CN207515586U - A kind of forced air cooler chip structure for preventing percussive pressure from damaging - Google Patents
A kind of forced air cooler chip structure for preventing percussive pressure from damaging Download PDFInfo
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- CN207515586U CN207515586U CN201721599566.6U CN201721599566U CN207515586U CN 207515586 U CN207515586 U CN 207515586U CN 201721599566 U CN201721599566 U CN 201721599566U CN 207515586 U CN207515586 U CN 207515586U
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- runner
- sealing plate
- wafer group
- cooled wafer
- check valve
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Abstract
The utility model is related to a kind of forced air cooler chip structures for preventing percussive pressure from damaging,Including upper sealing plate,Lower sealing plate,Cooled wafer group,Perforative runner one is equipped in upper sealing plate,One exit of runner is provided with check valve,The free flow side of check valve is communicated with runner one,Be equipped in lower sealing plate not through runner two,It closes in two left side of runner,Outlet of two right side of runner for the outflow of cooling medium,Cooled wafer group is installed between upper sealing plate and lower sealing plate,Cooled wafer group is assembled by several outer fins and several composite plates alternating,Outer fin passes through for air draught,It is axially disposed in composite plate to have runner three,Runner three respectively with runner one,Runner two communicates,Side seal board is connected on the right side of cooled wafer group,Side seal board is axially arranged with runner four,Four one end of runner is communicated with the non-return side of check valve,Four opposite side of runner is communicated with runner two；The utility model can make chip without damage, and the Opening pressure of check valve can be adjusted according to service condition.
Description
[technical field]
The utility model is related to forced air cooler technical field, specifically a kind of forced air cooler for preventing percussive pressure from damaging
Chip structure.
[background technology]
With the big flow of hydraulic test, high pressure trending, also more and more apparent along with oil shock, forced air cooler is made
Equipment to cool down medium, it is indispensable in hydraulic test, if the medium with oil shock enters forced air cooler
Chip certainly will damage chip.And the development with Hydraulic Industry and with the development of society, existing air cooling
Device cannot meet the needs of client comprehensively, and in order to meet the continuous innovation progress in mechanical equipment market, forced air cooler is also being done
The continuous demand improved to adapt to market.Therefore, if existing deficiency can be directed to, chip existing structure is optimized, with
The damage that oil shock is brought is prevented, will be had very important significance.
[utility model content]
The purpose of this utility model seeks to solve above-mentioned deficiency and provide a kind of air cooling for preventing percussive pressure from damaging
Device chip structure can make chip without damage, and the Opening pressure of check valve can be adjusted according to service condition, and use is very square
Just, the occasion for having percussive pressure can be applied, compensates for the deficiency of existing structure.
Design to achieve the above object it is a kind of prevent percussive pressure damage forced air cooler chip structure, including upper sealing plate 1, under
Sealing plate 3, cooled wafer group 8, check valve 10, side seal board 11, the upper sealing plate 1 is interior to be equipped with perforative runner 1, the runner one
The import that 2 left sides are flowed into for heating medium, the exit on one 2 right side of runner are provided with check valve 10, the check valve 10
Free flow side communicated with runner 1, be equipped in the lower sealing plate 3 not through runner 24,24 left side of runner is sealed
It closes, outlet of 24 right side of runner for the outflow of cooling medium is installed with cooled wafer between the upper sealing plate 1 and lower sealing plate 3
Group 8, the cooled wafer group 8 are replaced assembled by several outer fins 6 and several composite plates 5, and the outer fin 6 is used for
Air draught passes through, axially disposed in the composite plate 5 to have a runner 39, the runner 39 respectively with runner 1, runner two
4 communicate, and 8 right side of cooled wafer group is connected with side seal board 11, and the side seal board 11 is axially arranged with runner 4 12, the runner
4 12 sides are communicated with the non-return side of check valve 10, and 4 12 opposite side of runner is communicated with runner 24.
Further, the left side of the cooled wafer group 8 and the right side of side seal board 11 are welded with chip fixed plate 7.
Further, the upper sealing plate 1, lower sealing plate 3 using sealing welding technique be welded in respectively 8 upper end of cooled wafer group and
Lower end, the upper sealing plate 1, lower sealing plate 3, chip fixed plate 7 and cooled wafer group 8 form one.
Further, the side seal board 11 is welded in the right side of cooled wafer group 8, the side seal board using sealing welding technique
11 couple with upper sealing plate 1 and lower 3 butt welding of sealing plate.
