CN207166846U - The soft or hard combination pcb board of the high yield of high reliability - Google Patents
The soft or hard combination pcb board of the high yield of high reliability Download PDFInfo
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- CN207166846U CN207166846U CN201720871392.8U CN201720871392U CN207166846U CN 207166846 U CN207166846 U CN 207166846U CN 201720871392 U CN201720871392 U CN 201720871392U CN 207166846 U CN207166846 U CN 207166846U
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Abstract
The utility model discloses a kind of soft or hard combination pcb board of the high yield of high reliability, including common substrate layer, and PCB hardboards area, PCB flexible board areas and flex area is distributed with common substrate floor；Common substrate layer includes the first antistatic backing, the first copper foil layer, the first high-temperature resistant membrane layer, the first PI film layers, PE film layers, the 2nd PI film layers, the second high-temperature resistant membrane layer, the second copper foil layer, the second antistatic backing；The first side corresponds to PCB hardboards area and is provided with the first semi-solid preparation floor, the first strengthening course, the first copper foil layer, the first solder mask, the second semi-solid preparation floor, the second strengthening course, the second copper foil layer and the second solder mask on common substrate floor, and the first side corresponds to PCB flexible board areas and flex area and is provided with the first plastic layer, the first protection film layer, the first electromagnetic shielding membrane, the second plastic layer, the second protection film layer and the second electromagnetic shielding membrane on common substrate layer；Thereby, the bond strength of rigid-flex is improved, effectively solves the problems, such as that rigid-flex easily departs from, improves the quality and yield of product.
Description
Technical field
Soft or hard combination pcb board art is the utility model is related to, refers in particular to a kind of soft or hard knot of the high yield of high reliability
Close pcb board.
Background technology
At present, mainly there are PCB, FPC and three kinds of design application scenarios of soft or hard combination pcb board, wherein, soft or hard combination pcb board
Using more in the electronic products such as mobile phone, existing soft or hard combination pcb board, easily there is break-off, its process rate is low,
Stability in use is bad.Therefore, in present patent application, applicants studied a kind of new soft or hard combination pcb board structure, effectively solution
Determine foregoing problems.
Utility model content
In view of this, in view of the existing deficiencies of the prior art, its main purpose is to provide a kind of highly reliable the utility model
The high soft or hard combination pcb board of yield of property, it makes rigid-flex link into an integrated entity by common substrate layer, and the combination for improving rigid-flex is strong
Degree, effectively solves the problems, such as that rigid-flex easily departs from the prior art, improves the quality and yield of product.
To achieve the above object, the utility model is using following technical scheme：
A kind of soft or hard combination pcb board of the high yield of high reliability, includes common substrate layer, is distributed with common substrate layer
PCB hardboards area, PCB flexible board areas and flex area；
The common substrate layer has the first side, the second side being oppositely arranged；The common substrate layer includes from first
The first antistatic backing that side is set gradually towards the second side, the first copper foil layer, the first high-temperature resistant membrane layer, the first PI film layers,
PE film layers, the 2nd PI film layers, the second high-temperature resistant membrane layer, the second copper foil layer, the second antistatic backing；
The first side corresponds to PCB hardboards area from-inner-to-outer and is disposed with the first semi-solid preparation floor, on the common substrate floor
One strengthening course, the first copper foil layer and the first solder mask, on the common substrate floor the second side correspond to PCB hardboards area's from-inner-to-outer according to
It is secondary to be provided with the second semi-solid preparation layer, the second strengthening course, the second copper foil layer and the second solder mask,
The first side corresponds to PCB flexible board areas on the common substrate layer and flex area from-inner-to-outer is disposed with the first plastic cement
Layer, the first protection film layer and the first electromagnetic shielding membrane, the second side corresponds to PCB flexible board areas and flex area on the common substrate layer
From-inner-to-outer is disposed with the second plastic layer, the second protection film layer and the second electromagnetic shielding membrane；And the common substrate
Upper second side external surface of layer corresponds to PCB flexible board areas and is further provided with FR4 stiffening plates, and the outer surface of the FR4 stiffening plates covers
There is gum layer.
As a kind of preferred scheme, first plastic layer, the second plastic layer extend formed with prolonging towards PCB hardboards area
Clinch is stretched, both extension clinch are respectively outside corresponding first antistatic backing in PCB hardboards area, the second antistatic backing
Side, the first semi-solid preparation lamination in PCB hardboards area together in the extension clinch of the first plastic layer on the outside of, the second the half of PCB hardboards area
Cured layer is pressed on the outside of the extension clinch of the second plastic layer.
As a kind of preferred scheme, antenna field is provided with the PCB hardboards area.
The utility model has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technology
Scheme understands that it mainly makes rigid-flex link into an integrated entity by common substrate layer, improves the bond strength of rigid-flex, effectively
Solve the problems, such as that rigid-flex easily departs from the prior art, meanwhile, improve the quality of product and make yield, existing soft or hard knot
The yield of plywood in 30-40% or so, has a small number of reachable 60%, utilizes the new Rigid Flex skill of present patent application mostly
Art, it makes yield up to more than 80%, greatly improves yield, suitable for popularization and application, is also beneficial to the skill of related electronic products
Art develops.
More clearly to illustrate architectural feature and effect of the present utility model, come below in conjunction with the accompanying drawings with specific embodiment pair
The utility model is described in detail.
Brief description of the drawings
Fig. 1 is the first side view of the embodiment of the utility model；
Fig. 2 is the cross section structure diagram at M-M in Fig. 1.
Accompanying drawing identifier declaration：
100th, PCB hardboards area 200, PCB flexible board areas
300th, flex area 400, antenna field
11st, the first antistatic backing 12, the first copper foil layer
13rd, the first high-temperature resistant membrane layer 14, the first PI film layers
15th, PE film layers 16, the 2nd PI film layers
17th, the second high-temperature resistant membrane layer 18, the second copper foil layer
19th, the second antistatic backing
21st, the first semi-solid preparation layer 22, the first strengthening course
23rd, the first copper foil layer 24, the first solder mask
25th, the second semi-solid preparation layer 26, the second strengthening course
27th, the second copper foil layer 28, the second solder mask
31st, the first plastic layer 311, extension clinch
32nd, the first protection film layer 33, the first electromagnetic shielding membrane
34th, the second plastic layer 341, extension clinch
35th, the second protection film layer 36, the second electromagnetic shielding membrane
40th, FR4 stiffening plates 50, gum layer.
Embodiment
It refer to shown in Fig. 1 and Fig. 2, it is described highly reliable that show the concrete structure of the embodiment of the utility model
The high soft or hard combination pcb board of yield of property, includes common substrate layer, and it is soft that PCB hardboards area 100, PCB are distributed with common substrate floor
Plate area and flex area 300；Wherein, it is provided with antenna field 400 in the PCB hardboards area 100.
The common substrate layer has the first side, the second side being oppositely arranged；The common substrate layer includes from first
The first antistatic backing 11, the first copper foil layer 12, the first high-temperature resistant membrane layer 13, the first PI that side is set gradually towards the second side are thin
Film layer 14, PE film layers 15, the 2nd PI film layers 16, the second high-temperature resistant membrane layer 17, the second copper foil layer 18, the second antistatic backing
19。
The first side corresponds to the from-inner-to-outer of PCB hardboards area 100 and is disposed with the first semi-solid preparation floor on the common substrate floor
21st, the first strengthening course 22, the first copper foil layer 23 and the first solder mask 24, the second side corresponds to PCB hardboards on the common substrate layer
The from-inner-to-outer of area 100 is disposed with the second semi-solid preparation floor 25, the second strengthening course 26, the second copper foil layer 27 and the second solder mask
28。
The first side corresponds to PCB flexible board areas 200 on the common substrate layer and the from-inner-to-outer of flex area 300 is disposed with
One plastic layer 31, the first protection film layer 32 and the first electromagnetic shielding membrane 33, it is soft to correspond to PCB for the second side on the common substrate layer
Plate area 200 and the from-inner-to-outer of flex area 300 are disposed with the second plastic layer 34, the second protection film layer 35 and the second electromagnetic shielding
Film layer 36；And the second side external surface corresponds to PCB flexible board areas 200 and is further provided with FR4 stiffening plates on the common substrate layer
40, the outer surface of the FR4 stiffening plates 40 is covered with gum layer 50.
First plastic layer 31, the second plastic layer 34 extend formed with extension clinch towards PCB hardboards area 100
(diagram 311,341), corresponding first antistatic backing 11, second of both extension clinch respectively positioned at PCB hardboards area 100 are anti-
The outside of electrostatic layer 19, the first semi-solid preparation floor 21 in PCB hardboards area 100 are pressed on outside the extension clinch 311 of the first plastic layer 31
Side, the second semi-solid preparation floor 25 in PCB hardboards area 100 are pressed on the outside of extension clinch 341 of the second plastic layer 34.
In summary, design focal point of the present utility model is, it mainly connects rigid-flex by common substrate layer
Integrally, the bond strength of rigid-flex is improved, effectively solves the problems, such as that rigid-flex easily departs from the prior art, meanwhile, improve
The quality of product and make yield, the yield of existing Rigid Flex mostly in 30-40% or so, have it is a small number of up to 60%,
Using the new Rigid Flex technology of present patent application, it makes yield up to more than 80%, greatly improves yield, fit
In popularization and application, the technology development of related electronic products is also beneficial to.
It is described above, only it is preferred embodiment of the present utility model, not technical scope of the present utility model is made
Any restrictions, therefore every any trickle amendment made according to the technical essence of the utility model to above example, equivalent change
Change and modification, in the range of still falling within technical solutions of the utility model.
Claims (3)
- A kind of 1. soft or hard combination pcb board of the high yield of high reliability, it is characterised in that：Include common substrate layer, common substrate layer On PCB hardboards area, PCB flexible board areas and flex area is distributed with；The common substrate layer has the first side, the second side being oppositely arranged；The common substrate layer includes from the first side court The first antistatic backing, the first copper foil layer, the first high-temperature resistant membrane layer, the first PI film layers, the PE set gradually to the second side is thin Film layer, the 2nd PI film layers, the second high-temperature resistant membrane layer, the second copper foil layer, the second antistatic backing；The first side corresponds to PCB hardboards area from-inner-to-outer and is disposed with the first semi-solid preparation floor, the first benefit on the common substrate floor Strong layer, the first copper foil layer and the first solder mask, the second side corresponds to PCB hardboards area from-inner-to-outer and set successively on the common substrate floor The second semi-solid preparation layer, the second strengthening course, the second copper foil layer and the second solder mask are equipped with,On the common substrate layer the first side correspond to PCB flexible board areas and flex area from-inner-to-outer be disposed with the first plastic layer, First protection film layer and the first electromagnetic shielding membrane, on the common substrate layer the second side correspond to PCB flexible board areas and flex area from It is interior and be disposed with the second plastic layer, the second protection film layer and the second electromagnetic shielding membrane outside；And the common substrate layer Upper second side external surface corresponds to PCB flexible board areas and is further provided with FR4 stiffening plates, and the outer surface of the FR4 stiffening plates is covered with Gum layer.
- 2. the soft or hard combination pcb board of the high yield of high reliability according to claim 1, it is characterised in that：First plastic cement Floor, the second plastic layer extend towards PCB hardboards area is located at PCB respectively formed with extension clinch, both extension clinch Corresponding first antistatic backing in hardboard area, the second antistatic backing outside, the first semi-solid preparation lamination in PCB hardboards area is together in the first modeling On the outside of the extension clinch of glue-line, second semi-solid preparation in PCB hardboards area is laminated on the outside of the extension clinch together in the second plastic layer.
- 3. the soft or hard combination pcb board of the high yield of high reliability according to claim 1, it is characterised in that：The PCB hardboards area On be provided with antenna field.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720871392.8U CN207166846U (en) | 2017-07-18 | 2017-07-18 | The soft or hard combination pcb board of the high yield of high reliability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720871392.8U CN207166846U (en) | 2017-07-18 | 2017-07-18 | The soft or hard combination pcb board of the high yield of high reliability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207166846U true CN207166846U (en) | 2018-03-30 |
Family
ID=61713300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720871392.8U Expired - Fee Related CN207166846U (en) | 2017-07-18 | 2017-07-18 | The soft or hard combination pcb board of the high yield of high reliability |
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| Country | Link |
|---|---|
| CN (1) | CN207166846U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662369A (en) * | 2018-06-28 | 2020-01-07 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
| WO2020237672A1 (en) * | 2019-05-31 | 2020-12-03 | 庆鼎精密电子（淮安）有限公司 | Flexible circuit board and manufacture method therefor |
| CN112512204A (en) * | 2020-11-30 | 2021-03-16 | 维沃移动通信有限公司 | Flexible circuit board and forming method thereof |
-
2017
- 2017-07-18 CN CN201720871392.8U patent/CN207166846U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662369A (en) * | 2018-06-28 | 2020-01-07 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN110662369B (en) * | 2018-06-28 | 2021-02-09 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
| WO2020237672A1 (en) * | 2019-05-31 | 2020-12-03 | 庆鼎精密电子（淮安）有限公司 | Flexible circuit board and manufacture method therefor |
| CN112512204A (en) * | 2020-11-30 | 2021-03-16 | 维沃移动通信有限公司 | Flexible circuit board and forming method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180330 Termination date: 20180718 |