CN207009444U - Stacked wafer moudle attachment structure and stacked wafer moudle - Google Patents
Stacked wafer moudle attachment structure and stacked wafer moudle Download PDFInfo
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- CN207009444U CN207009444U CN201720961577.8U CN201720961577U CN207009444U CN 207009444 U CN207009444 U CN 207009444U CN 201720961577 U CN201720961577 U CN 201720961577U CN 207009444 U CN207009444 U CN 207009444U
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- 239000011159 matrix material Substances 0.000 claims abstract description 31
- 238000005452 bending Methods 0.000 claims abstract description 27
- 238000003475 lamination Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 description 11
- 230000005611 electricity Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 210000005252 bulbus oculi Anatomy 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Connection Of Batteries Or Terminals (AREA)
Abstract
It the utility model is related to stacked wafer moudle attachment structure and stacked wafer moudle.The stacked wafer moudle is matrix form arrangement stacked wafer moudle, and connected between matrix column element by " Z " type bending structure busbar with the lead-out wire for connecting bypass diode, multiple bypass diodes are connected between the both positive and negative polarity of the stacked wafer moudle and the lead-out wire for connecting bypass diode.Stacked wafer moudle of the present utility model has above-mentioned stacked wafer moudle attachment structure.
Description
Technical field
Photovoltaic cell field is the utility model is related to, more specifically, the utility model is related to a kind of stacked wafer moudle connection knot
Structure and stacked wafer moudle.
Background technology
With global technology and economic fast development, increasingly desirable more energy more cleaned carry out meet demand.The sun
Energy resource does not have carbon dioxide discharge when generating electricity and environmental pressure is small, therefore many countries and regions are all being greatly developed too
Positive energy (such as photovoltaic) battery is as the energy.
Monolithic solar cell effect is limited, and solar cell module turns into preferably selection.Solar cell module will
Realize that the function of generating electricity connects monolithic solar cell and become an entirety.Stacked wafer moudle is a kind of by photovoltaic
The technology that battery is interlinked in a manner of more close so that the gap between battery is preferably minimized, even edge is somewhat overlapping, because
This can lay more batteries in the case of unit area identical, and so as to the increase of extinction area, power also can be improved at least
10~15W.
In addition, stacked wafer moudle relatively saves component cost, stacked wafer moudle is with high power, height with little need for welding
Conversion efficiency break crystal silicon traditional market rapidly, and attract the eyeball of major photovoltaic producer.
At present in actual use, due to the diode of stacked wafer moudle design existing defects and diode design not
Rationally cause " component hot spot " occur, cause another quality accident together.Problem is serious, it would be highly desirable to solves.
In the prior art, only set a diode or diode arrangement unreasonable it is difficult to reduce for each panel
The probability that hot spot phenomenon occurs.If gap is not provided with each interregional junction of photovoltaic laminate component, although component can
To keep high power, high conversion efficiency, but the probability of happening of component hot spot phenomenon can not be reduced well.Therefore hot spot is reduced
The effect of phenomenon also has room for promotion.In addition, the setting of multiple terminal boxes understands waste of resource, occupies more spaces in the prior art
And increase cost.
Therefore, there is an urgent need to can solve the problem that above mentioned problem reduce hot spot phenomenon and high-power photovoltaic laminate component with
And corresponding attachment structure and outlet structure etc..
Utility model content
The purpose of this utility model is to provide a kind of stacked wafer moudle attachment structure and stacked wafer moudle.
Above-mentioned purpose according to stacked wafer moudle attachment structure of the present utility model by realizing that the stacked wafer moudle is matrix form
Arrangement stacked wafer moudle, and it is curved by " Z " type with the lead-out wire for connecting bypass diode between matrix column element
Folded structure busbar connects, and is connected between the both positive and negative polarity of the stacked wafer moudle and the lead-out wire for connecting bypass diode
Multiple bypass diodes.The generation of component hot spot phenomenon can be reduced well while high power, high conversion efficiency is kept
Probability.
According to preferred embodiment of the present utility model, " Z " the type bending structure busbar includes：First welding
Band；The second welded bands of the side of the first welded bands are connected to by the upper end side of " Z " type bar, and the second welded bands are connected to
The lower end side of " Z " type bar；And the 3rd welded bands of the first welded bands are connected to by horizontal stripe in the opposite side of the first welded bands,
3rd welded bands are used for the lead-out wire for connecting bypass diode, and the first welded bands are welded to the two neighboring column element of matrix
A upper column element, the second welded bands are welded to next column element of the two neighboring column element of matrix.This " Z " type is curved
The very convenient lead of folded structure busbar.It is furthermore possible to make to form the gradient between two neighboring column element, thus, it is possible in lamination
During component lamination and outdoor use, component stress is preferably discharged.
According to preferred embodiment of the present utility model, each matrix element generation of the matrix form arrangement stacked wafer moudle
One region of table, comprising possessing gap between multiple batteries in parallel connection strings and batteries in parallel connection string in each region.So as to take into account
It is each it is interregional be connected in series and each region in battery strings between being connected in parallel so that the high polycrystalline of reliability is folded
The automatic mass of watt component is possibly realized.
According to preferred embodiment of the present utility model, the matrix form arrangement stacked wafer moudle is arranged for 2X2 matrix forms
Cloth, four elements in matrix are respectively first area, second area, the 3rd region and the 4th region, in the first area
Battery strings negative pole of the negative pole as whole stacked wafer moudle, the positive pole of the battery strings in first area with the second area
Battery strings negative pole connection, the positive pole of the battery strings in second area connects with the negative pole of the battery strings in the 4th region
Logical, the positive pole of the battery strings in the 4th region connects with the negative pole of the battery strings in the 3rd region, the electricity in the 3rd region
The positive pole of the just extremely whole stacked wafer moudle of pond string.Herein by the way that stacked wafer moudle is divided into four regions, can preferably prevent
The only hot spot effect of component.Herein so that the global voltage of battery strings is four points of whole stacked wafer moudle voltage in each region
One of, so as to greatly reduce the risk of hot spot.
According to preferred embodiment of the present utility model, the 3rd welded bands in " Z " type bending structure busbar are than
One welded bands and/or the second welded bands are longer.
According to preferred embodiment of the present utility model, the 3rd welded bands bridge the two neighboring electricity in batteries in parallel connection string
Pond string between gap and extend on adjacent cell string.
Each " Z " type bending structure for connecting first area and second area is arranged in the following manner, i.e. each
The first welded bands in " Z " type bending structure are correspondingly welded on the negative pole of battery strings in the first region and the second welding
Band is correspondingly welded on the positive pole of the battery strings corresponding to above-mentioned battery strings in the second area, wherein, the first welded bands and
Second welded bands do not have to bridge the gap between the two neighboring battery strings in a region.But the 3rd welded bands are designed to compare
First welded bands and/or the second welded bands are longer, and therefore, the 3rd welded bands extend across the gap between two neighboring battery strings
To adjacent cell string, and by being welded to connect in the 3rd welded bands of adjacent cell string.Thus achieve, if using
Manual operations connection battery strings, then using spot welding.Thus man-hour can be saved, improves production efficiency to greatest extent.Also
Can be less use raw material simultaneously and then save more costs, realizes the manufacturing industry objective of cost efficiency.
According to preferred embodiment of the present utility model, the matrix form arrangement stacked wafer moudle includes being connected to the lamination
Four bypass diodes between the both positive and negative polarity of component and lead-out wire for connecting bypass diode.
According to preferred embodiment of the present utility model, bypass diode includes：First bypass diode, it is with first
Battery series-parallel connection in region, wherein, the positive pole of the first bypass diode is connected with the negative pole of the battery strings of first area, and the
The negative pole of one bypass diode is connected with the positive pole of the battery strings of first area；Second bypass diode, its with second area
Battery series-parallel connection, wherein, the positive pole of the second bypass diode is connected with the negative pole of the battery strings of second area, and second bypass
The negative pole of diode is connected with the positive pole of the battery strings of second area；3rd bypass diode, itself and the battery in the 3rd region
Connection in series-parallel, wherein, the positive pole of the 3rd bypass diode is connected with the negative pole of the battery strings in the 3rd region, and the 3rd bypass diode
Negative pole be connected with the positive pole of the battery strings in the 3rd region；4th bypass diode, itself and the battery series-parallel connection in the 4th region,
Wherein, the positive pole of the 4th bypass diode is connected with the negative pole of four-range battery strings, the negative pole of the 4th bypass diode with
The positive pole of four-range battery strings is connected.Thus, four bypass diodes protect four regions of its corresponding connection respectively, make
Obtaining the battery strings that hot spot effect occurs in each region can be bypassed by bypass diode in parallel therewith, wherein, bypass diode
Forward conduction, thus several battery strings still are able to normal work in addition.Therefore, each region can be protected well with
Preventing hot spot risk, save artificial, raising efficiency.
According to preferred embodiment of the present utility model, in the junction of first area and second area and the 3rd
Gap is left with four-range junction in region.
According to preferred embodiment of the present utility model, a terminal box is provided with the back side of stacked wafer moudle, is owned
Bypass diode is arranged in the terminal box.Thus only need to set a terminal box to accommodate four diodes, so as to save
Save structure space and and then save cost.In addition, the also solderable wire column in terminal box, and draw from junction box
Go out the positive pole cable and negative pole cable of whole component, positive pole cable and negative pole cable are connected to the 3rd region and first area
Drainage strip on so that positive pole cable and negative pole cable can connect solar components and use electrical component with corresponding.
According to preferred embodiment of the present utility model, four bypass diodes include five bypass diodes and drawn
Line, i.e. the bypass diode lead-out wire of first area and second area junction；The side in the 3rd region and the 4th region junction
Road diode lead-out line；Second area and the bypass diode lead-out wire of the 4th region junction；The side drawn from first area
Road diode lead-out line；And the bypass diode lead-out wire drawn from the 3rd region, described five bypass diodes are drawn
Line is welded on five wire columns by lead respectively.Thus, it is possible to it is more effective, more convenient, more efficiently in assembly between draw
Diode connecting line.The stacked wafer moudle has five outlets, four diode pair components to be protected, to component on assembly property
Carry out disposition.
According to preferred embodiment of the present utility model, five wire columns are welded in terminal box, and from terminal box
Draw the positive pole cable and negative pole cable of whole stacked wafer moudle in inside.Thus, the back side of stacked wafer moudle one can be provided with to connect
Line box, five wire columns and four diodes are arranged in a terminal box, can pole so as to the setting of a terminal box
Saving cost in big degree.In addition, five wire columns of welding are connected with the lead-out wire of bypass diode respectively in terminal box
Connect, can it is more effective, more convenient, more efficiently in assembly between draw diode connecting line.
The utility model further relates to a kind of stacked wafer moudle, and the stacked wafer moudle has above-mentioned stacked wafer moudle attachment structure.
Brief description of the drawings
The utility model is elaborated below according to accompanying drawing.Wherein：
Fig. 1 shows the circuit diagram of the attachment structure of stacked wafer moudle and its bypass diode of the present utility model, wherein showing
The stacked wafer moudle gone out includes four regions；
Fig. 2 shows a kind of general diagram of embodiment of the attachment structure of stacked wafer moudle of the present utility model, its
In only show coupling part roughly；
The partial schematic diagram of the first area and second area junction in Fig. 2 is shown in detail in Fig. 3；
Fig. 4 shows the structural representation of the busbar of " Z " type bending structure of the present utility model；
Fig. 5 shows the structural side view of the busbar of " Z " type bending structure of the present utility model；
Fig. 6 shows the connected mode of busbar and the drawing for bypass diode of " Z " type bending structure of the present utility model
Outlet structure schematic diagram；
Fig. 7 shows the schematic diagram of the rear connection box of stacked wafer moudle of the present utility model.
Embodiment
The technical scheme in the utility model preferred embodiment is clearly and completely described below in conjunction with accompanying drawing,
But described embodiment is only the utility model preferred embodiment.Based on the preferred embodiment in the utility model, sheet
The every other embodiment that field those of ordinary skill is obtained under the premise of creative work is not made, belongs to this practicality
Novel protected scope.
The directional terminology of middle appearance described in detail below, such as "front", "rear", "left", "right", " on ", " under " etc. are phases
For direction shown in accompanying drawing.Drawing for stacked wafer moudle cell piece towards the one side of sunlight, cell piece is towards sunlight
One side be negative pole.
It is matrix form arrangement stacked wafer moudle according to stacked wafer moudle of the present utility model, the matrix form arrangement stacked wafer moudle
Each matrix element represents a region, and multiple batteries in parallel connection strings are included in each region.The battery strings that each region is included
Number can difference can also be different, but preferably identical.
Fig. 1 shows the electricity of the stacked wafer moudle and stacked wafer moudle attachment structure according to a kind of preferred embodiment of the utility model
Lu Tu.Stacked wafer moudle in Fig. 1 is a kind of polycrystalline photovoltaic laminate component, and it includes four regions, i.e. first area 11, second
Region 22, the 3rd region 33 and the 4th region 44.Arranged in 2X2 matrix forms in four regions.Multiple electricity are included in each region
Pond is gone here and there (five battery strings are schematically shown in figure), the battery in the in parallel and each region of the battery strings in each region
Possess gap between string, and the positive pole of all battery strings in each region is connected with each other and negative pole is connected with each other.Passing through will
Stacked wafer moudle is divided into four regions, can be better protected from the hot spot effect of component.
The positive pole of each element and negative pole carry out specific company in stacked wafer moudle of being arranged according to matrix form of the present utility model
Connect.For example, for the stacked wafer moudle of the 2X2 matrixes in Fig. 1, the negative pole conduct of the battery strings in parallel in first area 11
The negative pole of whole stacked wafer moudle, the positive poles of the battery strings in parallel in first area 11 battery in parallel with second area 22
The negative pole of string connects, the positive pole of the battery strings in parallel in second area 22 and bearing for the battery strings in parallel in the 4th region 44
Pole connects, and the positive pole of the battery strings in parallel in the 4th region 44 connects with the negative pole of the battery strings in parallel in the 3rd region 33
It is logical, the positive pole of the just extremely whole stacked wafer moudle of the battery strings in parallel in the 3rd region 33.
According to matrix form of the present utility model arrange stacked wafer moudle matrix column element between by with for connecting
" Z " type bending structure busbar connection of the lead-out wire of bypass diode, in the both positive and negative polarity of the stacked wafer moudle and for connecting
Multiple bypass diodes are connected between the lead-out wire of bypass diode.With regard to matrix form of the present utility model stacked wafer moudle and
Speech, multiple diodes carry out specific connection, can preferably eliminate hot spot effect.As shown in figure 1, the first bypass diode D1 with
Battery series-parallel connection in first area 11, wherein, the first bypass diode D1 positive pole and the battery strings in first area 11
Negative pole is connected, and the first bypass diode D1 negative pole is connected with the positive pole of the battery strings in first area 11；Second bypass
Diode D2 and the battery series-parallel connection in second area 22, wherein, in the second bypass diode D2 positive pole and second area 22
The negative poles of battery strings be connected, and the second bypass diode D2 negative pole and the positive pole phase of the battery strings in second area 22
Even；Battery series-parallel connection in 3rd bypass diode D3 and the 3rd region 33, wherein, the 3rd bypass diode D3 positive pole and
The negative pole of battery strings in three regions 33 is connected, and the battery strings in the 3rd bypass diode D3 negative pole and the 3rd region 33
Positive pole be connected；Battery series-parallel connection in 4th bypass diode D4 and the 4th region 44, wherein, the 4th bypass diode D4's
Positive pole is connected with the negative pole of the battery strings in the 4th region 44, the electricity in the 4th bypass diode D4 negative pole and the 4th region 44
The positive pole of pond string is connected.Thus, four bypass diodes protect four regions of its corresponding connection respectively so that each region goes out
The battery strings of existing hot spot effect can be bypassed by bypass diode in parallel therewith, wherein, bypass diode forward conduction, thus
Other several battery strings still are able to normal work.
