CN207016891U - A kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot - Google Patents
A kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot Download PDFInfo
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- CN207016891U CN207016891U CN201720428118.3U CN201720428118U CN207016891U CN 207016891 U CN207016891 U CN 207016891U CN 201720428118 U CN201720428118 U CN 201720428118U CN 207016891 U CN207016891 U CN 207016891U
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- cooling
- heat sink
- ingot
- polycrystalline
- cooling device
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Abstract
A kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot, including the cooling heat sink being located in polycrystalline ingot furnace lower furnace body, thermometric thief hole is provided with the center of cooling heat sink, cooling pipe is paved with the lower surface of cooling heat sink, cooling pipe is provided with an import and one outlet, the protective plate I to connect with lower furnace body is surrounded by the lower surface of cooling heat sink, the thermometric thief hole in cooling heat sink upper surface is surrounded by protective plate II.For the utility model by setting cooling heat sink in polycrystalline ingot furnace lower furnace body, the lower surface for cooling down heat sink is provided with cooling pipe, and liquid is passed through in cooling pipe or inert gas is used to cool down, its cooling capacity is strong, and cooling velocity is accelerated；By protective plate I is set and protective plate II can prevent crucible rupture after feed liquid from warm thief hole or cool down the surrounding of heat sink and flow out, so as to strengthen protection, improve its security.
Description
Technical field
Production of polysilicon equipment technical field is the utility model is related to, it is more particularly to a kind of for the more of oversize silicon ingot
The cooling device of brilliant ingot furnace.
Background technology
Photovoltaic industry development is rapid, market scale sustainable growth, but Market competition simultaneously, to realize as early as possible
Par is surfed the Net, and realizes larger range of popularization and application, each link of the whole industry lays siege to and obtained high efficiency, inexpensive battery.
Crystal silicon link in upstream, acquisition high-quality, the crystal of low cost are extremely important, at present large scale（G6）Polycrystal silicon ingot turns into row
Owner flows, and oversize silicon ingot G7 or G8 of future generation turn into current trend and postponed the only way of development, can lift silicon ingot weight
Amount, productivity ratio is improved, reduce unit consumption, improve crystal quality.
Polycrystalline silicon ingot or purifying furnace is the equipment for manufacturing polycrystal silicon ingot, produces polycrystal silicon ingot using directional solidification method, first
The crucible for having installed silicon material is fitted into furnace chamber, is then evacuated, heated, melted, growing the processing steps such as brilliant, annealing, cooling.
With the continuous expansion of silicon ingot specification, voluntarily cooled down by body of heater, influence to grow brilliant effect, and the long brilliant time can also compare
It is longer, therefore, in order to solve the above technical problems, it is necessory to provide a kind of new ingot furnace cooling device, to overcome existing skill
The defect in art.
The content of the invention
Technical problem to be solved in the utility model is in view of the shortcomings of the prior art, there is provided it is a kind of reasonable in design, it is cold
But effect is good, the cooling device of the polycrystalline ingot furnace for oversize silicon ingot safe to use.
Technical problem to be solved in the utility model is realized by following technical scheme, and the utility model is
A kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot, is characterized in, including the cooling being located in lower furnace body dissipates
Hot plate, thermometric thief hole is provided with the center of cooling heat sink, cooling pipe is paved with the lower surface of cooling heat sink, it is cold
But pipeline is provided with an import and one outlet, and the protective plate to connect with lower furnace body is surrounded by the lower surface of cooling heat sink
I, the thermometric thief hole in cooling heat sink upper surface is surrounded by protective plate II.
Technical problem to be solved in the utility model can also be realized by following technical scheme, the protection
Plate I and protective plate II are thermal-insulation hard felt plate, ceramic wafer, alumina plate, zirconium oxide plate or graphite cake, are highly 20mm-60mm.
Technical problem to be solved in the utility model can also be realized by following technical scheme, the cooling
Heat sink is molybdenum plate or copper coin, and its thickness is 20mm-60mm.
Technical problem to be solved in the utility model can also be realized by following technical scheme, the cooling
Pipeline is molybdenum tube or copper pipe.
Technical problem to be solved in the utility model can also be realized by following technical scheme, cooling pipe
Cross-sectional shape is triangle, square, semicircle, circular or rectangle.
Technical problem to be solved in the utility model can also be realized by following technical scheme, cooling pipe
Internal diameter be 20mm-60mm.
Technical problem to be solved in the utility model can also be realized by following technical scheme, the cooling
Pipeline is in three-back-shaped setting of spiraling.
Compared with prior art, the utility model is dissipated by setting cooling heat sink, cooling in polycrystalline ingot furnace lower furnace body
The lower surface of hot plate is provided with cooling pipe, and liquid is passed through in cooling pipe or inert gas is used to cool down, and its cooling capacity is strong,
Cooling velocity is accelerated；By protective plate I is set and protective plate II can prevent crucible rupture after feed liquid from warm thief hole or cooling
The surrounding outflow of heat sink, so as to strengthen protection, improves its security.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is Fig. 1 present invention looks up structural representation.
