
It crosses the installing plate and is installed on plate upper surface and positioned at turntable side, the movable plate passes through a link block and the piston of cylinder
Bar is fixedly connected, this movable plate is used to connect with the press section that test loaded tool is buckled, and cap-opening mechanism is buckled with test loaded tool
Press section setting, can realize the opening to test loaded tool pressing plate automatically, be greatly saved labour, improve working efficiency.
3rd, the utility model chip conduction test and after-treatment system, pcb board one end are equipped with winding displacement seat, the other end
Upper surface has electrical contact area, and the pcb board, which is located at region between winding displacement seat and electrical contact area, has a wire jumper portion, the test
Needle is sequentially embedded in the through-hole of test bench and test board, this testing needle upper end and the connector of fingerprint chip to be detected are in electrical contact,
Testing needle lower end and the electrical contact area of the pcb board are in electrical contact, and a core board is electrically connected by grey winding displacement with winding displacement seat, this core
Plate directly can be transmitted and handle to the detection signal of acquisition with processing detection signal, the setting of core board for generating, high
Effect accurately completes the detection to chip performance.
4th, the utility model chip conduction test and after-treatment system, installing plate front side surface and under the movable plate
Side is provided with a stop screw, this stop screw is installed on by a fixed seat on installing plate, this stop screw insertion fixed seat
It is connected through a screw thread in the center through hole of upper surface and with the center through hole of fixed seat, the setting of adjustable limit screw, it can be with
The stroke of movable plate is limited, avoids movable plate down stroke excessive and damages pressing plate, and can be to different model
Carrier is finely adjusted when testing, and has good versatility.
Description of the drawings
Attached drawing 1 is the utility model chip conduction test and after-treatment system structure diagram；
Attached drawing 2 is the utility model chip conduction test and after-treatment system partial structural diagram；
Attached drawing 3 is the utility model chip conduction test and the test loaded tool decomposition diagram of after-treatment system；
Attached drawing 4 is the test loaded tool partial exploded view of the utility model after-treatment system；
Attached drawing 5 is the utility model chip conduction test and the cap-opening mechanism structure diagram of after-treatment system.
In the figures above：1st, bottom plate；2nd, rotary disk basement；3rd, turntable；4th, test loaded tool；401st, pcb board；402nd, support plate；403、
Test board；404th, test bench；405th, pressing plate；407th, testing needle；411st, winding displacement seat；412nd, wire jumper portion；413rd, notch section；414th, block
Button；415th, clamping portion；416th, pothook；417th, press section；418th, shaft；5th, cap-opening mechanism；501st, installing plate；502nd, cylinder；
503rd, movable plate；504th, stop screw；505th, fixed seat；6th, packaging mechanism；7th, adsorption mechanism；701st, support base；702nd, suction
Motor；703rd, suction screw；704th, suction nozzle；705th, driving wheel；706th, driven wheel；707th, sliding block；8th, non-defective unit carrier mechanism；9th, it is secondary
Product carrier mechanism.
Specific embodiment
Embodiment 1：A kind of chip conduction test and after-treatment system, including bottom plate 1, rotary disk basement 2, turntable 3, several surveys
Examination carrier 4, cap-opening mechanism 5 and packaging mechanism 6, the rotary disk basement 2, cap-opening mechanism 5 and packaging mechanism 6 are fixedly installed in bottom plate
1 upper surface, the turntable 3 are rotatably set to the top of rotary disk basement 2, several test loaded tools 4 be uniformly arranged in the circumferential direction in
3 upper surface of turntable；
The test loaded tool 4 further comprises pcb board 401, support plate 402, test board 403, test bench 404 and pressing plate 405,
The pressing plate 405 is flexibly connected by an installing handle with support plate 402, and the test bench 404 is embedded in the through-hole of support plate 402, institute
It states test board 403 and is installed on 402 lower surface of support plate and positioned at 404 lower section of test bench, the pcb board 401 is set under support plate 402
Surface, 405 side of pressing plate have a notch section 413, a buckle 414, the support plate are movably installed in this notch section 413
402 sides are provided with one and the 414 corresponding clamping portions 415 that are buckled, this clamping portion 415 is located at immediately below buckle 414, the buckle
414 be movably installed in the notch section 413 of pressing plate 405 by a shaft 418 and buckle 414 can 418 rotation around the shaft, the card
Button 414 further comprises pothook 416 and press section 417, and the pothook 416 of the buckle 414 is used to detain with clamping portion 415
It connects；
Described 401 one end of pcb board is equipped with winding displacement seat 411, and other end upper surface has electrical contact area, the pcb board 401
Region has a wire jumper portion 412 between winding displacement seat 411 and electrical contact area, and the testing needle 407 is sequentially embedded test bench 404
In the through-hole of test board 403, this 407 upper end of testing needle and the connector of fingerprint chip to be detected are in electrical contact, under testing needle 407
End and the electrical contact area of the pcb board 401 are in electrical contact, and a core board is electrically connected by grey winding displacement with winding displacement seat 411, this core board
For generating and processing detection signal；
The cap-opening mechanism 5 is made of installing plate 501, cylinder 502 and movable plate 503, and the cylinder 502 passes through the peace
Loading board 501 is installed on 1 upper surface of bottom plate and positioned at 3 side of turntable, and the movable plate 503 passes through a link block and cylinder 502
