CN207422710U - Semiconductor refrigerating air-conditioning - Google Patents
Semiconductor refrigerating air-conditioning Download PDFInfo
- Publication number
- CN207422710U CN207422710U CN201721459707.4U CN201721459707U CN207422710U CN 207422710 U CN207422710 U CN 207422710U CN 201721459707 U CN201721459707 U CN 201721459707U CN 207422710 U CN207422710 U CN 207422710U
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- air
- backboard
- shell
- cabinet
- semiconductor refrigerating
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Abstract
The utility model discloses a kind of semiconductor refrigerating air-conditionings, including the backboard being embedded on cabinet, lid closes the shell on backboard, and the in vivo refrigeration part of chamber formed mounted on backboard and shell, the first air inlet for being located at backboard top and the first air outlet for being located at outer casing underpart form the first air passage, the second air inlet for being located at outer casing underpart and the second air outlet for being located at backboard top form the second air passage, it is equipped at first air outlet by the first row of fan of the in vivo air discharge of cabinet, it is equipped at second air outlet and external air is sucked into vivo second exhaust fan of cabinet, the air that first air passage and the cooperation of the second air passage are exchanged inside and outside cabinet forms outer circulation.This programme solve DTU in-cabinet temperatures, humidity it is excessive caused by internal component decreasing insulating, normal service life degradation, caused by equipment safety hidden danger.
Description
Technical field
The utility model is related to constant temperature dehumidification apparatus, and in particular to the semiconductor refrigerating air-conditioning of DTU cabinets in a kind of ring main unit.
Background technology
Ring main unit (Ring Main Unit) is that one group of transmission ＆ distribution electrical equipment (high-tension switch gear) is mounted in metal or non-gold
Belong in insulation cabinet body or make the electrical equipment of assembled compartment ring network power supplying units, core is using on-load switch and melts
Disconnected device, has many advantages, such as that simple in structure, small, price is low, can improve power supply parameter and performance and power supply safety.It is wide
The general power distribution station for being used in the load centers such as Urban Residential District, skyscraper, large public building, factory and enterprise and box
In substation.
DTU (Data Transfer unit) is used exclusively for serial data being converted to IP data or turns IP data
It is changed to the wireless terminal device that serial data is transmitted by cordless communication network.DTU cabinets are typically mounted at conventional opening and closing
Institute's (station), outdoor small-sized switching station, ring main unit, Small Substation, box-type substation etc. complete the position letter of switching devices
Number, the acquisition and calculating of the data such as voltage, electric current, active power, reactive power, power factor, electric flux, it is split to put row point into
Closing operation realizes the fault identification to feeder switch, isolation and restores electricity to non-faulting section.Part DTU is also equipped with
Protection and the function of alternate power autocast.
Utility model content
The technical problems to be solved in the utility model is：There is provided a kind of solution DTU in-cabinet temperatures, humidity is excessive partly leads
Body refrigeration air-conditioner.
Technical solution is used by the utility model solves its technical problem：
A kind of semiconductor refrigerating air-conditioning, including the backboard being embedded on cabinet, lid closes the shell on backboard and is mounted on
The in vivo refrigeration part of chamber that backboard and shell are formed is located at first air inlet on backboard top and is located at the first of outer casing underpart
Air outlet forms the first air passage, and the second air inlet for being located at outer casing underpart and the second air outlet for being located at backboard top form second
Air passage is equipped with the first row of fan of the in vivo air discharge of cabinet at the first air outlet, and being equipped at the second air outlet will be outer
The air that air sucking in vivo second exhaust fan of cabinet in portion, the first air passage and the cooperation of the second air passage are exchanged inside and outside cabinet forms outer
Xun Huan.
Further, refrigeration part is fixed by the bracket in backboard and the cavity of shell formation；Stent and refrigeration part
Cavity is separated to form air passage.
Further, stent be " Z " type, including upper spacer, middle partition plate and lower clapboard, upper spacer it is parallel with lower clapboard and
Backboard is each perpendicular to, upper spacer is fixed on backboard top, and lower clapboard is fixed on outer casing underpart, and middle partition plate is parallel to backboard, interval
The upper end connection upper spacer of plate, lower end connection lower clapboard.
Further, several perforative mounting grooves are offered on middle partition plate, the cooling piece of refrigeration part is equipped in mounting groove,
Cooling piece is fixed by being mounted on the thermal component of middle partition plate both sides.
Further, thermal component includes support plate and several cooling fins, and several cooling fins are arranged in parallel and pacify vertically
On the supporting plate, support plate is fixed on middle partition plate dress.
