CN207011077U - A kind of multilayer circuit board that can improve heat-sinking capability - Google Patents
A kind of multilayer circuit board that can improve heat-sinking capability Download PDFInfo
- Publication number
- CN207011077U CN207011077U CN201720830087.4U CN201720830087U CN207011077U CN 207011077 U CN207011077 U CN 207011077U CN 201720830087 U CN201720830087 U CN 201720830087U CN 207011077 U CN207011077 U CN 207011077U
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- China
- Prior art keywords
- circuit board
- heat
- blind hole
- radiating
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The multilayer circuit board of heat-sinking capability can be improved the utility model discloses a kind of, including be sequentially arranged from bottom to top：First circuit board layer, the first adhesive layer, second circuit flaggy, the second adhesive layer and tertiary circuit flaggy, the radiating blind hole extended downwardly from top surface is offered on the multilayer circuit board, heat-conducting glue post is provided with the radiating blind hole, the top surface of the multilayer circuit board is fixed with fin, and the heat-conducting glue post is bonded with fin.Heat-conducting glue post can by board layer, especially among board layer on heat be timely transmitted to fin, avoid accumulation of the heat in board layer.And the usage amount of heat-conducting glue is the volume of blind hole, usage amount is smaller, will not cause being significantly increased for manufacturing cost.
Description
Technical field
A kind of circuit board is the utility model is related to, especially a kind of multilayer circuit board that can improve heat-sinking capability.
Background technology
Printed circuit board (PCB), also known as printed circuit board (PCB), are important electronic units, are the supporters of electronic component,
It is the carrier of electronic component electrical connection.With being increasingly miniaturized of electronic product, lighting, multifunction, circuit board
Size is also less and less, wiring density more and more higher, and the shape of circuit board is also varied, and Special-shaped circuit board is often used in
Every field.Meanwhile various multi-layered high density interconnected printed circuit boards can be increasingly becoming the weight of various high-tech electronic products
Want part.
The manufacturing process of general multilayer circuit board is：Using epoxy resin base plate as substrate, metal electricity is made in substrate
Road floor is to form single layer board, then, is bonded between polylith substrate by gluing to form multi-layer compound structure.With
The increase of device and wiring density on circuit board, radiate bad an important factor for being increasingly becoming influence board design.Circuit
Component on plate is mainly using air as heat-conduction medium, and such a mode can not quickly and effectively distribute the heat on device, especially
It is that the heat dissipation problem of middle layer circuit board is more difficult to solve.Also generate in the prior art using heat-conducting glue as between two pieces of substrates
Adhesive layer technique, however, compared to common insulation adhesive glue, heat-conducting glue it is expensive, it is big plus usage amount, it is more by increasing
The manufacturing cost of layer circuit board.
Utility model content
Technical problem to be solved in the utility model is the bad technical problem of existing multilayer circuit board radiating.
In order to solve the above-mentioned technical problem, the technical solution of the utility model is：It is a kind of to improve the more of heat-sinking capability
Layer circuit board, including be sequentially arranged from bottom to top：First circuit board layer, the first adhesive layer, second circuit flaggy, the second bonding
Layer and tertiary circuit flaggy, the radiating blind hole extended downwardly from top surface, the radiating blind hole are offered on the multilayer circuit board
Heat-conducting glue post is inside provided with, the top surface of the multilayer circuit board is fixed with fin, and the heat-conducting glue post is bonded with fin.
Further, the bottom of the radiating blind hole is located at the top surface of the first circuit board layer.
Further, each it is respectively arranged an independent fin at radiating blind hole.
Further, radiating is set to cover copper on first circuit board layer, second circuit flaggy or tertiary circuit flaggy, it is described to dissipate
Hot blind hole penetrates the radiating and covers copper.
The utility model is by opening up heat conduction blind hole, and filling heat-conductive glue forms heat-conducting glue post, heat-conducting glue post in heat conduction blind hole
Heat that can be by board layer, especially on the board layer of centre is timely transmitted to fin, avoids heat in circuit board
The accumulation of layer.And the usage amount of heat-conducting glue is the volume of blind hole, usage amount is smaller, will not cause being significantly increased for manufacturing cost.
Brief description of the drawings
Fig. 1 is the utility model schematic cross-sectional view；
Shown in Fig. 1：1a, first circuit board layer；1b, second circuit flaggy；1c, tertiary circuit flaggy；2a, the first bonding
Layer；2b, the second adhesive layer；3rd, fin；4th, copper is covered in radiating；5th, radiate blind hole；6th, heat-conducting glue post.
Embodiment
For the ease of understanding above-mentioned purpose of the present utility model, feature and advantage, it is illustrated with reference to embodiment.Should
Understand, these embodiments are merely to illustrate the utility model rather than limitation the scope of the utility model.For these implementations
A variety of modifications of example will be apparent to those skilled in the art, generic principles defined herein,
It can be achieved in other embodiments in the case where not departing from spirit or scope of the present utility model.
A kind of multilayer circuit board shown in Figure 1, including be sequentially arranged from bottom to top：First circuit board layer 1a,
One adhesive layer 2a, second circuit flaggy 1b, the second adhesive layer 2b, tertiary circuit flaggy 1c.Wherein first circuit board layer 1a, second
Board layer 1b, tertiary circuit flaggy 1c include the substrate made of epoxy resin base plate and the metallic circuit made in substrate
Layer, similarly to the prior art.Multilayer circuit board in the present embodiment has 3 layer circuit board Rotating fields, in some embodiments,
Such as in circuit board of server, there can also be 4 layers of even more Multi-layer circuit board structure.
Radiating blind hole 5 in many places is drilled with the multilayer circuit board, the bottom of the radiating blind hole 5 is preferably placed at the first circuit
Flaggy 1a top surface, thereby it is ensured that middle board layer is pierced, thus the radiating for preferably solving intermediate circuit flaggy is asked
Topic.
The radiating blind hole 5, which is opened in, to be needed near the copper cash that radiates, filling heat-conductive glue post 6 in the blind hole 5 that radiates, and described the
Three-circuit flaggy 1c surface is fixed with fin 3, and the heat-conducting glue post 6 is bonded with fin 3.The heat-conducting glue post 6 is covered with
The radiating blind hole 5, it is thus possible in time by blind hole side wall, the heat transfer of bottom to fin 3, dissipated rapidly by fin 3
Hair.In the present embodiment, an independent fin 3 is respectively arranged for each radiating blind hole 5, in order to setting for circuit board
Meter.In actual production, one piece of large scale fin 3 can also be arranged in tertiary circuit flaggy 1c surface.The fin 3
It is preferred that it is fixedly connected by screw with the multilayer circuit board.
On every layer circuit board layer, nearby radiating can also be set to cover copper 4 positioned at the copper cash for needing to radiate, copper is covered in the radiating
4 with wiring circuit contact, is only to play thermolysis.The radiating blind hole 5 penetrates the radiating and covers copper 4, in the blind hole 5 that radiates
Heat-conducting glue post 6 covers copper 4 with radiating and is bonded, and then the heat that radiating is covered on copper 4 is conducted to fin 3, strengthens radiating effect.
The manufacture craft of above-mentioned multilayer circuit board is：
The first step, prepare each layer circuit board；If it is necessary, radiating is designed on circuit board covers copper 4；
Second step, by the gluing formation Multi-layer circuit board structure of each layer circuit board；
3rd step, radiating blind hole 5 is bored on the top surface of the multilayer circuit board；
4th step, injection liquid heat conductive glue, is frozen into heat-conducting glue post 6 in radiating blind hole 5；
5th step, the fixing cooling fins 3 on the top surface of the multilayer circuit board, the top of the fin 3 and heat-conducting glue post 6
Fitting.
Claims (4)
1. the multilayer circuit board of heat-sinking capability can be improved a kind of, including be sequentially arranged from bottom to top：First circuit board layer,
One adhesive layer, second circuit flaggy, the second adhesive layer and tertiary circuit flaggy, it is characterised in that opened on the multilayer circuit board
Provided with the radiating blind hole extended downwardly from top surface, heat-conducting glue post, the top of the multilayer circuit board are provided with the radiating blind hole
Face is fixed with fin, and the heat-conducting glue post is bonded with fin.
2. the multilayer circuit board of heat-sinking capability can be improved as claimed in claim 1, it is characterised in that：The radiating blind hole
Bottom is located at the top surface of the first circuit board layer.
3. the multilayer circuit board of heat-sinking capability can be improved as claimed in claim 1, it is characterised in that：At each radiating blind hole
It is respectively arranged an independent fin.
4. the multilayer circuit board of heat-sinking capability can be improved as claimed in claim 1, it is characterised in that：First circuit board layer,
Radiating is set to cover copper on second circuit flaggy or tertiary circuit flaggy, the radiating blind hole penetrates the radiating and covers copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720830087.4U CN207011077U (en) | 2017-07-10 | 2017-07-10 | A kind of multilayer circuit board that can improve heat-sinking capability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720830087.4U CN207011077U (en) | 2017-07-10 | 2017-07-10 | A kind of multilayer circuit board that can improve heat-sinking capability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207011077U true CN207011077U (en) | 2018-02-13 |
Family
ID=61452669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720830087.4U Expired - Fee Related CN207011077U (en) | 2017-07-10 | 2017-07-10 | A kind of multilayer circuit board that can improve heat-sinking capability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207011077U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108471670A (en) * | 2018-05-09 | 2018-08-31 | 无锡天芯互联科技有限公司 | A kind of flush type power module structure and preparation method thereof |
| CN109219235A (en) * | 2018-11-23 | 2019-01-15 | 开平依利安达电子第三有限公司 | A kind of copper base of the radium-shine blind hole of band |
| WO2022121476A1 (en) * | 2020-12-10 | 2022-06-16 | 中兴通讯股份有限公司 | Heat dissipation apparatus and electronic device |
-
2017
- 2017-07-10 CN CN201720830087.4U patent/CN207011077U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108471670A (en) * | 2018-05-09 | 2018-08-31 | 无锡天芯互联科技有限公司 | A kind of flush type power module structure and preparation method thereof |
| CN109219235A (en) * | 2018-11-23 | 2019-01-15 | 开平依利安达电子第三有限公司 | A kind of copper base of the radium-shine blind hole of band |
| WO2022121476A1 (en) * | 2020-12-10 | 2022-06-16 | 中兴通讯股份有限公司 | Heat dissipation apparatus and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180213 Termination date: 20200710 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |