CN207118068U - A kind of multi-layer flexible circuit board - Google Patents
A kind of multi-layer flexible circuit board Download PDFInfo
- Publication number
- CN207118068U CN207118068U CN201721055567.4U CN201721055567U CN207118068U CN 207118068 U CN207118068 U CN 207118068U CN 201721055567 U CN201721055567 U CN 201721055567U CN 207118068 U CN207118068 U CN 207118068U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- conductive pole
- flexible circuit
- aluminium foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
It the utility model is related to a kind of multi-layer flexible circuit board, it includes polyimide substrate and conductive pole, symmetrically stacking is provided with copper foil circuit layer, fiberglass cloth, aluminium foil line layer and anti-solder ink layer from inside to outside on the surface of polyimide substrate two, and the conductive pole electrically connects with the copper foil circuit layer and aluminium foil line layer on the surface of polyimide substrate two respectively.The utility model is designed reasonably, low manufacture cost, good heat dissipation effect, there is excellent flexility and bending resistance.
Description
Technical field
It the utility model is related to wiring board techniques field, more particularly to a kind of multi-layer flexible circuit board.
Background technology
Existing multi-layer flexible printed circuit board, the surface of wiring board be typically by the use of copper foil as conductive layer, and in order to
The connection between plurality of conductive layers is realized, generally first set by plating, makes line again through the through hole for connecting each conductive layer, through hole
Conductive layer above and below the plate of road is electrically connected.However, copper is relatively valuable metal, circuit is caused using fine copper production wiring board
The cost of plate remains high, and the wiring board heat dispersion produced using copper is not very good, it is easy to causes wiring board to burn out, neither ring
Protect and cause the waste of copper, and electroplate more trouble inconvenience, its manufacturing cost in manufacture also to increase.
The content of the invention
The purpose of this utility model is in view of the shortcomings of the prior art, there is provided a kind of reasonable in design, low manufacture cost, dissipates
The good multi-layer flexible circuit board of thermal effect.
To achieve the above object, the utility model uses following technical scheme：
A kind of multi-layer flexible circuit board, it includes polyimide substrate and conductive pole, the surface of polyimide substrate two
Symmetrical stacking is provided with copper foil circuit layer, fiberglass cloth, aluminium foil line layer and anti-solder ink layer, the conduction from inside to outside
Post electrically connects with the copper foil circuit layer and aluminium foil line layer on the surface of polyimide substrate two respectively.
The conductive pole through being arranged on polyimide substrate, conductive pole both ends respectively with the copper foil circuit layer of homonymy and
Aluminium foil line layer electrically connects.The design not only instead of the electroplated metal layer of plating in traditional through hole, and simplify technique
Flow, making material is saved, reduces cost.
The conductive pole is hollow copper post or aluminium post.The design improves the result of ventilating heat dissipation of wiring board.
The conductive pole is multiple.
The anti-solder ink of the anti-solder ink layer is printed on aluminium foil circuit layer surface and is combined into one.
The anti-solder ink layer, which is arranged on aluminium foil circuit layer surface and need not be powered, connection and need not weld electronics member device
The position of part.
The utility model uses above technical scheme, the design of fiberglass cloth, not only can to copper foil circuit layer with
Insulated between aluminium foil line layer, and can effectively reduce the thickness of multi-layer flexible circuit board, improve its pliability and resistance to
Bending property；The design of aluminium foil line layer, the dosage of copper foil on wiring board can be greatly reduced, make its production cost lower, and
Aluminium foil layer is advantageous to improve the radiating effect of electronic component on wiring board and wiring board, so as to improve the use longevity of product
Life；The design of anti-solder ink layer, the circuit on wiring board can effectively be protected, prevent it from aoxidizing or because imprudence is wiped
Spend and cause open circuit or short circuit problem, improve the security used.The utility model is designed reasonably, low manufacture cost, radiating
Effect is good, has excellent flexility and bending resistance.
Brief description of the drawings
The utility model is further elaborated in conjunction with accompanying drawing：
Fig. 1 is the structural representation of the utility model multi-layer flexible circuit board.