Embodiment
Referring to the drawings, concrete technical scheme of the present utility model is further described, in order to those skilled in the art
Member is further understood that the present invention, without forming the limitation to its right.
Referring to Figures 1 and 2, the cooling device of a kind of polycrystalline ingot furnace for oversize silicon ingot, including it is located at polycrystalline
Cooling heat sink 2 in ingot furnace lower furnace body, cooling heat sink 2 are fixed in lower furnace body by support frame, and cooling heat sink 2 is
Molybdenum plate or copper coin, are shaped as square, and its thickness is 30mm.Thermometric thief hole is provided with the center of cooling heat sink 2, cold
But cooling pipe 5 is paved with the lower surface of heat sink 2, cooling pipe 5 is arranged on cooling heat sink 2 in three-back-shaped spiral, cold
But pipeline 5 is provided with an import and one outlet.The cooling pipe 5 is by good with some strength, fusing point height and thermal conductivity
Metal material be made, such as molybdenum tube or copper pipe, its internal diameter is 40mm, the cross-sectional shape of cooling pipe 5 can be triangle, it is square,
Semicircle, circular or rectangle.The form that is connected of cooling pipe 5 and cooling heat sink 2 is for directly welding or by outer
Portion's fastener connection, to ensure abundant contact between the two, makes conduction good.Cooling pipe 5 is connected with cooling device, in it
The medium that portion flows through is liquid or inert gas, pressure 0.1bar-6bar.
The protective plate I 3 to connect with lower furnace body is surrounded by the lower surface of cooling heat sink 2, in the cooling upper table of heat sink 2
The thermometric thief hole 4 in face is surrounded by protective plate II 1.Protective plate I 3 and protective plate II 1 are thermal-insulation hard felt plate, ceramic wafer, oxidation
Aluminium sheet, zirconium oxide plate or graphite cake, the height of protective plate II 1 is 30mm, and the height of protective plate I 3 is 50mm.Use protective plate I 3
Feed liquid flows out from the surrounding of warm thief hole or cooling heat sink after can preventing crucible rupture with protective plate II 1.
Claims (7)
- A kind of 1. cooling device of polycrystalline ingot furnace for oversize silicon ingot, it is characterised in that：Including being located at polycrystalline cast ingot Cooling heat sink in stove lower furnace body, thermometric thief hole is provided with the center of cooling heat sink, in the following table of cooling heat sink Cooling pipe is paved with face, cooling pipe is provided with an import and one outlet, is surrounded by the lower surface of cooling heat sink The protective plate I to connect with lower furnace body, the thermometric thief hole in cooling heat sink upper surface are surrounded by protective plate II.
- 2. the cooling device of the polycrystalline ingot furnace according to claim 1 for oversize silicon ingot, it is characterised in that： The protective plate I and protective plate II are thermal-insulation hard felt plate, ceramic wafer, alumina plate, zirconium oxide plate or graphite cake, are highly 20mm-60mm。
- 3. the cooling device of the polycrystalline ingot furnace according to claim 1 for oversize silicon ingot, it is characterised in that：Institute It is molybdenum plate or copper coin to state cooling heat sink, and its thickness is 20mm-60mm.
- 4. the cooling device of the polycrystalline ingot furnace according to claim 1 for oversize silicon ingot, it is characterised in that：Institute It is molybdenum tube or copper pipe to state cooling pipe.
- 5. the cooling device of the polycrystalline ingot furnace according to claim 4 for oversize silicon ingot, it is characterised in that：It is cold But pipeline section profile is triangle, square, semicircle, circular or rectangle.
- 6. the cooling device of the polycrystalline ingot furnace according to claim 4 for oversize silicon ingot, it is characterised in that：It is cold But the internal diameter of pipeline is 20mm-60mm.
- 7. the cooling device of the polycrystalline ingot furnace according to claim 1 for oversize silicon ingot, it is characterised in that：Institute It is in three-back-shaped setting of spiraling to state cooling pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720428118.3U CN207016891U (en) | 2017-04-23 | 2017-04-23 | A kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720428118.3U CN207016891U (en) | 2017-04-23 | 2017-04-23 | A kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207016891U true CN207016891U (en) | 2018-02-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720428118.3U Expired - Fee Related CN207016891U (en) | 2017-04-23 | 2017-04-23 | A kind of cooling device of polycrystalline ingot furnace for oversize silicon ingot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207016891U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107059118A (en) * | 2017-04-23 | 2017-08-18 | 连云港清友新能源科技有限公司 | Cooling device for the polycrystalline ingot furnace of oversize silicon ingot |
-
2017
- 2017-04-23 CN CN201720428118.3U patent/CN207016891U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107059118A (en) * | 2017-04-23 | 2017-08-18 | 连云港清友新能源科技有限公司 | Cooling device for the polycrystalline ingot furnace of oversize silicon ingot |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180216 Termination date: 20180423 |