CN207200834U - Optical module - Google Patents
Optical module Download PDFInfo
- Publication number
- CN207200834U CN207200834U CN201720771112.6U CN201720771112U CN207200834U CN 207200834 U CN207200834 U CN 207200834U CN 201720771112 U CN201720771112 U CN 201720771112U CN 207200834 U CN207200834 U CN 207200834U
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- China
- Prior art keywords
- substrate
- optical element
- lens assembly
- circuit board
- optical module
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Abstract
The utility model provides a kind of optical module, including circuit board, encapsulation unit and lens assembly.Encapsulation unit includes substrate, optical element and packing colloid, and wherein substrate is configured on circuit board, and optical element is configured on substrate, and packing colloid is configured on substrate and encapsulating optical element.Lens assembly is configured on substrate and covers optical element and packing colloid.
Description
Technical field
It the utility model is related to a kind of optical module, more particularly to a kind of optical module for including lens assembly.
Background technology
Image acquiring device (such as mobile phone, digital camera, panorama camera, 3 D stereo camera), which generally has, corresponds to mirror
Head optical sensing elements (such as CMOS (Complementary Metal-Oxide Semiconductor,
CMOS) sensing element), to sense from the incident light of camera lens.
In some image acquiring devices, optical sensing elements pass through surface joining technique (Surface-Mount
Technology, SMT) and be engaged on circuit board, and lens assembly is also configured on circuit board and covers optical sensing elements.
Under such a design method, the scolding tin between optical sensing elements and circuit board can make optical sensing elements relative to lens group
Part tilts, so as to influence the quality of image acquiring device.
Utility model content
The utility model provides a kind of optical module, optical element can be avoided to be tilted relative to lens assembly.
Optical module of the present utility model includes circuit board, encapsulation unit and lens assembly.Encapsulation unit includes substrate, light
Learn element and packing colloid, wherein substrate are configured on circuit board, optical element is configured on substrate, and packing colloid is configured at base
On plate and encapsulating optical element.Lens assembly is configured on substrate and covers optical element and packing colloid.
In an embodiment of the present utility model, above-mentioned lens assembly is located away from circuit board.
In an embodiment of the present utility model, the width of the edge of above-mentioned substrate perpendicular to the direction of the optical axis of lens assembly
Degree is more than width of the packing colloid along the direction.
In an embodiment of the present utility model, above-mentioned substrate has middle section and peripheral region, and peripheral region encloses
Around middle section, optical element is configured at middle section, peripheral region carrying lens assembly.
In an embodiment of the present utility model, above-mentioned lens assembly has main part and supporting part, main part contraposition
In optical element, supporting part is connected to main part and is engaged in substrate.
In an embodiment of the present utility model, above-mentioned lens assembly includes camera lens, and camera lens is configured at main part.
In an embodiment of the present utility model, above-mentioned substrate has relative first surface and second surface, optics
Element, packing colloid and lens assembly are configured at first surface, and second surface is towards circuit board.
In an embodiment of the present utility model, above-mentioned encapsulation unit includes light transmitting cover, and packing colloid has opening,
Opening exposure optical element, light transmitting cover are configured on packing colloid and cover opening.
In an embodiment of the present utility model, above-mentioned optical element is electrically connected at circuit board by substrate.
Based on above-mentioned, in optical module of the present utility model, the substrate except optical element to be configured to encapsulation unit
On, more lens assembly is configured on the substrate of encapsulation unit, rather than lens assembly is configured on circuit board.Thereby, sealing
The substrate of dress unit is engaged in the feelings of circuit board by surface joining technique (Surface-Mount Technology, SMT)
Under condition, even if the scolding tin between substrate and circuit board causes encapsulation unit to be tilted relative to circuit board, the light being configured on substrate
Learning element and the lens assembly that is configured on substrate will not therefore relative tilt.So as to which the yield of optical module can be carried
Rise.
For features described above and advantage of the present utility model can be become apparent, special embodiment below, and coordinate accompanying drawing
It is described in detail below.
Brief description of the drawings
Fig. 1 is the schematic side view of the optical module of the embodiment of the utility model one.
Fig. 2 is the schematic top plan view of Fig. 1 encapsulation unit.
Fig. 3 is the schematic side view of the optical module of another embodiment of the utility model.