The utility model is compared with the existing technology, structure novel, simple, and reasonable design is set by the oil inlet side in chip
Check valve is equipped with, and is equipped with below check valve and adds a runner, so as to when medium is along with percussive pressure or media flow resistance
When big, if it exceeds the Opening pressure of check valve, extra medium can be flowed out from check valve, make chip without damage, and single
It can be adjusted to the Opening pressure of valve according to service condition, it is very easy to use, the occasion for having percussive pressure can be applied, is compensated for existing
Some applications are insufficient, have widened the application scenario of forced air cooler, have been worthy of popularization.
[description of the drawings]
Fig. 1 is the structure diagram of the utility model；
Fig. 2 is the side structure schematic diagram of the utility model；
In figure：1st, upper sealing plate 2, runner 1, lower sealing plate 4, runner 25, composite plate 6, outer fin 7, chip are fixed
Plate 8, cooled wafer group 9, runner 3 10, check valve 11, side seal board 12, runner four.
[specific embodiment]
The utility model is made below in conjunction with the accompanying drawings further explained below：
As shown in drawings, the utility model includes upper sealing plate 1, lower sealing plate 3, cooled wafer group 8, check valve 10, side seal board
11, upper sealing plate 1 is interior to be equipped with perforative runner 1, the import that one 2 left side of runner is flowed into for heating medium, with the heat of supply and demand cooling
Medium flows into, and the exit on one 2 right side of runner is provided with check valve 10, and the free flow side of check valve 10 is communicated with runner 1,
Be equipped in lower sealing plate 3 not through runner 24,24 left side of runner closes, and 24 right side of runner is to supply cold medium stream after cooling
The outlet gone out is installed with cooled wafer group 8 between upper sealing plate 1 and lower sealing plate 3, if cooled wafer group 8 by several outer fins 6 and
Dry a composite plate 5 is alternately assembled to be formed there are one entirety, and outer fin 6 passes through for air draught, axially disposed in composite plate 5
There is runner 39, runner 39 communicates respectively with runner 1, runner 24, and 8 right side of cooled wafer group is connected with side seal board 11, side seal
Plate 11 is axially arranged with runner 4 12, and 4 12 side of runner is communicated with the non-return side of check valve 10,4 12 opposite side of runner and runner
24 communicate；Wherein, the left side of cooled wafer group 8 and the right side of side seal board 11 are welded with chip fixed plate 7, upper sealing plate 1,
Lower sealing plate 3 is welded in 8 top and bottom of cooled wafer group respectively using sealing welding technique, and upper sealing plate 1, lower sealing plate 3, chip are fixed
Plate 7 forms one with cooled wafer group 8, and side seal board 11 is welded in the right side of cooled wafer group 8, side seal board using sealing welding technique
11 couple with upper sealing plate 1 and lower 3 butt welding of sealing plate.
The operation principle of the utility model is：The thermal medium cooled down is needed to be flowed into from the runner one of upper sealing plate, and if passing through
The runner three of dry composite plate, is pooled to the runner two of lower sealing plate, and pass through runner two and flow out.The wind turbine of cooler passes through rotation
Turn, air is made to form air-flow, air-flow is entered by the side of chip in several outer fins, in the runner three of composite plate
Thermal medium carries out heat exchange；After heat exchange, the thermal current of formation is discharged from the opposite side of chip, be pulled away the cold medium of heat from
The runner three of several composite plates is pooled to the runner two of lower sealing plate, and passes through runner two and flow out.When the runner of upper sealing plate is first-class
When the thermal medium entered is along with percussive pressure, if percussive pressure is more than the Opening pressure of check valve, check valve is opened, extra medium
It is flowed out from the runner four of side seal board, absorbs impact, protect the chip crushing that is not hit bad.When the heat that the runner two of upper sealing plate flows into
Rate-of flow becomes larger or the runner of composite plate three blocks, and causes media flow resistance big, pressure rise, if pressure is higher than single
To the Opening pressure of valve, check valve is opened, and extra medium is flowed out from the runner four of side seal board, protects chip not by high crushing
It is bad.The Opening pressure of check valve can be according to actual use situation adjustment.
And existing forced air cooler chip structure is made of upper sealing plate, lower sealing plate, cooled wafer group, chip fixed plate,
Upper sealing plate setting not through runner, the thermal medium of supply and demand cooling flows into, the setting of lower sealing plate not through runner, confession is after cooling
Cold medium flows out, and by several outer fins and several composite plates, alternately assembly forms that there are one entirety, upper envelopes to cooled wafer group
Plate, lower sealing plate, chip fixed plate form an entirety by sealing welding technique and cooled wafer group, and outer fin is used for air gas
Stream passes through, composite plate axially setting runner, and being communicated with the runner of the runner of upper sealing plate and lower sealing plate.
The existing structure is in use, need the thermal medium cooled down to be flowed into, and it is compound to pass through several from the runner of upper sealing plate
The runner of plate is pooled to the runner of lower sealing plate, and is flowed out by runner.The wind turbine of cooler makes air form gas by rotation
Stream, air-flow are entered by the side of chip in several outer fins, and heat exchange is carried out with the thermal medium in the runner of composite plate；
After heat exchange, the thermal current of formation is discharged from the opposite side of chip, is pulled away the cold medium of heat from the stream of several composite plates
Road is pooled to the runner of lower sealing plate, and is flowed out by runner.If the thermal medium that the runner of upper sealing plate flows into along with percussive pressure,
Percussive pressure can be transmitted in the runner of composite plate, with the extension of time, chip can be caused to be damaged；If the heat that runner flows into is situated between
Mass flow amount become larger or the runner of composite plate block, media flow resistance can be caused big, pressure rise, can equally cause chip by
Damage.Therefore, existing chip structure needs to improve, and the utility model structure can then solve this deficiency.
The utility model is simultaneously not limited to the embodiments described above, and other any spirit without departing from the utility model are real
Matter with made under principle change, modification, replacement, combine, simplification, should be equivalent substitute mode, be included in this practicality
Within novel protection domain.
Claims (4)
1. a kind of forced air cooler chip structure for preventing percussive pressure from damaging, it is characterised in that：Including upper sealing plate (1), lower sealing plate
(3), cooled wafer group (8), check valve (10), side seal board (11), the upper sealing plate (1) is interior to be equipped with perforative runner one (2), institute
State the import flowed into for heating medium on the left of runner one (2), the exit on the right side of the runner one (2) is provided with check valve
(10), the free flow side of the check valve (10) is communicated with runner one (2), be equipped in the lower sealing plate (3) not through stream
Road two (4), runner two (4) left side are closed, the outlet on the right side of the runner two (4) for the outflow of cooling medium, the upper envelope
Be installed with cooled wafer group (8) between plate (1) and lower sealing plate (3), the cooled wafer group (8) by several outer fins (6) and
Several composite plates (5) are alternately assembled, and the outer fin (6) passes through for air draught, along axis in the composite plate (5)
To runner three (9) is provided with, the runner three (9) communicates respectively with runner one (2), runner two (4), the cooled wafer group
(8) right side is connected with side seal board (11), and the side seal board (11) is axially arranged with runner four (12), described four (12) side of runner with
The non-return side of check valve (10) communicates, and described four (12) opposite side of runner is communicated with runner two (4).
2. the forced air cooler chip structure as described in claim 1 for preventing percussive pressure from damaging, it is characterised in that：The cooling core
The left side of piece group (8) and the right side of side seal board (11) are welded with chip fixed plate (7).
3. the forced air cooler chip structure as claimed in claim 2 for preventing percussive pressure from damaging, it is characterised in that：The upper sealing plate
(1), lower sealing plate (3) is welded in cooled wafer group (8) top and bottom respectively using sealing welding technique, the upper sealing plate (1), under
Sealing plate (3), chip fixed plate (7) and cooled wafer group (8) form one.
4. the forced air cooler chip structure as claimed in claim 3 for preventing percussive pressure from damaging, it is characterised in that：The side seal board
(11) right side of cooled wafer group (8), the side seal board (11) and upper sealing plate (1) and lower sealing plate are welded in using sealing welding technique
(3) butt welding couples.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721599566.6U CN207515586U (en) | 2017-11-24 | 2017-11-24 | A kind of forced air cooler chip structure for preventing percussive pressure from damaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721599566.6U CN207515586U (en) | 2017-11-24 | 2017-11-24 | A kind of forced air cooler chip structure for preventing percussive pressure from damaging |
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| Publication Number | Publication Date |
|---|---|
| CN207515586U true CN207515586U (en) | 2018-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721599566.6U Active CN207515586U (en) | 2017-11-24 | 2017-11-24 | A kind of forced air cooler chip structure for preventing percussive pressure from damaging |
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| CN (1) | CN207515586U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111879155A (en) * | 2020-08-25 | 2020-11-03 | 广州广恒日森机械有限公司 | Heat exchanger structure |
-
2017
- 2017-11-24 CN CN201721599566.6U patent/CN207515586U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111879155A (en) * | 2020-08-25 | 2020-11-03 | 广州广恒日森机械有限公司 | Heat exchanger structure |
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