CN207410311U - A kind of complete quartz crystal resonator of modified electrode connection structure - Google Patents
A kind of complete quartz crystal resonator of modified electrode connection structure Download PDFInfo
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- CN207410311U CN207410311U CN201721507571.XU CN201721507571U CN207410311U CN 207410311 U CN207410311 U CN 207410311U CN 201721507571 U CN201721507571 U CN 201721507571U CN 207410311 U CN207410311 U CN 207410311U
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Abstract
The utility model discloses a kind of complete quartz crystal resonator of modified electrode connection structure, it is related to quartz-crystal resonator field, two corners on a pair of of linea angulata of quartz wafer set metal layer, and metal layer includes the upper metal layer for being arranged on quartz wafer upper surface and the lower metal layer for being arranged on quartz wafer lower surface；Upper metal layer and quartz wafer are equipped with perforative through hole one, two corners on a pair of of linea angulata of encapsulation base are respectively equipped with through hole two and through hole three, after quartz wafer is mounted on encapsulation base, the perforation of through hole one and through hole two, through hole three and lower metal layer contact；The metal-coated layer of the inner wall of through hole one, through hole two and through hole three, and it is internal filled with sealing medium.The problem of metal material that the utility model solves the semicircle ring structure plating set at two endpoints of existing complete quartz crystal resonator quartz wafer a pair of linea angulata easily comes off, and the metal layer after coming off causes bad stability in conduction.
Description
Technical field
The utility model is related to quartz-crystal resonator field more particularly to a kind of full quartz of modified electrode connection structure
Crystal resonator.
Background technology
Quartz oscillator also known as quartz resonator, abbreviation crystal oscillator are to utilize the quartz crystal slice with piezoelectric effect
It is manufactured.This quartz crystal can generate mechanical oscillation when being acted on be subject to applied alternating field, when the frequency of alternating electric field
When rate is identical with the intrinsic frequency of quartz crystal, vibration just becomes very strong, and here it is the reactions of crystal resonant characteristic.Utilize this
Kind characteristic, it is possible to quartz resonator substitution LC (coil and capacitance) resonant tank, wave filter etc..Due to quartz resonance utensil
Have the advantages that small, light-weight, reliability is high, frequency stability is high, be applied in household electrical appliance and communication equipment.Quartz
Resonator is used primarily in the oscillating circuit for requiring frequency sufficiently stable because having high frequency stability and makees resonant element
Part.
The utility model patent of Patent No. 201521073610.0 discloses a kind of quartz with Circular wafer structure
Crystal resonator, it is encapsulated by quartz wafer, cap and encapsulation base, and quartz wafer includes round member, connecting portion
And protecting frame, free oscillation in the cavity that round member can be after packaging are provided with electrode district, connecting portion and guarantor on round member
It protects on frame and is provided with metal layer A, be provided with metal layer B in the location hole on protecting frame, pin, electrode are provided on encapsulation base
Area is electrically connected with the pin and is by metal layer A, metal layer B.This full quartz resonator can be used for the low cost of miniaturization resonator
Mass production, and quartz plate center can be enhanced can fall into effect, significantly promote homogeneity of product.But this full quartz
Crystal resonator has the disadvantages that：On quartz wafer, semicircular ring is provided at two endpoints of quartz wafer a pair of linea angulata
Structure, metal-coated material on this semicircle ring structure, metal layer and envelope of this metal material as outer lead connection motor area
The pin on pedestal is filled, pin reconnection has external circuit, and still, metal material is arranged on the outside of encapsulation base as lead,
Metal liftoff is easy to cause, the metal layer after coming off causes bad stability in conduction；In addition, the quartz on quartz wafer
Wafer central region is circle, and the shape of corresponding electrode is circle, and circular electrode is when setting, due to round size and half
Footpath size, when designing chip, only two parameters of wafer radius and electrode radius are designed with limitation.
Utility model content
The purpose of this utility model is that：To solve the two of existing complete quartz crystal resonator quartz wafer a pair of linea angulata
The metal material of the semicircle ring structure plating set at a endpoint easily comes off, and the metal layer after coming off causes to stablize in conduction
Property the problem of being deteriorated, the utility model provides a kind of complete quartz crystal resonator of modified electrode connection structure.
The technical solution of the utility model is as follows：
A kind of complete quartz crystal resonator of modified electrode connection structure, including cap, quartz wafer, encapsulation base,
The lower surface of cap is equipped with cap concave surface platform, and the upper and lower surface that quartz wafer includes includes in quartz wafer
Region and straight slot are entreated, the surface of quartz wafer middle section is covered with center double-faced plating belt electrode, center double-faced electrode plating
Including upper surface electrode plating and lower surface electrode plating, center double-faced electrode plating is connected with metal wiring layer, metal lead wire
Including upper metal lead wire and lower metal lead wire.The upper surface of the encapsulation base is equipped with encapsulation base concave surface platform, encapsulation base
Lower surface corner be equipped with pin.
Two corners on a pair of of linea angulata of the quartz wafer set metal layer, and metal layer includes being arranged on quartz wafer
The upper metal layer of upper surface and the lower metal layer for being arranged on quartz wafer lower surface, upper metal layer are connected with upper metal lead wire, under
Metal layer is connected with lower metal lead wire；Upper metal layer and quartz wafer are equipped with perforative through hole one, the pair of horns of encapsulation base
Two corners on line are respectively equipped with through hole two and through hole three, after quartz wafer is mounted on encapsulation base, through hole one and logical
The position in hole two is corresponding, through hole three and lower metal layer contact.
The metal-coated layer of the inner wall of through hole one, through hole two and through hole three, and through hole one, through hole two and through hole three are filled out
Filled with sealing medium.
Preferably, the metal layer material of the inner wall plating of the through hole one, the through hole two and the through hole three for silver,
The metal materials such as chromium, copper, gold, in principle, as long as metal material that can be conductive, may be used to metal in the utility model
Material.
Preferably, the sealing medium is low temperature glass, and sealing medium is low temperature glass, and low temperature glass has low softening
Temperature or low fusion temperature will not damage device in specific encapsulation, and it is at low cost under.In other embodiment
In, sealing medium is alternatively common metal or other nonmetallic materials.
Further, the shape of the upper surface electrode plating and lower surface electrode plating is rectangular or square.Rectangle
Or square, for circle, tool, can be real under the premise of ensureing that control methods are simple there are two regulatable parameter
Now more accurately regulate and control.
After using the above program, the beneficial effects of the present invention are：
(1) compared with prior art, the conducting path of electrode current is had been moved into crystals rather than crystal edge,
The metal layer of three inner wall of through hole one, through hole two and through hole is not easily to fall off, the stability of electric current is added, further, it is possible on ensureing
The uniformity that coating surface electrode and lower surface electrode plating are powered so that the effect of complete quartz crystal resonator is more excellent.
Through hole one, through hole two and through hole three filled with sealing medium, ensure that the tight encapsulation of the inside of complete quartz crystal resonator,
Air-tightness is more preferable.
(2) sealing medium is low temperature glass, and low temperature glass has low softening temperature or low fusion temperature, sealed specifically
Device will not be damaged during dress, and it is at low cost under.In other embodiment, sealing medium is alternatively common metal
Or other nonmetallic materials.
(3) shape of upper surface electrode plating and lower surface electrode plating is rectangular or square, rectangle or square
For circle, tool can be realized more precisely there are two regulatable parameter under the premise of ensureing that control methods are simple
Regulation and control.
Description of the drawings
Structure diagram when Fig. 1 is the utility model unencapsulated combination；
Fig. 2 is the top view of the quartz wafer of the utility model；
It is marked in figure：1- caps, 101- caps concave surface platform, 2- quartz wafers, 201- quartz wafer middle sections,
202- straight slots, 203a- upper surfaces electrode plating, 203b- lower surfaces electrode plating, 204- through holes one, the upper metal layers of 205a-,
205b- lower metal layers, the upper metal lead wires of 206a-, under 206b-metal lead wire, 3- encapsulation bases, 301- encapsulation bases concave surface is put down
Platform, 302a- through holes two, 302b- through holes three, 303- pins.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, the technical solution in the present embodiment is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the implementation of the part of the embodiment rather than whole of the utility model
Example.Based on the embodiment in the utility model, those of ordinary skill in the art are obtained without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
The complete quartz crystal resonator of the modified electrode connection structure of the present embodiment, including cap 1, quartz wafer 2, envelope
Pedestal 3 is filled, the lower surface of cap 1 is equipped with cap concave surface platform 101, and the upper and lower surface that quartz wafer 2 includes is equal
Including quartz wafer middle section 201 and straight slot 202, the surface of quartz wafer middle section 201 is covered with center double-faced plating
Belt electrode, center double-faced electrode plating include upper surface electrode plating 203a and lower surface electrode plating 203b, center double-faced plating
It covers electrode to be connected with metal wiring layer, metal lead wire includes encapsulation base described in upper metal lead wire 206a and lower metal lead wire 206b
3 upper surface is equipped with encapsulation base concave surface platform 301, and the corner of the lower surface of encapsulation base 3 is equipped with pin 303.
Two corners on a pair of of linea angulata of quartz wafer 2 set metal layer, and metal layer includes being arranged on quartz wafer 2
The upper metal layer 205a on surface and the lower metal layer 205b, upper metal layer 205a and upper metal for being arranged on 2 lower surface of quartz wafer
Lead 206a connections, lower metal layer 205b are connected with lower metal lead wire 206b；Upper metal layer 205a and quartz wafer 2, which are equipped with, to be passed through
The through hole 1 worn, two corners on a pair of of linea angulata of encapsulation base 3 are respectively equipped with three 302b of two 302a of through hole and through hole,
After quartz wafer 2 is mounted on encapsulation base 3, the perforation of two 302a of through hole 1 and through hole, three 302b of through hole and lower gold
Belong to layer 205b contacts.
The metal-coated layer of inner wall of three 302b of through hole 1, two 302a of through hole and through hole, and it is through hole 1, logical
Two 302a of hole and three 302b of through hole is filled with sealing medium.
In the complete quartz crystal resonator of the modified electrode connection structure of the utility model, for face electrode plating
203a is connected with upper metal lead wire 206a, and upper metal lead wire 206a is connected again with upper metal layer 205a, through hole 1, through hole two
The metal-coated layers of 302a, the metal layer be connected with upper metal layer 205a after by current lead-through to pin 303, pin 303 with it is outer
Portion's circuit board connection, it is achieved thereby that the energization of upper surface electrode plating 203a, for electrode plating 203b, the transmission of electric current
Path is：Metal layer-pin 3030- the external circuit board of lower three 302b of metal lead wire 206b- lower metal layer 205b- through holes.With
Existing technology is compared, and the conducting path of electrode current is had been moved to crystals rather than crystal edge, through hole 1 leads to
The metal layer of three 302b inner walls of two 302a of hole and through hole is not easily to fall off, the stability of electric current is added, further, it is possible on ensureing
The uniformity that coating surface electrode 203a and lower surface electrode plating 203b is powered so that the effect of complete quartz crystal resonator is more
Add excellent.Through hole 1, two 302a of through hole and three 302b of through hole filled with sealing medium, ensure that complete quartz crystal resonance
The tight encapsulation of the inside of device, air-tightness are more preferable.
In the present embodiment, the metal layer of the inner wall plating of three 302b of through hole 1, two 302a of the through hole and the through hole
Material is nickel.Sealing medium is low temperature glass, and low temperature glass has low softening temperature or low fusion temperature, encapsulated specifically
Shi Buhui damages device, and it is at low cost under.In other embodiment, sealing medium be alternatively common metal or
Person's others nonmetallic materials.
In addition, in the prior art, the quartz wafer central area on quartz wafer 2 is circular, the shape of corresponding electrode
For circle, due to round size only and radius size, when designing chip, only two parameters of wafer radius and electrode radius,
It is designed with limitation.In the present embodiment, the shape of upper surface electrode plating 203a and lower surface electrode plating 203b for rectangle or
For circle, tool can ensure that control methods are simple there are two regulatable parameter for square, rectangle or square
On the premise of realize more accurately to regulate and control.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned exemplary embodiment, and
And in the case of the spirit or essential attributes without departing substantially from the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new
The scope of type is indicated by the appended claims rather than the foregoing description, it is intended that will fall containing in the equivalent requirements of the claims
All changes in justice and scope are embraced therein.Any reference numeral in claim should not be considered as limitation
Involved claim.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
Bright book is as an entirety, and the technical solutions in each embodiment can also be properly combined, and forming those skilled in the art can be with
The other embodiment of understanding.
Claims (4)
1. a kind of complete quartz crystal resonator of modified electrode connection structure, including cap (1), quartz wafer (2), encapsulation base
Seat (3), covered with center double-faced electrode plating, the center double-faced of upper and lower surface plates on the surface of quartz wafer middle section (201)
Electrode is covered to be connected with upper metal lead wire (206a) and lower metal lead wire (206b) respectively, which is characterized in that
A pair of of linea angulata of the quartz wafer (2) is equipped with upper metal layer (205a) and position positioned at quartz wafer (2) upper surface
Lower metal layer (205b) in quartz wafer (2) lower surface, upper metal layer (205a) are connected with upper metal lead wire (206a), lower gold
Belong to layer (205b) to be connected with lower metal lead wire (206b)；Upper metal layer (205a) and quartz wafer (2) are equipped with perforative through hole
One (204), two corners on a pair of of linea angulata of encapsulation base (3) are respectively equipped with through hole two (302a) and through hole three (302b),
After quartz wafer (2) is mounted on encapsulation base (3), through hole one (204) is corresponding with the position of through hole two (302a), through hole
Three (302b) and lower metal layer (205b) contact；
The metal-coated layer of inner wall of through hole one (204), through hole two (302a) and through hole three (302b), and through hole one (204),
Through hole two (302a) and through hole three (302b) are filled with sealing medium.
A kind of 2. complete quartz crystal resonator of modified electrode connection structure according to claim 1, which is characterized in that institute
State the metal layer material of the inner wall plating of through hole one (204), the through hole two (302a) and the through hole three (302b) for silver or
Chromium.
A kind of 3. complete quartz crystal resonator of modified electrode connection structure according to claim 1, which is characterized in that institute
Sealing medium is stated as low temperature glass.
A kind of 4. complete quartz crystal resonator of modified electrode connection structure according to claim 1, which is characterized in that institute
The shape for stating upper surface electrode plating (203a) and lower surface electrode plating (203b) is rectangular or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721507571.XU CN207410311U (en) | 2017-11-13 | 2017-11-13 | A kind of complete quartz crystal resonator of modified electrode connection structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721507571.XU CN207410311U (en) | 2017-11-13 | 2017-11-13 | A kind of complete quartz crystal resonator of modified electrode connection structure |
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| CN207410311U true CN207410311U (en) | 2018-05-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107769750A (en) * | 2017-11-13 | 2018-03-06 | 成都泰美克晶体技术有限公司 | A kind of complete quartz crystal resonator of modified electrode attachment structure and preparation method thereof |
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2017
- 2017-11-13 CN CN201721507571.XU patent/CN207410311U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107769750A (en) * | 2017-11-13 | 2018-03-06 | 成都泰美克晶体技术有限公司 | A kind of complete quartz crystal resonator of modified electrode attachment structure and preparation method thereof |
| CN107769750B (en) * | 2017-11-13 | 2024-07-16 | 成都泰美克晶体技术有限公司 | All-quartz crystal resonator with improved electrode connection structure and preparation method thereof |
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