CN207321769U - A kind of high efficiency and heat radiation Universal machine cabinet based on conduction - Google Patents
A kind of high efficiency and heat radiation Universal machine cabinet based on conduction Download PDFInfo
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- CN207321769U CN207321769U CN201721449665.6U CN201721449665U CN207321769U CN 207321769 U CN207321769 U CN 207321769U CN 201721449665 U CN201721449665 U CN 201721449665U CN 207321769 U CN207321769 U CN 207321769U
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Abstract
The utility model discloses a kind of high efficiency and heat radiation Universal machine cabinet based on conduction, belong to equipment cabinets technical field.It includes the chassis frame of metal material and plate, chassis frame includes backboard, cover board, top panel, bottom plate, right plate and left plate, top panel and bottom plate are equipped with the slot corresponded, plate is inserted in a manner of parallel to right plate and left plate in one group of slot corresponded, plate includes board support frame, there is installation position on backboard, heat conduction boss and heat pipe are additionally provided with backboard and board support frame.The utility model uses passive radiating mode, and without additional power supply, radiation processes are noiseless, without friction, and reliability is high, long lifespan.
Description
Technical field
Equipment cabinets technical field is the utility model is related to, particularly relates to a kind of high efficiency and heat radiation universal machine based on conduction
Case.
Background technology
Under some environment, electronic equipment is only capable of carrying out the dissipation of heat by equipment mounting surface, in order to make electronic equipment work
Make within the temperature range of permission, it is necessary to which the heat produced inside equipment is transmitted on equipment mounting surface.With the hair of technology
Exhibition, device integration is higher and higher, and power consumption is increasing, and the index of the weight of consideration, the weight being assigned on cooling system has
Limit, in this case, the mode such as conventional pilot backing, which radiates, can not be effectively conducted to the heat that equipment produces equipment installation
On face, cause chip local temperature quickly to raise, influence equipment performance, in some instances it may even be possible to which equipment is caused to damage.
Utility model content
In view of this, the utility model proposes a kind of high efficiency and heat radiation Universal machine cabinet based on conduction, its with it is expansible, can
The characteristics of general, can be suitable for high integration, the environment of big power consumption.
Based on above-mentioned purpose, technical solution provided by the utility model is：
A kind of high efficiency and heat radiation Universal machine cabinet based on conduction, it includes the chassis frame of metal material and for setting electricity
The plate of road plate component, the chassis frame includes backboard, cover board, top panel, bottom plate, right plate and left plate, described above
Plate and bottom plate are equipped with the slot corresponded, the plate be inserted in a manner of parallel to right plate and left plate one group it is mutual
In corresponding slot, the plate includes board support frame, has the installation position for being used for setting motherboard, institute on the backboard
State and heat conduction boss is additionally provided with the board support frame of backboard and plate and for conducting heat at the bottom plate
The heat pipe flattened.
Optionally, the right plate or left plate are equipped with the preformed hole for being used for setting connector.
Optionally, the cover board is equipped with the reservation window for being used for exposing the circuit interface on the plate.
Optionally, the end of the slot is equipped with limited block.
Optionally, the board support frame of the slot is equipped with groove, and the heat pipe of the plate is located at the groove
Interior, the groove is located on opposite two sides with the heat conduction boss on the plate.
Optionally, it is additionally provided with heat conductive pad on the heat conduction boss.
From narration above as can be seen that the beneficial effect of technical solutions of the utility model is：
1st, the utility model perfect heat-dissipating：By the combination of metal framework structure and heat pipe, structure is greatly improved
Heat conductivility, compared with equivalent weight simple metal frame, heat transfer property lifts about 20 times.
2nd, the utility model overall volume is small, light-weight：Primary structure can use Light Aluminum Alloy material, can utilize
Finite element analysis carries out optimized design, can try one's best on the premise of intensity is met and mitigate construction weight, in addition, the utility model will
Heat pipe in embedded plate and bottom plate, reduces weight, with realizing setting for identical function after flattening while average temperature performance is improved
Standby to compare, weight reduces 40%.
3rd, the utility model versatility is good, scalability is strong：Big power consuming devices cloth in fixed range such as circuit board assemblies
Office is, it can be achieved that the generalization of board plug structure.By increasing on backboard to grafting plug number and slot number, it is possible to achieve insert
The extension of plate.
4th, the utility model heat dissipation it is noiseless, without power supply, highly reliable：Using passive radiating mode, without additional power supply,
Radiation processes are noiseless, without friction, and the utility model uses heat pipe as main thermal component, and reliability is high, long lifespan.
Brief description of the drawings
In order to clearly describe this patent, one or more attached drawing is provided below, these attached drawings are intended to this patent
Background technology, technical principle and/or some specific embodiments make aid illustration.It should be noted that these attached drawings can
It can not also provide some to provide and have been described and belong to known in those of ordinary skill in the art often at this patent word segment
The detail of knowledge；Also, because those of ordinary skill in the art can combine the published word content of this patent completely
And/or accompanying drawing content, more attached drawings, therefore these attached drawings below are designed in the case where not paying any creative work
Can cover can not also cover all technical solutions that this patent word segment is described.In addition, these attached drawings is specific interior
Containing needs the word content with reference to this patent to be determined, when word content and some obvious knot in these attached drawings of this patent
, it is necessary to which to carry out comprehensive descision be this on earth with reference to the narration of the common knowledge and this patent other parts of this area when structure is not consistent
There are exist to draw mistake in clerical mistake, or attached drawing for the word segment of patent.Especially, the following drawings is the figure of exemplary in nature
Piece, it is not intended that imply the protection domain of this patent, those of ordinary skill in the art are by reference to the text disclosed in this patent
Word content and/or accompanying drawing content, can design more attached drawings, these are new in the case where not paying any creative work
Technical solution representated by attached drawing is still within the protection domain of this patent.
Fig. 1 is the explosive view of the utility model；
Fig. 2 is a kind of structure diagram of Fig. 1 centerboards；
Fig. 3 is a kind of structure diagram of Fig. 1 dorsulums；
Fig. 4 is the distribution schematic diagram of heat conduction boss on plate frame；
Fig. 5 is the distribution schematic diagram of heat conduction boss on backboard；
Fig. 6 is the structure diagram of slot end；
Fig. 7 is that plate is intended to the structure that backboard is combined.
Embodiment
For the ease of understanding of the those skilled in the art to the art of this patent scheme, meanwhile, in order to make the technology of this patent
Purpose, technical solution and beneficial effect are clearer, and the protection domain of claims is fully supported, below with tool
The form of body case makes the technical solution of this patent further, more detailed description.
As shown in Fig. 1~7, a kind of high efficiency and heat radiation Universal machine cabinet based on conduction, it includes the chassis frame of metal material
With plate 9, the chassis frame includes backboard 2, cover board 8, top panel 4, bottom plate 10, right plate 6 and left plate 11, described above
Plate 4 and bottom plate 10 are equipped with the slot corresponded, and the plate 9 is inserted in a manner of parallel to right plate 6 and left plate 11
In one group of slot corresponded, the plate 9 includes board support frame, and the board support frame is mainly by outline border
There is the installation position for being used for setting motherboard, backboard and the circuit board branch and the reinforcing rib in outline border forms, on the backboard 2
Heat conduction boss 15 is additionally provided with support frame frame and for conducting heat to the heat pipe 12~14 flattened at the bottom plate.
Optionally, the right plate 6 is equipped with the preformed hole for being used for setting connector 1.
Optionally, the cover board 8 is equipped with the reservation window for being used for exposing the circuit interface on the plate.
Optionally, the end of the slot is equipped with limited block 16, and two edge up and down of the plate, which are equipped with, to be used to clamp plate
Wedge lock mechanism 5.
Optionally, the board support frame of the slot is equipped with groove, and the heat pipe of the plate is located at the groove
Interior, groove is located on opposite two sides with heat conduction boss, and the gap between heat pipe and groove can be filled and be carried out with adhesive
Milling, ensures good flatness and roughness.
Optionally, heat conductive pad 3 is additionally provided with the heat conduction boss 15, specifically, heat conductive pad 3 is arranged on the big work(of circuit board
The surface of chip is consumed, and is come into full contact with heat conduction boss, easy to the transmission of heat.
Plate on the surface of the big power dissipating chip of circuit board assemblies 7 in use, add the heat conductive pad of suitable dimension, so first
Circuit board assemblies 7 are arranged on plate frame afterwards and is screwed and compresses, ensure the abundant of heat conductive pad and heat conduction boss
Wedge lock mechanism 5, is then screwed and up and down at two edge, completes the assembling of plate in plate by contact.
Backboard is in use, add the heat conductive pad of suitable dimension on the surface of the big power dissipating chip of motherboard, then with screw by mother
Plate is fixed and is pressed on backboard, and guarantee heat conductive pad comes into full contact with heat conduction boss.
The radiating principle of the cabinet is, the heat that plate circuit board assemblies produce by heat conductive pad, heat conduction lands conduct extremely
On plate frame, bottom position is delivered to by heat pipe, and conduct heat on bottom plate by the contact surface of heat pipe and bottom plate.
The heat that backplane circuit board component produces is delivered to bottom by heat conductive pad, heat conduction lands conduct to backboard wall by heat pipe
Portion position.Finally, the heat of equipment is conducted on heat sink by bottom plate.
The cabinet uses the chassis frame of split type, is fastened after overall package with screw.In the cabinet, except supporting, to
Internal circuit board component is provided outside good installation environment effect, and each panel can also have the function that each different.For example, left,
Right plate can connector mounting as requested；Top panel, bottom plate are used for the main radiating surface of fixing insertion module, bottom plate or equipment
With main load-carrying surface, heat is quickly delivered to radiating surface by heat derives by plate and backboard using heat pipe；Cover board is used to form
The cabinet of one closing.
Plate can use the tower structure of closure, and design support column at middle reinforced rib is connected with circuit board assemblies,
Increase the rigidity of printed board assembly, groove can also be milled out, heat pipe is set, improve heat transfer efficiency.
Limited block can ensure the reliability of plate contact, while after ensureing several plates and backboard to inserting, plate connects
Plug-in unit side is in same plane.
In use, motherboard can be set on backboard, expansible assembly module is set in plate, on left and right side plate
External interface is set, in addition, setting motherboard interface, the medial extremity of every block of plate on backboard at the position corresponding to every block of plate
On face set plate interface, plate along slot be inserted into bottom when, plate interface is connected with motherboard interface just, in plate end face outside
Interface be then exposed at just at the reservation window of cover board.
The cooling system of the utility model mainly includes the heat pipe on plate and backboard, and plate can be directed to different big power consumption devices
Part designs two kinds of heat pipes：Two " L " type heat pipes being arranged symmetrically（That is the heat pipe 12 in Fig. 2）For dissipating compared with small package device
Heat；Two " P " type heat pipes being arranged symmetrically（That is the heat pipe 13 in Fig. 2）Heat dissipation for big packaging.It can be designed on backboard
Two " L " type heat pipes being arranged symmetrically are used for the heat dissipation of big packaging.
The cooling system of the utility model has the characteristics that plug and play, and each plate can independently radiate, from the shadow of adjacent insert plates
Ring, while there is scalability.Cooling system is without outer power supply source, and noiseless, without friction, heat dissipation effect is well reliable.
By appropriate optimization design, the utility model is capable of providing the heat dissipation capacity of single plate 100W, it is with weight
Gently, the advantages of small, expansible, by the way of big power consuming devices are laid out in fixed range, it is easy to accomplish generalization and
Modularization, is highly suitable to be applied in the environment harsh to weight, volume, anti-vibration requirement.
It is to be appreciated that to be intended merely to facilitate this area common for the above-mentioned narration for this patent embodiment
The exemplary description that technical staff understands this patent scheme and enumerates, does not imply that the protection domain of this patent is limited solely to
In this few example, those of ordinary skill in the art completely can on the premise of making and fully understanding to the art of this patent scheme,
In the form of not paying any creative work, by taking each example cited by this patent combination technique feature, replacing
Some technical characteristics, add more technical characteristics etc. mode, obtains more embodiments, all these specific implementations
Mode is within the covering scope of patent claims book, and therefore, these new embodiments also should be in this patent
Protection domain within.
In addition, for the purpose for simplifying narration, this patent may also not enumerate some ordinary specific embodiments, this
A little schemes are that those of ordinary skill in the art can expect naturally after it understanding of the art of this patent scheme, it is clear that this
A little schemes should also be included within the protection domain of this patent.
For the purpose for simplifying narration, above-mentioned each embodiment may only up to for the extent of disclosure of ins and outs
The degree that can voluntarily make a decision to those skilled in the art, i.e. there is no disclosed ins and outs for above-mentioned embodiment,
Those of ordinary skill in the art completely can be in the case where not paying any creative work, in filling for the art of this patent scheme
Divide under prompting, completed by means of the disclosed document of textbook, reference book, paper, patent, audio-visual product etc., alternatively, this
A little details are the contents that can voluntarily be maked decision according to actual conditions under being generally understood that of those of ordinary skill in the art.
As it can be seen that even if these underground ins and outs, the open adequacy of the art of this patent scheme will not be impacted.
In short, on the basis of explanation effect of the patent specification to claims protection domain is combined, it is any
Fall into the specific embodiment of patent claims book covering scope, within the protection domain of this patent..
Claims (6)
1. a kind of high efficiency and heat radiation Universal machine cabinet based on conduction, it is characterised in that chassis frame and use including metal material
In the plate for setting circuit board assemblies, the chassis frame includes backboard, cover board, top panel, bottom plate, right plate and left plate,
The top panel and bottom plate are equipped with the slot corresponded, and the plate is inserted in a manner of parallel to right plate and left plate
In one group of slot corresponded, the plate includes board support frame, has on the backboard and is used to set motherboard
Installation position, heat conduction boss and described for conducting heat to is additionally provided with the board support frame of the backboard and plate
The heat pipe flattened at bottom plate.
2. the high efficiency and heat radiation Universal machine cabinet according to claim 1 based on conduction, it is characterised in that the right plate or a left side
Side plate is equipped with the preformed hole for being used for setting connector.
3. the high efficiency and heat radiation Universal machine cabinet according to claim 1 based on conduction, it is characterised in that the cover board is equipped with
For exposing the reservation window for the circuit interface being located on the plate.
4. the high efficiency and heat radiation Universal machine cabinet according to claim 1 based on conduction, it is characterised in that the end of the slot
Equipped with limited block.
5. the high efficiency and heat radiation Universal machine cabinet according to claim 1 based on conduction, it is characterised in that the circuit of the slot
Plate support frame is equipped with groove, and the heat pipe of the plate is located in the groove, the groove and the heat conduction on the plate
Boss is located on opposite two sides.
6. the high efficiency and heat radiation Universal machine cabinet according to claim 1 based on conduction, it is characterised in that on the heat conduction boss
It is additionally provided with heat conductive pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721449665.6U CN207321769U (en) | 2017-11-03 | 2017-11-03 | A kind of high efficiency and heat radiation Universal machine cabinet based on conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721449665.6U CN207321769U (en) | 2017-11-03 | 2017-11-03 | A kind of high efficiency and heat radiation Universal machine cabinet based on conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207321769U true CN207321769U (en) | 2018-05-04 |
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ID=62380435
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721449665.6U Active CN207321769U (en) | 2017-11-03 | 2017-11-03 | A kind of high efficiency and heat radiation Universal machine cabinet based on conduction |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167318A (en) * | 2019-04-29 | 2019-08-23 | 中国科学院西安光学精密机械研究所 | A kind of temperature control system and electronics cabinet |
| CN110337209A (en) * | 2019-07-16 | 2019-10-15 | 中国电子科技集团公司第二十九研究所 | A kind of electronic cabinet and its assemble method of structure-function integration |
| WO2020103155A1 (en) * | 2018-11-23 | 2020-05-28 | 北京比特大陆科技有限公司 | Main machine |
-
2017
- 2017-11-03 CN CN201721449665.6U patent/CN207321769U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020103155A1 (en) * | 2018-11-23 | 2020-05-28 | 北京比特大陆科技有限公司 | Main machine |
| CN110167318A (en) * | 2019-04-29 | 2019-08-23 | 中国科学院西安光学精密机械研究所 | A kind of temperature control system and electronics cabinet |
| CN110337209A (en) * | 2019-07-16 | 2019-10-15 | 中国电子科技集团公司第二十九研究所 | A kind of electronic cabinet and its assemble method of structure-function integration |
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