CN207379622U - Heat-conductive assembly and temperature measuring equipment - Google Patents
Heat-conductive assembly and temperature measuring equipment Download PDFInfo
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- CN207379622U CN207379622U CN201721546252.XU CN201721546252U CN207379622U CN 207379622 U CN207379622 U CN 207379622U CN 201721546252 U CN201721546252 U CN 201721546252U CN 207379622 U CN207379622 U CN 207379622U
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- heat
- conducting substrate
- measuring equipment
- connecting portion
- temperature measuring
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Abstract
The utility model discloses a kind of heat-conductive assemblies and temperature measuring equipment for conducting heat to temperature element.The heat-conductive assembly includes heat-conducting substrate.The heat-conducting substrate has the upper surface and the lower surface.The lower surface of the heat-conducting substrate is used to contact setting with measured object.Conductive layer is fixedly installed on the upper surface of the heat-conducting substrate.The conductive layer includes the support connecting portion being connected to each other and output connecting portion.The support connecting portion is used to support temperature element, and is electrically connected and can thermally conductively contact with the temperature element.The output connecting portion is used to be electrically connected the connector for the signal that exportable temperature element is sensed.The utility model heat-conductive assembly structure is simplified and heat conduction is fast so that the thermometric fast response time of the temperature measuring equipment.
Description
Technical field
It is particularly a kind of to conduct heat to leading for temperature element the utility model is related to a kind of structure for conducting heat
Hot component and temperature measuring equipment.
Background technology
Temperature survey, it is corresponding signal to generally require corresponding converting heat, and forms corresponding temperature value.Cause
And, it is necessary to conduct heat to temperature element.How so that heat quickly conduction to temperature measurement component, the response for temperature element
The promotion of speed plays key effect.
Utility model content
One of the purpose of this utility model be in order to overcome deficiency of the prior art, provide a kind of structure simplify, heat
Conduct fast heat-conductive assembly and temperature measuring equipment.
In order to achieve the above object, the utility model is achieved through the following technical solutions：
The utility model provides a kind of heat-conductive assembly, for conducting the heat of measured object to temperature element.It is described
Heat-conductive assembly includes heat-conducting substrate.The heat-conducting substrate has the upper surface and the lower surface.The lower surface of the heat-conducting substrate is used for
Setting is contacted with measured object.Conductive layer is fixedly installed on the upper surface of the heat-conducting substrate.The conductive layer includes that
The support connecting portion of this connection and output connecting portion.The support connecting portion is used to support temperature element, and with the temperature element
It is electrically connected and can thermally conductively contact.The output connecting portion is used to be electrically connected the company for the signal that exportable temperature element is sensed
Fitting.
Preferably, the heat-conducting substrate and thickness at least one in the conductive layer are uniform.
Preferably, the upper surface of the heat-conducting substrate has recess.The part conductive layer is filled to the recess.
Preferably, the heat-conducting substrate constructs for electrical isolation.
Preferably, the heat-conducting substrate is ceramic wafer.
Preferably, the heat-conducting substrate is aluminium nitride material structure.
Preferably, the conductive layer has the thickness less than the heat-conducting substrate.
Preferably, the conductive layer includes physical vapour deposition (PVD) structure, woven wire printing construction and metallic slurry curing
At least one of structure.
Preferably, the conductive layer is a PVD layers.
Preferably, a pair of support connecting portion is intervally installed, for being electrically connected respectively with temperature measurement component.
Preferably, the heat-conductive assembly further includes metal connecting layer, and the metal connecting layer is arranged on the conductive layer
On.The conductive layer is different metal materials from the metal connecting layer.
Preferably, the metal connecting layer has the resistivity less than the conductive layer.
Preferably, the metal connecting layer is electroplated structural.
The utility model provides a kind of temperature measuring equipment.The temperature measuring equipment include it is foregoing any one of heat-conductive assembly
And temperature element.The temperature element is arranged on the upper surface of the heat-conducting substrate, and is electrically connected with the support connecting portion.
Preferably, the temperature element can thermally conductively contact setting with the heat-conductive assembly.
Preferably, the temperature element is fixedly connected with the support connecting portion.
Preferably, the temperature element is surface mount elements.
Preferably, the temperature measuring equipment further includes connector.One end of the connector connects with the output connecting portion
Get an electric shock connection, and the signal that the exportable temperature element is sensed.
Preferably, the temperature measuring equipment further includes one end of the connector and is fixedly connected with the output connecting portion.
Preferably, the temperature measuring equipment further includes holding housing.The holding housing has chamber wall.The chamber wall
A cavity volume is surrounded with the heat-conducting substrate, the cavity volume can be used for housing filling member.At least partly described temperature element is arranged on
In the cavity volume.
Preferably, the inner surface of the chamber wall is provided with limiting slot.The part heat-conducting substrate is contained in the /V
In slot.
Preferably, it is provided with guide through hole on the holding housing.The guide through hole runs through the chamber wall, and connects
It sets the cavity volume.The temperature measuring equipment further includes connector.One end of the connector by the guide through hole, and with
The output connecting portion contact electrical connection.The other end of the connector is used to export the signal that the temperature element is sensed.
Preferably, the holding housing further includes reinforcement arm.The reinforcement arm is set from the inner surface extension of the chamber wall
It puts, is used to support filling member.
Preferably, the cavity volume is divided at least two sub- cavity volumes by the reinforcement arm.
Preferably, the temperature measuring equipment further includes filling member.The filling member is set with filling the cavity volume.
Preferably, the filling member is light-sensitive emulsion consolidated structures or silica gel consolidated structures.
Compared with prior art, the utility model is by support of the heat-conducting substrate offer to conducting shell, and heat is conducted
To conducting shell.The conducting shell can convenient electrical connection of the realization for temperature element and heat conductive contact, structure simplifies,
Need the heat heated few so that the whole thermometric speed of temperature element is fast.It that is to say, the response speed of the temperature measuring equipment
Soon.Correspondingly, the convenient of the heat-conductive assembly produces unified specification, enables to the performance one of whole thermometric response speed
Cause property is good.
Description of the drawings
Fig. 1 is a kind of dimensional structure diagram of heat-conductive assembly provided by the utility model.
Fig. 2 is partial sectional view of the heat-conductive assembly of Fig. 1 when being provided with metal connecting layer.
Fig. 3 is a kind of dimensional structure diagram of temperature measuring equipment provided by the utility model.
Fig. 4 is that the temperature measuring equipment of Fig. 3 is provided with the perspective view for keeping housing and connector.
Fig. 5 is sectional view of the temperature measuring equipment of Fig. 4 along E-E.
Fig. 6 be 4 in dimensional structure diagram of holding housing when showing top end opening.
The holding housing that Fig. 7 is Fig. 6 shows dimensional structure diagram during bottom end opening.
The temperature measuring equipment that Fig. 8 is Fig. 4 is provided with dimensional structure diagram during filling member.
Fig. 9 is the perspective view of the temperature measuring equipment of Fig. 8.
Specific embodiment
The utility model is described in detail below in conjunction with the accompanying drawings：
Embodiment one：
It please refers to Fig.1 and Fig. 2, a kind of heat-conductive assembly 101 provided by the utility model.The heat-conductive assembly 101 is used for will
The heat of measured object (not shown) is conducted to temperature element 200.The heat-conductive assembly 101 includes heat-conducting substrate 10.
The upper surface 10a of the heat-conducting substrate 10 is provided with conductive layer 30.
The heat-conducting substrate 10 has upper surface 10a and lower surface 10b.The lower surface 10b of the heat-conducting substrate 10 is used for
Setting is contacted with measured object.The heat-conducting substrate 10 is used to conduct the heat of measured object to the conductive layer 30.
The specific and construction of the heat-conducting substrate 10 selects as needed.It, being capable of convenient sensing electronics in order to promote universal performance
Component consolidates, and the heat-conducting substrate 10 is electrical isolation material structure.In order to promote the heat-conductive characteristic of the heat-conducting substrate 10,
The heat-conducting substrate 10 is ceramic wafer.More specifically, the heat-conducting substrate 10 is that (chemical formula is aluminium nitride：AlN).Correspondingly,
The heat-conducting substrate 10 can significant increase heat conduction velocity, so as to shorten the response time of temperature element 200.In order to be promoted
It states the stable connection performance of heat-conducting substrate 10 and the conductive layer 30 and promotes heat conduction velocity, the upper table of the heat-conducting substrate 10
Face 10a is provided with recess.It that is to say, the upper surface 10a of the heat-conducting substrate 10 has certain roughness.As being preferably implemented
Mode, the thickness uniformity of the heat-conducting substrate 10 so that the heat-conducting substrate 10 of batch production can ensure heat conduction
The uniformity of performance so that the conductive layer 30 can guarantee when being contacted with any part of the upper surface 10a of heat-conducting substrate 10
The uniformity of thermometric performance.
The conductive layer 30 is used to implement being electrically connected between temperature element 200 and connector 204, and conducts heat to
Temperature element 200.The conductive layer 30 is fixed on the upper surface 10a of the heat-conducting substrate 10.Correspondingly, the conduction
Layer 30 is inseparably set with the heat-conducting substrate 10.The conductive layer 30 includes the support connecting portion 32 that is connected to each other and defeated
Go out connecting portion 34.The support connecting portion 32 is used to support temperature element 200.The support connecting portion 32 and temperature element 200
It contacts directly, and electrical conduction and can thermally conductively connect.As long as the concrete shape and construction of the support connecting portion 32 can be real
Now corresponding support.In the present embodiment, in order to increase the upper table of support connecting portion 32 and the heat-conducting substrate 10
The contact area of face 10a, the support connecting portion 32 are substantially plate-like.In order to fully save material, promote heat conduction velocity, institute
The shape for stating support connecting portion 32 is roughly the same with the shape of the bottom surface of temperature element 200.Specifically, the support connecting portion 32
For rectangle.In the present embodiment, in order to save material, reduce the heated material for being heated to the temperature sensed is needed to promote heat
Conduction of velocity, a pair of support connecting portion 32,32b are intervally installed, and can be electrically connected with a corresponding temperature measurement component 200.
The output connecting portion 34 is connected with the support connecting portion 32.Further, in order to promote heat-conductive characteristic, institute
It states conductive layer 30 and is integrated part.The output connecting portion 34 is used for the signal output that temperature element 200 is sensed to following
Connector 204.As long as the concrete shape and construction of the output connecting portion 34 can realize corresponding electrical connection.As excellent
Choosing, in order to promote the heat conduction velocity of the conducting shell 30, the upper surface of the output connecting portion 34 and the heat-conducting substrate 10
10a contacts are set.In order to fully reduce the volume of the output connecting portion 34 to promote heat conduction velocity and ensure the output
Connecting portion 34 and the firm switching performance of corresponding connector 200, the output 34 generally rectangular shaped plate of connecting portion.In order to just
Beneficial to the transmission of corresponding signal, in the present embodiment, a pair of output connecting portion 34,34b connect corresponding a pair of of connector respectively
204th, 204b, so as to form electrical connection circuit.
In order to enable there is enough clearance spaces between temperature element 200 and connector 205, the output connecting portion 34
Linking arm 36 is connected between the support connecting portion 32.The both ends of the linking arm 36 connect the output and connect respectively
Socket part 34 and the support connecting portion 32.The shape and construction of the linking arm 36 can realize corresponding electrical connection.Tool
Body, the linking arm 36 substantially plate.In order to promote heat conduction velocity, the linking arm 36, which has, is less than the output company
The volume of socket part 34, the support connecting portion 32.In the present embodiment, linking arm 36 connects corresponding output connecting portion 34 and branch
Support connecting portion 32；Linking arm 36b connections corresponding output connecting portion 34b and support connecting portion 32b.Preferably, the linking arm
36th, the output connecting portion 34 and support connecting portion 32 connection are in an integral structure.It is the linking arm 36b, described defeated
It is in another integral structure to go out connecting portion 34b and the support connecting portion 32b connections.
Arbitrary conductive material manufacture may be employed in the conductive layer 30.In the present embodiment, the conductive layer 30 is metal
Material.For example, the conductive layer 30 can be that copper material or aluminium construct.In order to promote the conductive layer 30 and the heat-conducting substrate
10 firm switching performance and heat conduction velocity is promoted, the conductive layer 30 is that (English full name is physical vapour deposition (PVD)
Physical Vapor Deposition, abbreviation PVD) structure.That is to say, the conductive layer 30 by physical vapour deposition (PVD) with
The upper surface 10a of the heat-conducting substrate 10 is integrally connected.As another preferred embodiment, the conductive layer 30 is wire wire mark
Brush construction.It that is to say, metallic slurry is applied to the heat-conducting substrate 10 by the conductive layer 30 by way of silk-screen printing
Upper surface 10a, and form corresponding consolidated structures.As another preferred embodiment, the conductive layer 30 can be metallic slurry
Consolidated structures.It that is to say, the metal material of slurry shape by being applied to the upper table of the heat-conducting substrate 10 by the conductive layer 30
Face 10a, and pass through to cure and be integrally connected with the upper surface 10a of the heat-conducting substrate 10.As needed, the metallic slurry can be with
Consolidated structures are formed by high temperature sintering.Preferably, the thickness uniformity of the conductive layer 30 so that thermometric
Element 30 can ensure the uniformity of thermometric performance when being contacted with the arbitrary upper surface of conductive layer 30.In order to promote heat transfer speed
Degree, the conductive layer 30 have the thickness less than the heat-conducting substrate 10.
Embodiment two：
Please continue to refer to Fig. 2, in order to further reduce thermal resistance, resistance to promote the response speed of temperature element 200, this reality
With a kind of heat-conductive assembly 101b of new offer.Compared with embodiment one, the heat-conductive assembly 101b further includes metal connecting layer 50.
The metal connecting layer 50 is arranged on the conductive layer 30.
The metal connecting layer 50 is electrically connected for being contacted directly with temperature element 200, and can transmit heat.As excellent
Choosing, further to promote the response speed of temperature element 200, the metal connecting layer 50 has the heat less than the conductive layer 30
Resistance and/or resistance.Further, in order to promote the firm switching performance of the metal connecting layer 50 and the conductive layer 30 and carry
Heat conduction velocity is risen, the metal connecting layer 50 is the coat of metal.It that is to say, the metal connecting layer 50 passes through metal plating shape
Into the metallic conduction structure for being laid on the conductive layer 30.In order to avoid promoting corrosion resistance, the metal connecting layer 50 can
With metal materials such as gold or silver.
Embodiment three：
Referring to Fig. 3, the utility model also provides a kind of temperature measuring equipment 301.The temperature measuring equipment 301 is included according to foregoing
The heat-conductive assembly 101 and temperature element 200 that embodiment one is recorded.The temperature element 200 is arranged on the heat-conductive assembly
On 101, the heat that is conducted by the heat-conductive assembly 101 is and the temperature that senses measured object.Further, the heat conduction group
Part 101 (or 101b) can heat conductive contact setting with the temperature measurement component 200.Preferably, the temperature measuring equipment
301 for measuring solid temperature, and with response speed extremely fast.
The temperature element 200 is arranged on the upper surface 10a of the heat-conducting substrate 10.The temperature element 200 and institute
Support connecting portion 32 is stated to be electrically connected.Preferably, the part temperature element 200 is arranged on the support connecting portion 32, with institute
State the support contact electrical connection of connecting portion 32.Further, the temperature element 200 can be thermally conductively with the support connecting portion 32
Contact.Further, the temperature element 200 is fixedly connected with the support connecting portion 32.Specifically, the temperature element
200 are welded to connect with the support connecting portion 32.In order to fully save space and convenient assembling, the temperature element 200 is
Surface mount elements.According to thermometric needs, the temperature element 200 can be thermistor.More specifically, the temperature element 200
It can be with negative temperature coefficient (Negative Temperature Coefficient, abbreviation NTC) thermistor or positive temperature coefficient
(Positive Temperature Coefficient, abbreviation PTC) thermistor.
Example IV：
Fig. 4 and Fig. 5 is referred to, in order to facilitate that promoting the overall performance of the temperature measuring equipment 301, the utility model provides
Another temperature measuring equipment 301b.Compared with foregoing temperature measuring equipment 301, the temperature measuring equipment 301b, which is further included, keeps housing 202.
Also referring to Fig. 6 and Fig. 7, the holding housing 202 has chamber wall 221.The chamber wall 221 surrounds an appearance
Chamber 223.Specifically, the chamber wall 221 surrounds cavity volume 223 with the heat-conducting substrate 10.The cavity volume 223 is following for housing
Filling member 206.The cavity volume 223 is for accommodating at least partly described temperature element 200.
In order to facilitate that realizing the installation of following filling members 206, the cavity volume 223 is a tube chamber.It that is to say, the cavity volume
223 vertical directions are through the holding housing 202.Correspondingly, the cavity volume 223 forms top in the chamber wall 221 and opens
Mouth 223a and top end opening 223b.The top end opening 223a is used to house following filling members 206.The bottom end opening 223b is used
In the accommodating part heat-conducting substrate 10.
In order to further consolidate correct, the quick assembling for keeping the heat-conducting substrate 10 and the convenient heat-conducting substrate 10,
The inner surface of the chamber wall 221 is provided with limiting slot 225.The limiting slot 225 keeps the heat-conducting substrate 10 for accommodating,
So as to which the heat-conducting substrate 10 can also be avoided to slide completely to the cavity volume 223.For the further convenient heat conduction base
Plate 10 is accurate, is quick mounting in the limiting slot 225, and the limiting slot 225 is rectangular channel.Correspondingly, the heat-conducting substrate
10 be rectangular slab.The firm performance of the holding housing 202 is assembled in order to further enhance the heat-conducting substrate 10, it is described to lead
Hot substrate 10 can be interference fitted with the limiting slot 225.It is, the heat-conducting substrate 10 can be with the slot of the limiting slot 225
Wall contacts.According to using needs, the heat-conducting substrate 10 can also be contacted with the chamber wall 221.
In order to promoted the holding housing 202 to the firm retention properties of following filling members 206 and reduce filling member 206 because
Difference variation generate deformation and generate the harmful effect to other component, it is described holding housing 202 further include reinforcement arm 227.
The inner surface of the reinforcement arm 227 from the chamber wall 221 is extended, and sustainable filling member 206, and can enhance the guarantor
Hold the integral strength of housing 202.The concrete shape and construction of the reinforcement arm 227 select as needed.Further, it is described
Inner surface of the both ends of reinforcement arm 227 with the chamber wall 221 is connected.Preferably, the reinforcement arm 227 is by the cavity volume
223 are divided at least two sub- cavity volumes 224.The quantity of the reinforcement arm 227 and distribution select as needed.In the present embodiment
In, the cavity volume 223 is divided into three sub- cavity volumes 224,224b, 224c by four reinforcement arm 227,227b, 227c, 227d.Tool
Body, three reinforcement arm 227,227b, 227c and the chamber wall 221, which surround one, can surround the temperature element 200
Sub- cavity volume 224.Another described reinforcement arm 227d connects the reinforcement arm 227c and the chamber wall 221 respectively, and separates shape
Into two sub- cavity volume 224b, 224c.Two described sub- cavity volume 224b, 224c are each other in symmetrical alphabetical " L " shape.In order to facilitate that
The filling of following filling members 206, the sub- cavity volume 224, communicate with each other setting between 224b, 224c.
In order to facilitate that being extended for following connectors 204, guide through hole 229 is provided in the chamber wall 221.Institute
Guide through hole 229 is stated through the chamber wall 221, and connects 223 ground of cavity volume and sets.In the present embodiment, two guiding
Through hole 229,229b, which are extended in parallel, to be set, for guiding following two connectors 204,204b.
In order to facilitate that the output for the temperature signal that the temperature element 200 is sensed, the temperature measuring equipment 101 further includes
Connector 204.One end 241 of the connector 204 contacts electrical connection with the output connecting portion 34, with the exportable thermometric
The signal that element 200 is sensed.Specifically, one end 241 of the connector 204 is welded to connect with the output connecting portion 34.
Correspondingly, one end 241 of the connector 204 is fixedly connected with the output connecting portion 34.The other end of the connector 204
242 are used to export the sensing signal that the temperature element 200 senses.The concrete shape and specification of the connector 204 are according to need
It wants and selects, as long as corresponding electrical connection can be realized.In the present embodiment, the connector 204 can be with plain conductor.
Further, the plain conductor can be to be provided with insulating coating on enameled wire or the plain conductor, to promote security
Energy.In the present embodiment, two connectors 204, one end 241 of 204b, 241b respectively with it is corresponding it is described output connecting portion 34,
34b contact electrical connections.Two connectors 204, the other end 242 of 204b, 242b pass through corresponding two guide through hole respectively
229th, 229b, and extend to outside the holding housing 202.
Embodiment five：
Fig. 8 and Fig. 9 is referred to, in order to promote the protection to the corresponding device in the cavity volume 223, the utility model also carries
For another temperature measuring equipment 301c.Compared with foregoing temperature measuring equipment 301b, the temperature measuring equipment 301c further includes filling member 206.
The filling member 206 is filled in the cavity volume 223 of the holding housing 202.The filling member 206 can protect such as thermometric member
The protection such as part 200, the electrical isolation of heat-conductive assembly 101, waterproof.As long as the specific material and specification of the filling member 206 can be real
Now corresponding filling.The filling member 206 can be with silica gel consolidated structures.It that is to say, melting silica gel is perfused to the cavity volume
In 223, by being formed by curing corresponding integral structure.In the present embodiment, the filling member 206 is light-sensitive emulsion.It is described photosensitive
Glue can also be referred to as UV glue, that is to say through ultraviolet light colloid to form consolidated structures.
It should be noted that as without particularly pointing out, the thickness occurred in the utility model is the extension of vertical direction
Size.In addition, " upper and lower " that occurs in the utility model, " left and right ", " forward and backward ", " one, another " they are relative concept,
For with reference to attached drawing with the convenient relative position for understanding all parts.Wherein, " upper and lower " may be referred to the upper and lower in Fig. 9
To.
It these are only the utility model preferred embodiment, be not used to limitation the scope of protection of the utility model, it is any
Modification, equivalent substitution or improvement in the utility model spirit etc., all cover in the right of the utility model.
Claims (26)
1. a kind of heat-conductive assembly, for conducting the heat of measured object to temperature element, which is characterized in that including：
Heat-conducting substrate, the heat-conducting substrate have the upper surface and the lower surface；The lower surface of the heat-conducting substrate be used for it is measured
Object contact is set；
Conductive layer is fixedly installed on the upper surface of the heat-conducting substrate；
The conductive layer includes the support connecting portion being connected to each other and output connecting portion；
The support connecting portion is used to support temperature element, and is electrically connected and can thermally conductively contact with the temperature element；
The output connecting portion is used to be electrically connected the connector for the signal that exportable temperature element is sensed.
2. heat-conductive assembly according to claim 1, it is characterised in that：
The heat-conducting substrate and thickness at least one in the conductive layer are uniform.
3. heat-conductive assembly according to claim 1, it is characterised in that：
The upper surface of the heat-conducting substrate has recess；
The part conductive layer is filled to the recess.
4. heat-conductive assembly according to claim 1, it is characterised in that：
The heat-conducting substrate constructs for electrical isolation.
5. heat-conductive assembly according to claim 1, it is characterised in that：
The heat-conducting substrate is ceramic wafer.
6. heat-conductive assembly according to claim 5, it is characterised in that：
The heat-conducting substrate is aluminium nitride material structure.
7. heat-conductive assembly according to claim 1, it is characterised in that：
The conductive layer has the thickness less than the heat-conducting substrate.
8. heat-conductive assembly according to claim 1, which is characterized in that
The conductive layer is included at least one in physical vapour deposition (PVD) structure, woven wire printing construction and metallic slurry consolidated structures
Kind.
9. heat-conductive assembly according to claim 1, it is characterised in that：
The conductive layer is a PVD layers.
10. heat-conductive assembly according to claim 1, it is characterised in that：
A pair of support connecting portion is intervally installed, for being electrically connected respectively with temperature measurement component.
11. heat-conductive assembly according to any one of claim 1 to 10, which is characterized in that further include：
Metal connecting layer, the metal connecting layer are arranged on the conductive layer；
The conductive layer is different metal materials from the metal connecting layer.
12. heat-conductive assembly according to claim 11, it is characterised in that：
The metal connecting layer has the resistivity less than the conductive layer.
13. heat-conductive assembly according to claim 11, it is characterised in that：
The metal connecting layer is electroplated structural.
14. a kind of temperature measuring equipment, which is characterized in that including：
According to claim 1 to 13 any one of them heat-conductive assembly；And
Temperature element, the temperature element are arranged on the upper surface of the heat-conducting substrate, and are electrically connected with the support connecting portion
It connects.
15. temperature measuring equipment according to claim 14, it is characterised in that：
The temperature element can thermally conductively contact setting with the heat-conductive assembly.
16. temperature measuring equipment according to claim 14, it is characterised in that：
The temperature element is fixedly connected with the support connecting portion.
17. temperature measuring equipment according to claim 14, it is characterised in that：
The temperature element is surface mount elements.
18. temperature measuring equipment according to claim 14, which is characterized in that further include：
Connector, one end of the connector contact electrical connection, and the exportable temperature element institute with the output connecting portion
The signal of sensing.
19. temperature measuring equipment according to claim 18, it is characterised in that：
One end of the connector is fixedly connected with the output connecting portion.
20. temperature measuring equipment according to claim 14, which is characterized in that further include：
Housing is kept, the holding housing has chamber wall；
The chamber wall surrounds a cavity volume with the heat-conducting substrate, and the cavity volume can be used for housing filling member；
At least partly described temperature element is arranged in the cavity volume.
21. temperature measuring equipment according to claim 20, it is characterised in that：
The inner surface of the chamber wall is provided with limiting slot；
The part heat-conducting substrate is contained in the limiting slot.
22. temperature measuring equipment according to claim 20, which is characterized in that
Guide through hole is provided on the holding housing；
The guide through hole runs through the chamber wall, and sets with connecting the cavity volume；
The temperature measuring equipment further includes connector；
One end of the connector contacts electrical connection by the guide through hole, and with the output connecting portion；
The other end of the connector is used to export the signal that the temperature element is sensed.
23. temperature measuring equipment according to claim 20, it is characterised in that：
The holding housing further includes reinforcement arm；
The inner surface of the reinforcement arm from the chamber wall is extended, and is used to support filling member.
24. temperature measuring equipment according to claim 23, it is characterised in that：
The cavity volume is divided at least two sub- cavity volumes by the reinforcement arm.
25. the temperature measuring equipment according to any one of claim 20 to 24, which is characterized in that further include：
Filling member, the filling member are set with filling the cavity volume.
26. temperature measuring equipment according to claim 25, it is characterised in that：
The filling member is light-sensitive emulsion consolidated structures or silica gel consolidated structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721546252.XU CN207379622U (en) | 2017-11-17 | 2017-11-17 | Heat-conductive assembly and temperature measuring equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721546252.XU CN207379622U (en) | 2017-11-17 | 2017-11-17 | Heat-conductive assembly and temperature measuring equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207379622U true CN207379622U (en) | 2018-05-18 |
Family
ID=62333378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721546252.XU Active CN207379622U (en) | 2017-11-17 | 2017-11-17 | Heat-conductive assembly and temperature measuring equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207379622U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109798993A (en) * | 2017-11-17 | 2019-05-24 | 泰科电子(上海)有限公司 | Heat-conductive assembly and temperature measuring equipment |
| CN110617895A (en) * | 2018-06-18 | 2019-12-27 | 矢崎总业株式会社 | Sensor body and method for manufacturing sensor body |
-
2017
- 2017-11-17 CN CN201721546252.XU patent/CN207379622U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109798993A (en) * | 2017-11-17 | 2019-05-24 | 泰科电子(上海)有限公司 | Heat-conductive assembly and temperature measuring equipment |
| CN110617895A (en) * | 2018-06-18 | 2019-12-27 | 矢崎总业株式会社 | Sensor body and method for manufacturing sensor body |
| CN110617895B (en) * | 2018-06-18 | 2021-07-23 | 矢崎总业株式会社 | Sensor body and method for manufacturing sensor body |
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