CN207338354U - Cooling device for electrical components - Google Patents
Cooling device for electrical components Download PDFInfo
- Publication number
- CN207338354U CN207338354U CN201720517463.4U CN201720517463U CN207338354U CN 207338354 U CN207338354 U CN 207338354U CN 201720517463 U CN201720517463 U CN 201720517463U CN 207338354 U CN207338354 U CN 207338354U
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- electrical components
- cooling
- cooling element
- cooling device
- baffle
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Abstract
The utility model includes the cooling device for electrical components.Cooling device includes electrical components (6) and cooling element (1a to c), and cooling element (1a to c) includes bottom (2) and side wall (3) and the entrance (4) for cooling fluid and outlet (5).The base section (7) of electrical components (6) is relatively fixed on the side wall (3) of cooling element (1a to c) with bottom (2) and forms the head cover of cooling element (1a to c).There is at least one baffle (8) for cooling fluid in the internal cooling fluid chamber (14) of cooling element (1a to c), the baffle supports the base section (7) of electrical components (6).
Description
Technical field
It the utility model is related to a kind of cooling device for electrical components.
Background technology
Electrical components must be cooled to overcome wherein caused excessive thermal power.The purpose of cooling is, by electric portion
The internal part of part is maintained within required temperature extremes and compensates the temperature difference of the inside of equipment.Fortune is realized by cooling down
Row security and the extension for realizing the service life of electrical components.
Either efficient semiconductor is usually by liquid or air cooling, or pass through liquid and air cooled combination
To cool down.Because used semi-conducting material cannot withstand high temperature at this stage, cooling must be effective.Known to one
Solution propose：Semiconductor is placed on cooling element and transfer greases are used between semiconductor and cooling element
To reduce the contact impedance between semiconductor and cooling element.
The problem of above device, is, the characteristic of hot interface and transfer greases is formed between semiconductor and cooling element
Change with the time and have air entrance even between semiconductor and cooling element.
Utility model content
Thus, the utility model is based on following purposes：Research and develop a kind of cooling device, enabling solution is hereinbefore carried
To the problem of.The purpose of this utility model is realized by a kind of cooling device for electrical components.
The utility model based on the fact that：Cooling device for electrical components includes electrical components and cooling element.Cooling
Element includes bottom and side wall and the entrance and exit for cooling fluid.The base section of electrical components is relatively solid with bottom
It is scheduled on the side wall of cooling element and forms the head cover of cooling element.Deposited in the cooling fluid chamber inside cooling element
In at least one baffle for cooling fluid, the baffle supports the base section of electrical components.
The advantages of cooling device according to the present utility model for electrical components is, positioned at electrical components and cooling element it
Between the quantity at hot interface reduce and avoid the use of transfer greases.
Brief description of the drawings
The utility model is elaborated referring now to attached drawing combination preferred embodiment, wherein
Fig. 1 shows the cooling device of electrical components；
Fig. 2 shows the cooling device of the electrical components of Fig. 1 in decomposition view；
Fig. 3 shows the cooling element of Fig. 1；
Fig. 4 shows cooling element；
Fig. 5 shows fixation of the electrical components on cooling element；And
Fig. 6 a to b show cooling element.
Embodiment
Fig. 1 shows the cooling device of electrical components, and Fig. 2 shows the cooling device of the electrical components of Fig. 1 in decomposition view, its
In these parts show spaced slightly apart from one anotherly.
Cooling element 1a includes bottom 2 and the identical side wall 3 around bottom and the entrance 4 for cooling fluid and goes out
Mouth 5.Such as cooling liquid is used as cooling fluid.The base section 7 of electrical components 6 is relatively fixed at cooling member with bottom 2
On the side wall 3 of part 1a and form the head cover of cooling element 1a.The electrical components 6 being shown in the drawings is semiconductor.In cooling member
There is at least one baffle 8 for cooling fluid inside part 1a, the baffle extends directly from the bottom 2 of cooling element 1a
To electrical components 6 base section 7 and support the base section 7 of electrical components 6.The baffle 8 for extending up to base section 7 is also used
Strengthening portion as the ribbed of base section 7.Baffle 8 prevents the base section 7 of electrical components 6 from being bent towards bottom 2.
It is by means of the pretreatment of corrosion resistant coating by the base section 7 of electrical components 6 so that the cooling circulated in systems
Fluid does not dissolve or corrodes base section.Here, the base section 7 of electrical components 6 is for example applied with nickel layer, or base section 7
There is the paint of resistance to cooling flow-induced corrosion, or base section can be handled with epoxy resin.Base section 7 is, for example, to be connected to electricity
Copper coin on component.
In the accompanying drawings, electrical components 6 and cooling element 1a to c are each other by means of in positioned at the lower section of bottom 2 of cooling element 1a to c
Support plate 9 fixed by fixed mechanism 10.Cooling element 1a to c has for fixed mechanism 10 at its marginal portion 11
Fixing point 12.Support plate 9 is advantageously slightly wider than the bottom 2 of cooling element 1a to c along width w.In support plate 9,
Formed at the entrance and exit 4,5 of cooling element 1a and connect hole 13, inflow pipe and effuser for cooling fluid.It is as long as cold
But the material of element 1a to c does not allow electrical components to be fixed directly by means of fixed mechanism on the cooling element, then substitutes
Support plate 9, such as the structure conduct support of the equipment for the lower section of bottom 2 for being mounted in cooling element 1a to c can be used and consolidated
Determine face.
Cooling element 1a to c is advantageously manufactured by plastic manufacturing or by being cast by aluminium.
Fig. 3 shows the cooling element 1a of Fig. 1.Cooling fluid chamber 14 by the bottom 2 of cooling element 1a and side wall 3 and by
The shape that the base section 7 of electrical components 6 is formed is rectangle.On the bottom 2 of cooling element 1a, along the vertical of cooling element
To direction h, the entrance and exit 4,5 for being useful for cooling fluid is formed in the mid portion of the cooling element.
Inside cooling element 1a, the baffle 8 of banding is provided with along the longitudinal direction h of cooling element 1a.Baffle 8
It is wavy towards the observation of bottom 2 so that the baffle extends to the second tip 15b from the first tip 15a.The depth of convolution 16
Between entrance 4 and outlet 5 so that entrance 4 of the baffle 8 around cooling fluid stream.Baffle 8 will be flowed into cold from entrance 4
But the cold cooling fluid in fluid cavity 14 is separated towards two short sides.Cooling fluid returns to cold from the outflow side of baffle 8
But in the mid portion of element and the cooling fluid of heating through outlet 5 outflow.The flow direction of cooling fluid passes through arrow table
Show.Cooling fluid cooling element 1a into c by means of positioned at exterior pump circulation, and the cooling fluid passes through positioned at outer
The system in portion is cooled as in fluid-air heat exchanger.In the accompanying drawings, pump, which is set, is used for by the suction heating of outlet 5
Cooling fluid.
Fig. 4 shows cooling element 1b.Along the width w of cooling element 1b at side wall 3, along the width of cooling element
Direction w is spent at the mid portion of side wall 3, forms the entrance 4 for being useful for cooling fluid and outlet 5.Cooling fluid is flowed from cooling
The first end 17a on 4 side of entrance of body 1b is flow to positioned at the second end 17b on 5 sides is exported to cool down electrical components 6.
The flow direction of cooling fluid is represented by arrow.Vertical stake is provided with cooling fluid chamber 14 as baffle 8, institute
Stating stake has criss-cross cross section.Baffle 8 prevents the base section 7 of electrical components 6 from being bent towards cooling fluid chamber 14.Water conservancy diversion
Body 8, vertical stake, the base section 7 of electrical components 6 is extended to from the bottom 2 of cooling element 1.Baffle 8 is on cooling element 1
Along longitudinal h orientation mid diameter be symmetrically arranged.
Fig. 5 shows fixation of the electrical components 6 on cooling element 1b.Electrical components 6 is by means of installed in the bottom of cooling element 1b
The support plate 9 of the lower section of portion 2 is placed on cooling element 1b.Electrical components 6 and cooling element 1b the edge part being orientated along longitudinal h
It is, for example, fixed screw to divide 11 to have the hole for being used for fixed mechanism 10 as fixing point 12, the fixed mechanism.By plastics structure
Into cooling element 1b below there are steel support plate 9.In Figure 5, holding plate has the hole for fastening screw, and institute
State to fix and realized by nut and spring 18.Spring 18, the spring are provided between the nut of fastening screw and support plate 9
Absorb the potential compression shock of cooling fluid.By disposing spring to also compensates for warm-up movement.As alternative, in steel
Also the screw thread for fixed screw can be made in support plate 9, electrical components 6 is placed on the screw thread by means of fastening screw.
Fig. 6 a show cooling element 1c and support plate 9, and Fig. 6 b show its cross section.Also show that in figure 6b as cooling
The electrical components 6 of the head cover of element 1c.Along the width w of cooling element 1c on side wall 3, along the width side of cooling element
To w in the middle part of side wall 3, form and be useful for the entrance and exit 4,5 of cooling fluid.Cooling fluid is from cooling element 1c
First end 17a flow to second end 17b.The flow direction of cooling fluid is represented by arrow.In the bottom 2 of cooling element 1c
On, wavy metallic plate 19 is provided with cooling fluid chamber 14.The depth of convolution 20 of metallic plate 19 and peak 21 substantially along
The width w of cooling element.The wavy moulding of metallic plate 19 improves the vortex of cooling fluid stream and improves heat
Transmission.
Two baffles 8 are provided with the cooling fluid chamber 14 of cooling element 1c.Baffle 8 is in vpg connection mirror each other
Picture.Baffle is slightly wavy from 2 direction of bottom, i.e., described baffle extends to the second point from the first tip 15a
Hold 15b.Baffle 8 is placed as relative to each other so that the depth of convolution 16 is opposite each other, wherein between baffle 8 form have along
The flow channel that the longitudinal direction h of cooling element 1c is tapered and then widens first.Flow channel is made of baffle 8
Shape improve flowing velocity in the mid portion of electrical components 6 at hot spot.
Baffle 8 extends to the base section 7 of electrical components 6 from wavy metallic plate 19, wherein the baffle is supported
Base section 7.Baffle 8 prevents the base section 7 of electrical components 6 from being bent towards bottom 2.
Cooling scheme according to the present utility model is favourable in manufacture view.Cooling element 1a to c is without separated
Should be by the header field of mechanization due to Heat transmission.Cooling element 1a to c can be manufactured advantageous by casting.
The semiconductor being shown in the drawings is, for example, the power semiconductor of the power semiconductor either frequency converter of frequency converter
Module, the power semiconductor modular include multiple power semiconductors.
For those skilled in the art it is readily apparent that can also be realized in a number of different manners in technological improvement
The basic thought of the utility model.Thus, the utility model and embodiments thereof are not only restricted to hereinbefore described example,
But it can change in required protection domain.
List of parts：1a is to c cooling elements, and 2 bottoms, 3 side walls, 4 entrances, 5 outlets, 6 electrical componentss, 7 base sections, 8 lead
Fluid, 9 support plates, 10 fixed mechanisms, 11 marginal portions, 12 fixing points, 13 connect hole, 14 cooling fluid chambers, 15a to b tips,
16 depth of convolutions, 17a to b ends, 18 springs, 19 plates, the depth of convolution of 20 plates, 21 height.
H longitudinal directions, w widths.
Claims (7)
1. a kind of cooling device for electrical components, the cooling device includes electrical components (6) and cooling element (1a to c), and
And the cooling element (1a to c) includes bottom (2) and side wall (3) and the entrance (4) for cooling fluid and outlet (5),
It is characterized in that, the base section (7) of the electrical components (6) is relatively fixed at the cooling member with the bottom (2)
On the side wall (3) of part (1a to c) and the head cover of the cooling element (1a to c) is formed, and in the cooling element
There is at least one baffle (8) for cooling fluid, the baffle in cooling fluid chamber (14) in the inside of (1a to c)
Support the base section (7) of the electrical components (6).
2. the cooling device according to claim 1 for electrical components, it is characterised in that the electrical components (6) it is described
Base section (7) nickel or paint coating.
3. the cooling device according to claim 1 or 2 for electrical components, it is characterised in that in the cooling element (1a
There are support plate (9) below to the bottom (2) c), can be disposed in the support plate by means of fixed mechanism (10)
The electrical components (6).
4. the cooling device according to claim 3 for electrical components, it is characterised in that the fixed mechanism (10) is spiral shell
Silk, and it is provided with spring (18) between the nut of the screw and the support plate (9).
5. the cooling device according to claim 1 or 2 for electrical components, it is characterised in that the electrical components (6) is work(
Rate semiconductor.
6. the cooling device according to claim 3 for electrical components, it is characterised in that the electrical components (6) is power
Semiconductor.
7. the cooling device according to claim 4 for electrical components, it is characterised in that the electrical components (6) is power
Semiconductor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FIU20164109 | 2016-05-11 | ||
| FIU20164109U FI11337U1 (en) | 2016-05-11 | 2016-05-11 | Electrical component cooling arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207338354U true CN207338354U (en) | 2018-05-08 |
Family
ID=56885715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720517463.4U Active CN207338354U (en) | 2016-05-11 | 2017-05-10 | Cooling device for electrical components |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207338354U (en) |
| FI (1) | FI11337U1 (en) |
-
2016
- 2016-05-11 FI FIU20164109U patent/FI11337U1/en active IP Right Grant
-
2017
- 2017-05-10 CN CN201720517463.4U patent/CN207338354U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| FI11337U1 (en) | 2016-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190410 Address after: Baden, Switzerland Patentee after: ABB TECHNOLOGY LTD. Address before: Helsinki Patentee before: ABB T & D Technology Ltd. |