CN207021260U - A kind of encapsulating lead of high stock utilization - Google Patents
A kind of encapsulating lead of high stock utilization Download PDFInfo
- Publication number
- CN207021260U CN207021260U CN201720854887.XU CN201720854887U CN207021260U CN 207021260 U CN207021260 U CN 207021260U CN 201720854887 U CN201720854887 U CN 201720854887U CN 207021260 U CN207021260 U CN 207021260U
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- Prior art keywords
- carrier
- lead
- fin
- stock utilization
- package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a kind of encapsulating lead of high stock utilization, including multiple row package lead unit, each column package lead unit includes multiple package lead units, and the package lead unit of adjacent column staggers arrangement；Each package lead unit includes carrier（1）, fin（2）With multiple outer pins（3）；Carrier is connected with fin；The packaging lead frame structure of the high stock utilization is compact, and reliability is high.
Description
Technical field
It the utility model is related to a kind of encapsulating lead of high stock utilization.
Background technology
Lead frame is the support or skeleton of Plastic Package product, is mainly made up of two parts：Carrier and pin.Wherein carry
Body is for adhering chip, plays a part of mechanical support；And pin is then to connect chip and the circuit of package outside.Pin has
It is divided into interior pin and outer pin, interior pin is wrapped around inside product plastic packaging material, before this can be by itself and one on chip
Pad is connected by bonding line；Outer pin be then in the outside of product plastic-sealed body, it provide plastic packaging product and pcb board machinery and
It is electrically connected.
The function of lead frame is that next is played and outside it will be apparent that playing the supporting role of encapsulating products first
Circuit connection, will also or product heat dissipation channel, in addition, it is also contemplated that the adhesion with plastic packaging material, prevents plastic packaging
Material with lead frame in faying face because of the difference of material expand coefficient, caused composition surface at work or during variation of ambient temperature
Peel off layering.
In Plastic Package product, when encapsulating products profile is smaller, large-area metal and plastic packaging material are combined and easily occurred
Peel off layering, cause product bonding line pull or thermal conductivity path disconnect, influence the realization of the final function of product.Currently
The SOT223 frameworks typically used are 5 rows, the lead frame of 100*160mil carrier sizes, as shown in figure 1, in this framework,
What each package lead unit was generally flush with, space-consuming is big, and stock utilization is low.
Therefore, it is necessary to design a kind of encapsulating lead of new high stock utilization.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of encapsulating lead of high stock utilization, the height
The packaging lead frame structure of stock utilization is compact, and reliability is high.
The technical solution of utility model is as follows：
A kind of encapsulating lead of high stock utilization, including multiple row package lead unit, each column package lead unit
Including multiple package lead units, the package lead unit of adjacent column staggers arrangement；
Each package lead unit includes carrier, fin and multiple outer pins；
Carrier is connected with fin；In bonding process, the pad in outer pin passes through the pad on bonding line and carrier
Connection, carrier are also known as Ji Dao.
The outer pin that each package lead unit includes is 3.
Carrier is rectangular carrier, and 4 V-grooves connected two-by-two are provided with the upper surface of described rectangular carrier；4 V-types
Groove forms the V-groove proof mechanism of water of a rectangle.
The linkage section of fin and carrier is provided with V-groove.
Lock hole is provided with outer pin or fin.Lock hole is circular hole, elliptical aperture, preferably waist-shaped hole.
Each encapsulation unit includes carrier, fin, the frame-type structure of interior pin composition.In the structure, carrier interposition
Install the V-type capillary groove of square frame profile；One oval lock hole is set with its interior pin intersection below carrier；On carrier
Side's connection outside heat sink, both intersections equally set an oval lock hole；The carrier back side is provided with matrix form distribution
Square groove；Carrier both sides relative position then respectively sets an interior pin, and an ellipse locking is set on each interior pin
Hole；The interior pin back side is provided with square groove；Lead frame surface carries out roughening treatment, increases the knot of lead frame and plastic packaging material
With joint efforts, above lead frame mode can improve reliability.
Each package lead unit（Installation unit）There are 3 outer pins and 1 fin, 3 outer pins are between any two
Spacing width compared to outer pin width will width, this space can be utilized, then the first row and secondary series installation unit pair in every group
To distribution, i.e. outer pin is relative with outer pin, and outer pin is to misplace up and down in appearance in Heterogeneous Permutation, two row installation units are intersected
Distribution, so stock utilization can be improved with utilization space.
Beneficial effect：
The encapsulating lead of high stock utilization of the present utility model, has the characteristics that：
This patent lead frame is that multiple encapsulation units are distributed with matrix form；One oval lock hole is set on carrier,
V-type capillary groove is set among it；The carrier back side is provided with the square groove of matrix form distribution；One ellipse is set on fin
Lock hole；One oval lock hole is respectively set on interior pin, and the back side sets square groove；Outer pin, which is intersected, to be dislocatedly distributed.
Lock hole, the effect of similar pin, makes interior pin firmly be locked in plastic-sealed body, and it is anti-dilatory to improve outer pin
Ability；
The edge increase V-type capillary groove of carrier, can play a part of isolation, and main plastic-sealed body inner moisture of isolating enters load
Body region；And V-groove is provided between fin and carrier, mainly prevent outside moisture by leaking outside between fin and plastic-sealed body
Gap is entered carrier zones.
The utility model reduces accounting of the carrier in plastic-sealed body, increase ellipse by changing the form of frame structure
Lock hole, while make to combine more closely between plastic packaging material and lead frame, prevent layering from improving product reliability, in addition, logical
Staggered arrangement is crossed to improve stock utilization.
Brief description of the drawings
Fig. 1 is existing packaging lead frame structure schematic diagram；
Fig. 2 is the general structure schematic diagram of encapsulating lead of the present utility model；
Fig. 3 is the general structure schematic diagram of encapsulating lead of the present utility model（Enlarged drawing）；
Fig. 4 is the structural representation of the package lead unit of high stock utilization.
Label declaration：1- carriers, 2- fin, 3- outer pins, 4- lock holes, 5-V type grooves.
Embodiment
The utility model is described in further details below with reference to the drawings and specific embodiments：
Embodiment 1：Such as Fig. 2-4, a kind of encapsulating lead of high stock utilization, including multiple row package lead unit,
Each column package lead unit includes multiple package lead units, and the package lead unit of adjacent column staggers arrangement；
Each package lead unit includes carrier 1, fin 2 and multiple outer pins 3；
Carrier is connected with fin；In bonding process, the pad in outer pin passes through the pad on bonding line and carrier
Connection, carrier are also known as Ji Dao.
The outer pin that each package lead unit includes is 3.
Carrier is rectangular carrier, and 4 V-grooves 5 connected two-by-two are provided with the upper surface of described rectangular carrier；4 V-types
Groove forms the V-groove proof mechanism of water of a rectangle.
The linkage section of fin and carrier is provided with V-groove 5.
Lock hole 4 is provided with interior pin or fin.Lock hole is circular hole, elliptical aperture, preferably waist-shaped hole.
Lead frame is 8 rows by 5 rows increase, increases encapsulation unit, and the area of average each unit is also being reduced, and improves material
Expect utilization rate；Meanwhile after carrier reduces, the distance of bonding is reduced, and bonding line dosage is reduced, equipment, which is formed, to be shortened, production efficiency
It is improved.