Further, outer casing inner wall top is equipped with control unit, control unit and the first row of fan and the second exhaust fan
It connects and controls the first row of fan and the switch of the second exhaust fan.
The beneficial effects of the utility model are：This programme solve DTU in-cabinet temperatures, humidity it is excessive caused by internal first device
Part decreasing insulating, normal service life degradation, caused by equipment safety hidden danger.Temperature, humidity in DTU cabinets is larger
Air can be discharged by the first air passage, the cold air outside DTU cabinets can be entered by the second air passage inside DTU cabinets, so as to complete
The outer loop process of semiconductor refrigerating air-conditioning realizes heat dissipation, dehumidifying inside DTU cabinets.
Description of the drawings
Fig. 1 is the structure diagram of the utility model semiconductor refrigerating air-conditioning；
Fig. 2 is the structure diagram of the utility model semiconductor refrigerating air-conditioning other direction；
Fig. 3 is the front view of the utility model semiconductor refrigerating air-conditioning；
Fig. 4 is the A-A sectional views of Fig. 3.
In figure：
1- backboards；
2- shells；
3- stents, 31- upper spacers, partition plate in 32-, 33- lower clapboards；
41- the first row of fan, the second exhaust fans of 42-；
5- thermal components, 51- support plates, 52- cooling fins；
6- control units；
7- fixed plates；
The first air passages of 11-, the first air inlets of 111-, the first air outlets of 112-；
The second air passages of 12-, the second air inlets of 121-, the second air outlets of 122-.
Specific embodiment
In order to which those skilled in the art is made to more fully understand the technical solution of the utility model, below in conjunction with the accompanying drawings and have
The utility model is described in further detail for body embodiment.
As shown in Figures 1 to 4, a kind of semiconductor refrigerating air-conditioning, including backboard 1, shell 2, stent 3, thermal component 5 and control
Component 6 processed.The lid of shell 2 is closed on backboard 1, and 2 inner wall of shell and 1 inner wall of backboard surround inner cavity.
As shown in Figure 1, Figure 2, Figure 4 shows, it is located at first air inlet 111 on 1 top of backboard and is located at the first of 2 lower part of shell
Air port 112 forms the first air passage 11, is equipped at the first air outlet 112 by the first row of fan 41 of the in vivo air discharge of cabinet.
The second air inlet 121 for being located at 2 lower part of shell and the second air passage 12 of the second air outlet 122 formation for being located at 1 top of backboard, second
It is equipped at air outlet 122 and external air is sucked into vivo second exhaust fan 42 of cabinet.First air passage 11 and the second air passage 12
The air that cooperation exchanges inside and outside cabinet forms outer circulation.
As shown in Figure 1, upper end connection 1 inner wall of backboard of stent 3, the inner wall of lower end connected with outer casing 2, stent 3 divide inner cavity
It is divided into the first air passage 11 of top and the second air passage 12 of lower section.Stent 3 be " Z " type, including upper spacer 31, middle partition plate 32 and under
Partition plate 33.Upper spacer 31 is parallel with lower clapboard 33 and is each perpendicular to backboard 1, and upper spacer 31 is fixed on 1 top of backboard, lower clapboard
33 are fixed on 2 lower part of shell, and middle partition plate 32 is parallel to backboard 1, the upper end connection upper spacer 31 of middle partition plate 32, under the connection of lower end every
Plate 33.Several perforative mounting grooves are offered on middle partition plate 32, are equipped with cooling piece in mounting groove, cooling piece is by being mounted on interval
The thermal component 5 of 32 both sides of plate is fixed.
As shown in Figure 1 and Figure 2, the first air inlet 111 is located at the top of upper spacer 31, and the first air outlet 112 is located at lower clapboard
33 top.Second air inlet 121 is located at the lower section of lower clapboard 33, and the second air outlet 122 is located at the lower section of upper spacer 31.First
Exhaust fan 41 is mounted on the first air outlet 112 by fan fixing rack, and the second exhaust fan 42 is installed by fan fixing rack
In the second air outlet 122.
As shown in Figure 1, thermal component 5 includes support plate 51 and several cooling fins 52, several cooling fins 52 are arranged in parallel simultaneously
And be vertically installed in support plate 51, support plate 51 is fixed on middle partition plate 32.Support plate 51 is with being mounted in 2 inner wall of shell
Fixed plate 7 connects.
As shown in Figure 1, Figure 2, Figure 4 shows, control unit 6 is located at the first air passage 11 and mounted on 2 upper inside wall of shell, control
Component 6 is connected with 41 and second exhaust fan 42 of the first row of fan, and control unit 6 controls 41 and second exhaust fan 42 of the first row of fan
Opening and closing.
Wherein, upper spacer 31 and lower clapboard 33 are metal partion (metp), and middle partition plate 32 is heat-insulated epoxy plate.Control unit 6 is to open
Powered-down source, Switching Power Supply are mounted on the upper inside wall of shell 2 by power shelf.
Outer loop process is as follows：
From the first air inlet under the suction of the first row of fan 41 of the hot-air at the first air outlet 112 inside DTU cabinets
111 enter the first air passage 11, and pass through thermal component 5 and radiate, and are finally discharged from the first air outlet 112.Cold sky outside DTU cabinets
Under the suction of the second exhaust fan 4 of the gas at the second air outlet 122, enter the second air passage 12 from the second air inlet 121, finally lead to
The second air outlet 122 is crossed to enter in DTU cabinets.
Above embodiment does not form the restriction to the technical solution protection domain, any in the above embodiment
Spirit and principle within the modifications, equivalent substitutions and improvements made etc., should be included in the technical solution protection domain it
It is interior.
Claims (6)
1. a kind of semiconductor refrigerating air-conditioning, including the backboard (1) being embedded on cabinet, lid closes the shell (2) on backboard (1), with
And the in vivo refrigeration part of chamber formed mounted on backboard (1) and shell (2), it is characterised in that：It is located at the of backboard (1) top
One air inlet (111) and the first air outlet (112) formation the first air passage (11) for being located at shell (2) lower part, are located under shell (2)
It second air inlet (121) in portion and is located at second air outlet (122) on backboard (1) top and forms the second air passage (12), described the
It is equipped at one air outlet (112) by the first row of fan (41) of cabinet in vivo air discharge, at second air outlet (122)
It is equipped with and external air is sucked into vivo second exhaust fan (42) of cabinet, the first air passage (11) and the second air passage (12) cooperation is handed over
The air changed inside and outside cabinet forms outer circulation.
2. semiconductor refrigerating air-conditioning according to claim 1, it is characterised in that：The refrigeration part is solid by stent (3)
Due in the cavity that backboard (1) and shell (2) are formed；Stent (3) separates cavity with refrigeration part to form air passage.
3. semiconductor refrigerating air-conditioning according to claim 2, it is characterised in that：The stent (3) is " Z " type, including upper
Partition plate (31), middle partition plate (32) and lower clapboard (33), the upper spacer (31) is parallel with lower clapboard (33) and is each perpendicular to carry on the back
Plate (1), the upper spacer (31) are fixed on backboard (1) top, and the lower clapboard (33) is fixed on shell (2) lower part, in described
Partition plate (32) is parallel to backboard (1), the upper end connection upper spacer (31) of middle partition plate (32), lower end connection lower clapboard (33).
4. semiconductor refrigerating air-conditioning according to claim 3, it is characterised in that：It is offered on the middle partition plate (32) several
Perforative mounting groove, the interior cooling piece for being equipped with refrigeration part of the mounting groove, the cooling piece is by being mounted on middle partition plate (32)
The thermal component (5) of both sides is fixed.
5. semiconductor refrigerating air-conditioning according to claim 4, it is characterised in that：The thermal component (5) includes support plate
(51) it is arranged in parallel and is vertically installed in support plate (51), institute with several cooling fins (52), several cooling fins (52)
Support plate (51) is stated to be fixed on middle partition plate (32).
6. semiconductor refrigerating air-conditioning according to any one of claim 1 to 5, it is characterised in that：Shell (2) inner wall
Top is equipped with control unit (6), the control unit (6) be connected with the first row of fan (41) and the second exhaust fan (42) and
Control the switch of the first row of fan (41) and the second exhaust fan (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721459707.4U CN207422710U (en) | 2017-11-03 | 2017-11-03 | Semiconductor refrigerating air-conditioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721459707.4U CN207422710U (en) | 2017-11-03 | 2017-11-03 | Semiconductor refrigerating air-conditioning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207422710U true CN207422710U (en) | 2018-05-29 |
Family
ID=62307406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721459707.4U Active CN207422710U (en) | 2017-11-03 | 2017-11-03 | Semiconductor refrigerating air-conditioning |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207422710U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117212920A (en) * | 2023-09-19 | 2023-12-12 | 广东英为拓科技有限公司 | Semiconductor dehumidifier with multi-air-channel structure |
-
2017
- 2017-11-03 CN CN201721459707.4U patent/CN207422710U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117212920A (en) * | 2023-09-19 | 2023-12-12 | 广东英为拓科技有限公司 | Semiconductor dehumidifier with multi-air-channel structure |
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