CN206920009U - A kind of MEMS platform based on optical detection - Google Patents
A kind of MEMS platform based on optical detection Download PDFInfo
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- CN206920009U CN206920009U CN201720407299.1U CN201720407299U CN206920009U CN 206920009 U CN206920009 U CN 206920009U CN 201720407299 U CN201720407299 U CN 201720407299U CN 206920009 U CN206920009 U CN 206920009U
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Abstract
The utility model discloses a kind of MEMS platform based on optical detection, including：Main platform body, optical de-tection means and outer enclosure plate；Main platform body includes shaking platform；Main platform body and optical de-tection means are encapsulated in inside confined space by outer enclosure plate shape into confined space；Optical de-tection means include laser, speculum, diode array；Speculum is horizontally fixed at the top of shaking platform, and minute surface is towards the top of outer enclosure plate；Laser and diode array are located at outer enclosure plate inside top, and diode array includes multiple photodiodes；Diode array is centered around around laser；The illumination that laser is sent is mapped on speculum, and the reflected light formed after the reflection of speculum is irradiated on diode array；The light intensity of Diode Array Detector reflected light.MEMS platform disclosed in the utility model, the linearity of measurement result is improved, improves accuracy of detection.
Description
Technical field
Micro electro mechanical system field is the utility model is related to, is put down more particularly to a kind of MEMS based on optical detection
Platform.
Background technology
MEMS (MEMS, Micro-Electro-Mechanical System) platform is by particular support knot
The minute yardstick platform that structure is propped up.MEMS platform can MEMS actuation techniques such as electrostatic drive, electromagnetic drive,
Multiaxial motion is realized under the drive control of the technologies such as Piezoelectric Driving, including vibrates, translate, can apply to MEMS miniature devices
Position, be mobile.
Realize the MEMS piezoelectric actuators of drive control because with small volume, light weight, price using piezoelectric driving technology
It is cheap, displacement resolution is high, High power output, bears the advantages such as load big, fast response time, instantaneous acceleration be big, receive wide
General concern, be it is a kind of be applied to for MEMS platform provide high-resolution position, the device of high dynamic motion feature.
But creep easily occurs for piezoelectric used in MEMS piezoelectric actuators, under the influence of creep, MEMS pressures
The positioning precision and displacement accuracy of electric drive can significantly decline.Creep is that fixed material is keeping the constant condition of stress
Under, strain with time lengthening and increased phenomenon.So it is essence to implement feedback control to such MEMS platform
The really effective ways of the vibrational state of control MEMS platform.
Feedback control is also known as closed-loop control, i.e., MEMS is put down according to the output signal of MEMS platform
The vibrational state of platform is controlled, that is, is compared output vibration and it is expected the deviation between vibration, and eliminate deviation to obtain expection
Vibration output control mode.So feedback control is applied to MEMS platform, it is necessary to MEMS platform
Vibrational state be monitored.
The technological means being monitored in the prior art to the vibrational state of MEMS platform uses micro electronmechanical more
The technological means of system platform back side integrated capacitance detection structure realizes the detection to MEMS Platform Vibration state, that is, exists
MEMS platform lower surface and pedestal upper surface integrate a capacity plate antenna structure, by the output current for measuring capacity plate antenna
It can measure to obtain the acceleration magnitude of vibration caused by MEMS platform.
But it is that capacitance is being vibrated with MEMS platform to use capacity plate antenna to measure greatest problem to vibration
During the change of displacement that occurs be not linear relationship, it is necessary to additional correction, and because capacitance is smaller, to measuring circuit
Input impedance require it is very high, plus the influence of the factors such as parasitic capacitance so that signal transacting difficulty is very big so that micro electronmechanical
The linearity of the measurement result of the technological means of integrated capacitance detection structure is poor in system platform, and accuracy of detection is not high enough.
The content of the invention
The purpose of this utility model is to provide a kind of MEMS platform of optical detection, improves the line of measurement result
Property degree, improves accuracy of detection.
To achieve the above object, the utility model provides following scheme：
A kind of MEMS platform based on optical detection, including：Main platform body, optical de-tection means and outer enclosure
Plate；The main platform body includes shaking platform；The outer enclosure plate shape is into confined space, by the main platform body and the light
Testing agency is learned to be encapsulated in inside the confined space；The optical de-tection means include laser, speculum, diode battle array
Row；The speculum is horizontally fixed at the top of the shaking platform, and minute surface is towards the top of the outer enclosure plate；The laser
Device and the diode array are located at the outer enclosure plate inside top, and the diode array includes multiple poles of photoelectricity two
Pipe；The diode array is centered around around the laser；The illumination that the laser is sent is mapped on the speculum, warp
The reflected light formed after the reflection of the speculum is irradiated on the diode array；It is anti-described in the Diode Array Detector
Penetrate the light intensity of light.
Optionally, the diode array includes the first array and the second array；First array is located at the laser
Device periphery；Second array is located at first array periphery；The quantity of photodiode described in first array and
Arrangement mode is identical with the quantity of photodiode and arrangement mode described in second array.
Optionally, the line of all adjacent photodiodes forms equilateral polygon in first array；Described second
The line of all adjacent photodiodes forms equilateral polygon in array.
Optionally, the position of the photodiode at any one angle of equilateral polygon described in second array with
The line of the position of photodiode both passes through the laser position described in corresponding first array.
Optionally, the optical de-tection means also include bias electrode；The bias electrode is arranged on the outer enclosure
On plate, the laser and the diode array are electrically connected by the bias electrode with external device (ED), described outer
Part device includes the data for providing the power supply of electric energy for the laser and being analyzed the electric signal of the diode array
Processing unit.
Optionally, the main platform body also includes driving structure, the driving structure be located at the shaking platform bottom and
Surrounding, the shaking platform is driven to produce vibration.
Optionally, the driving structure includes horizontal drive structure and vertical drive structure；The horizontal drive structure bit
In the surrounding of the shaking platform, the shaking platform is driven to produce the vibration of horizontal direction；The vertical drive structure is located at
The bottom of the shaking platform, the shaking platform is driven to produce the vibration of vertical direction.
Optionally, the main platform body also includes supporting construction；The supporting construction be used for support the shaking platform and
The driving structure.
According to specific embodiment provided by the utility model, the utility model discloses following technique effect：This practicality is new
Type is integrated with an optical de-tection means in main platform body, and the speculum of optical de-tection means is arranged on shaking platform, with
The vibration of shaking platform, speculum can produce corresponding displacement, so that the light intensity of the reflected light of irradiation on the diode occurs
Change, the vibrational state of shaking platform is analyzed by detecting the change of light intensity.This detection of the present utility model
Device, it can ensure that shaking platform caused displacement in vibration processes has linear relationship with the light intensity detected, improve
The linearity of measurement result, improves accuracy of detection.Optical de-tection means of the present utility model are mutual with main platform body simultaneously
Independent, the independence of production process is ensure that, it is easy to loading and unloading.Because the setting of optical de-tection means does not interfere with main platform body
Motion state, physically without too big correlation so that optical de-tection means of the present utility model can also answer
Use in various MEMSs, there is versatility.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description are only of the present utility model
Some embodiments, for those of ordinary skill in the art, without having to pay creative labor, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is the structure drawing of device of MEMS platform embodiment one of the utility model based on optical detection；
Fig. 2 is the dress of the optical de-tection means of MEMS platform embodiment one of the utility model based on optical detection
Put structure chart；
Fig. 3 is the dress of the optical de-tection means of MEMS platform embodiment two of the utility model based on optical detection
Put structure chart.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings and tool
Body embodiment is described in further detail to the utility model.
Fig. 1 is the structure drawing of device of MEMS platform embodiment one of the utility model based on optical detection.
Referring to Fig. 1, the MEMS platform based on optical detection is somebody's turn to do, including：Main platform body 1, the and of optical de-tection means 2
Outer enclosure plate 3；
The main platform body 1 includes shaking platform 101, driving structure 102 and supporting construction 103；The driving structure 102
Positioned at the bottom of shaking platform 101 and surrounding, the shaking platform 101 is driven to produce vibration；The supporting construction 103 is used for
Support the shaking platform 101 and the driving structure 102；The driving structure 102 includes horizontal drive structure 1021 and hung down
Straight driving structure 1022；The horizontal drive structure 1021 is located at the surrounding of the shaking platform 101, drives the shaking platform
101 produce the vibration of horizontal direction；The vertical drive structure 1022 is located at the bottom of the shaking platform 101, described in driving
Shaking platform 101 produces the vibration of vertical direction；
The outer enclosure plate 3 forms confined space, and the main platform body 1 and the optical de-tection means 2 are encapsulated in
Inside the confined space；The outer enclosure plate 3 uses silicon materials, is process using the method for deep silicon etching.
The optical de-tection means 2 include laser 201, speculum 202, diode array 203 and bias electrode 204；
The speculum 202 is horizontally fixed on the top of the shaking platform 101, and minute surface is towards the top of the outer enclosure plate 3；It is described
Laser 201 is vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL),
The laser 201 and the diode array 203 are located at the inside top of outer enclosure plate 3, the diode array 203
Including multiple photodiodes；The diode array 203 is centered around around the laser 201；The laser 201 is sent
Illumination be mapped on the speculum 202, the reflected light formed after the reflection of the speculum 202 is irradiated to the diode
On array 203；The diode array 203 detects the light intensity of the reflected light.The bias electrode 204 is arranged on the outside
In package board 3, the laser 201 and the diode array 203 are carried out by the bias electrode 204 and external device (ED)
Electrical connection, the external device (ED) include providing the power supply of electric energy for the laser and entering the electric signal of the diode array
The data processing equipment of row analysis；The bias electrode 204 is drawing on the laser 201 and the diode array 203
Outlet, the bias electrode 204 pass through the extraction through hole on the outer enclosure plate 3；The extraction through hole uses silicon hole skill
Art (Through Silicon via, TSV) is process；The laser 201 and the diode array 203 pass through upside-down mounting
Chip is arranged on the top of the outer enclosure plate 3.
Described in the light intensity for the reflected light that the data processing equipment detects according to the diode array 203 calculates
The light path for the light that laser 201 is sent；The vibrational state of the shaking platform 101 is determined according to the change of the light path.
Fig. 2 is the dress of the optical de-tection means of MEMS platform embodiment one of the utility model based on optical detection
Put structure chart.
Referring to Fig. 2, the diode array 203 includes the first array 2031 and the second array 2032；First array
2031 positioned at the periphery of laser 201；Second array 2032 is positioned at the periphery of the first array 2031；Described first gust
The number of the quantity of photodiode described in row 2031 and arrangement mode and photodiode described in second array 2032
Amount is identical with arrangement mode.In this embodiment, photoelectricity two described in first array 2031 and second array 2032
The quantity of pole pipe is 8.
The line of all adjacent photodiodes forms equilateral polygon in first array 2031；Second array
The line of all adjacent photodiodes forms equilateral polygon in 2032.Equilateral polygon described in second array 2032
Any one angle the photodiode position and photodiode described in corresponding first array 2031
The line of position both passes through the position of laser 201, i.e., the equilateral polygon of described first array 2031 is appointed
Meaning is while parallel with the side of the equilateral polygon of corresponding second array 2032.In this embodiment, described first
The line of all adjacent photodiodes forms equilateral octagon in array 2031, all adjacent light in second array 2032
The line of electric diode forms equilateral octagon.
The Cleaning Principle of the vibrational state of shaking platform of the present utility model is as follows：When the shaking platform 101 shakes
When dynamic, under the drive of the shaking platform 101 synchronous vibration can occur for speculum 202, when the light that the laser 201 is sent
When being irradiated on the speculum 202, because the position of speculum 202 constantly changes, cause what is sent from the laser 201
The light path of light can change, and then the light intensity being induced to up to the diode array 203 changes；Pass through the diode
The light intensity for the reflected light that array 203 detects can obtain the change of the light path of the light sent from the laser 201, from
And the vibrational state of the shaking platform 101 is obtained according to the mutation analysis of the light path.
This detection means of the present utility model, shaking platform caused displacement and detection in vibration processes can be ensured
To light intensity there is linear relationship, improve the linearity of measurement result, improve accuracy of detection.Light of the present utility model simultaneously
It is separate that testing agency, which is learned, with main platform body, ensure that the independence of production process, easy to loading and unloading.Due to optical detection
The setting of mechanism does not interfere with the motion state of main platform body, physically without too big correlation so that this practicality
New optical de-tection means are also applied in various MEMSs, have versatility.
Utilize the side of the MEMS detection of platform shaking platform motion state of the present utility model based on optical detection
Method includes：
It is origin with the laser 201, the exit direction of the light sent using the laser 201 establishes right angle as z-axis
Coordinate system, obtain each coordinate position (x, y, z) light intensity：
The light intensity at wherein I (x, y, z) denotation coordinations position (x, y, z) place；P represents the general power for the light that laser is sent；w
(z) represent that light launches downwards the radius after z distances, andawRepresent the diverging for the light that laser is sent
Angle.
Obtain the luminous power that each photodiode detects in the first array；
Obtain the luminous power that each photodiode detects in the second array；
The summation of the luminous power that all photodiodes detect in the first array is calculated, obtains the total light work(of the first array
Rate；
The summation of the luminous power that each photodiode detects in the second array is calculated, obtains the total light work(of the second array
Rate；
The light intensity of the first array total optical power, the second array total optical power and coordinate position (x, y, z) place is integrated
Analyze the light path of light；
The vibrational state of the shaking platform is determined according to the light path of the light.
Or
It is origin with the laser 201, the exit direction of the light sent using the laser 201 establishes right angle as z-axis
Coordinate system, obtain each coordinate position (x, y, z) light intensity；
Calculate the difference of the luminous power that all relative centrosymmetric two photodiodes of origin detect in the first array
Score value, obtain the first array difference value；
Calculate the difference of the luminous power that all relative centrosymmetric two photodiodes of origin detect in the second array
Score value, obtain the second array difference value；
Calculate the light that the photodiode in opposite direction of relatively described origin in the first array and the second array detects
The difference value of power, obtain difference value between array；
By difference value between the first array difference value, the second array difference value and array and coordinate position (x, y, z) place
Light intensity comprehensive analysis light light path；
The vibrational state of the shaking platform is determined according to the light path of the light.
In the utility model, the distance z of the speculum 202 and the laser 201mDirectly influence what is detected
The linearity between luminous power and light path, in the utility model, with the first array total optical power and distance zmRelation and
Two array total optical powers and distance zmRelation exemplified by illustrate.When the distance of the speculum 202 and the laser 201
It is arranged to 1000 μm~1200 μm or 3900 μm~4400 μm, it is ensured that have between the luminous power and light path that detect good
Linear relationship, so as to improve detection accuracy.When determining light path with the first array total optical power, by the speculum 202
1000 μm~1200 μm are arranged to the distance of the laser 201, it is ensured that accuracy of detection is better than 0.8 μm, measurement error limit
System is within 0.4%；When determining light path with the second array total optical power, by the speculum 202 and the laser 201
Distance is arranged to 3900 μm~4400 μm, it is ensured that accuracy of detection is better than 6 μm, and measurement error is limited within 1.2%.
Fig. 3 is the dress of the optical de-tection means of MEMS platform embodiment two of the utility model based on optical detection
Put structure chart.
Referring to Fig. 3, in this embodiment, other devices and the MEMS platform embodiment one based on optical detection
Apparatus structure is identical, and difference is, the line structure of all adjacent photodiodes in first array 2031 of the embodiment
Into equilateral quadrangle, the line of all adjacent photodiodes forms equilateral quadrangle in second array 2032.
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed be and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.
Specific case used herein is set forth to principle of the present utility model and embodiment, above example
Explanation be only intended to help and understand method and its core concept of the present utility model；Meanwhile for the general technology of this area
Personnel, according to thought of the present utility model, there will be changes in specific embodiments and applications.In summary,
This specification content should not be construed as to limitation of the present utility model.
Claims (8)
- A kind of 1. MEMS platform based on optical detection, it is characterised in that including：Main platform body, optical de-tection means With outer enclosure plate；The main platform body includes shaking platform；The outer enclosure plate shape is into confined space, by the platform master Body and the optical de-tection means are encapsulated in inside the confined space；The optical de-tection means include laser, speculum, Diode array；The speculum is horizontally fixed at the top of the shaking platform, and minute surface is towards the top of the outer enclosure plate； The laser and the diode array are located at the outer enclosure plate inside top, and the diode array includes multiple light Electric diode；The diode array is centered around around the laser；The illumination that the laser is sent is mapped to the reflection On mirror, the reflected light formed after the reflection of the speculum is irradiated on the diode array；The diode array inspection Survey the light intensity of the reflected light.
- A kind of 2. MEMS platform based on optical detection according to claim 1, it is characterised in that two pole Pipe array includes the first array and the second array；First array is located at laser periphery；Second array is located at First array periphery；In the quantity of photodiode described in first array and arrangement mode and second array The quantity of the photodiode is identical with arrangement mode.
- 3. a kind of MEMS platform based on optical detection according to claim 2, it is characterised in that described first The line of all adjacent photodiodes forms equilateral polygon in array；All adjacent photodiodes in second array Line form equilateral polygon.
- 4. a kind of MEMS platform based on optical detection according to claim 3, it is characterised in that described second In the position of the photodiode at any one angle of equilateral polygon described in array and corresponding first array The line of the position of the photodiode both passes through the laser position.
- A kind of 5. MEMS platform based on optical detection according to claim 1, it is characterised in that the optics Testing agency also includes bias electrode；The bias electrode is arranged on the outer enclosure plate, the laser and described two Pole pipe array is electrically connected by the bias electrode with external device (ED), and the external device (ED) includes carrying for the laser Power can power supply and the data processing equipment analyzed the electric signal of the diode array.
- A kind of 6. MEMS platform based on optical detection according to claim 1, it is characterised in that the platform Main body also includes driving structure, and the driving structure is located at the shaking platform bottom and surrounding, drives the shaking platform to produce Raw vibration.
- A kind of 7. MEMS platform based on optical detection according to claim 6, it is characterised in that the driving Structure includes horizontal drive structure and vertical drive structure；The horizontal drive structure is located at the surrounding of the shaking platform, drives The dynamic shaking platform produces the vibration of horizontal direction；The vertical drive structure is located at the bottom of the shaking platform, driving The shaking platform produces the vibration of vertical direction.
- A kind of 8. MEMS platform based on optical detection according to claim 7, it is characterised in that the platform Main body also includes supporting construction；The supporting construction is used to support the shaking platform and the driving structure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720407299.1U CN206920009U (en) | 2017-04-18 | 2017-04-18 | A kind of MEMS platform based on optical detection |
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| CN201720407299.1U CN206920009U (en) | 2017-04-18 | 2017-04-18 | A kind of MEMS platform based on optical detection |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106949955A (en) * | 2017-04-18 | 2017-07-14 | 中国工程物理研究院电子工程研究所 | A kind of MEMS platform based on optical detection |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106949955A (en) * | 2017-04-18 | 2017-07-14 | 中国工程物理研究院电子工程研究所 | A kind of MEMS platform based on optical detection |
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