Carrier ellipse lock hole, passes through plastic packaging material, similar pin, while carrier area is reduced, enters one
Carrier and the adhesion at plastic packaging material interface are walked, improves its anti-delamination strength；
Carrier centre position V-type capillary groove, inside and outside steam can be isolated and enter chip viscose glue region, also to isolate viscose glue and wave
Influence of the stimulating food to carrier, improve carrier and plastic packaging material interface binding power；
Carrier back side square groove, it is that matrix form is distributed in the range of carrier backside area, main purpose is enhancing carrier
The back side and the combination of plastic packaging material, so, except the roughening treatment of framework surface, groove can also further enhance interface binding power；
Lock hole on fin and interior pin, purpose are identical with carrier lock hole effect.
1. the encapsulation unit that this patent lead frame wall scroll accommodates is more, while make use of the space of outer pin spacing, profit
It is high with rate, the comparison is as follows table.
| Explanation | Every frame size（mm） | Individual/bar | Average each product area（mm2） |
| Existing 5 row lead frame | 238*56 | 100 | 133.28 |
| This patent lead frame | 250*79 | 256 | 77.15 |
As seen from the above table, this patent lead frame averagely saves 42.11% compared to the existing each product of 5 row lead frame
Copper material.
2. plastic packaging encapsulation bar number is constant, when every can encapsulation unit increase when, then plastic packaging production efficiency improves, as follows
Table.
| Explanation | Per mould bar number（mm） | Per modulus amount（It is individual） | Daily modulus（It is secondary） | Yield（It is individual） |
| Existing 5 row lead frame | 8 | 8*100=800 | 500 | 400000 |
| This patent lead frame | 8 | 8*256=2048 | 500 | 1024000 |
As seen from the above table, this patent lead frame compares existing 5 row lead frame, and when plastic packaging produces, efficiency can improve
2.56 again.
Claims (4)
1. a kind of encapsulating lead of high stock utilization, it is characterised in that including multiple row package lead unit, each column encapsulation
Lead wire unit includes multiple package lead units, and the package lead unit of adjacent column staggers arrangement；
Each package lead unit includes carrier (1), fin (2) and multiple outer pins (3)；
Carrier is connected with fin；
Carrier is rectangular carrier, and 4 V-grooves (5) connected two-by-two are provided with the upper surface of described rectangular carrier；4 V-grooves
Form the V-groove proof mechanism of water of a rectangle.
2. the encapsulating lead of high stock utilization according to claim 1, it is characterised in that each package lead
The outer pin that unit includes is 3.
3. the encapsulating lead of high stock utilization according to claim 1, it is characterised in that fin and carrier
Linkage section is provided with V-groove (5).
4. the encapsulating lead of the high stock utilization according to claim any one of 1-3, it is characterised in that draw inside
Pin or fin are provided with lock hole (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720854887.XU CN207021260U (en) | 2017-07-13 | 2017-07-13 | A kind of encapsulating lead of high stock utilization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720854887.XU CN207021260U (en) | 2017-07-13 | 2017-07-13 | A kind of encapsulating lead of high stock utilization |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207021260U true CN207021260U (en) | 2018-02-16 |
Family
ID=61482977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720854887.XU Active CN207021260U (en) | 2017-07-13 | 2017-07-13 | A kind of encapsulating lead of high stock utilization |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207021260U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300873A (en) * | 2018-11-28 | 2019-02-01 | 铜陵中锐电子科技有限公司 | Pin staggered type multi-row lead frame frame suitable for TO252 |
| WO2021262538A1 (en) * | 2020-06-26 | 2021-12-30 | Cree, Inc. | Radio frequency transistor amplifier package |
-
2017
- 2017-07-13 CN CN201720854887.XU patent/CN207021260U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300873A (en) * | 2018-11-28 | 2019-02-01 | 铜陵中锐电子科技有限公司 | Pin staggered type multi-row lead frame frame suitable for TO252 |
| WO2021262538A1 (en) * | 2020-06-26 | 2021-12-30 | Cree, Inc. | Radio frequency transistor amplifier package |
| US11581859B2 (en) | 2020-06-26 | 2023-02-14 | Wolfspeed, Inc. | Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurations |
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