Description of reference numerals
100、200：Optical module
110、210：Circuit board
120、220：Encapsulation unit
122、222：Substrate
122a、222a：First surface
122b、222b：Second surface
124、224：Optical element
126、226：Packing colloid
126a、226a：Opening
128、228：Light transmitting cover
130、230：Lens assembly
130a、230a：Camera lens
132、232：Main part
134、234：Supporting part
L、L’：Light
R1：Middle section
R2：Peripheral region
S、S’：Scolding tin
X、Y、Z：Direction
Embodiment
Fig. 1 is the schematic side view of the optical module of the embodiment of the utility model one.It refer to Fig. 1, the light of the present embodiment
Learning module 100 includes circuit board 110, encapsulation unit 120 and lens assembly 130.Encapsulation unit 120 includes substrate 122, optics member
Part 124 and packing colloid 126.Substrate 122 is configured on circuit board 110, and optical element 124 is configured on substrate 122 and passed through
Substrate 122 and be electrically connected at circuit board 110, packing colloid 126 is configured on substrate 122 and encapsulating optical element 124.Camera lens
Component 130 is configured on substrate 122 and is located away from circuit board 110, and lens assembly 130 covers optical element 124 and packaging plastic
Body 126.
Under above-mentioned configuration mode, except optical element 124 is configured on the substrate 122 of encapsulation unit 120, more will
Lens assembly 130 is configured on the substrate 122 of encapsulation unit 120, rather than lens assembly 130 is configured on circuit board 110.By
This, is engaged in the substrate 122 of encapsulation unit 120 by surface joining technique (Surface-Mount Technology, SMT)
In the case of circuit board 110, even if the scolding tin S between substrate 122 and circuit board 110 causes encapsulation unit 120 relative to electricity
Road plate 110 tilts, and the optical element 124 being configured on substrate 122 and the lens assembly 130 that is configured on substrate 122 will not be because
This and relative tilt.So as to which the yield of optical module 100 can be lifted.
Specifically, the substrate 122 of the present embodiment has relative first surface 122a and second surface 122b, optics member
Part 124, packing colloid 126 and lens assembly 130 are configured at the first surface 122a of substrate 122, and the second surface of substrate 122
122b is towards circuit board 110.That is, optical element 124, packing colloid 126 and lens assembly 130 are located at the top of substrate 122
And using reference plane common as its first surface 122a, and circuit board 110 is located at the lower section of substrate 122.
Fig. 2 is the schematic top plan view of Fig. 1 encapsulation unit.The substrate 122 of the present embodiment has middle section as shown in Figure 2
R1 and peripheral region R2, Fig. 2 distinguish middle section R1 and peripheral region R2 with dotted line frame.Peripheral region R2 surrounds middle section
R1, optical element 124 and packing colloid 126 are configured at middle section R1, and peripheral region R2 carries the lens assembly shown in Fig. 1
130.More specifically, the width W1 (being shown in Fig. 2) along direction X of substrate 122 is more than width of the packing colloid 126 along direction X
W2 (being shown in Fig. 2) is spent, and the width W3 (being shown in Fig. 2) along direction Y of substrate 122 is more than packing colloid 126 along direction Y's
Width W4 (is shown in Fig. 2), and using makes to have enough spaces on substrate 122 to configure optical element 124, packing colloid 126
And lens assembly 130.Wherein, direction X and direction Y all perpendicular to the optical axis of lens assembly 130 (coincide with light L axis,
It is parallel to direction Z).Packing colloid 126 and substrate 122 are all schematically shown as square by Fig. 2, and so it is only to illustrate, packing colloid
126 and substrate 122 may actually be other suitable shapes.
In the present embodiment, lens assembly 130 has main part 132 and supporting part 134 as shown in Figure 1.Main part 132 is right
Positioned at optical element 124, the camera lens 130a of lens assembly 130 is configured at main part 132, and supporting part 134 is connected to main part 132
And it is engaged in substrate 122.In other embodiments, lens assembly 130 can be the structure of other shapes and be configured at substrate 122
On, the utility model is any limitation as not to this.
In addition, the packing colloid 126 of the present embodiment has opening 126a, opening 126a exposure optical elements 124 make optics
Element 124 can receive light L by opening 126a.Hold, encapsulation unit 120 also includes light transmitting cover 128, light transmitting cover
128 are configured on packing colloid 126 and cover opening 126a, to protect optical element 124.
In the present embodiment, for optical module 100 for example applied to image acquiring device, optical element 124 is, for example, as mutually
Bu Shi metal-oxide-semiconductor (MOS)s (Complementary Metal-Oxide Semiconductor, CMOS) sensing element or other kinds
The optical sensing elements of class, to receive the light L for passing through lens assembly 130 and incidence.In other embodiments, optical module
100 can be applied to other kinds of Optical devices, and optical element 124 can be correspondingly other kinds of element, and this practicality is new
Type is any limitation as not to this.This is illustrated below by way of accompanying drawing.
Fig. 3 is the schematic side view of the optical module of another embodiment of the utility model.In Fig. 3 optical module 200,
Circuit board 210, substrate 222, first surface 222a, second surface 222b, packing colloid 226, opening 226a, light transmitting cover 228,
Lens assembly 230, camera lens 230a, main part 232, supporting part 234, scolding tin S ' configuration mode similar to Fig. 1 circuit board 110,
Substrate 122, first surface 122a, second surface 122b, packing colloid 126, opening 126a, light transmitting cover 128, lens assembly
130th, camera lens 130a, main part 132, supporting part 134, scolding tin S configuration mode, are repeated no more in this.Optical module 200 and light
The difference for learning module 100 is in the optical element 224 of encapsulation unit 220 is not if aforementioned optical element 124 is optical sensing
Element, optical element 224 are light-emitting component (such as light emitting diode element) and pass through camera lens to the L ' that emits beam, light L '
230a and project.
In summary, in optical module of the present utility model, the substrate except optical element to be configured to encapsulation unit
On, more lens assembly is configured on the substrate of encapsulation unit, rather than lens assembly is configured on circuit board.Thereby, sealing
The substrate of dress unit is engaged in the feelings of circuit board by surface joining technique (Surface-Mount Technology, SMT)
Under condition, even if the scolding tin between substrate and circuit board causes encapsulation unit to be tilted relative to circuit board, the light being configured on substrate
Learning element and the lens assembly that is configured on substrate will not therefore relative tilt.So as to which the yield of optical module can be carried
Rise.
Although the utility model is disclosed as above with embodiment, so it is not limited to the utility model, any affiliated
Technical staff in technical field, do not departing from spirit and scope of the present utility model, when a little change and retouching can be made, therefore
The scope of protection of the utility model is worked as to be defined depending on as defined in claim.
Claims (9)
- A kind of 1. optical module, it is characterised in that including：Circuit board；Encapsulation unit, including substrate, optical element and packing colloid, wherein the substrate is configured on the circuit board, it is described Optical element is configured on the substrate, and the packing colloid is configured on the substrate and encapsulates the optical element；AndLens assembly, it is configured on the substrate and covers the optical element and the packing colloid.
- 2. optical module according to claim 1, it is characterised in that the lens assembly is located away from the circuit board.
- 3. optical module according to claim 1, it is characterised in that the edge of the substrate is perpendicular to the lens assembly The width in the direction of optical axis is more than width of the packing colloid along the direction.
- 4. optical module according to claim 1, it is characterised in that the substrate has middle section and peripheral region, The peripheral region surrounds the middle section, and the optical element is configured at the middle section, the peripheral region carrying The lens assembly.
- 5. optical module according to claim 1, it is characterised in that the lens assembly has main part and supporting part, The main part is pointed to the optical element, and the supporting part is connected to the main part and is engaged in the substrate.
- 6. optical module according to claim 5, it is characterised in that the lens assembly includes camera lens, and the camera lens is matched somebody with somebody It is placed in the main part.
- 7. optical module according to claim 1, it is characterised in that the substrate has relative first surface and second Surface, the optical element, the packing colloid and the lens assembly are configured at the first surface, the second surface court To the circuit board.
- 8. optical module according to claim 1, it is characterised in that the encapsulation unit includes light transmitting cover, the envelope Dress colloid has opening, the opening exposure optical element, and the light transmitting cover is configured on the packing colloid and covered Cover the opening.
- 9. optical module according to claim 1, it is characterised in that the optical element is electrically connected by the substrate It is connected to the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720771112.6U CN207200834U (en) | 2017-06-29 | 2017-06-29 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720771112.6U CN207200834U (en) | 2017-06-29 | 2017-06-29 | Optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207200834U true CN207200834U (en) | 2018-04-06 |
Family
ID=61784340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720771112.6U Active CN207200834U (en) | 2017-06-29 | 2017-06-29 | Optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207200834U (en) |
-
2017
- 2017-06-29 CN CN201720771112.6U patent/CN207200834U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210929 Address after: No. 77, the Third Avenue, Kunshan comprehensive free trade zone, Suzhou, Jiangsu Patentee after: Caijing Optoelectronic Technology (Kunshan) Co.,Ltd. Address before: No. 12, Lixing Road, Science Park, Hsinchu City Patentee before: Altek Corp. |