Piston rod is fixedly connected, this movable plate 503 is used to connect with the press section 417 of the buckle of test loaded tool 4 414, the installation
501 front side surface of plate and the lower section of movable plate 503 is provided with a stop screw 504, this stop screw 504 passes through a fixed seat
505 are installed on installing plate 501, this stop screw 504 is embedded in the center through hole of 505 upper surface of fixed seat and and fixed seat
505 center through hole is connected through a screw thread；
The packaging mechanism 6 further comprises adsorption mechanism 7, non-defective unit carrier mechanism 8 and substandard products carrier mechanism 9, described good
Product carrier mechanism 8 and substandard products carrier mechanism 9 are arranged in parallel, the adsorption mechanism 7 and non-defective unit carrier mechanism 8 and substandard products carrier mechanism
9 are vertically arranged and positioned at 9 top of non-defective unit carrier mechanism 8 and substandard products carrier mechanism, and the adsorption mechanism 7 further comprises support base
701st, suction motor 702, suction screw 703 and suction nozzle 704, the support base 701 are installed on 1 upper surface of bottom plate, the suction
Motor 702 is installed on the inner surface of 701 one end of support base, and the output shaft of the suction motor 702 is with being set to support base 701
The driving wheel 705 of the outer surface of one end connects, this driving wheel 705 is sequentially connected by belt and driven wheel 706 below,
This driven wheel 706 is connect with the suction screw 703, and the suction nozzle 704 is by a mounting blocks and is set on suction screw 703
Sliding block 707 be fixedly connected.
The number of above-mentioned several test loaded tools 4 is 8；Above-mentioned 418 both ends of shaft are set with spring.
Embodiment 2：A kind of chip conduction test and after-treatment system, including bottom plate 1, rotary disk basement 2, turntable 3, several surveys
Examination carrier 4, cap-opening mechanism 5 and packaging mechanism 6, the rotary disk basement 2, cap-opening mechanism 5 and packaging mechanism 6 are fixedly installed in bottom plate
1 upper surface, the turntable 3 are rotatably set to the top of rotary disk basement 2, several test loaded tools 4 be uniformly arranged in the circumferential direction in
3 upper surface of turntable；
The test loaded tool 4 further comprises pcb board 401, support plate 402, test board 403, test bench 404 and pressing plate 405,
The pressing plate 405 is flexibly connected by an installing handle with support plate 402, and the test bench 404 is embedded in the through-hole of support plate 402, institute
It states test board 403 and is installed on 402 lower surface of support plate and positioned at 404 lower section of test bench, the pcb board 401 is set under support plate 402
Surface, 405 side of pressing plate have a notch section 413, a buckle 414, the support plate are movably installed in this notch section 413
402 sides are provided with one and the 414 corresponding clamping portions 415 that are buckled, this clamping portion 415 is located at immediately below buckle 414, the buckle
414 be movably installed in the notch section 413 of pressing plate 405 by a shaft 418 and buckle 414 can 418 rotation around the shaft, the card
Button 414 further comprises pothook 416 and press section 417, and the pothook 416 of the buckle 414 is used to detain with clamping portion 415
It connects；
Described 401 one end of pcb board is equipped with winding displacement seat 411, and other end upper surface has electrical contact area, the pcb board 401
Region has a wire jumper portion 412 between winding displacement seat 411 and electrical contact area, and the testing needle 407 is sequentially embedded test bench 404
In the through-hole of test board 403, this 407 upper end of testing needle and the connector of fingerprint chip to be detected are in electrical contact, under testing needle 407
End and the electrical contact area of the pcb board 401 are in electrical contact, and a core board is electrically connected by grey winding displacement with winding displacement seat 411, this core board
For generating and processing detection signal；
The cap-opening mechanism 5 is made of installing plate 501, cylinder 502 and movable plate 503, and the cylinder 502 passes through the peace
Loading board 501 is installed on 1 upper surface of bottom plate and positioned at 3 side of turntable, and the movable plate 503 passes through a link block and cylinder 502
Piston rod is fixedly connected, this movable plate 503 is used to connect with the press section 417 of the buckle of test loaded tool 4 414, the installation
501 front side surface of plate and the lower section of movable plate 503 is provided with a stop screw 504, this stop screw 504 passes through a fixed seat
505 are installed on installing plate 501, this stop screw 504 is embedded in the center through hole of 505 upper surface of fixed seat and and fixed seat
505 center through hole is connected through a screw thread；
The packaging mechanism 6 further comprises adsorption mechanism 7, non-defective unit carrier mechanism 8 and substandard products carrier mechanism 9, described good
Product carrier mechanism 8 and substandard products carrier mechanism 9 are arranged in parallel, the adsorption mechanism 7 and non-defective unit carrier mechanism 8 and substandard products carrier mechanism
9 are vertically arranged and positioned at 9 top of non-defective unit carrier mechanism 8 and substandard products carrier mechanism, and the adsorption mechanism 7 further comprises support base
701st, suction motor 702, suction screw 703 and suction nozzle 704, the support base 701 are installed on 1 upper surface of bottom plate, the suction
Motor 702 is installed on the inner surface of 701 one end of support base, and the output shaft of the suction motor 702 is with being set to support base 701
The driving wheel 705 of the outer surface of one end connects, this driving wheel 705 is sequentially connected by belt and driven wheel 706 below,
This driven wheel 706 is connect with the suction screw 703, and the suction nozzle 704 is by a mounting blocks and is set on suction screw 703
Sliding block 707 be fixedly connected.
Above-mentioned pothook 416 and press section 417 are vertical setting；Above-mentioned wire jumper portion 412 is located at pcb board 401 close to winding displacement
411 sides of seat.
During using said chip conduction test and after-treatment system, the setting of packaging mechanism will by adsorption mechanism
Product after detection separately delivers post package according to non-defective unit substandard products, realizes that the integration of detection encapsulation operates, high degree of automation,
Improve production efficiency；Secondly, the setting being buckled on pressing plate is flexible and convenient, convenient for picking and placeing for chip to be measured；Again, cap-opening mechanism with
The press section setting of test loaded tool buckle, can realize the opening to test loaded tool pressing plate, labour is greatly saved, carries automatically
High working efficiency；Again, the setting of core board directly can be transmitted and handle to the detection signal of acquisition, efficiently and accurately
Complete the detection to chip performance；In addition, the setting of adjustable limit screw, can limit the stroke of movable plate, keep away
It is finely adjusted, has good when it is excessive and damage pressing plate to exempt from movable plate down stroke, and the carrier of different model can be tested
Good versatility.
Above-described embodiment is only the technical concepts and features for illustrating the utility model, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement according to this, can not the scope of protection of the utility model be limited with this.
It is all according to the spirit of the present invention substantially equivalent change or modification for being made, should all cover the scope of protection of the utility model it
It is interior.
Claims (5)
1. a kind of chip conduction test and after-treatment system, it is characterised in that：Including bottom plate（1）, rotary disk basement（2）, turntable
（3）, several test loaded tools（4）, cap-opening mechanism（5）And packaging mechanism（6）, the rotary disk basement（2）, cap-opening mechanism（5）And encapsulation
Mechanism（6）It is fixedly installed in bottom plate（1）Upper surface, the turntable（3）Rotatably it is set to rotary disk basement（2）Top, it is described
Several test loaded tools（4）It is uniformly arranged in the circumferential direction in turntable（3）Upper surface；
The test loaded tool（4）Further comprise pcb board（401）, support plate（402）, test board（403）, test bench（404）And pressure
Plate（405）, the pressing plate（405）Pass through an installing handle and support plate（402）Flexible connection, the test bench（404）Embedded support plate
（402）Through-hole in, the test board（403）It is installed on support plate（402）Lower surface and positioned at test bench（404）Lower section, it is described
Pcb board（401）It is set to support plate（402）Lower surface, the pressing plate（405）Side has a notch section（413）, this notch section
（413）Inside it is movably installed with a buckle（414）, the support plate（402）Side is provided with one and buckle（414）Corresponding clamping portion
（415）, this clamping portion（415）Positioned at buckle（414）Underface, the buckle（414）Pass through a shaft（418）It is movably installed in
Pressing plate（405）Notch section（413）Interior and buckle（414）It can be around the shaft（418）Rotation, the buckle（414）Further comprise
Pothook（416）And press section（417）, the buckle（414）Pothook（416）For with clamping portion（415）Snapping；
The pcb board（401）One end is equipped with winding displacement seat（411）, other end upper surface has electrical contact area, the pcb board
（401）Positioned at winding displacement seat（411）Region has a wire jumper portion between electrical contact area（412）, the testing needle（407）It is embedding successively
Enter test bench（404）And test board（403）Through-hole in, this testing needle（407）Upper end and the connector of fingerprint chip to be detected
Electrical contact, testing needle（407）Lower end and the pcb board（401）Electrical contact area electrical contact, a core board pass through grey winding displacement with row
Line seat（411）Electrical connection, this core board is for generation and processing detection signal；
The cap-opening mechanism（5）By installing plate（501）, cylinder（502）And movable plate（503）Composition, the cylinder（502）Pass through
The installing plate（501）It is installed on bottom plate（1）Upper surface and positioned at turntable（3）Side, the movable plate（503）Pass through a connection
Block and cylinder（502）Piston rod be fixedly connected, this movable plate（503）For with test loaded tool（4）Buckle（414）Press section
（417）It connects, the installing plate（501）Front side surface and positioned at movable plate（503）Lower section is provided with a stop screw
（504）, this stop screw（504）Pass through a fixed seat（505）It is installed on installing plate（501）On, this stop screw（504）It is embedded
Fixed seat（505）In the center through hole of upper surface and and fixed seat（505）Center through hole be connected through a screw thread；
The packaging mechanism（6）Further comprise adsorption mechanism（7）, non-defective unit carrier mechanism（8）With substandard products carrier mechanism（9）, institute
State non-defective unit carrier mechanism（8）With substandard products carrier mechanism（9）It is arranged in parallel, the adsorption mechanism（7）With non-defective unit carrier mechanism（8）With
Substandard products carrier mechanism（9）It is vertically arranged and positioned at non-defective unit carrier mechanism（8）With substandard products carrier mechanism（9）Top, the Material sucking machine
Structure（7）Further comprise support base（701）, suction motor（702）, suction screw（703）And suction nozzle（704）, the support base
（701）It is installed on bottom plate（1）Upper surface, the suction motor（702）It is installed on support base（701）The inner surface of one end, institute
State suction motor（702）Output shaft and be set to support base（701）The driving wheel of the outer surface of one end（705）Connection, this
Driving wheel（705）Pass through belt and driven wheel below（706）It is sequentially connected, this driven wheel（706）With the suction screw
（703）Connection, the suction nozzle（704）By a mounting blocks and it is set in suction screw（703）On sliding block（707）It is fixed to connect
It connects.
2. chip conduction test according to claim 1 and after-treatment system, it is characterised in that：Several tests carry
Tool（4）Number be 8.
3. chip conduction test according to claim 1 and after-treatment system, it is characterised in that：The shaft（418）
Both ends are set with spring.
4. chip conduction test according to claim 1 and after-treatment system, it is characterised in that：The pothook
（416）And press section（417）It is vertical setting.
5. chip conduction test according to claim 1 and after-treatment system, it is characterised in that：The wire jumper portion
（412）Positioned at pcb board（401）Close to winding displacement seat（411）Side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721431309.1U CN207541216U (en) | 2017-11-01 | 2017-11-01 | Chip conduction test and after-treatment system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721431309.1U CN207541216U (en) | 2017-11-01 | 2017-11-01 | Chip conduction test and after-treatment system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207541216U true CN207541216U (en) | 2018-06-26 |
Family
ID=62611807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721431309.1U Expired - Fee Related CN207541216U (en) | 2017-11-01 | 2017-11-01 | Chip conduction test and after-treatment system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207541216U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110716588A (en) * | 2018-07-13 | 2020-01-21 | 苏州永测电子有限公司 | High-precision burning machine |
| CN110718490A (en) * | 2018-07-13 | 2020-01-21 | 苏州永测电子有限公司 | Chip burning machine capable of automatically feeding and discharging |
| CN112363088A (en) * | 2020-11-09 | 2021-02-12 | 博众精工科技股份有限公司 | Positioning structure and testing device |
| CN117066128A (en) * | 2023-10-16 | 2023-11-17 | 广东昭信智能装备有限公司 | Fingerprint chip test equipment |
-
2017
- 2017-11-01 CN CN201721431309.1U patent/CN207541216U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110716588A (en) * | 2018-07-13 | 2020-01-21 | 苏州永测电子有限公司 | High-precision burning machine |
| CN110718490A (en) * | 2018-07-13 | 2020-01-21 | 苏州永测电子有限公司 | Chip burning machine capable of automatically feeding and discharging |
| CN110718490B (en) * | 2018-07-13 | 2022-05-10 | 苏州永测电子有限公司 | Chip burning machine capable of automatically feeding and discharging |
| CN112363088A (en) * | 2020-11-09 | 2021-02-12 | 博众精工科技股份有限公司 | Positioning structure and testing device |
| CN112363088B (en) * | 2020-11-09 | 2023-11-17 | 博众精工科技股份有限公司 | Positioning structure and testing device |
| CN117066128A (en) * | 2023-10-16 | 2023-11-17 | 广东昭信智能装备有限公司 | Fingerprint chip test equipment |
| CN117066128B (en) * | 2023-10-16 | 2024-01-16 | 广东昭信智能装备有限公司 | Fingerprint chip test equipment |
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Granted publication date: 20180626 Termination date: 20191101 |