CN206906590U - Back scattering detecting module - Google Patents
Back scattering detecting module Download PDFInfo
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- CN206906590U CN206906590U CN201720718414.7U CN201720718414U CN206906590U CN 206906590 U CN206906590 U CN 206906590U CN 201720718414 U CN201720718414 U CN 201720718414U CN 206906590 U CN206906590 U CN 206906590U
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Abstract
The utility model proposes a kind of back scattering detecting module, including the light-transparent carrier of tabular, two layers of scintillator and optical sensor；Light-transparent carrier has two relative transmission planes and at least one light output end, the light output end is between two transmission planes by being available for the material that fluorescent photon passes through to make；Fixation fits in two transmission planes to two layers of scintillator respectively；Optical sensor is coupled in the light output end.Back scattering detecting module of the present utility model, X ray is absorbed using two layers of scintillator and light-transparent carrier, drastically increase detection efficient, this detecting module is used as optical material by the use of light-transparent carrier, and optical sensor is set in end face, light-transparent carrier can not only transmit fluorescent photon, additionally it is possible to change light path, greatly reduce the thickness of backscatter detector.
Description
Technical field
It the utility model is related to a kind of detecting module, more particularly to a kind of back scattering detected to back scattering X-ray
Detecting module.
Background technology
Current existing backscatter detector, is that back scattering X-ray is converted into fluorescent photon using scintillator material,
Fluorescent photon is collected and converted to electric signal output by optical sensor again.The characteristics of in view of back scattering X-ray, if wanting to improve
The detection efficient of back scattering X-ray and sensitivity, it is desirable to which backscatter detector must have sufficiently large sensitive area, general side
Formula is to be equipped with some large area backscatter detectors in the pencil beam both sides of scanning imaging system.
In order to improve the performance indications of back scattering X-ray system, produce fluorescent photon scintillator material must sunset glow it is low,
X-ray absorption rate is high and light conversion efficiency is high, and the spectral response of its luminescent spectrum and optical sensor matches.Meet bar at present
The scintillator material of the backscatter detector of part is typically divided to two classes, i.e. powder screen class (such as GOS, barium fluochloride) or transparent crystal
Class.The general sunset glow of scintillator of powder screen class is low, light conversion efficiency is high, but density is low, causes the absorption efficiency to back scattering X-ray
Also it is low, while because its light transmittance is low, so powder screen class scintillator can only use laminate structure；The scintillator of transparent crystal class is general
Light conversion efficiency is high, also high to the absorption efficiency of back scattering X-ray, but its price is high, makes large area technique hardly possible, and these are all
Limit it and dissipate middle the reason for using in the back of the body.
In addition to scintillator material used in backscatter detector, the scattered detector of the back of the body mainly uses scintillator film at present, then uses up
Electric multiplier tube is as electrooptical device；Such a scattered detector volume of the back of the body is big, assembling inconvenience and poor seismic behavior, and detects
Efficiency is low.
Above- mentioned information is only used for strengthening the understanding to background of the present utility model disclosed in the background section, because
This it can include not forming the information to prior art known to persons of ordinary skill in the art.
Utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, there is provided a kind of detection efficient is high, structure is tight
The back scattering detecting module to gather.
Additional aspect and advantage of the present utility model will be set forth in part in the description, and partly will be from retouching
It is apparent from stating, or can be by practice of the present utility model and acquistion.
According to one side of the present utility model, a kind of back scattering detecting module, including the light-transparent carrier of tabular, two layers of sudden strain of a muscle
Bright body and optical sensor；Light-transparent carrier by being available for the material that fluorescent photon passes through to make, have two relative transmission planes with
And at least one light output end, the light output end is between two transmission planes；Two layers of scintillator is fixed respectively to be pasted
Together in two transmission planes；Optical sensor is coupled in the light output end.
According to an embodiment of the present utility model, the light-transparent carrier has been stacked multiple, each printing opacity load
One layer of scintillator is fitted with two transmission planes of body.
According to an embodiment of the present utility model, the light-transparent carrier is overall rectangular slab.
According to an embodiment of the present utility model, the light-transparent carrier includes two prisms, two prisms
Each there is a fully reflecting surface and a light output end, two fully reflecting surfaces are mutually bonded so that two Rhizoma Sparganii microscope groups
Into rectangular parallelepiped structure, an optical sensor is each provided with two light output ends.
According to an embodiment of the present utility model, the light-transparent carrier include it is multiple be arranged side by side it is circular or square
The optical fiber of shape, the optical fiber is Nian Jie with the flicker bulk optics, and the end face of the optical fiber is Nian Jie with the optical sensor optics.
According to an embodiment of the present utility model, the end face of each optical fiber is respectively connected with a light sensing
Device.
According to an embodiment of the present utility model, the fiber-draw combines together and forms the light output end.
According to an embodiment of the present utility model, multiple optical fiber are bundled into a fibre bundle, the end of the fibre bundle
Face forms the light output end and is connected with the optical sensor after being modified.
According to an embodiment of the present utility model, the optical fiber is fine to move the glistening light of waves.
According to an embodiment of the present utility model, in addition to the metal shell of lower openings and for covering described open
The pcb board of mouth, the pcb board are provided with and are pointed to the hard supporting construction that the scintillator of bottom is supported, the metal shell
The tip position of inner surface be provided with and be used to be pointed to the elastomeric material that the scintillator of top layer is crimped, the pcb board and gold
Sealing ring is provided between category shell.
According to an embodiment of the present utility model, the sealing ring and hard supporting construction are same structure.
It is described to be provided with firmly between supporting construction and the scintillator to scintillator according to an embodiment of the present utility model
Carry out the auxiliary support mechanism of Auxiliary support.
According to an embodiment of the present utility model, the inner surface of the metal shell handles or scribbled reflection by lucifuge
Layer.
According to an embodiment of the present utility model, the optical sensor is photomultiplier or silicon photoelectric diode.
According to an embodiment of the present utility model, the equal minute surface of all exposed surfaces of the scintillator and light-transparent carrier is thrown
Light scribbles reflecting layer.
According to an embodiment of the present utility model, two layers of scintillator is the scintillator of unlike material.
According to an embodiment of the present utility model, the material of the scintillator on each light-transparent carrier is different.
According to an embodiment of the present utility model, filter plate is provided between the two neighboring light-transparent carrier.
As shown from the above technical solution, it is the advantages of the utility model with good effect：
Back scattering detecting module of the present utility model, X ray is absorbed using two layers of scintillator and light-transparent carrier, greatly
Ground improves detection efficient, and this detecting module sets optical sensor, printing opacity by the use of light-transparent carrier as optical material in end face
Carrier can not only transmit fluorescent photon, additionally it is possible to change light path, greatly reduce the thickness of backscatter detector.
Brief description of the drawings
Its example embodiment is described in detail by referring to accompanying drawing, above and other feature and advantage of the present utility model will
Become readily apparent from.
Fig. 1 is the structural representation of the back scattering detecting module shown in the utility model embodiment one；
Fig. 2 is the structural representation after the encapsulation of the back scattering detecting module shown in Fig. 1；
Fig. 3 is the use schematic diagram of the back scattering detecting module shown in Fig. 1；
Fig. 4 is the structural representation of the back scattering detecting module shown in the utility model embodiment two；
Fig. 5 to Figure 10 is the structural representation of the back scattering detecting module shown in the utility model embodiment three.
Reference in figure：
1、211、212：Scintillator；
2nd, light-transparent carrier；
221、222：Prism；
3、231、232：Optical sensor；
4th, elastomeric material；
5th, hard supporting construction；
6th, pcb board；
7th, sealing ring；
8th, metal shell；
9th, protective case；
10th, back scattering detecting module；
11st, X source；
12nd, object；
13rd, X-ray beam；
14th, back scattering X-ray.
Embodiment
Example embodiment is described more fully with referring now to accompanying drawing.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, these embodiments are provided so that this practicality is new
The design of example embodiment fully and completely, and will be comprehensively communicated to those skilled in the art by type.Identical in figure
Reference represents same or similar structure, thus will omit their detailed description.
Embodiment one
As shown in Figure 1 to Figure 3, the utility model embodiment discloses a kind of back scattering detecting module, and it includes printing opacity
Carrier 2, two layers of scintillator 1 and optical sensor 3.Two layers of scintillator 1 can send fluorescent photon after X ray is received, should
The structure type of scintillator 1 is lamellar for large area, and its thickness is about 0.2mm~0.8mm, preferably 0.3mm~0.5mm.
Light-transparent carrier 2 is equally into tabular, and more specifically, the light-transparent carrier 2 is overall rectangular slab, and its upper and lower surface is
Big plane, integral thickness substantially can be in 5mm or so, and it is transparent material for fluorescent photon as caused by relative to scintillator 1
Material makes, that is to say, that and the material that light-transparent carrier 2 is selected has good photoconductivity to fluorescent photon, specific material such as PC,
PMMA, quartz glass or polystyrene etc..
The light-transparent carrier 2 has two relative transmission planes and at least one light output end, and light output end is located at this
Between two transmission planes.In Fig. 1, the upper and lower surface of light-transparent carrier 1 is transmission plane, and the end face on the right side of it is
Light end face.Fixation is fitted on two transmission planes two layers of scintillator 1 respectively, and optical sensor 3 is coupled in light output end, and the light passes
The length of side of the photosurface of sensor 3 is equal with the lateral thickness sum of scintillator 1 and light-transparent carrier 2, so as to receive more
Fluorescent photon.In Fig. 1, the optical sensor 3 is directly fitted on light output end, thus the optical sensor 3 is direct-coupling
In on light output end, and in the utility model other embodiment being described below, the optical sensor 3 can also coupling indirectly
Together on light output end.It when being attached between scintillator 1 and light-transparent carrier 2, can directly crimp, light transmittance can also be used
Good viscose glue carries out optics bonding.
Optical sensor 3 is used for opto-electronic conversion, and fluorescent photon is changed into electric signal, and its particular type is not intended to limit, such as
Photomultiplier (PMT) or silicon photomultiplier (SiPM) can be selected, wherein it is preferred that using silicon photomultiplier.Silicon photoelectricity
The general photodiode of multiplier tube is compared, and has about 105Multiplication factor, nanosecond order signal response.Equally put with height
Big multiple, the Traditional photovoltaic multiplier tube of quick response are compared, the negative-feedback Geiger mode angular position digitizer of silicon photomultiplier to intense light pulse more
Add safety, operate also simpler.High level output signal is not only advantageous to improve detector sensitivity, also helps increasing
Add the anti-interference and environment resistant changing capability of detector.In addition, silicon photomultiplier is than traditional photomultiplier small volume very
It is more, thus achieve the whole back of the body and dissipate detector compact structure, and silicon photomultiplier small volume, installed in scintillator 1 and thoroughly
The side of light carrier 2, blind area (when multiple detectors are mounted side by side, do not covered by scintillator 1 region) will not also be caused
Big change.
As shown in Figure 1, in the present embodiment, the scintillator 1 and light-transparent carrier 2 form the interlayer structure of " sandwich ",
It is mutual from the back scattering X-ray that scanned object reflects and the first layer scintillator 1 positioned at upper portion in Fig. 1
After effect, caused fluorescent photon penetrates the interface that scintillator 1 and light-transparent carrier 2 intersect and entered in light-transparent carrier 2, and saturating
Light carrier 2 is finally collected after some secondary reflections by the photosurface of optical sensor 3.Arrow in Fig. 1 illustrate X ray with
The travel path of fluorescent photon.The situation that the X-ray of part is not absorbed by the scintillator on Fig. 1 upper stratas it can be seen from Fig. 1
Under, these X ray penetrate the second layer positioned at the lower section of light-transparent carrier 2 reached after light-transparent carrier 2 in Fig. 1 positioned at lower portion and dodged
Bright body, and interacted with the scintillator of the second layer and produce fluorescent photon.Thus, it becomes possible to significantly increase X and penetrate
The absorption efficiency of line, improve the detection efficient to X ray.
Furthermore, in the present embodiment " five Mingzhi " can also be made in scintillator 1 and light-transparent carrier 2, " seven is bright
Control " etc. as more layers structure, that is to say, that light-transparent carrier 2 can be stacked it is multiple, in each light-transparent carrier 2
Two transmission planes on be fitted with one layer of scintillator.Multiple light-transparent carriers 2 mentioned here, expression is light-transparent carrier 2
Quantity be two or more, with the increase of the quantity of light-transparent carrier 2, this makes it possible to the X ray for causing a part
It after passing a light-transparent carrier, can enter back into another light-transparent carrier, thus further improve the absorbing detection to X ray
Efficiency.In addition, two layers of scintillator 1 in the both sides of light-transparent carrier 2 can select different materials, such as upper strata scintillator to select
GOS films, lower floor are plastic scintillant, so can detect the low energy of X ray and high energy portion using different types of scintillator
Point.
Preferred mode is to use above-mentioned multigroup " sandwich " structure, that is, is being stacked the base of multiple light-transparent carriers
On plinth, the scintillator of each light-transparent carrier is arranged to unlike material, for example, the scintillator of first light-transparent carrier is GOS films,
Scintillator on second light-transparent carrier is plastic scintillant.Set unlike material scintillator after, above one or more groups of spies
The low energy part surveyed in back scattering X-ray, set below or multigroup detection back of the body dissipate the energetic portions in X ray, form dual intensity and visit
Survey device.Also it multigroup can be allocated, multipotency detector formed, to carry out Object Classification.It can be pressed between multiple light-transparent carriers
It is sturdy, it can also mutually leave certain gap.
Still further, further filter plate can also be set between two neighboring light-transparent carrier so that specific X
Ray can enter in light-transparent carrier, it is possible thereby to preferably to carry out Object Classification.Can between filter plate and light-transparent carrier
It is sturdy to press, it can also mutually leave certain gap.
Referring to Fig. 2 and Fig. 3, in the present embodiment, the back scattering detecting module also includes metal shell 8 and pcb board 6.
Metal shell 8 is manufactured by drawing process, can prevent outer rays (such as scattered ray of cosmic ray, Multiple Scattering)
Injection, its bottom has an opening, and pcb board 6 is used to cover the opening.Scintillator 1 and light-transparent carrier 2 are placed on outside metal
The inside of shell 8.The inner surface of metal shell 8 handles by lucifuge or scribbles reflecting layer, to be avoided as much as non-back scattering X
The interference of ray.The tip position of the inner surface of metal shell 8 is provided with the bullet for being crimped to the scintillator of top layer
Property material 4, on pcb board 6 be provided be pointed to the hard supporting construction 5 that the scintillator of bottom is supported.In pcb board 6 and metal
Sealing ring 7 is additionally provided between shell 8.After loading onto pcb board 6, the pcb board 6 and metal shell 8 enter to the scintillator of upper and lower both sides
Row extruding, can so ensure the stability of scintillator 1 and light-transparent carrier 2, avoid both from shaking.Sealing ring 7 also can be with
Hard supporting construction 5 is used as same structure, i.e. the hard supporting construction 5 has the double action of support and sealing simultaneously.This is supported firmly
Structure 5 generally supports the both ends of scintillator 1, is also provided with entering scintillator 1 between hard supporting construction 5 and scintillator 1
The auxiliary support mechanism of row Auxiliary support.The auxiliary support mechanism can provide support to the medium position of scintillator so that dodge
Bright body is more stable.When in use, can also be according to the back scattering X-ray energy height selection plane of incidence.When back scattering X-ray energy
When amount is higher, metal shell 8 can be selected to be used as the plane of incidence, so can effectively protect the detectors such as scintillator, light-transparent carrier
Element, when back scattering X-ray energy is relatively low, from pcb board as the plane of incidence, it is possible to increase detection efficient.In scintillator and
All exposed surfaces of light-transparent carrier mirror-finish or scribbled reflecting layer so that the path of fluorescent photon is limited as far as possible
In scintillator, light-transparent carrier and optical sensor.
Referring to Fig. 3, the back scattering detecting module of present embodiment is as follows using process.X source 11 launches X-ray beam 13,
The directive object 12 of X-ray beam 13, and back scattering is produced on object 12, back scattering X-ray 14 is sent out from the surface of object to surrounding
Penetrate, two back scattering detecting modules 10 of the present utility model, the two back scattering detecting modules are arranged in the both sides of X source 11
Back scattering X-ray 14 is converted to electric signal by 10, so that follow-up electronic equipment analyzes and processes to electric signal.
Back scattering detecting module of the present utility model, penetrated using at least two layers of scintillator 1 and light-transparent carrier 2 to absorb X
Line, detection efficient is drastically increased, and combine multilayer scintillator combination, detection efficient can be improved by a larger margin, or realize
Dual intensity detects (multipotency detection) for Object Classification.This detecting module is by the use of light-transparent carrier as optical material, and in end face
Optical sensor is set, and light-transparent carrier can not only transmit fluorescent photon, additionally it is possible to change light path, greatly reduce back scattering spy
Survey the thickness of device.After this detecting module is further by the use of silicon photomultiplier SiPM as optical sensor, can further it reduce
Volume, reduce detection dead band.This detecting module uses modular construction, is modularized design in structure and shock resistance, knot
Structure is compact, easy for installation, shock resistance is strong, additionally it is possible to effectively stops external disturbance and visible ray.This detecting module can basis
Back scattering X-ray energy height selects the different planes of incidence, can either effectively protect detector element, can also try one's best big increasing
The big back of the body dissipates penetration depth.
Embodiment two
As shown in figure 4, back scattering detecting module disclosed in the utility model embodiment and the structure base of embodiment one
This is identical, and equally including light-transparent carrier, two layers of scintillator and optical sensor, the difference of itself and embodiment one is,
Light-transparent carrier includes two prisms 221 and 222, and prism 221 and prism 222 each have a fully reflecting surface and one
Light output end.The two fully reflecting surfaces mutually bond, so that the two prisms 221 and 222 form rectangular parallelepiped structure.In Rhizoma Sparganii
Optical sensor 231 is provided with the light output end of mirror 221, optical sensor 232 is provided with the light output end of prism 222.Dodge
Fluorescent photon reaches optical sensor 231 after the fully reflecting surface reflection of prism 221 caused by bright body 211.In scintillator
Caused fluorescent photon reaches optical sensor 232 after the fully reflecting surface reflection of prism 222 on 212.
Embodiment three
Referring to Fig. 5 to Figure 10, the back scattering detecting module of present embodiment and the identical place of embodiment one and two are not
Repeat again, its difference is, light-transparent carrier 2 in the present embodiment include it is multiple be arranged side by side it is circular or square
Optical fiber.The front view of the arrangement mode of round fiber is shown in wherein Fig. 5, and the arrangement side of square optical fiber is shown in Fig. 6
Left view of the optical fiber in arrangement shown in Fig. 5 and Fig. 6 is shown in the front view of formula, Fig. 7.In the present embodiment, optical fiber
It is arranged as the structure of tabular.Optical fiber is bonding with the progress optics of scintillator 1, and the end face of optical fiber is carried out with the photosurface of optical sensor 3
Optics is bonded.The remaining surface of optical fiber can apply reflecting layer so that fluorescent photon can only reach optical sensor from optical fiber.
The schematic diagram handled optical fiber is shown in Fig. 8.The light biography as shown in figure 8, each optical fiber can be independently connected
Sensor 3, fiber-draw can also be combined together and form overall light output end, be then attached with optical sensor 3.
In addition, Fig. 9 is the schematic diagram bundled to optical fiber.As shown in figure 9, each optical fiber in light-transparent carrier 2 can also be bundled into
One fibre bundle, after being modified to the end face of fibre bundle, it is connected in one end away from scintillator 1 with optical sensor 3.Figure 10 is
Optical fiber is fixed on to the schematic diagram of metal shell.As shown in Figure 10, can be in pcb board 6 when optical fiber is located in metal shell 8
It is upper that corresponding protective case 9 is set, for carrying out protection and spacing to optical sensor 3, prevent it from rocking.
When light-transparent carrier 2 is using optical fiber, can be spliced using multiple optical fiber, thus light-transparent carrier 2 is being realized greatly
While area, cost can be significantly decreased.Optical fiber, which can also be selected, moves glistening light of waves fibre so that fluorescence spectrum caused by scintillator
Match with the spectral response of optical sensor.
Illustrative embodiments of the present utility model are particularly shown and described above.It should be understood that the utility model
Disclosed embodiment is not limited to, on the contrary, the utility model is intended to cover included in spirit and scope of the appended claims
Interior various modifications and equivalent arrangements.
Claims (18)
- A kind of 1. back scattering detecting module, it is characterised in that including：The light-transparent carrier of tabular, made by the material for being available for fluorescent photon to pass through, with two relative transmission planes and extremely A few light output end, the light output end is between two transmission planes；Two layers of scintillator, respectively fixation fit in two transmission planes；Optical sensor, it is coupled in the light output end.
- 2. back scattering detecting module according to claim 1, it is characterised in that the light-transparent carrier has been stacked more It is individual, it is fitted with one layer of scintillator on two transmission planes of each light-transparent carrier.
- 3. back scattering detecting module according to claim 1 or 2, it is characterised in that the light-transparent carrier is overall square Shape plate.
- 4. back scattering detecting module according to claim 1 or 2, it is characterised in that the light-transparent carrier includes two three Prism, two prisms each have a fully reflecting surface and a light output end, and two fully reflecting surfaces mutually bond So that two prisms form rectangular parallelepiped structures, an optical sensor is each provided with two light output ends.
- 5. back scattering detecting module according to claim 1 or 2, it is characterised in that the light-transparent carrier includes more The individual circular or square optical fiber being arranged side by side, the optical fiber is Nian Jie with the flicker bulk optics, the end face of the optical fiber and institute State optical sensor bonding fiber.
- 6. back scattering detecting module according to claim 5, it is characterised in that the end face of each optical fiber is respectively connected with One optical sensor.
- 7. back scattering detecting module according to claim 5, it is characterised in that the fiber-draw combines together and shape Into the light output end.
- 8. back scattering detecting module according to claim 5, it is characterised in that multiple optical fiber are bundled into an optical fiber Beam, the end face of the fibre bundle form the light output end after being modified and are connected with the optical sensor.
- 9. back scattering detecting module according to claim 5, it is characterised in that the optical fiber is fine to move the glistening light of waves.
- 10. back scattering detecting module according to claim 1, it is characterised in that the also metal shell including lower openings And for covering the pcb board of the opening, the pcb board is provided with and is pointed to the hard support that the scintillator of bottom is supported Structure, the tip position of the inner surface of the metal shell, which is provided with, to be used to be pointed to the elastic material that the scintillator of top layer is crimped Material, is provided with sealing ring between the pcb board and metal shell.
- 11. back scattering detecting module according to claim 10, it is characterised in that the sealing ring is with hard supporting construction Same structure.
- 12. back scattering detecting module according to claim 11, it is characterised in that the hard supporting construction and the flicker The auxiliary support mechanism that Auxiliary support is carried out to scintillator is provided between body.
- 13. back scattering detecting module according to claim 10, it is characterised in that the inner surface of the metal shell passes through Lucifuge processing scribbles reflecting layer.
- 14. back scattering detecting module according to claim 1, it is characterised in that the optical sensor is photomultiplier Or silicon photoelectric diode.
- 15. back scattering detecting module according to claim 1, it is characterised in that the institute of the scintillator and light-transparent carrier There is exposed surface to mirror-finish or scribble reflecting layer.
- 16. back scattering detecting module according to claim 1, it is characterised in that two layers of scintillator is unlike material Scintillator.
- 17. back scattering detecting module according to claim 2, it is characterised in that the flicker on each light-transparent carrier The material of body is different.
- 18. back scattering detecting module according to claim 17, it is characterised in that between the two neighboring light-transparent carrier It is provided with filter plate.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109085634A (en) * | 2018-08-14 | 2018-12-25 | 同济大学 | A kind of nuclear radiation detection device based on photonic crystal scintillator |
| WO2021003744A1 (en) * | 2019-07-11 | 2021-01-14 | 定垣企业有限公司 | Radiation beam detection device |
-
2017
- 2017-06-20 CN CN201720718414.7U patent/CN206906590U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109085634A (en) * | 2018-08-14 | 2018-12-25 | 同济大学 | A kind of nuclear radiation detection device based on photonic crystal scintillator |
| WO2021003744A1 (en) * | 2019-07-11 | 2021-01-14 | 定垣企业有限公司 | Radiation beam detection device |
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