CN207217504U - A kind of transmission line radio frequency chip of three level stack - Google Patents
A kind of transmission line radio frequency chip of three level stack Download PDFInfo
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- CN207217504U CN207217504U CN201720638229.7U CN201720638229U CN207217504U CN 207217504 U CN207217504 U CN 207217504U CN 201720638229 U CN201720638229 U CN 201720638229U CN 207217504 U CN207217504 U CN 207217504U
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Abstract
It the utility model is related to semiconductor radio frequency chip manufacturing field, it discloses a kind of transmission line radio frequency chip of three level stack, solve conventional transmission core piece, passive feeding network separation design, the problem of number of chips for causing system to be integrated in encapsulating is very limited.The chip includes：It is located at transmission line radio frequency chip, passive feeding network radio frequency chip and the passive strip transmission line chip of upper, middle and lower-ranking respectively；Entirety is formed by three chips of bump bonding, reduces volume；Because passive feeding network is using integrated chip design, the passive DC filtering feeding network radio circuit of two-way can be integrated in one chips, two radio-frequency enabled chips can be fed, add the quantity of functional chip in same encapsulation, in addition, the passive strip transmission line with transmission line radio frequency chip radiofrequency signal direction of transfer square crossing is integrated with, then can increase the design of functional chip signal path in vertical direction, also increases the quantity of functional chip in same encapsulation.
Description
Technical field
It the utility model is related to semiconductor radio frequency chip manufacturing field, the transmission line radio frequency of more particularly to a kind of three level stack
Chip.
Background technology
In prior art designs, as shown in figure 1, transmission line radio frequency chip 1 and passive feeding network 2 are using the design mould separated
Formula；The effect of transmission line radio frequency chip 1 is by radio signal transmission to active radio frequency functional chip 3, passive DC filtering transmission network
Network more than 2 is completed using the design of hybrid circuit collection substrate sections, and radio frequency inductive and electric capacity are installed on circuit substrate, is completed to active
The feeding function of radio-frequency enabled chip 3.
It is big using transmission line radio frequency chip 1 and passive feeding network 2 the occupancy volume of separation design in existing product,
And due to power-up direction and power-up form limitation, a passive feeding network 2 is only a radio frequency chip power-up, so being
During system encapsulation (SIP), the number of chips that an encapsulation can integrate is very limited.In addition, banding of the prior art passes
Defeated line is mainly used in the transmission of the radiofrequency signal of multilayer circuit, can not solve the problems, such as radiofrequency signal intersection in planar circuit,
It further limit the number of chips that can be integrated in an encapsulation.
Utility model content
Technical problem to be solved in the utility model is：A kind of transmission line radio frequency chip of three level stack is proposed, is solved
Transmission line radio frequency chip uses separation design with passive feeding network in conventional art, and can not solve radio frequency in planar circuit
Signal cross problem, cause system encapsulate in the number of chips that can integrate it is very limited the problem of.
Technical scheme is used by the utility model solves its technical problem：A kind of transmission line radio frequency core of three level stack
Piece, including：Transmission line radio frequency chip positioned at top layer, the passive feeding network radio frequency chip positioned at middle level and positioned at bottom
Passive strip transmission line chip, the transmission line radio frequency chip and the passive feeding network radio frequency chip and the passive band
Shape transmission line chip contraposition stacking is bonded to an entirety：
Be designed with the back side of the transmission line radio frequency chip the first connecting salient points positioned at upper position, second connection it is convex
Point and the 3rd connecting salient points, positioned at the 4th connecting salient points, the 5th connecting salient points and the 6th connecting salient points of lower position；The nothing
It is designed with positioned at the 7th connecting salient points of upper position and the 9th connecting salient points, is located on the front of source feeding network radio frequency chip
Tenth connecting salient points of lower position and the 12nd connecting salient points；The passive feeding network radio frequency chip upper position and
Lower position is also respectively provided with as the 8th connecting salient points of two-sided connecting salient points and the 11st connecting salient points；
The 13rd connecting salient points positioned at upper position are designed with the front of the passive strip transmission line chip, are located at
14th connecting salient points of lower position；
First connecting salient points and the 3rd connecting salient points align key with the 7th connecting salient points and the 9th connecting salient points respectively
Close；4th connecting salient points and the 6th connecting salient points respectively with the tenth connecting salient points and the 12nd connecting salient points para-linkage；
The front of 8th connecting salient points and the 11st connecting salient points respectively with the second connecting salient points and the 5th connecting salient points pair
Position bonding；The back side of 8th connecting salient points and the 11st connecting salient points respectively with the 13rd connecting salient points and the 14th connecting salient points
Para-linkage.
As further optimization, the transmission line radio frequency chip uses the transmission mould that co-planar waveguide and microstrip line are combined
Formula, it includes input port, output port, earth terminal and the transmission line circuit of connection input port and output port；It is described
Transmission line circuit is microstrip line；The earth terminal is arrived by being arranged at ground connection bump bonding corresponding to the transmission line radio frequency chip back side
Ground, input port and output port connect input, output radio circuit by gold wire bonding respectively.
As further optimization, the passive feeding network radio frequency chip includes the passive feeding network radio circuit of two-way,
Wherein the 7th connecting salient points of corresponding connection and the 9th connect the input of passive feeding network radio circuit respectively with output end all the way
Salient point is connect, the 9th connecting salient points provide DC feedback by gold wire bonding for an active radio frequency functional chip；In addition all the way without
The input of source feeding network radio circuit and output end the tenth connecting salient points of corresponding connection and the 12nd connecting salient points respectively, the
12 connecting salient points provide DC feedback by gold wire bonding for another active radio frequency functional chip.
As further optimization, on the passive feeding network radio frequency chip and passive strip transmission line chip is with passing
The back side of defeated line radio frequency chip sets the correspondence position of ground connection salient point to be also provided with ground connection salient point, wherein passive feeding network is penetrated
Ground connection salient point on frequency chip is two-sided salient point, its front and the ground connection salient point para-linkage on transmission line radio frequency chip, the back side
With the ground connection salient point para-linkage on passive strip transmission line chip.
As further optimization, the 13rd connecting salient points and the 14th connecting salient points of the passive strip transmission line chip
Between integrate strip line, the 13rd connecting salient points, by gold wire bonding, two other is active respectively for the 14th connecting salient points
The signal transmission end of radio-frequency enabled chip, transmit vertical direction for transmission line radio frequency chip radiofrequency signal and radiofrequency signal all the way is provided
Access path.
The beneficial effects of the utility model are：
1) realize to transmission line radio frequency chip, passive feeding network radio frequency chip and passive strip transmission line chip
Three-dimensional stacked interconnection, so as to design it is a can both complete to be transmitted radiofrequency signal, can be active radio frequency signal again
It is powered up, the chip product of vertical radio frequency cross signal all the way can also be provided, reduces chip and take volume；
2) because passive feeding network is designed using integrated chip, the passive DC filtering of two-way can be integrated in a chips
Feeding network radio circuit, DC feedback can be carried out to two radio-frequency enabled chips, be encapsulated so as to add in same encapsulation
Functional chip quantity；
3) due to being integrated with the passive strip transmission line with transmission line radio frequency chip radiofrequency signal direction of transfer square crossing
It chip, then can increase the design of functional chip signal path in vertical direction, further increase encapsulation in same encapsulation
The quantity of functional chip.
Brief description of the drawings
Fig. 1 is transmission line radio frequency chip and passive feeding network separation design schematic diagram in conventional art；
Fig. 2 a are transmission line radio frequency chip three-dimensional salient point design diagram in the utility model, and 2b is its side view；
Fig. 3 a are passive feeding network three-dimensional salient point design diagram in the utility model, and 3b is its side view；
Fig. 4 a are passive strip transmission line chip three-dimensional salient point design diagram in the utility model, and 4b is its side view；
Fig. 5 is transmission line radio frequency chip and passive feeding network, passive strip transmission line chip para-linkage schematic diagram；
Fig. 6 is the transmission line radio frequency chip application schematic diagram of three level stack in the utility model.
Embodiment
The utility model is directed to a kind of transmission line radio frequency chip of three level stack, solves transmission line in conventional art and penetrates
Frequency chip uses separation design with passive feeding network, and can not solve radiofrequency signal cross-cutting issue in planar circuit, causes
The problem of number of chips that can be integrated in system encapsulation is very limited.
Below in conjunction with the accompanying drawings and embodiment is further described to scheme of the present utility model：
Embodiment：
The transmission line radio frequency chip of three level stack in the present embodiment is formed by upper, middle and lower-ranking chip para-linkage, its
Including the transmission line radio frequency chip positioned at upper strata (top layer), positioned at lower floor's (bottom) passive strip transmission line chip and be located at
The passive feeding network radio frequency chip in middle level；
Wherein, transmission line radio frequency chip as shown in Figure 2 a, is designed with the back side of the transmission line radio frequency chip and is located at
The first connecting salient points 4, the second connecting salient points 5 and the 3rd connecting salient points 6 of upper position, the 4th connection positioned at lower position are convex
The 7, the 5th connecting salient points 8 of point and the 6th connecting salient points 9；
First connecting salient points 4, the plane connectivity port that the 3rd connecting salient points 6 are passive feeding network radio frequency chip；4th
Connecting salient points 7, another group of plane connectivity port that the 6th connecting salient points 9 are passive feeding network radio frequency chip；Second connection is convex
The plane connectivity port of point 5 and the passive strip transmission line chip of the 5th connecting salient points 8；
Input port S1, the output port S2 of transmission line radio frequency chip use coplanar wave guide transmission pattern, can pass through gold
Silk bonding connection input, output radio circuit, earth terminal (not illustrating in figure) are bonded to ground, input port by being grounded salient point 20
Radio frequency transmission circuitry between S1 and output port S2 uses microstrip line 18, surface gold-plating；The side view of transmission line radio frequency chip
As shown in 2b；
Passive feeding network radio frequency chip as shown in Figure 3 a, is designed with the front of the passive feeding network radio frequency chip
Positioned at the 7th connecting salient points 10 of upper position and the 9th connecting salient points 12, positioned at the tenth connecting salient points 13 of lower position and
12 connecting salient points 15；It is also respectively provided with the upper position and lower position of the passive feeding network radio frequency chip to be double
8th connecting salient points 11 of face connecting salient points and the 11st connecting salient points 14；
Passive feeding network radio frequency chip includes the passive feeding network radio circuit of two-way, a route MIM capacitor C1 peace
Surface helix inductance L1 is formed, the input of this road radio circuit with output end is corresponding respectively connects the 7th connecting salient points 10 and the 9th
Connecting salient points 12, the 9th connecting salient points 12 can provide DC feedback by gold wire bonding for an active radio frequency functional chip；
Other feeding network radio circuit passive all the way is made up of MIM capacitor C2 and planar spiral inductor L2, the passive feeding network in this road
The input of radio circuit and output end the tenth connecting salient points 13 of corresponding connection and the 12nd connecting salient points 15 respectively, the 12nd connects
DC feedback can be provided by gold wire bonding for another active radio frequency functional chip by connecing salient point 15.Passive feeding network radio frequency
The side view of chip is as shown in Figure 3 b.
Passive strip transmission line chip as shown in fig. 4 a, is designed with positioned at upper on the front of passive strip transmission line chip
The 13rd connecting salient points 16, the 14th connecting salient points 17 positioned at lower position of portion position；In the He of the 13rd connecting salient points 16
Strip line 19 is integrated between 14th connecting salient points 17；The side view of passive strip transmission line chip is as shown in Figure 4 b.
In addition, on the passive feeding network radio frequency chip and passive strip transmission line chip and transmission line radio frequency core
The back side of piece sets the correspondence position of ground connection salient point 20 to be also provided with ground connection salient point 21,22, wherein passive feeding network radio frequency
Ground connection salient point 21 on chip is two-sided salient point, its front and the para-linkage of ground connection salient point 20 on transmission line radio frequency chip, the back of the body
Face and the para-linkage of ground connection salient point 22 on passive strip transmission line chip.
Fig. 5 illustrates the transmission line radio frequency chip situation chip-stacked with passive feeding network, passive strip transmission line, its
In,
First connecting salient points 4 and the 3rd connecting salient points 6 align with the 7th connecting salient points 10 and the 9th connecting salient points 12 respectively
Bonding；4th connecting salient points 7 and the 6th connecting salient points 9 are right with the tenth connecting salient points 13 and the 12nd connecting salient points 15 respectively
Position bonding；The front of 8th connecting salient points 11 and the 11st connecting salient points 14 is connected convex with the second connecting salient points 5 and the 5th respectively
8 para-linkages of point；The back side of 8th connecting salient points 11 and the 11st connecting salient points 14 respectively with the 13rd connecting salient points 16 and
The para-linkage of 14 connecting salient points 17.
The front of the ground connection salient point 21 of passive feeding network radio frequency chip is right with the ground connection salient point 20 of transmission line radio frequency chip
Position bonding, the back side of the ground connection salient point 21 of passive feeding network radio frequency chip and the ground connection salient point 22 of passive strip transmission line chip
Para-linkage.
As shown in fig. 6, the transmission line radio frequency chip carried out after three level stack can be both transmitted to radiofrequency signal, again may be used
Think that active radio frequency functional chip is powered up, and due to employing two-way network radio frequency electricity in passive feeding network radio frequency chip
Road is designed, and can be that two active radio frequency functional chips power up therefore, it is achieved thereby that the system envelope of more radio-frequency enabled chips
Dress；Further, since it is integrated with the passive strip transmission line core with transmission line radio frequency chip radiofrequency signal direction of transfer square crossing
It piece, then can increase the design of functional chip signal path in vertical direction, further increase the work(of encapsulation in same encapsulation
The quantity of energy chip.
It is existing to become apparent from the implementation process of the transmission line radio frequency chip of the three level stack in the utility model and principle
Specifically explain its design technology：
A. first, chip circuit model is established；
B. then, according to the rear end design of model progress GaAs chips is established, technological design conversion is carried out；
C. transmission line radio frequency chip carries out wafer flow；
D. transmission line radio frequency chip wafer three-dimensional integration PROCESS FOR TREATMENT (is etched, medium is precipitated, led at its back side by deep hole
The technique such as electricity filling and plating) be integrated and connected salient point；
E. transmission line radio frequency chip wafer is cut, and cuts into one single chip；
F. passive feeding network radio frequency chip wafer flow production；
G. passive feeding network radio frequency chip wafer three-dimensional integration PROCESS FOR TREATMENT (is etched, medium precipitation, conduction by deep hole
The technique such as filling and plating) be integrated and connected salient point；
H. passive feeding network radio frequency chip wafer cutting, cuts into one single chip；
I. passive strip transmission line chip carries out wafer flow；
J. the passive three-dimensionally integrated PROCESS FOR TREATMENT of strip transmission line chip die is (its front is etched by deep hole, medium sinks
The techniques such as shallow lake, conductive fill and plating) be integrated and connected salient point；
K. passive strip transmission line chip die cutting, cuts into one single chip；
L. passive strip transmission line chip and passive feeding network radio frequency chip are subjected to salient point para-linkage；
M. salient point para-linkage is carried out with transmission line radio frequency chip again；
N. progress electrical parameter and technological parameter survey eventually on testing jig are arranged on to the chip of shaping.
It is pointed out that this specification be not intended to by the utility model be confined to shown in and described concrete structure and
In the scope of application, every corresponding modification for being possible to be utilized and equivalent, it is apllied specially to belong to the utility model
Sharp scope.
Claims (4)
- A kind of 1. transmission line radio frequency chip of three level stack, it is characterised in that including：Transmission line radio frequency chip positioned at top layer, Passive feeding network radio frequency chip positioned at middle level and the passive strip transmission line chip positioned at bottom, the transmission line radio frequency Chip and the passive feeding network radio frequency chip and the passive strip transmission line chip contraposition stacking be bonded to one it is whole Body：Be designed with the back side of the transmission line radio frequency chip the first connecting salient points (4) positioned at upper position, second connection it is convex Point (5) and the 3rd connecting salient points (6), connect positioned at the 4th connecting salient points (7) of lower position, the 5th connecting salient points (8) and the 6th Connect salient point (9)；The 7th connecting salient points positioned at upper position are designed with the front of the passive feeding network radio frequency chip (10) and the 9th connecting salient points (12), positioned at the tenth connecting salient points (13) of lower position and the 12nd connecting salient points (15)； The upper position and lower position of the passive feeding network radio frequency chip are also respectively provided with as the 8th of two-sided connecting salient points the Connecting salient points (11) and the 11st connecting salient points (14)；The 13rd connecting salient points (16) positioned at upper position are designed with the front of the passive strip transmission line chip, are located at 14th connecting salient points (17) of lower position；First connecting salient points (4) and the 3rd connecting salient points (6) respectively with the 7th connecting salient points (10) and the 9th connecting salient points (12) para-linkage；4th connecting salient points (7) and the 6th connecting salient points (9) respectively with the tenth connecting salient points (13) and the tenth Two connecting salient points (15) para-linkage；The front of 8th connecting salient points (11) and the 11st connecting salient points (14) is connected with the second connecting salient points (5) and the 5th respectively Salient point (8) para-linkage；The back side of 8th connecting salient points (11) and the 11st connecting salient points (14) is connected convex with the 13rd respectively Point (16) and the 14th connecting salient points (17) para-linkage；The transmission line radio frequency chip uses the transmission mode that co-planar waveguide and microstrip line are combined, and it includes input port (S1), output port (S2), earth terminal and the transmission line circuit of connection input port (S1) and output port (S2)；The biography Defeated line circuit is microstrip line (18)；The earth terminal is grounded salient point (20) by being arranged at corresponding to the transmission line radio frequency chip back side Ground is bonded to, input port (S1) connects input, output radio circuit by gold wire bonding respectively with output port (S2).
- A kind of 2. transmission line radio frequency chip of three level stack as claimed in claim 1, it is characterised in that the passive transmission network Network radio frequency chip includes the passive feeding network radio circuit of two-way, wherein all the way the input of passive feeding network radio circuit with Output end corresponds to the 7th connecting salient points (10) of connection respectively and the 9th connecting salient points (12), the 9th connecting salient points (12) pass through spun gold It is bonded and provides DC feedback for an active radio frequency functional chip；The input of other feeding network radio circuit passive all the way with Output end corresponds to the tenth connecting salient points (13) of connection respectively and the 12nd connecting salient points (15), the 12nd connecting salient points (15) pass through Gold wire bonding provides DC feedback for another active radio frequency functional chip.
- 3. the transmission line radio frequency chip of a kind of three level stack as claimed in claim 2, it is characterised in that in the passive feed On network radio frequency chip, and the back side of passive strip transmission line chip and transmission line radio frequency chip sets ground connection salient point (20) Correspondence position is also provided with ground connection salient point (21,22), wherein the ground connection salient point (21) on passive feeding network radio frequency chip is Two-sided salient point, its front and ground connection salient point (20) para-linkage on transmission line radio frequency chip, the back side and passive strip transmission line Ground connection salient point (22) para-linkage on chip.
- 4. the transmission line radio frequency chip of a kind of three level stack as claimed in claim 3, it is characterised in that the passive banding passes Integrated strip line (19) between 13rd connecting salient points (16) of defeated core piece and the 14th connecting salient points (17), the described 13rd Connecting salient points (16), the 14th connecting salient points (17) pass through the signal of two other active radio frequency functional chip of gold wire bonding respectively Transmission end, transmit vertical direction for transmission line radio frequency chip radiofrequency signal and radiofrequency signal access path all the way is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720638229.7U CN207217504U (en) | 2017-06-02 | 2017-06-02 | A kind of transmission line radio frequency chip of three level stack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720638229.7U CN207217504U (en) | 2017-06-02 | 2017-06-02 | A kind of transmission line radio frequency chip of three level stack |
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| Publication Number | Publication Date |
|---|---|
| CN207217504U true CN207217504U (en) | 2018-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720638229.7U Active CN207217504U (en) | 2017-06-02 | 2017-06-02 | A kind of transmission line radio frequency chip of three level stack |
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| CN (1) | CN207217504U (en) |
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- 2017-06-02 CN CN201720638229.7U patent/CN207217504U/en active Active
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