Embodiment
As shown in figure 1, multi-layer flexible circuit board of the present utility model, including polyimide substrate 1 and conductive pole 6, it is described
Symmetrically stacking is provided with copper foil circuit layer 2, fiberglass cloth 3, aluminium foil line layer from inside to outside on polyimide substrate 1 liang of surface
4 and anti-solder ink layer 5, the conductive pole 6 copper foil circuit layer 2 and aluminium foil line layer 4 with 1 liang of surface of polyimide substrate respectively
Electrical connection.
The conductive pole 6 is through being arranged on polyimide substrate 1, the both ends of conductive pole 6 copper foil circuit with homonymy respectively
Layer 2 and aluminium foil line layer 4 electrically connect.The design not only instead of the electroplated metal layer of plating in traditional through hole, and simplify
Technological process, making material is saved, reduces cost.
The conductive pole 6 is hollow copper post or aluminium post.The design improves the result of ventilating heat dissipation of wiring board.
The conductive pole 6 is multiple.
The anti-solder ink of the anti-solder ink layer 5 is printed on the surface of aluminium foil line layer 4 and is combined into one.
The anti-solder ink layer 5 be arranged on the surface of aluminium foil line layer 4 need not be powered connection and need not weld electronics member
The position of device.
The surface of aluminium foil line layer 4 is needing energization connection and is needing the position of welding electronic component to pass through chemical sink
The mode of copper, nickel or silver lays one layer of copper, nickel or silver layer, to form layer（Not shown in figure）.
The utility model uses above technical scheme, and the design of fiberglass cloth 3 not only can be to copper foil circuit layer 2
Insulated between aluminium foil line layer 4, and can effectively reduce the thickness of multi-layer flexible circuit board, improve its pliability and
Bending resistance；The design of aluminium foil line layer 4, the dosage of copper foil on wiring board can be greatly reduced, make its production cost lower, and
And aluminium foil layer is advantageous to improve the radiating effect of electronic component on wiring board and wiring board, so as to improve the use longevity of product
Life；The design of anti-solder ink layer 5, the circuit on wiring board can effectively be protected, prevent it from aoxidizing or because of imprudence
Wipe flower and cause open circuit or short circuit problem, improve the security used.
Above description should not have any restriction to the scope of protection of the utility model.
Claims (5)
- A kind of 1. multi-layer flexible circuit board, it is characterised in that：It includes polyimide substrate and conductive pole, described polyimide-based Symmetrically stacking is provided with copper foil circuit layer, fiberglass cloth, aluminium foil line layer and anti-solder ink layer to the surface of plate two from inside to outside, The conductive pole electrically connects with the copper foil circuit layer and aluminium foil line layer on the surface of polyimide substrate two respectively.
- A kind of 2. multi-layer flexible circuit board according to claim 1, it is characterised in that：The conductive pole is poly- through being arranged on On acid imide substrate, conductive pole both ends electrically connect with the copper foil circuit layer and aluminium foil line layer of homonymy respectively.
- A kind of 3. multi-layer flexible circuit board according to claim 2, it is characterised in that：The conductive pole is hollow copper post Or aluminium post.
- A kind of 4. multi-layer flexible circuit board according to claim 1, it is characterised in that：The anti-solder paste of the anti-solder ink layer Ink print is in aluminium foil circuit layer surface and is combined into one.
- A kind of 5. multi-layer flexible circuit board according to claim 1, it is characterised in that：The anti-solder ink layer is arranged on aluminium Tinsel cord road layer surface need not be powered connection and do not need welding electronic component position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721055567.4U CN207118068U (en) | 2017-08-22 | 2017-08-22 | A kind of multi-layer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721055567.4U CN207118068U (en) | 2017-08-22 | 2017-08-22 | A kind of multi-layer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207118068U true CN207118068U (en) | 2018-03-16 |
Family
ID=61577286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721055567.4U Expired - Fee Related CN207118068U (en) | 2017-08-22 | 2017-08-22 | A kind of multi-layer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207118068U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110111929A (en) * | 2019-05-30 | 2019-08-09 | 王奉瑾 | A kind of graphene conductive material |
-
2017
- 2017-08-22 CN CN201721055567.4U patent/CN207118068U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110111929A (en) * | 2019-05-30 | 2019-08-09 | 王奉瑾 | A kind of graphene conductive material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180316 Termination date: 20200822 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |