CN207337070U - A kind of litho machine wafer spin coating device - Google Patents
A kind of litho machine wafer spin coating device Download PDFInfo
- Publication number
- CN207337070U CN207337070U CN201721240564.8U CN201721240564U CN207337070U CN 207337070 U CN207337070 U CN 207337070U CN 201721240564 U CN201721240564 U CN 201721240564U CN 207337070 U CN207337070 U CN 207337070U
- Authority
- CN
- China
- Prior art keywords
- workbench
- support plate
- threaded rod
- spin coating
- coating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004528 spin coating Methods 0.000 title claims abstract description 17
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 241000252254 Catostomidae Species 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 241000478345 Afer Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The utility model discloses a kind of litho machine wafer spin coating device, including workbench, motor on the table, and the horizontal vacuum cup being arranged on electric machine main shaft are fixedly connected with, further include the support plate of a L-shaped；The front of the workbench is equipped with a horizon rule；The left surface of the workbench is rotatably connected on the vertical plate portion medial surface of support plate by articulated shaft；Two horizontally disposed guide rails are additionally provided with the medial surface of the vertical plate portion of the support plate and one is located between two guide rails, and horizontally disposed threaded rod, wherein one end of the threaded rod is rotatably connected on the vertical plate portion medial surface of support plate by bearing；The utility model can make whole workbench be in horizontality by adjusting threaded rod, so as to ensure that the thickness of coating adhesive is uniform.
Description
Technical field
It the utility model is related to wafer lithography technical field, more particularly to a kind of litho machine wafer spin coating device.
Background technology
Photoetching process (coats glue-line including chip spin coating altogether）, front baking, exposure, development, post bake, burn into remove photoresist
Step, wherein, spin coating is in order to make to be distributed in the photoresist on chip to be evenly distributed and can reach certain thickness, during to expose
The photoresist of wafer surface can obtain appropriate photosensitive；Usually all it is that absorption is driven in vacuum using motor wherein in spin coating
Afer rotates on sucker, so as to make glue be uniformly distributed on a wafer under the influence of centrifugal force, glued membrane applied thickness can root
It is controlled according to the speed of electric machine rotational axis.
But since workbench may not be in horizontality when mounted, such vacuum cup is not just horizontal
State, so when motor rotates, the centrifugal force that sucker produces is not just on horizontal plane direction, so as to can make coating adhesive distribution not
Uniformly, the thickness of the glue-line on chip is caused to differ, so as to largely effect on follow-up photoetching process.
Utility model content
The purpose of this utility model is and a kind of wafer cleaning proposed in order to solve shortcoming existing in the prior art
Device.
To achieve these goals, the utility model employs following technical solution：
A kind of litho machine wafer spin coating device, including workbench, it is fixedly connected with motor on the table, Yi Jishui
The flat vacuum cup on electric machine main shaft, further includes the support plate of a L-shaped；The front of the workbench is equipped with a level
Ruler；The left surface of the workbench is rotatably connected on the vertical plate portion medial surface of support plate by articulated shaft；The support plate
Vertical plate portion medial surface on be additionally provided with two horizontally disposed guide rails and one between two guide rails, it is and horizontally disposed
Threaded rod, wherein one end of the threaded rod is rotatably connected on the vertical plate portion medial surface of support plate by bearing；It is described
A sliding block is slidably connected on guide rail；The threaded rod runs through sliding block, and is threadedly coupled with sliding block；The bottom of the workbench
Tension spring is fixedly connected between the upper surface of the horizontal plate part of face and support plate；The workbench right flank is oblique upper right side
Inclined plane；The upper surface of the sliding block is also the inclined plane being adapted with the inclined plane of the workbench.
Preferably, there is hollow cavity inside the vacuum cup, and upper surface has some suckers connected with hollow cavity；
The hollow cavity is also connected with vacuum generator.
Preferably, the vertical plate portion top of the support plate is equipped with a horizontally toward nozzle above vacuum cup, institute
State nozzle and be connected with wind turbine.
Preferably, the right end of the threaded rod is fixedly connected with turning handle.
Than the prior art, the advantages of this practicality, is：
The utility model can intuitively observe whether whole workbench is in horizontality by setting horizon rule, then
Level tune can be carried out to whole workbench, when in not horizontality, can rotate by being threaded bar and sliding block
Threaded rod, so as to drive workbench right end to rise or fall by the inclined plane of sliding block and workbench, until it is in horizontal
State, thereby may be ensured that follow-up spin coating process makes the thickness of silica gel be not in too big deviation.
Brief description of the drawings
Fig. 1 is the structure diagram of the utility model；
Fig. 2 is the utility model front view；
Fig. 3 is the left view sectional view below utility model works platform.
In figure：1st, vacuum cup；101st, sucker；102nd, hollow cavity；103rd, vacuum generator；2nd, workbench；3rd, motor；4、
Support plate；5th, articulated shaft；6th, guide rail；7th, threaded rod；8th, sliding block；9th, tension spring；10th, horizon rule；11st, wind turbine；12nd, nozzle；13rd, turn
Handle.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
With reference to shown in Fig. 1-3, a kind of litho machine described in the utility model wafer spin coating device, including it is workbench 2, solid
Surely the motor 3 being connected on workbench 2, and the horizontal vacuum cup 1 being arranged on 3 main shaft of motor, further include the branch of a L-shaped
Fagging 4；The front of workbench 2 is equipped with a horizon rule 10；The left surface of workbench 2 is rotatably connected on support by articulated shaft 5
On the vertical plate portion medial surface of plate 4；Two horizontally disposed 6 Hes of guide rail are additionally provided with the medial surface of the vertical plate portion of support plate 4
One is located between two guide rails 6, and horizontally disposed threaded rod 7, one end of wherein threaded rod 7 are rotatably connected on by bearing
On the vertical plate portion medial surface of support plate 4；A sliding block 8 is slidably connected on guide rail 6；Threaded rod 7 runs through sliding block 8, and with cunning
Block 8 is threadedly coupled；Tension spring 9 is fixedly connected between the upper surface of the bottom surface of workbench 2 and the horizontal plate part of support plate 4；Work
Make the inclined plane that 2 right flank of platform is oblique upper right side；The upper surface of sliding block 8 is also to incline with what the inclined plane of workbench 2 was adapted
Inclined-plane.
The inside of vacuum cup 1 has hollow cavity 102, and upper surface has some suckers 101 connected with hollow cavity 102；
Hollow cavity 102 is also connected with vacuum generator 103.Wafer is placed into the top of vacuum cup 1, opens vacuum generator 103,
So as to adsorb wafer on the upper surface of vacuum cup 1.
The vertical plate portion top of support plate 4 is equipped with one, and horizontally toward the nozzle 12 above vacuum cup 1, nozzle 12 connect
There is wind turbine 11.Due to obtained in spin coating and during, if dust in air has been coated in the surface of wafer together with silica gel
On, follow-up photoetching can be caused to work larger deviation occurs, so wind turbine 11 and nozzle 12, so that in spin coating process
In, the wind that nozzle 12 sprays dispels the air of the top of vacuum cup 1, so as to avoid the dust in air from falling into just in spin coating
On wafer.
The right end of threaded rod 7 is fixedly connected with turning handle 13.13 purpose of turning handle is set to be to be easy to rotating threaded rod 7.
Operation principle：The wafer for treating gluing is adsorbed on vacuum cup 1, the state of horizon rule 10 is observed, if water
Leveling ruler 10 shows that workbench 2 is not at horizontality, rotating threaded rod 7, so that moved to the left or to the right with movable slider 8, due to
The right surface of workbench 2 is inclined plane, so sliding block 8 is when being moved to the left, under the pulling force effect of tension spring 9, the right side of workbench 2
End can upwarp, and when sliding block 8 moves right, workbench 2 can sink, so only needing to control the right side of workbench 2 by threaded rod 7
End upwarp or the horizontality for the i.e. adjustable working table 2 of sinking；After being adjusted to horizontal level, toward wafer on the upper silicon of spraying
Glue, opens motor 3, drives vacuum cup 1 to rotate, under the influence of centrifugal force the silica gel meeting uniform fold on wafer to wafer
On the surface of piece.
The above, is only the preferable embodiment of the utility model, but the scope of protection of the utility model is not
This is confined to, any one skilled in the art is in the technical scope that the utility model discloses, according to this practicality
New technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (4)
1. a kind of litho machine wafer spin coating device, including workbench（2）, be fixedly connected on workbench（2）On motor
（3）, and horizontal it is arranged on motor（3）Vacuum cup on main shaft（1）, it is characterised in that：Further include the support plate of a L-shaped
（4）；The workbench（2）Front be equipped with a horizon rule（10）；The workbench（2）Left surface pass through articulated shaft（5）
It is rotatably connected on support plate（4）Vertical plate portion medial surface on；The support plate（4）Vertical plate portion medial surface on be additionally provided with
Two horizontally disposed guide rails（6）It is located at two guide rails with one（6）Between, and horizontally disposed threaded rod（7）, wherein described
Threaded rod（7）One end support plate is rotatably connected on by bearing（4）Vertical plate portion medial surface on；The guide rail（6）Upper cunning
It is dynamic to be connected with a sliding block（8）；The threaded rod（7）Through sliding block（8）, and and sliding block（8）It is threadedly coupled；The workbench
（2）Bottom surface and support plate（4）Horizontal plate part upper surface between be fixedly connected with tension spring（9）；The workbench（2）It is right
Side is the inclined plane in oblique upper right side；The sliding block（8）Upper surface also be and the workbench（2）Inclined plane be adapted
Inclined plane.
A kind of 2. litho machine according to claim 1 wafer spin coating device, it is characterised in that：The vacuum cup
（1）Inside has hollow cavity（102）, and upper surface has some and hollow cavity（102）The sucker of connection（101）；It is described hollow
Chamber（102）Also with vacuum generator（103）Connection.
A kind of 3. litho machine according to claim 2 wafer spin coating device, it is characterised in that：The support plate（4）
Vertical plate portion top be equipped with a horizontally toward vacuum cup（1）The nozzle of top（12）, the nozzle（12）It is connected with wind
Machine（11）.
A kind of 4. litho machine according to claim 3 wafer spin coating device, it is characterised in that：The threaded rod（7）
Right end be fixedly connected with turning handle（13）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721240564.8U CN207337070U (en) | 2017-09-26 | 2017-09-26 | A kind of litho machine wafer spin coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721240564.8U CN207337070U (en) | 2017-09-26 | 2017-09-26 | A kind of litho machine wafer spin coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207337070U true CN207337070U (en) | 2018-05-08 |
Family
ID=62369822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721240564.8U Expired - Fee Related CN207337070U (en) | 2017-09-26 | 2017-09-26 | A kind of litho machine wafer spin coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207337070U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108649004A (en) * | 2018-05-21 | 2018-10-12 | 王青 | A kind of litho machine wafer coating system |
| CN108646517A (en) * | 2018-05-29 | 2018-10-12 | 侯玉闯 | A kind of litho machine wafer spin coating device |
| CN109828438A (en) * | 2018-12-29 | 2019-05-31 | 上海华力集成电路制造有限公司 | The method for monitoring the coating platform flatness of litho machine |
| CN113721425A (en) * | 2021-08-27 | 2021-11-30 | 宁波润华全芯微电子设备有限公司 | Wafer glue-homogenizing developing device |
| CN114713465A (en) * | 2022-06-08 | 2022-07-08 | 上海图双精密装备有限公司 | Automatic gluing mechanism |
-
2017
- 2017-09-26 CN CN201721240564.8U patent/CN207337070U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108649004A (en) * | 2018-05-21 | 2018-10-12 | 王青 | A kind of litho machine wafer coating system |
| CN108646517A (en) * | 2018-05-29 | 2018-10-12 | 侯玉闯 | A kind of litho machine wafer spin coating device |
| CN108646517B (en) * | 2018-05-29 | 2021-06-08 | 江西维易尔半导体设备有限公司 | Wafer glue homogenizing device for photoetching machine |
| CN109828438A (en) * | 2018-12-29 | 2019-05-31 | 上海华力集成电路制造有限公司 | The method for monitoring the coating platform flatness of litho machine |
| CN109828438B (en) * | 2018-12-29 | 2021-10-15 | 上海华力集成电路制造有限公司 | Method for monitoring flatness of coating platform of photoetching machine |
| CN113721425A (en) * | 2021-08-27 | 2021-11-30 | 宁波润华全芯微电子设备有限公司 | Wafer glue-homogenizing developing device |
| CN114713465A (en) * | 2022-06-08 | 2022-07-08 | 上海图双精密装备有限公司 | Automatic gluing mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180508 |