CN207491291U - A kind of folder foil base circuit board with self heat dissipation function - Google Patents
A kind of folder foil base circuit board with self heat dissipation function Download PDFInfo
- Publication number
- CN207491291U CN207491291U CN201721296739.7U CN201721296739U CN207491291U CN 207491291 U CN207491291 U CN 207491291U CN 201721296739 U CN201721296739 U CN 201721296739U CN 207491291 U CN207491291 U CN 207491291U
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- Prior art keywords
- heat dissipation
- layer
- plate body
- circuit plate
- heat dissipating
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
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Abstract
The utility model discloses a kind of folder foil base circuit boards with self heat dissipation function, including circuit plate body heat dissipating layer, through-hole is provided among the circuit plate body heat dissipating layer, and it is provided with silk-screen adhesive layer below circuit plate body heat dissipating layer, heat dissipation metal substrate is provided with below the silk-screen adhesive layer, setting cooling layer above the circuit plate body heat dissipating layer, and circuit element is installed inside cooling layer, it is flow chamber inside the cooling layer, the left side of its flow chamber is water inlet, and is water outlet on the right side of flow chamber.The folder foil base circuit board heat dissipation metal substrate and wiring board combination stability with self heat dissipation function are good, with excellent thermal diffusivity, it can also improve wiring board wiring density simultaneously, with excellent electrical property, electromagnetic wave shielding, and due to devising heat dissipation metal substrate more than circuit plate body heat dissipating layer so that this kind of heat dissipation metal wiring board has good machining property and effectively improve circuit design freedom, improve wiring density.
Description
Technical field
The utility model is related to press from both sides foil base circuit board technical field, specially a kind of folder foil baseline with self heat dissipation function
Road plate.
Background technology
Wiring board is the base electronic element that nearly all required by electronic product is wanted, with the development of science and technology, electronic product
Integrated level it is higher and higher, volume is more done smaller so that the component calorific value on wiring board is increasing, particularly in LED
The special industries such as illumination, the requirement to heat dissipation for the quality of harshness, heat dissipation by will be directly related to the quality of product and using the longevity
Life, existing common line plate can not meet the needs of this kind of product, have so urgent need is a kind of novel from heat dissipation work(
The folder foil base circuit board of energy.
Utility model content
The purpose of this utility model is to provide a kind of folder foil base circuit board with self heat dissipation function, to solve the above-mentioned back of the body
The existing design used proposed in scape technology is unreasonable, and the integrated level of electronic product is higher and higher, and volume is more done smaller so that
Component calorific value on wiring board is increasing, and particularly in special industries such as LED illuminations, the requirement to heat dissipation is by being severe
The problem of carving, influencing the quality and service life of product.
To achieve the above object, the utility model provides following technical solution, a kind of folder foil base with self heat dissipation function
Wiring board including circuit plate body heat dissipating layer, is provided with through-hole, and circuit plate body dissipates among the circuit plate body heat dissipating layer
Silk-screen adhesive layer is provided with below thermosphere, heat dissipation metal substrate, the wiring board are provided with below the silk-screen adhesive layer
Setting cooling layer above main body heat dissipating layer, and circuit element is installed inside cooling layer, it is flow chamber inside the cooling layer,
The left side of flow chamber is water inlet, and is water outlet on the right side of flow chamber.
Preferably, the circuit plate body heat dissipating layer, heat dissipation metal substrate and silk-screen adhesive layer are correspondingly arranged composition mirror
As structure.
Preferably, the heat dissipation metal substrate is bigger 1-3mm than circuit plate body heat dissipating layer profile.
Preferably, the cooling layer is plastics, and cooling layer is mutually close to circuit element.
Preferably, the cooling layer bonds, and the water inlet of cooling layer both sides is with going out with circuit plate body heat dissipating layer front
The mouth of a river is on same horizontal line.
Compared with prior art, the beneficial effects of the utility model are：The folder foil base circuit board with self heat dissipation function
Heat dissipation metal substrate is good with wiring board combination stability, has excellent thermal diffusivity, while can also improve wiring board wiring density,
With excellent electrical property, electromagnetic wave shielding, and due to devising heat dissipation metal substrate more than circuit plate body heat dissipating layer so that
This kind of heat dissipation metal wiring board has good machining property and effectively improves that circuit design freedom, to improve wiring close
Degree, difference and the single-sided clamp foil base circuit board of common LED, can be widely used in power hybrid integrated circuit, Switching Power Supply,
The manufacture of the electronic equipments such as automobile, naval vessel.Circuit plate body heat dissipating layer, heat dissipation metal substrate and silk-screen adhesive layer are correspondingly arranged
Forming mirror-image structure, double-layer mirror image structure so that the hardened stability of closing of whole circuit is good, has excellent thermal diffusivity, while
Wiring board wiring density can be improved, there is excellent electrical property, electromagnetic wave shielding, heat dissipation metal substrate radiates than circuit plate body
The big 1-3mm of layer profile so that this kind of heat dissipation metal wiring board has good machining property and effectively improve circuit design
Degree of freedom improves wiring density, difference and the single-sided clamp foil base circuit board of common LED, can be widely used in power mixing
Integrated circuit, Switching Power Supply, the manufacture of the electronic equipments such as automobile, naval vessel, cooling layer are plastics, and cooling layer and circuit element phase
Mutually it is close to so that cooling layer can be covered on electronic component, cooling down degree of heat radiation more preferably, and cooling layer radiates with circuit plate body
Layer front bonds, and the water inlet of cooling layer both sides and water outlet are on same horizontal line so that cooling layer water flow inside
The water of chamber can flow, and flow absorbs heat, and heat is driven to be lost in rapidly, cool down better heat-radiation effect.
Description of the drawings
Fig. 1 is the utility model circuit plate body heat dissipating layer overlooking the structure diagram；
Fig. 2 is the utility model positive structure schematic.
In figure：1st, circuit plate body heat dissipating layer, 2, heat dissipation metal substrate, 3, through-hole, 4, silk-screen adhesive layer, 5, flow
Chamber, 6, water inlet, 7, cooling layer, 8, circuit element, 9, water outlet.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of folder foil baseline road with self heat dissipation function
Plate including circuit plate body heat dissipating layer 1, is provided with through-hole 3, and circuit plate body heat dissipating layer 1 among circuit plate body heat dissipating layer 1
Lower section is provided with silk-screen adhesive layer 4, and circuit plate body heat dissipating layer 1, heat dissipation metal substrate 2 are corresponding with silk-screen adhesive layer 4 to be set
Put composition mirror-image structure, double-layer mirror image structure so that the hardened stability of closing of whole circuit is good, has excellent thermal diffusivity, simultaneously
Also wiring board wiring density can be improved, there is excellent electrical property, electromagnetic wave shielding, heat dissipation metal substrate 2 is than circuit plate body
The big 1-3mm of 1 profile of heat dissipating layer so that this kind of heat dissipation metal wiring board has good machining property and effectively improve circuit
Design freedom improves wiring density, difference and the single-sided clamp foil base circuit board of common LED, can be widely used in power
Hydrid integrated circuit, Switching Power Supply, the manufacture of the electronic equipments such as automobile, naval vessel, 4 lower section of silk-screen adhesive layer are provided with metal and dissipate
Hot substrate 2,1 top setting cooling layer 7 of circuit plate body heat dissipating layer, and circuit element 8 is installed inside cooling layer 7, cooling layer 7
For plastics, and cooling layer 7 is mutually close to circuit element 8 so that cooling layer 7 can cover on electronic component 8, cooling heat dissipation
More preferably, cooling layer 7 bonds, and with 1 front of circuit plate body heat dissipating layer at the water inlet 6 of 7 both sides of cooling layer and water outlet 9 degree
In on same horizontal line so that the water of 7 water flow inside chamber 5 of cooling layer can flow, and flow absorbs heat, drive heat rapid
It is lost in, cools down better heat-radiation effect, the inside of cooling layer 7 is flow chamber 5, and the left side of flow chamber 5 is water inlet 6, and flow chamber 5
Right side is water outlet 9.
Operation principle：When using the folder foil base circuit board with self heat dissipation function, pass through circuit plate body heat dissipating layer 1
Bottom setting heat dissipation metal substrate 2 it is with being equipped on heat dissipation metal substrate 2 consistent with 1 hole of circuit plate body heat dissipating layer position
Through-hole 3 exposes circuit pads, is welded so that heat dissipation metal substrate 2 passes through silk-screen conducting adhesive oxidant layer 4 and wiring board
The connection of main body heat dissipating layer 1 is fixed, and using the superior thermal conductivity of metal, is radiated to circuit plate body heat dissipating layer 1, while pressing from both sides
Foil substrate face can to circuit elements device 8 weld, so as to by excellent electrical property, electromagnetic wave shielding distribute heat,
Again by entering the flow chamber 5 of cooling layer 7 from 6 water flowing of water inlet, the heat that circuit element 8 generates is taken away by water, finally
It is flowed out by water outlet 9, here it is the use processes of the folder foil base circuit board with self heat dissipation function.
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art is come
Say, can still modify to the technical solution recorded in foregoing embodiments or to which part technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (5)
1. a kind of folder foil base circuit board with self heat dissipation function, including circuit plate body heat dissipating layer（1）, it is characterised in that：Institute
State circuit plate body heat dissipating layer（1）Centre is provided with through-hole（3）, and circuit plate body heat dissipating layer（1）Lower section is provided with silk-screen and glues
Tie oxidant layer（4）, the silk-screen adhesive layer（4）Lower section is provided with heat dissipation metal substrate（2）, the circuit plate body heat dissipating layer
（1）Top sets cooling layer（7）, and cooling layer（7）Inside is equipped with circuit element（8）, the cooling layer（7）Inside is flow
Chamber（5）, flow chamber（5）Left side be water inlet（6）, and flow chamber（5）Right side is water outlet（9）.
2. a kind of folder foil base circuit board with self heat dissipation function according to claim 1, it is characterised in that：The circuit
Plate body heat dissipating layer（1）, heat dissipation metal substrate（2）With silk-screen adhesive layer（4）It is correspondingly arranged composition mirror-image structure.
3. a kind of folder foil base circuit board with self heat dissipation function according to claim 1, it is characterised in that：The metal
Heat-radiating substrate（2）Than circuit plate body heat dissipating layer（1）The big 1-3mm of profile.
4. a kind of folder foil base circuit board with self heat dissipation function according to claim 1, it is characterised in that：The cooling
Layer（7）For plastics, and cooling layer（7）With circuit element（8）Mutually it is close to.
5. a kind of folder foil base circuit board with self heat dissipation function according to claim 1, it is characterised in that：The cooling
Layer（7）With circuit plate body heat dissipating layer（1）Front bonds, and cooling layer（7）The water inlet of both sides（6）With water outlet（9）It is in
On same horizontal line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721296739.7U CN207491291U (en) | 2017-10-10 | 2017-10-10 | A kind of folder foil base circuit board with self heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721296739.7U CN207491291U (en) | 2017-10-10 | 2017-10-10 | A kind of folder foil base circuit board with self heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207491291U true CN207491291U (en) | 2018-06-12 |
Family
ID=62479813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721296739.7U Expired - Fee Related CN207491291U (en) | 2017-10-10 | 2017-10-10 | A kind of folder foil base circuit board with self heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207491291U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110113867A (en) * | 2019-05-31 | 2019-08-09 | 维沃移动通信有限公司 | Radiator structure and mobile terminal |
-
2017
- 2017-10-10 CN CN201721296739.7U patent/CN207491291U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110113867A (en) * | 2019-05-31 | 2019-08-09 | 维沃移动通信有限公司 | Radiator structure and mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180612 Termination date: 20181010 |