CN207503968U - A kind of new type superthin PLCC modules - Google Patents
A kind of new type superthin PLCC modules Download PDFInfo
- Publication number
- CN207503968U CN207503968U CN201721437836.3U CN201721437836U CN207503968U CN 207503968 U CN207503968 U CN 207503968U CN 201721437836 U CN201721437836 U CN 201721437836U CN 207503968 U CN207503968 U CN 207503968U
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- CN
- China
- Prior art keywords
- pin
- chip
- plcc
- shell
- wiring board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The utility model discloses a kind of new type superthin PLCC modules, including flexible board, first line plate, the second wiring board, optical filter, shell, groove, pin, chip and cap.The beneficial effects of the utility model are：Second angle of wiring board four is provided with protrusion cushion pad, the four flat-sided flat packages with cushion pad, prevent during transport pin occur bending and deformation, between pin apart from very little and pin it is very thin, it is small with appearance and size, the advantages of reliability is high, reliability greatly improves, it is welded between pin and chip and flexible board by control collapsed chip method, improve electric heating property, so as to reach the reliable and stable work of circuit, chip is attached by being placed in groove with pin, further reduce the packaging height of PLCC modules, meets mobile terminal to pursue the needs of ultra-thin, cap card is placed on the contact of upper surface of outer cover, encapsulate delay time diminution, it is easily achieved component high speed, improve assembly yield.
Description
Technical field
The utility model is related to a kind of PLCC modules, specially a kind of new type superthin PLCC modules belong to PLCC encapsulation skills
Art field.
Background technology
One of PLCC, the plastic chip carrier surface mount packages with lead, shape is square, and the encapsulation of 32 feet is drawn
Foot is drawn from four sides of encapsulation, is plastic products in T-shaped, appearance and size is more much smaller than DIP encapsulation, and PLCC encapsulation is suitable
SMT surface mounting techniques installation wiring on PCB is shared, has the advantages that appearance and size is small, reliability is high.
At present, PLCC is widely used in various mobile terminals, but existing PLCC modules thickness is larger, the envelope of PLCC modules
Dress size is big more than chip, and packaging efficiency is very low, has accounted for many effective mounting areas, power consumption also increases therewith, and moves end
End is ultra-thin in order to pursue, it will usually it is required that reducing the packaging height of PLCC, therefore existing PLCC modules cannot meet shifting
The demand of dynamic terminal, how preferably to reduce the packaging height of PLCC is those skilled in the art's urgent problem to be solved.
Utility model content
The purpose of this utility model is that solve the above-mentioned problems and provides a kind of new type superthin PLCC modules.
The utility model is achieved through the following technical solutions above-mentioned purpose：A kind of new type superthin PLCC modules, including soft
Property plate, first line plate, the second wiring board, optical filter, shell, groove, pin, chip and cap；The flexible board setting
Between first line plate and the second wiring board, one end of the flexible board is placed in the bottom of first line plate, the flexibility
The other end of plate is placed in the top of the second wiring board, and the first line plate is connected by flexible board and the second wiring board
It connects, the first line plate is located at the left side of the second wiring board, and optical filter, shell and encapsulation are equipped with above second wiring board
Lid, the optical filter are located at the center of the second wiring board, and the optical filter is fixed on flexible board, and the optical filter is connected to
Between flexible board and shell, the groove opens up on the shell, and the pin is separately positioned on the surrounding of shell, and the pin is worn
It crosses shell chip and flexible board link together, the chip is placed in groove on the shell, and the cap is located at core
The surrounding of the top of piece, the cap and shell is fixed together.
Preferably, pin occurs bending and deformation during transport in order to prevent, described second wiring board, four angle settings
There is protrusion cushion pad.
Preferably, in order to greatly improve reliability, between the pin apart from very little and pin it is very thin.
Preferably, in order to improve electric heating property, pass through control collapsed chip method between the pin and chip and flexible board
It is welded.
Preferably, in order to reduce the packaging height of PLCC modules, the chip is carried out by being placed in groove with pin
Connection.
Preferably, in order to realize component high speed, the cap card is placed on the contact of upper surface of outer cover.
The beneficial effects of the utility model are：New type superthin PLCC module designs are reasonable, and the second angle of wiring board four is set
Be equipped with protrusion cushion pad, the flat-sided flat package of four with cushion pad, prevent during transport pin occur bending and deformation, pin it
Between apart from very little and pin it is very thin, have the advantages that appearance and size is small, reliability is high, reliability greatly improves, pin and chip
It is welded between flexible board by control collapsed chip method, improves electric heating property, so as to reach the reliable and stable work of circuit
Make, chip is attached by being placed in groove with pin, further reduces the packaging height of PLCC modules, meets movement eventually
End is in order to pursue ultra-thin demand, and cap card is placed on the contact of upper surface of outer cover, and encapsulation delay time reduces, it is easy to accomplish group
Part high speed, improves assembly yield.
