CN207305067U - A kind of flexible PCB and display device - Google Patents
A kind of flexible PCB and display device Download PDFInfo
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- CN207305067U CN207305067U CN201721426073.2U CN201721426073U CN207305067U CN 207305067 U CN207305067 U CN 207305067U CN 201721426073 U CN201721426073 U CN 201721426073U CN 207305067 U CN207305067 U CN 207305067U
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- flexible pcb
- contact electrode
- substrate
- liquid
- encapsulated layer
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- 239000007788 liquid Substances 0.000 claims abstract description 125
- 239000000758 substrate Substances 0.000 claims abstract description 107
- 239000000126 substance Substances 0.000 claims abstract description 47
- 239000012528 membrane Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims description 34
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 6
- 229910000807 Ga alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 239000008151 electrolyte solution Substances 0.000 claims description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052753 mercury Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 15
- 230000008859 change Effects 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 9
- 239000007769 metal material Substances 0.000 description 8
- 230000005611 electricity Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000002547 anomalous effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The utility model discloses a kind of flexible PCB and display device, the flexible PCB, including：Substrate, positioned at least one conductive structure of substrate, contacts electrode group, for packaging conductive structure and the encapsulated layer of contact electrode group, and ventilated membrane；Wherein, electrode group is contacted, including：For contacting electrode and the second contact electrode with the first of the both ends electrical connection of conductive structure respectively；Encapsulated layer forms interconnected cavity and liquid storage area with substrate；Conductive structure, including：Liquid conductive substance in cavity；Liquid storage area is used for storing liquid conductive materials, and ventilated membrane is used to encapsulate liquid storage area and make liquid storage area connect with external atmosphere pressure.When stretching the flexible PCB, the liquid conductive substance in conductive structure is flowed due to the change of air pressure, realize liquid conductive substance with first contact electrode and second contact electrode between conducting, realize the stretchable of flexible PCB.
Description
Technical field
Display technology field is the utility model is related to, espespecially a kind of flexible PCB and display device.
Background technology
With the continuous development of Display Technique, display screen or touch-screen are had been widely used in the life of people, wherein,
Liquid crystal display (Liquid Crystal Display, LCD) have the characteristics that it is small, low in energy consumption, radiationless, in the market
Occupy critical role.Organic electroluminescence device (Organic Light-Emitting Diode, OLED) has self-luminous, anti-
Should be fast, visual angle is wide, brightness is high, color is gorgeous, frivolous the advantages that, also it has been widely used in market.
With the rapid development of Display Technique, people have the pursuit of higher for display mode, effect etc., increasingly
More users has flexible extensible, wearing display etc. the requirement of higher.However, traditional flexible PCB (Flexible
Printed Circuit, FPC) due to non-stretchable property, and signal thread breakage easily occurs in use, thus cause
Signal transmission anomalous effects display screen normally shows, causes to show bad, and therefore, flexible PCB of the prior art is difficult should
For in stretchable display device or wearable device.
Utility model content
The utility model embodiment provides a kind of flexible PCB and display device, existing in the prior art to solve
The problem of flexible PCB is non-stretchable.
In a first aspect, the utility model embodiment provides a kind of flexible PCB, including：Substrate, positioned at the substrate
On at least one conductive structure, contact electrode group, for encapsulate the conductive structure and it is described contact electrode group encapsulation
Layer, and ventilated membrane；Wherein,
The contact electrode group, including：For contacting electrode with the first of the both ends electrical connection of the conductive structure respectively
With the second contact electrode；
The encapsulated layer forms interconnected cavity and liquid storage area with the substrate；
The conductive structure, including：Liquid conductive substance in the cavity；
The liquid storage area is used to store the liquid conductive substance, and the ventilated membrane is used to encapsulate the liquid storage area and make
The liquid storage area is connected with external atmosphere pressure.
It is described in the above-mentioned flexible PCB that the utility model embodiment provides in a kind of possible implementation
Liquid storage area is located at the conductive structure and contacts one end that electrode is connected with described first.
It is described in the above-mentioned flexible PCB that the utility model embodiment provides in a kind of possible implementation
The orthographic projection of first contact electrode and the liquid storage area on substrate partly overlaps, and the second contact electrode and the cavity exist
Orthographic projection on substrate partly overlaps.
It is described in the above-mentioned flexible PCB that the utility model embodiment provides in a kind of possible implementation
Encapsulated layer, including：First encapsulated layer, and the second encapsulated layer positioned at first encapsulated layer away from the substrate side；
First encapsulated layer is away from the surface of the substrate side and the flush of the liquid storage area, second envelope
Layer is filled away from the surface of the substrate side and the flush of the ventilated membrane.
It is described in the above-mentioned flexible PCB that the utility model embodiment provides in a kind of possible implementation
Part surface of the first contact electrode close to the substrate side is exposed；Or, the first contact electrode deviates from the substrate one
The part surface of side is exposed；
Part surface of the second contact electrode close to the substrate side is exposed；Or, the second contact electrode back of the body
Surface portion from the substrate side is exposed.
It is described in the above-mentioned flexible PCB that the utility model embodiment provides in a kind of possible implementation
The pore diameter size of ventilated membrane is located between molecular diameter maximum in air and the particle diameter of liquid conductive substance.
It is described in the above-mentioned flexible PCB that the utility model embodiment provides in a kind of possible implementation
Ventilated membrane includes expanded polytetrafluoroethylsealing material.
It is described in the above-mentioned flexible PCB that the utility model embodiment provides in a kind of possible implementation
Liquid conductive substance includes liquid metal, and either the electrolyte solution liquid metal includes indium tin gallium alloy material or mercury.
It is described in the above-mentioned flexible PCB that the utility model embodiment provides in a kind of possible implementation
Substrate includes resin material, and the encapsulated layer includes resin material.
Second aspect, the utility model embodiment provide a kind of display device, including：Above-mentioned flexible PCB.
The utility model has the beneficial effect that：
The utility model embodiment provides a kind of flexible PCB and display device, the flexible PCB, including：Lining
Bottom, positioned at least one conductive structure of substrate, contacts electrode group, for packaging conductive structure and the envelope of contact electrode group
Fill layer, and ventilated membrane；Wherein, electrode group is contacted, including：For being contacted respectively with the first of the both ends electrical connection of conductive structure
Electrode and the second contact electrode；Encapsulated layer forms interconnected cavity and liquid storage area with substrate；Conductive structure, including：It is located at
Liquid conductive substance in cavity；Liquid storage area is used for storing liquid conductive materials, and ventilated membrane is used to encapsulate liquid storage area and makes storage
Liquid zone is connected with external atmosphere pressure.The above-mentioned flexible PCB that the utility model embodiment provides, since conductive structure includes position
In the liquid conductive substance in cavity, when stretching the flexible PCB, the liquid conductive substance in conductive structure is due to air pressure
Change and flow, realize that liquid conductive substance contacts conducting between electrode and the second contact electrode with first, thus is protecting
On the basis of the electric conductivity for having demonstrate,proved flexible PCB, the stretchable of flexible PCB is realized.
Brief description of the drawings
Fig. 1 is the top view for the flexible PCB that the utility model embodiment provides；
Fig. 2 a and Fig. 2 b are the schematic cross-section at AB in Fig. 1；
Fig. 3 is schematic diagram of the flexible PCB in drawing process in the utility model embodiment；
Fig. 4 is the structure diagram after flexible circuit plate stretching in the utility model embodiment；
Fig. 5 is one of flow chart of production method of above-mentioned flexible PCB that the utility model embodiment provides；
Fig. 6 a~Fig. 6 c, Fig. 8 and Figure 10 a~Figure 10 c are the knot in above-mentioned production method in the utility model embodiment
Structure schematic diagram；
Fig. 7 is the two of the flow chart of the production method for the above-mentioned flexible PCB that the utility model embodiment provides；
Fig. 9 is the three of the flow chart of the production method for the above-mentioned flexible PCB that the utility model embodiment provides；
Wherein, 11, substrate；12nd, conductive structure；13rd, electrode group is contacted；131st, the first contact electrode；132nd, the second contact
Electrode；14th, encapsulated layer；141st, the first encapsulated layer；142nd, the second encapsulated layer；15th, ventilated membrane；16th, conductive layer；17th, underlay substrate；
18th, groove；21st, cavity；22nd, liquid storage area.
Embodiment
For flexible PCB existing in the prior art it is non-stretchable the problem of, the utility model embodiment provides one
Kind flexible PCB and display device.
Below in conjunction with the accompanying drawings, the flexible PCB and the specific embodiment party of display device provided the utility model embodiment
Formula is described in detail.The thickness of each film layer and shape do not reflect actual proportions in attached drawing, and purpose is schematically illustrate reality
With new content.
In a first aspect, the utility model embodiment provides a kind of flexible PCB, such as Fig. 1, and shown in Fig. 2 a and Fig. 2 b, bag
Include：Substrate 11, at least one conductive structure 12 on substrate 11, contacts electrode group 13, for packaging conductive structure 12
With the encapsulated layer 14 of contact electrode group 13, and ventilated membrane 15；Wherein,
Electrode group 13 is contacted, including：For respectively with the both ends of conductive structure are electrically connected first contacts electrode 131 and the
Two contact electrodes 132；
Encapsulated layer forms interconnected cavity 21 and liquid storage area 22 with substrate；
Conductive structure 12, including：Liquid conductive substance in cavity 21；
Liquid storage area 22 is used for storing liquid conductive materials, ventilated membrane 15 be used to encapsulating liquid storage area 22 and make liquid storage area 22 with
External atmosphere pressure connects.
The above-mentioned flexible PCB that the utility model embodiment provides, since substrate and encapsulated layer generally can with certain
Draftability, and conductive structure 12 includes the liquid conductive substance in cavity 21, it is conductive when stretching the flexible PCB
Liquid conductive substance in structure 12 is flowed due to the change of air pressure, realizes that liquid conductive substance contacts electrode 131 with first
And the second conducting between contact electrode 132, thus on the basis of it ensure that the electric conductivity of flexible PCB, realize soft
Property circuit board it is stretchable.
As shown in Figure 1, in the specific implementation, the first contact electrode 131 and second in each contact electrode group 13 connects
Touched electrode 132 is generally located on the both ends of flexible PCB, and a conductive structure 12 contacts electricity with positioned at the first of both ends respectively
Pole 131 and second contacts electrode 132 and connects, thus two devices can be turned on by flexible PCB, to include 7 in Fig. 1
Illustrated exemplified by the contact electrode groups of conductive structure 12,7, herein not to the quantity of conductive structure 12 and contact electrode group 13 into
Row limits.Specifically, the first contact electrode 131 and second, which contacts electrode 132, can generally use metal material to make, such as the
One contact electrode and the second contact electrode can be copper electrode, and the first contact electrode and the second contact electrode can also use other
Conductive material, can be it is flexible can also be it is rigid, since the first contact electrode and the second contact electrode generally distinguish position
In the both ends of flexible PCB, the stress produced in drawing process will not focus on the first contact electrode and the second contact electrode
On, therefore, the first contact electrode and second contacts the tensile property that electrode does not interfere with flexible PCB, and flexible PCB is being drawn
During stretching first contact electrode and the second contact electrode will not be broken.
With reference to Fig. 1, since the connection of each conductive structure 12 is positioned at the first contact contact electricity of electrode 131 and second at both ends
Pole 132, thus, adjacent two conductive structures 12 need to keep insulating, so a conductive structure 12 is preferably a corresponding storage
Liquid zone 22, in addition, for the ease of making, adjacent several conductive structures 12 can share a ventilated membrane 15, this time not to saturating
The quantity of air film 15 and liquid storage area 22 is defined.
In the specific implementation, the above-mentioned flexible PCB that the utility model embodiment provides, in a display device, for even
Display screen and printed circuit board (PCB) (Printed Circuit Board, PCB) are connect, specifically, can be by positioned at each of the same end
First contact electrode (i.e. golden finger) is connected with each contact pad designed (pad) on display screen respectively, by positioned at each of the other end
Second contact electrode is connected with each contact pad designed (pad) on printed circuit board (PCB) respectively.In addition it is also possible to it is applied to other equipment
In, for example, in the device such as bracelet, wrist-watch, the application range of flexible PCB is not defined this time.
With reference to Fig. 1, Fig. 2 a and Fig. 2 b, in the above-mentioned flexible PCB that the utility model embodiment provides, can use
Material with certain tensile property makes substrate and encapsulated layer, thus can realize the tensility of substrate 11 and encapsulated layer 14
Can, and the conductive structure 12 of electric action is played, including：Liquid conductive substance in cavity 21, due to liquid conductive material
Matter has mobility so that flexible PCB is not in the situation that conductive structure 12 is broken in drawing process.It is each in Fig. 1
The shape of conductive structure 12 is the preferred implementation of the utility model embodiment, in practical applications, can be according to reality
Need, to set the shape of conductive structure 12, not limit herein.
In addition, by setting the liquid storage area 22 for storing liquid conductive materials, and for encapsulating liquid storage area 22 and making
The ventilated membrane 15 that liquid storage area 22 is connected with ambient atmosphere, can make liquid conductive substance in drawing process to the direction that air pressure is low
Flowing, so as to ensure that conductive structure 12 contact the contact electrode 132 of electrode 131 and second with first and keeps good and connect after the stretch
Touch, to ensure electric conductivity, specific drawing process combination Fig. 3 and Fig. 4 are described in detail；
Fig. 2 a and Fig. 2 b are the reset condition that flexible PCB is not stretched, as can be seen from the figure the liquid in cavity 21
State conductive materials contact the contact electrode 132 of electrode 131 and second with the first of both ends and contact well；As shown in figure 3, stretching
Cheng Zhong, since the volume of cavity 21 becomes larger, can form negative pressure region, i.e. gas at arrow C at the position in figure shown in arrow C
Pressure is smaller, and the air pressure of the liquid storage area 22 connected with external atmosphere pressure is larger so that the liquid conductive substance in liquid storage area 22 exists
Negative pressure region C is flowed under the action of atmospheric pressure, structure as shown in Figure 4, liquid conductive substance and first are obtained after the completion of stretching
Contact electrode 131 and second contacts electrode 132 and realizes good contact.In practical applications, it is necessary to according to the degree of stretching come
The content of cavity 21 and the liquid conductive substance in liquid storage area 22 is set, to ensure liquid conductive substance in reset condition and stretching
After can be with contacting electrode group good contact.
It should be noted that in the utility model embodiment, above-mentioned liquid conductive substance can refer in flexible PCB
Under working environment be liquid conductive materials, be not limited only at room temperature be liquid conductive materials, such as can use in work
Make under environment be liquid metal material, due to liquid metal have high conductivity, high thermal conductivity, high resiliency and high yield it is strong
The features such as spending, but also with high temperature resistant, erosion-resisting feature, do not trickle at high temperature, not volatile and oxidation therefore, can
To ensure that flexible PCB has good electric conductivity and stability.Since the fusing point of the liquid metal of different materials is different,
In practical applications, it is necessary to determine to need the liquid metal material used according to actual working environment.
Specifically, in the above-mentioned flexible PCB provided in the utility model embodiment, as shown in Figure 2 a and 2 b, liquid storage
Area 22 is located at conductive structure 12 and contacts the connected one end of electrode 131 with first.So in flexible PCB drawing process, liquid
Conductive materials are flowed only along a direction, it is easier to ensure that liquid conductive substance contacts electrode 131 and with the first of both ends
Liquid storage area 22, can also be arranged on conductive structure 12 and contact 132 phase of electrode with second by good contact between two contact electrodes 132
One end even, or liquid storage area 22 is arranged on other positions according to being actually needed, do not limit herein.
In the above-mentioned flexible PCB provided referring again to Fig. 2 a and Fig. 2 b, the utility model embodiment, the first contact electricity
The orthographic projection of pole 131 and liquid storage area 22 on substrate partly overlaps, the positive throwing of the second contact electrode 132 and cavity 21 on substrate
Shadow partly overlaps.Contact surface of the first contact electrode (or second contact electrode) between liquid conductive substance can so be increased
Product, conductive structure 12 contact with first, to be not easy appearance between electrode (or second contact electrode) breaking, ensure that flexible electrical
The electric conductivity of road plate.By taking the orthographic projection of the second contact electrode and cavity on substrate partly overlaps as an example, such as Fig. 2 a and Fig. 2 b
The right end of hollow cavity 21, has overlapping region by the second contact electrode and cavity so that second contact electrode side and
Surface in cavity 21 can be contacted with liquid conductive substance, compared to only in the side of the second contact electrode and liquid
Conductive materials contact, and considerably increase contact area, and the first contact electrode is had to the principle class of overlapping region with liquid storage area 22
Seemingly, details are not described herein again.
Specifically, in the above-mentioned flexible PCB that the utility model embodiment provides, as shown in Figure 2 a and 2 b, above-mentioned envelope
Layer 14 is filled, can be included：First encapsulated layer 141, and the second encapsulated layer positioned at the first encapsulated layer 141 away from 11 side of substrate
142；
First encapsulated layer 141 is carried on the back away from the surface of 11 side of substrate and the flush of liquid storage area 22, the second encapsulated layer 142
Surface and the flush of ventilated membrane 15 from 11 side of substrate.
The knot by setting the first encapsulated layer 141 to form liquid storage area 22 and cavity 21 is can be seen that from Fig. 2 a and Fig. 2 b
Structure, to house liquid conductive substance, by setting the second encapsulated layer 142 with 15 flush of ventilated membrane, carries on the back encapsulated layer 14
Surface from 11 side of substrate keeps smooth, makes the structure of flexible PCB compacter, in the specific implementation, the first encapsulated layer
141 and second encapsulated layer 142 can use identical material, different materials can also be used, moreover, the first encapsulated layer 141
It can respectively be formed with the second encapsulated layer 142, same technique can also be used to form integrative-structure.In the utility model embodiment
In, the first encapsulated layer deviates from substrate side away from the surface of substrate side and the flush of liquid storage area, and the second encapsulated layer
Surface and ventilated membrane flush be the utility model embodiment preferred embodiment, in practical applications, the first envelope
Filling layer can not also be concordant with the surface of liquid storage area away from the surface of substrate side, and the second encapsulated layer deviates from the surface of substrate side
Surface with ventilated membrane can not also be concordant.
Specifically, in the above-mentioned flexible PCB that the utility model embodiment provides, the first contact electrode is close to substrate 11
The part surface of side is exposed, as shown in Figure 2 a, can by set encapsulated layer 14 maximum width be more than substrate 11 width,
First side of the contact electrode 131 away from 12 side of conductive structure is concordant with encapsulated layer 14, to realize that the first contact electrode 131 leans on
The part surface of nearly 11 side of substrate is exposed；Or, first contact electrode 131 away from 11 side of substrate part surface it is exposed, such as
, can be by setting the width of substrate 11 to be more than the maximum width of encapsulated layer 14 shown in Fig. 2 b, the first contact electrode 131 is remote to lead
The side of electric 12 side of structure is concordant with substrate 11, to realize the first part surface of the contact electrode 131 away from 11 side of substrate
It is exposed.Similarly, part surface of the second contact electrode close to substrate side can also be set exposed；Or, second contact electrode the back of the body
Surface portion from substrate side is exposed.It on the one hand can so make the first contact electrode (or second contact electrode) with being sealed in
Liquid conductive substance between substrate and encapsulated layer is electrically connected, on the other hand, the first contact electrode (or second contact electrode) portion
Exposed surface is divided to be connected with other devices, such as can be with the contact pad designed connection on display screen.
In the specific implementation, in order to make liquid storage area 22 and atmosphere, and the liquid metals in liquid storage area 22 is ensured not
It can be flowed out by ventilated membrane 15, in the above-mentioned flexible PCB that the utility model embodiment provides, the pore diameter of ventilated membrane 15
It is preferably sized to be located between molecular diameter and liquid conductive substance particle diameter maximum in air molecule.Specifically, it is above-mentioned
Ventilated membrane 15 preferably comprises expanded polytetrafluoroethylsealing material.
In practical applications, the material that it is liquid under the working environment of flexible PCB that above-mentioned liquid conductive substance, which is,
Therefore, the material of liquid conductive substance can be set according to the needs of actual working environment, due to mobile phone, television set or computer
Working environment Deng display device is generally room temperature, in some special cases, can also be applied in sub-zero environment,
Therefore, liquid conductive substance is preferably using the relatively low material of fusing point, for example, liquid conductive substance preferably comprises the conjunction of indium tin gallium
Golden material, the fusing point of indium tin gallium alloy is about -19 DEG C, and boiling point is about 1300 DEG C, i.e. temperature of the indium tin gallium alloy more than -19 DEG C
All it is liquid, and the performance of indium tin gallium alloy material is more stable, it is thus possible to meet to use under normal working environment, have
Body, the proportioning of gallium-indium-tin alloy material can be Ga:In:Sn=68.5%:21.5%:10%.In addition, above-mentioned liquid is conductive
Material can also use electrolyte solution or mercury or other disclosure satisfy that the material used under normal operation circumstances,
Do not limit herein.
Specifically, in the above-mentioned flexible PCB in the utility model embodiment, above-mentioned substrate 11 preferably comprises resin
Material, encapsulated layer 14 preferably comprise resin material.Specifically, the first encapsulated layer 141 and the second encapsulated layer in encapsulated layer 14
142 can use resin material.Since resin material has certain elasticity, the draftability of flexible PCB disclosure satisfy that
Can, specifically, above-mentioned resin material is preferably elastic resin, can also use the preferable material of other drawing effects, not right herein
The material of substrate 11 and encapsulated layer 14 is defined.
Second aspect, based on same inventive concept, the utility model embodiment additionally provides a kind of display device, including：
Above-mentioned flexible PCB.The display device can be applied to mobile phone, tablet computer, television set, display, laptop, number
Any products or component with display function such as code photo frame, navigator.Due to the principle that the display device solves the problems, such as with it is upper
State that flexible PCB is similar, therefore the implementation of the display device may refer to the implementation of above-mentioned flexible PCB, repeat part not
Repeat again.
The third aspect, based on same inventive concept, the utility model embodiment additionally provides a kind of above-mentioned flexible PCB
Production method.Since the principle that the production method solves the problems, such as is similar to above-mentioned flexible PCB, the production method
Implementation may refer to the implementation of above-mentioned flexible PCB, and overlaps will not be repeated.
The production method for the above-mentioned flexible PCB that the utility model embodiment provides, as shown in figure 5, can include：
S201, provide a substrate 11, such as the substrate 11 that elastic resin can be used to form, so that the substrate formed is realized
Substrate 11 stretchable, that other materials can also be used to form, is not defined the material of substrate 11 herein；
S202, form at least one contact electrode group on substrate 11, and as shown in Figure 6 a, contact electrode group generally comprises
Electrode and the second contact electrode are contacted positioned at the first of 11 both ends of substrate, the first contact electrode and the second contact electrode are relative to lining
Bottom 11 stretches out, to be formed adjacent to the first exposed contact electrode of the part surface of 11 side of substrate and the second contact electricity
Pole, can if the to be formed first contact electrode and the second contact electrode is exposed in the part surface away from 11 side of substrate
The side of the first contact electrode and the second contact electrode is arranged to concordant with the side of substrate 11；
S203, form encapsulated layer 14 using 3D printing technique, and encapsulated layer 14 is equipped with close to the side of substrate 11 to be used to house
The cavity 21 of liquid conductive substance, and the liquid storage area 22 connected with cavity 21, as shown in Figure 6 b, such as can use elasticity tree
Fat forms encapsulated layer 14, so that encapsulated layer has tensility, other materials can also be used to make encapsulated layer 14, not right herein
The material of encapsulated layer 14 is defined, and during 3D printing, be may be integrally formed encapsulated layer 14, can also be formed first respectively
141 and second encapsulated layer 142 of encapsulated layer；
S204, inject liquid conductive substance into liquid storage area 22, liquid conductive substance is such as schemed with contacting electrode group connection
Shown in 6c, in practical applications, it is necessary to according to the degree of stretching come the liquid conductive substance that determines to inject into liquid storage area 22
Content, to ensure that liquid conductive substance can be with contacting electrode group good contact after reset condition and stretching；
S205, using ventilated membrane 15 encapsulate liquid storage area 22, to form the structure shown in Fig. 2 a.
Fourth aspect, based on same inventive concept, the utility model embodiment additionally provides a kind of above-mentioned flexible PCB
Production method.Since the principle that the production method solves the problems, such as is similar to above-mentioned flexible PCB, the production method
Implementation may refer to the implementation of above-mentioned flexible PCB, and overlaps will not be repeated.
The production method for the above-mentioned flexible PCB that the utility model embodiment provides, as shown in fig. 7, can include：
S301, provide a substrate 11, such as the substrate 11 that elastic resin can be used to form, and can also use other materials
The substrate 11 of composition, is not defined the material of substrate 11 herein；
S302, form at least one contact electrode group on substrate 11, and as shown in Figure 6 a, contact electrode group generally comprises
Contact electrode and the second contact electrode positioned at the first of 11 both ends of substrate, the first contact electrode (or second contact electrode) relative to
Substrate 11 stretches out, be formed adjacent to the part surface of 11 side of substrate it is exposed first contact electrode (or second contact
Electrode), if the to be formed first contact electrode (or second contact electrode) is exposed in part surface away from 11 side of substrate,
The side that electrode (or second contact electrode) can be then contacted first is arranged to concordant with the side of substrate 11；
S303, using liquid metal material, and at a temperature of the fusing point less than liquid metal material, form conductive layer
16, conductive layer is patterned；Conductive layer 16 contacts electrode group connection with least one；In the temperature of the fusing point less than liquid metal
Under degree, liquid metal is solid-state, thus can form solid conductive layer 16, and conductive layer 16 is patterned, and is obtained such as Fig. 8
Shown structure；
S304, at a temperature of the fusing point less than liquid metal material, form encapsulation conductive layer 16 and contact electrode group
Encapsulated layer 14, to form the cavity 21 of conductive structure 12 and liquid storage area 22, as fig. 6 c；Molten less than liquid metal material
At a temperature of point, conductive layer 16 remains as solid-state, and encapsulated layer 14 is formed on conductive layer 16 and contact electrode group, so as to
Form the cavity 21 and liquid storage area 22 of conductive structure 12 as fig. 6 c, the temperature more than the fusing point in liquid metal material
When spending, conductive layer 16 is liquid, thus can the flowing in the cavity 21 and liquid storage area 22 of formation；
S305, the ventilated membrane 15 for forming encapsulation liquid storage area 22, to form the structure shown in Fig. 2 a.
5th aspect, based on same inventive concept, the utility model embodiment additionally provides a kind of above-mentioned flexible PCB
Production method.Since the principle that the production method solves the problems, such as is similar to above-mentioned flexible PCB, the production method
Implementation may refer to the implementation of above-mentioned flexible PCB, and overlaps will not be repeated.
The production method for the above-mentioned flexible PCB that the utility model embodiment provides, as shown in figure 9, can include：
S401, provide a underlay substrate 17, which can be that stretchable underlay substrate 17 can also be not
Stretchable underlay substrate 17, such as glass substrate, are not defined the material of underlay substrate 17 herein；
S402, form encapsulated layer 14 on underlay substrate 17, and as shown in Figure 10 a, encapsulated layer 14, which is equipped with, to be used to house
The groove 18 of liquid conductive substance, and the liquid storage area 22 connected with groove 18, in liquid storage area 22 close to underlay substrate 17 one
Side is equipped with ventilated membrane 15, and production method provided in this embodiment, by forming encapsulated layer 14 on underlay substrate 17, then uses
Patterning processes are to form groove 18 (cavity 21 after encapsulating) and liquid storage area 22 for housing liquid conductive substance, specifically
Ground, can use a patterning processes to be formed and seal layer with integrative-structure, can also use patterning processes difference shape twice
Into the figure of the first encapsulated layer 141 and the figure of the second encapsulated layer 142, to form the figure of encapsulated layer 14；
S403, the filling liquid conductive materials into the groove 18 on encapsulated layer 14 and liquid storage area 22, as shown in fig. lob,
, it is necessary to determine the content of liquid conductive substance injected into liquid storage area 22 according to the degree of stretching in practical application, to protect
Demonstrate,proving liquid conductive substance can be with contacting electrode group good contact after reset condition and stretching；
S404, provide a substrate 11；Such as the substrate 11 that elastic resin can be used to form, so that substrate is with stretchable
Performance, the substrate 11 that other materials can also be used to form, is not defined the material of substrate 11 herein；
S405, form at least one contact electrode group on substrate 11；As shown in Figure 6 a, contact electrode group generally comprises
Contact electrode and the second contact electrode positioned at the first of 11 both ends of substrate, the first contact electrode (or second contact electrode) relative to
Substrate 11 stretches out, be formed adjacent to the part surface of 11 side of substrate it is exposed first contact electrode (or second contact
Electrode), if the to be formed first contact electrode (or second contact electrode) is exposed in part surface away from 11 side of substrate,
The side that electrode (or second contact electrode) can be then contacted first is arranged to concordant with the side of substrate 11；
S406, by the underlay substrate 17 after filling liquid conductive materials contact the substrate 11 after electrode group to box with being formed,
After underlay substrate 17 and substrate 11 align, by glue or other, the two is bonded by the mode of fixation, such as Figure 10 c
It is shown；
S407, remove underlay substrate 17, to obtain structure as shown in Figure 2 a.
In the present embodiment, the shape of encapsulated layer 14, and filling liquid conductive materials are formed by upside down first, afterwards and shape
Into the substrate 11 for contacting electrode group to box, the knot obtained as shown in Figure 2 a will be turned around to the flexible PCB obtained after box
Structure.
The flexible PCB and display device that the utility model embodiment provides, since conductive structure is included in cavity
Liquid conductive substance, when stretching the flexible PCB, liquid rice field material in conductive structure due to air pressure change and
Flowing, realizes that liquid conductive substance contact electrode and second with first and contacts conducting between electrode, thus ensure that flexibility
On the basis of the electric conductivity of circuit board, the stretchable of flexible PCB is realized.
Obviously, those skilled in the art can carry out the utility model various modification and variations without departing from this practicality
New spirit and scope.If in this way, these modifications and variations of the utility model belong to the utility model claims and
Within the scope of its equivalent technologies, then the utility model is also intended to comprising including these modification and variations.
Claims (10)
- A kind of 1. flexible PCB, it is characterised in that including：Substrate, positioned at least one conductive structure of the substrate, Electrode group is contacted, for encapsulating the encapsulated layer of the conductive structure and the contact electrode group, and ventilated membrane；Wherein,The contact electrode group, including：For respectively with the both ends of the conductive structure are electrically connected first contacts electrode and the Two contact electrodes；The encapsulated layer forms interconnected cavity and liquid storage area with the substrate；The conductive structure, including：Liquid conductive substance in the cavity；The liquid storage area is used to store the liquid conductive substance, and the ventilated membrane is used to encapsulate the liquid storage area and makes described Liquid storage area is connected with external atmosphere pressure.
- 2. flexible PCB as claimed in claim 1, it is characterised in that the liquid storage area be located at the conductive structure with it is described One end that first contact electrode is connected.
- 3. flexible PCB as claimed in claim 2, it is characterised in that the first contact electrode and the liquid storage area are serving as a contrast Orthographic projection on bottom partly overlaps, and the orthographic projection of the second contact electrode and the cavity on substrate partly overlaps.
- 4. flexible PCB as claimed in claim 1, it is characterised in that the encapsulated layer, including：First encapsulated layer, and Deviate from the second encapsulated layer of the substrate side positioned at first encapsulated layer；First encapsulated layer is away from the surface of the substrate side and the flush of the liquid storage area, second encapsulated layer Away from the surface of the substrate side and the flush of the ventilated membrane.
- 5. flexible PCB as claimed in claim 1, it is characterised in that the first contact electrode is close to the substrate side Part surface it is exposed；Or, part surface of the first contact electrode away from the substrate side is exposed；Part surface of the second contact electrode close to the substrate side is exposed；Or, the second contact electrode deviates from institute The surface portion for stating substrate side is exposed.
- 6. flexible PCB as claimed in claim 1, it is characterised in that the pore diameter size of the ventilated membrane is located at air Between middle maximum molecular diameter and liquid conductive substance particle diameter.
- 7. flexible PCB as claimed in claim 6, it is characterised in that the ventilated membrane includes expanded polytetrafluoroethylsealing material Material.
- 8. such as claim 1~7 any one of them flexible PCB, it is characterised in that the liquid conductive substance includes liquid Either the electrolyte solution liquid metal includes indium tin gallium alloy material or mercury to state metal.
- 9. such as claim 1~7 any one of them flexible PCB, it is characterised in that the substrate includes resin material, institute Stating encapsulated layer includes resin material.
- A kind of 10. display device, it is characterised in that including：Such as claim 1~9 any one of them flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721426073.2U CN207305067U (en) | 2017-10-31 | 2017-10-31 | A kind of flexible PCB and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721426073.2U CN207305067U (en) | 2017-10-31 | 2017-10-31 | A kind of flexible PCB and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207305067U true CN207305067U (en) | 2018-05-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721426073.2U Withdrawn - After Issue CN207305067U (en) | 2017-10-31 | 2017-10-31 | A kind of flexible PCB and display device |
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| Country | Link |
|---|---|
| CN (1) | CN207305067U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660066A (en) * | 2017-10-31 | 2018-02-02 | 北京京东方显示技术有限公司 | A kind of flexible PCB, its preparation method and display device |
| CN108882540A (en) * | 2018-09-05 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of pcb board manufacturing method, pcb board and electronic equipment |
-
2017
- 2017-10-31 CN CN201721426073.2U patent/CN207305067U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660066A (en) * | 2017-10-31 | 2018-02-02 | 北京京东方显示技术有限公司 | A kind of flexible PCB, its preparation method and display device |
| CN107660066B (en) * | 2017-10-31 | 2024-05-14 | 北京京东方显示技术有限公司 | Flexible circuit board, manufacturing method thereof and display device |
| CN108882540A (en) * | 2018-09-05 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of pcb board manufacturing method, pcb board and electronic equipment |
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