Fig. 2 shows a kind of general diagram of embodiment of the attachment structure of stacked wafer moudle of the present utility model, its
In only show coupling part roughly (concrete structure is referring to Fig. 3-Fig. 6).As shown in Fig. 2 in the area of first area 11 and second
Busbar between domain 22 and between the 3rd region 33 and the 4th region 44 by " Z " type bending structure connects, wherein,
The junction of first area 11 and second area 22 and leave gap in the junction in the 3rd region 33 and the 4th region 44.
The busbar of this " Z " type bending structure is shown in Fig. 3 into Fig. 6.The connected mode of the busbar of " Z " type bending structure be
The positive pole of one section of battery strings welds a busbar, among the busbar punching leave the width of battery strings positive pole main grid, will
This position is welded on the negative pole of another string battery strings.It can be confluxed between the region 44 of second area 22 and the 4th by common
Bar is conductively connected, can also be by flexible conductive adhesive band connection, as long as realizing being electrically connected with each other for battery strings in each region
.
Concrete structure is described with reference to the accompanying drawings, to connect " Z " type bending structure of first area 11 and second area 22
Busbar exemplified by, connection the 3rd region 33 it is identical with the bus-bar structure of " Z " the type bending structure in the 4th region 44.It is described
" Z " type bending structure busbar includes the first welded bands 111, is connected to the first welded bands by the upper end side 101 of " Z " type bar
Second welded bands 122 of side, and the first welded bands opposite side by horizontal stripe be connected to the first welded bands the 3rd weldering
Tape splicing 100, the second welded bands 122 are connected to the lower end side 102 of " Z " type bar, and the 3rd welded bands are used to connect bypass diode
Lead-out wire, the first welded bands are welded to a upper column element for the two neighboring column element of matrix, and the second welded bands are welded to
Next column element of the two neighboring column element of matrix.Specifically, being somebody's turn to do the busbar of " Z " type bending structure includes 3 welding
Band, for example, as shown in Fig. 2 wherein first welded bands 111 is welded on the negative pole face of first area 11, Article 2 welded bands
122 are welded on the positive pole-face of second area 22, and Article 3 welded bands 100 are used for connecting bypass diode lead-out wire, " Z " type bar
Upper end side 101 be connected to the first welded bands 111, the lower end side 102 of " Z " type bar is connected to the second welded bands 122.This " Z "
The very convenient lead of busbar of type bending structure.It is furthermore possible to make to form a slope between first area 11 and second area 22
Degree, and the gradient is also formed between the 3rd region 33 and the 4th region 44, such purpose is to be laminated in stacked wafer moudle
During outdoor use, component stress is preferably discharged, but also each interregional be connected in series and each can be taken into account
Being connected in parallel between the battery strings in region, so that turn into can for the automatic mass of the high polycrystalline imbrication component of reliability
Energy.
Specifically, attachment structure of this " Z " the type bending structure busbar between battery strings is illustrated according to Fig. 3.Fig. 3 shows
The partial enlarged drawing of the first area 11 gone out in Fig. 2 and the junction of second area 22.There is illustrated in first area 11
The battery strings 11A and battery strings 11B adjacent thereto in first area 11；And the battery strings 22A in second area 22 and
Battery strings 22B in second area 22 adjacent thereto.As described above, leave gap between battery strings 11A and battery strings 11B
And leave gap between the battery strings 22A and battery strings 22B in second area 22.Battery strings 11A is bent by " Z " type
Structure busbar is connected with battery strings 22A and battery strings 11B passes through another " Z " type bending structure busbar and battery strings 22B
Connection.The first welded bands 111 for connecting battery strings 11A and battery strings 22A " Z " type bending structure busbar are welded on battery strings
On 11A negative pole face and Article 2 welded bands 122 are welded on battery strings 22A positive pole-face.In addition, connection battery strings 11B
Be welded on the first welded bands 111 of battery strings 22B " Z " type bending structure busbar on battery strings 11B negative pole face and
Article 2 welded bands 122 are welded on battery strings 22B positive pole-face.Wherein, each first welded bands 111 and Article 2 welded bands
122 do not bridge the gap between gap or battery strings 22A and battery strings 22B between battery strings 11A and battery strings 11B.And
Connect the 3rd welded bands 100 bridging battery strings 11A and electricity of battery strings 11A and battery strings 22A " Z " type bending structure busbar
Region between the string 11B of pond is extended on battery strings 11B, and the end extended on battery strings 11B of the 3rd welded bands 100
It is welded in the 3rd welded bands 100 of connection battery strings 11B and battery strings 22B " Z " type bending structure busbar.Connection electricity
3rd welded bands 100 of pond string 11B and battery strings 22B " Z " type bending structure busbar also bridge as described above
It is attached on to next 3rd welded bands 100 and by the welding in end.
Thus, it is enterprising in series welding machine equipment according to the battery strings of the stacked wafer moudle of this arrangement of the present utility model
During row processing, the welding that these battery strings are easy to carry out on streamline is operated and need to only cut once, is thus not only improved
Welding quality can also save man-hour.If using manual operations connection battery strings, using spot welding.Thus to greatest extent
Improve production efficiency.Can also be less use raw material simultaneously and then save more costs, realizes the manufacture of cost efficiency
Industry objective.
Fig. 7, which is shown, sets one and only one terminal box 1 at the back side of whole stacked wafer moudle, and the inside of terminal box 1 is set
Have four bypass diode D, respectively the first bypass diode D1, the second bypass diode D2, the 3rd bypass diode D3 with
And the 4th bypass diode D4.
In addition, as shown in fig. 7, be also welded with five wire columns 3 in terminal box 1, and draw whole group from the inside of terminal box 1
The positive pole cable 4 and negative pole cable 5 of part, positive pole cable 4 and negative pole cable 5 are connected to the 3rd region 33 and first area 11
Drainage strip on so that positive pole cable 4 and negative pole cable 5 can connect solar components and use electrical component with corresponding.
For the ease of the diode outlet of stacked wafer moudle bypass diode attachment structure, as shown in figure 1, the four of stacked wafer moudle
Individual diode D outlet structure forms five bypass diode lead-out wires altogether, including：First area 11 is connected with second area 22
One bypass diode lead-out wire of one bypass diode lead-out wire 12 at place, the 3rd region 33 and the junction of the 4th region 44
34, a bypass diode lead-out wire 24 of second area 22 and the junction of the 4th region 44, one drawn from first area 11
Individual bypass diode lead-out wire 10, the bypass diode lead-out wire 30 drawn from the 3rd region 33.
Five bypass diode lead-out wires are welded on wire column 3 by lead respectively, thus, it is possible to more effective, more square
Just, more efficiently in assembly between draw diode connecting line, polycrystalline stacked wafer moudle has five outlets, four diode pair components
Protected, disposition is carried out to component on assembly property.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (14)
1. a kind of stacked wafer moudle attachment structure, it is characterised in that the stacked wafer moudle is that matrix form is arranged stacked wafer moudle, and square
Connected between the column element of battle array by " Z " type bending structure busbar with the lead-out wire for connecting bypass diode,
Multiple bypass diodes are connected between the both positive and negative polarity of the stacked wafer moudle and lead-out wire for connecting bypass diode.
2. stacked wafer moudle attachment structure according to claim 1, it is characterised in that " Z " the type bending structure busbar
Including：First welded bands (111)；The of the side of the first welded bands (111) is connected to by the upper end side (101) of " Z " type article
Two welded bands (122), and the second welded bands (122) are connected to the lower end side (102) of " Z " type bar；And in the first welded bands
(111) opposite side is connected to the 3rd welded bands (100) of the first welded bands by horizontal stripe, and the 3rd welded bands are used to connect
The lead-out wire of bypass diode, the first welded bands (111) are welded to a upper column element for the two neighboring column element of matrix, the
Two welded bands (122) are welded to next column element of the two neighboring column element of matrix.
3. stacked wafer moudle attachment structure according to claim 1 or 2, it is characterised in that the matrix form arrangement stack of laminations
Each matrix element of part represents a region, and multiple batteries in parallel connection strings are included in each region.
4. stacked wafer moudle attachment structure according to claim 3, it is characterised in that matrix form arrangement stacked wafer moudle is
2X2 matrix forms are arranged, and four elements in matrix are respectively first area (11), second area (22), the 3rd region (33)
With the 4th region (44), the negative pole of the negative poles of the battery strings in the first area (11) as whole stacked wafer moudle, the firstth area
The positive pole of battery strings in domain (11) connects with the negative pole of the battery strings in the second area (22), in second area (22)
The positive pole of battery strings connects with the negative pole of the battery strings in the 4th region (44), and the battery strings in the 4th region (44) are just
Pole is connected with the negative pole of the battery strings in the 3rd region (33), and the just extremely whole of the battery strings in the 3rd region (33) is folded
The positive pole of piece component.
5. stacked wafer moudle attachment structure according to claim 3, it is characterised in that possess gap between batteries in parallel connection string.
6. stacked wafer moudle attachment structure according to claim 5, it is characterised in that in " Z " type bending structure busbar
3rd welded bands (100) are longer than the first welded bands (111) and/or the second welded bands (122).
7. stacked wafer moudle attachment structure according to claim 6, it is characterised in that the 3rd welded bands (100) are across parallel connection
The gap between two neighboring battery strings (11A, 11B) in battery strings is simultaneously extended on adjacent cell string (11B).
8. stacked wafer moudle attachment structure according to claim 4, it is characterised in that the matrix form arrangement stacked wafer moudle bag
Include four bypass diodes between the both positive and negative polarity that is connected to the stacked wafer moudle and lead-out wire for connecting bypass diode
(D)。
9. stacked wafer moudle attachment structure according to claim 8, it is characterised in that bypass diode (D) includes：
First bypass diode (D1), itself and the battery series-parallel connection in the first area (11), wherein, the first bypass diode
(D1) positive pole is connected with the negative pole of the battery strings of first area (11), and the negative pole of the first bypass diode (D1) and the firstth area
The positive pole of the battery strings in domain (11) is connected；
Second bypass diode (D2), itself and the battery series-parallel connection in the second area (22), wherein, the second bypass diode
(D2) positive pole is connected with the negative pole of the battery strings of second area (22), and the negative pole of the second bypass diode (D2) and the secondth area
The positive pole of the battery strings in domain (22) is connected；
3rd bypass diode (D3), itself and the battery series-parallel connection in the 3rd region (33), wherein, the 3rd bypass diode
(D3) positive pole is connected with the negative pole of the battery strings in the 3rd region (33), and the negative pole of the 3rd bypass diode (D3) and the 3rd area
The positive pole of the battery strings in domain (33) is connected；
4th bypass diode (D4), itself and the battery series-parallel connection in the 4th region (44), wherein, the 4th bypass diode
(D4) positive pole is connected with the negative pole of the battery strings in the 4th region (44), the negative pole of the 4th bypass diode (D4) and the 4th region
(44) positive pole of battery strings is connected.
10. stacked wafer moudle attachment structure according to claim 9, it is characterised in that in the first area (11) and institute
State the junction of second area (22) and left in the junction of the 3rd region (33) and the 4th region (44)
Gap.
11. stacked wafer moudle attachment structure according to claim 1 or 2, it is characterised in that set at the back side of stacked wafer moudle
There is a terminal box (1), all bypass diodes are arranged in the terminal box.
12. stacked wafer moudle attachment structure according to claim 10, it is characterised in that four bypass diodes (D) include
Five bypass diode lead-out wires, including：
The bypass diode lead-out wire (12) of first area (11) and second area (22) junction；3rd region (33) and the 4th
The bypass diode lead-out wire (34) of region (44) junction；Second area (22) and the bypass two of the 4th region (44) junction
Pole pipe lead-out wire (24)；The bypass diode lead-out wire (10) drawn from first area (11)；And draw from the 3rd region (33)
The bypass diode lead-out wire (30) gone out, described five bypass diode lead-out wires are welded in five wires by lead respectively
On post (3).
13. stacked wafer moudle attachment structure according to claim 11, it is characterised in that five wire columns (3) are welded
It is connected in the terminal box (1), and the positive pole cable (4) and negative pole of whole stacked wafer moudle is drawn inside the terminal box (1)
Cable (5).
14. a kind of stacked wafer moudle, it is characterised in that the stacked wafer moudle has according to any one of claim 1 to 13
Stacked wafer moudle attachment structure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720961577.8U CN207009444U (en) | 2017-08-03 | 2017-08-03 | Stacked wafer moudle attachment structure and stacked wafer moudle |
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| CN201720961577.8U CN207009444U (en) | 2017-08-03 | 2017-08-03 | Stacked wafer moudle attachment structure and stacked wafer moudle |
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| CN207009444U true CN207009444U (en) | 2018-02-13 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109301019A (en) * | 2018-10-24 | 2019-02-01 | 锦州阳光锦懋光伏科技有限公司 | Lower than series-parallel component of the cell stack of 36V and preparation method thereof |
| CN109659381A (en) * | 2018-11-02 | 2019-04-19 | 苏州爱康光电科技有限公司 | A kind of imbrication component |
| WO2019178931A1 (en) * | 2018-03-23 | 2019-09-26 | 成都晔凡科技有限公司 | Method and system for testing battery pieces of shingled assembly |
| CN113659024A (en) * | 2021-07-21 | 2021-11-16 | 晶澳（扬州）太阳能科技有限公司 | Electric connection structure, photovoltaic module and preparation method thereof |
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2017
- 2017-08-03 CN CN201720961577.8U patent/CN207009444U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019178931A1 (en) * | 2018-03-23 | 2019-09-26 | 成都晔凡科技有限公司 | Method and system for testing battery pieces of shingled assembly |
| CN109301019A (en) * | 2018-10-24 | 2019-02-01 | 锦州阳光锦懋光伏科技有限公司 | Lower than series-parallel component of the cell stack of 36V and preparation method thereof |
| CN109659381A (en) * | 2018-11-02 | 2019-04-19 | 苏州爱康光电科技有限公司 | A kind of imbrication component |
| CN113659024A (en) * | 2021-07-21 | 2021-11-16 | 晶澳（扬州）太阳能科技有限公司 | Electric connection structure, photovoltaic module and preparation method thereof |
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Assignee: TONGWEI SOLAR ENERGY (HEFEI) Co.,Ltd.|TONGWEI SOLAR (CHENGDU) Co.,Ltd. Assignor: CHENGDU YEFAN SCIENCE AND TECHNOLOGY Co.,Ltd. Contract record no.: 2018990000165 Denomination of utility model: Laminating component connection structure and laminating component Granted publication date: 20180213 License type: Common License Record date: 20180628 |
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Effective date of registration: 20231207 Address after: 230000 No.888 Changning Avenue, hi tech Zone, Hefei City, Anhui Province Patentee after: TONGWEI SOLAR ENERGY (HEFEI) Co.,Ltd. Address before: No. 588, Middle Section of Tianfu Avenue, High tech Zone, Chengdu City, Sichuan Province, 610041 Patentee before: CHENGDU YEFAN SCIENCE AND TECHNOLOGY Co.,Ltd. |