Description of the drawings
FIG. 1 is a schematic structural view of the utility model；
In figure：1st, flexible board, 2, first line plate, the 3, second wiring board, 4, optical filter, 5, shell, 6, groove, 7, draw
Foot, 8, chip and 9, cap.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
Referring to Fig. 1, a kind of new type superthin PLCC modules, including flexible board 1, first line plate 2, the second wiring board 3, filter
Mating plate 4, shell 5, groove 6, pin 7, chip 8 and cap 9；The flexible board 1 is arranged on 2 and second circuit of first line plate
Between plate 3, one end of the flexible board 1 is placed in the bottom of first line plate 2, and the other end of the flexible board 1 is placed in
The top of two wiring boards 3, the first line plate 2 are attached by flexible board 1 and the second wiring board 3, the first line
Plate 2 is located at the left side of the second wiring board 3, and 3 top of the second wiring board is equipped with optical filter 4, shell 5 and cap 9, the filter
Mating plate 4 is located at the center of the second wiring board 3, and the optical filter 4 is fixed on flexible board 1, and the optical filter 4 is connected to flexibility
Between plate 1 and shell 5, the groove 6 is opened on shell 5, and the pin 7 is separately positioned on the surrounding of shell 5, the pin
7 link together chip 8 and flexible board 1 across shell 5, and the chip 8 is placed in the groove 6 on shell 5, the encapsulation
Lid 9 is located at the top of chip 8, and the surrounding of the cap 9 and shell 5 is fixed together, and described second wiring board, 3 four angles are set
Be equipped with protrusion cushion pad, the flat-sided flat package of four with cushion pad, prevent during transport pin 7 occur bending and deformation, it is described
Between pin 7 apart from very little and pin it is very thin, have the advantages that appearance and size is small, reliability is high, reliability greatly improves, described
It is welded between pin 7 and chip 8 and flexible board 1 by control collapsed chip method, improves electric heating property, so as to reach circuit
Reliable and stable work, the chip 8 is attached by being placed in groove 6 with pin 7, further reduction PLCC modules
Packaging height meets mobile terminal to pursue the needs of ultra-thin, and the cap 9 blocks the contact for being placed on 5 upper surface of shell, envelope
Fill delay time diminution, it is easy to accomplish component high speed improves assembly yield.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned exemplary embodiment, and
And in the case of the spirit or essential attributes without departing substantially from the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that by containing in the equivalent requirements of the claims is fallen
All changes in justice and range are embraced therein.Any reference numeral in claim should not be considered as limitation
Involved claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in each embodiment can also be properly combined, forms those skilled in the art
The other embodiment being appreciated that.
Claims (5)
1. a kind of new type superthin PLCC modules, it is characterised in that：Including flexible board (1), first line plate (2), the second wiring board
(3), optical filter (4), shell (5), groove (6), pin (7), chip (8) and cap (9)；The flexible board (1) is arranged on
Between first line plate (2) and the second wiring board (3), one end of the flexible board (1) is placed in the bottom of first line plate (2)
Portion, the other end of the flexible board (1) are placed in the top of the second wiring board (3), and the first line plate (2) passes through flexible board
(1) it being attached with the second wiring board (3), the first line plate (2) is positioned at the left side of the second wiring board (3), and described second
Optical filter (4), shell (5) and cap (9) are equipped with above wiring board (3), the optical filter (4) is positioned at the second wiring board (3)
Center at, the optical filter (4) is fixed on flexible board (1), and the optical filter (4) is connected to flexible board (1) and shell (5)
Between, the groove (6) is opened on shell (5), and the pin (7) is separately positioned on the surrounding of shell (5), the pin
(7) chip (8) and flexible board (1) are linked together across shell (5), the chip (8) is placed on the groove on shell (5)
(6) in, the cap (9) is fixed together positioned at the top of chip (8), the cap (9) and the surrounding of shell (5).
2. a kind of new type superthin PLCC modules according to claim 1, it is characterised in that：Second wiring board (3) four
A angle is provided with protrusion cushion pad.
3. a kind of new type superthin PLCC modules according to claim 1, it is characterised in that：The pin (7) and chip (8)
It is welded between flexible board (1) by control collapsed chip method.
4. a kind of new type superthin PLCC modules according to claim 1, it is characterised in that：The chip (8) passes through placement
It is attached in groove (6) with pin (7).
5. a kind of new type superthin PLCC modules according to claim 1, it is characterised in that：Cap (9) card is placed on
The contact of shell (5) upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721437836.3U CN207503968U (en) | 2017-11-01 | 2017-11-01 | A kind of new type superthin PLCC modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721437836.3U CN207503968U (en) | 2017-11-01 | 2017-11-01 | A kind of new type superthin PLCC modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207503968U true CN207503968U (en) | 2018-06-15 |
Family
ID=62502178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721437836.3U Expired - Fee Related CN207503968U (en) | 2017-11-01 | 2017-11-01 | A kind of new type superthin PLCC modules |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207503968U (en) |
-
2017
- 2017-11-01 CN CN201721437836.3U patent/CN207503968U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180615 Termination date: 20191101 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |