CN206893612U - 一种用于高温真空焊接液冷板中的密封结构 - Google Patents

一种用于高温真空焊接液冷板中的密封结构 Download PDF

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CN206893612U
CN206893612U CN201720502689.7U CN201720502689U CN206893612U CN 206893612 U CN206893612 U CN 206893612U CN 201720502689 U CN201720502689 U CN 201720502689U CN 206893612 U CN206893612 U CN 206893612U
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high density
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sealing structure
liquid cooling
spring sealed
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冯甲
乔纳威·帕拉格·巴哈拉
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Baode South China Shenzhen Thermal Energy System Co ltd
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Reach (shenzhen) Heat Energy System Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/005Other auxiliary members within casings, e.g. internal filling means or sealing means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254Cold plates transferring heat from heat source to coolant

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本实用新型公开了一种用于高温真空焊接液冷板中的密封结构,该密封结构包括高密度翅片底板,弹簧密封片,顶盖,所述弹簧密封片位于高密度翅片底板与顶盖之间,在高密度翅片底板的上基面上设有高密度翅片顶面,所述弹簧密封片包括弹簧密封片顶部浮动面和弹簧密封片底面,在顶盖的下基面上设有顶盖的定位槽,所述弹簧密封片顶部浮动面与顶盖的定位槽接触,弹簧密封片底面与高密度翅片顶面紧密贴合,高密度翅片底板的上基面与顶盖的下基面通过高温真空焊接连接。本实用新型有效的解决了高密度翅片与顶盖在翅片顶部安装间隙过大的问题,有效的提高了液冷板效率,具有可加工性强和提高散热板效率的优点。

Description

一种用于高温真空焊接液冷板中的密封结构
技术领域
本实用新型涉及电子产品中的液冷***,具体涉及到一种用于高温真空焊接液冷板中的密封结构。
背景技术
随着电子技术的发展,芯片的功耗越来越高,更高效率的液冷***应用也越来越广泛,因此就需要高密度翅片来提高液冷板的效率,减小热阻。
在目前的高密度翅片中,翅片之间的间隙通常在0.1-0.2mm,但高密度翅片板与顶盖之间的组装公差却很难控制在0.1mm以内,并且由于焊接温度较高,也不能使用橡胶等材料来填充间隙,导致液冷板热阻变大,效率变低。
发明内容
针对现有技术中存在的问题,本实用新型提供一种用于高温真空焊接液冷板中的密封结构,能够有效的减小甚至消除高密度翅片与顶盖之间的间隙,控制间隙在0.1mm以内。有效的减小了液冷板热阻,提高了液冷板效率。
为实现上述目的,本实用新型采用以下技术方案:
一种用于高温真空焊接液冷板中的密封结构,该密封结构包括高密度翅片底板,弹簧密封片,顶盖,所述弹簧密封片位于高密度翅片底板与顶盖之间,在高密度翅片底板的上基面上设有高密度翅片顶面,所述弹簧密封片包括弹簧密封片顶部浮动面和弹簧密封片底面,在顶盖的下基面上设有顶盖的定位槽,所述弹簧密封片顶部浮动面与顶盖的定位槽接触,弹簧密封片底面与高密度翅片顶面紧密贴合,高密度翅片底板的上基面与顶盖的下基面通过高温真空焊接连接。
为了得到高的热导率,所述高密度翅片底板为铜质或者铝材。
所述弹簧密封片为冲压成的具有弹性的不锈钢密封片,是为了让弹簧密封片在压缩时可以依靠弹力紧密贴合顶盖的下基面和高密度翅片的上基面,从而减小甚至消除间隙。
所述弹簧密封片为不锈钢材质。
所述弹簧密封片的厚度为0.1-0.2mm。
所述顶盖为铜质或者铝材。
所述高密度翅片底板的翅片之间的间隙为0.1-0.2mm。
所述高密度翅片底板和顶盖之间采用真空焊接,温度高达500度以上。
基于上述技术方案,本实用新型具有如下技术优点:
① 本实用新型通过采用弹簧密封片,可以有效的减小甚至消除间隙,有效的提高液冷板的效率。
② 本实用新型中,弹簧密封片采用不锈钢材质可以有效的避免其他材质在长期与铜接后发生电化学腐蚀的现象,提高了产品性能稳定性。
③ 本实用新型通过采用冲压成型的弹簧密封片,通过弹力填补间隙,因此不需要过高的加工精度,提供的加工效率。
附图说明
本实用新型的具体结构由以下的实施例及其附图给出。
图1为本实用新型用于高温真空焊接液冷板中的密封结构的整体结构图。
图2为本实用新型用于高温真空焊接液冷板中的密封结构的整体***图。
图3为本实用新型用于高温真空焊接液冷板中的密封结构的顶盖的示意图。
图4为本实用新型用于高温真空焊接液冷板中的密封结构的弹簧密封片的前视图。
图5为本实用新型用于高温真空焊接液冷板中的密封结构的高密度翅片底板的前视图。
具体实施方式
下面结合实施举例和附图对本实用新型作进一步说明,但不应以此限制本实用新型的保护范围。
如图1、2、3、4和5所示,本实施例用于高温真空焊接液冷板中的密封结构,该密封结构包括高密度翅片底板1,弹簧密封片2,顶盖3,所述弹簧密封片2位于高密度翅片底板1与顶盖3之间,在高密度翅片底板的上基面9上设有高密度翅片顶面8,所述弹簧密封片2包括弹簧密封片顶部浮动面6和弹簧密封片底面7,在顶盖的下基面5上设有顶盖的定位槽4,所述弹簧密封片顶部浮动面6与顶盖的定位槽4接触,弹簧密封片底面7与高密度翅片顶面8紧密贴合,高密度翅片底板的上基面9与顶盖的下基面5通过高温真空焊接连接。
作为优选,本实施例高密度翅片底板1为铜质或者铝材。
作为优选,本实施例弹簧密封片2为冲压成的具有弹性的密封片。
作为进一步优选,本实施例弹簧密封片2为不锈钢材质,弹簧密封片2的厚度为0.1-0.2mm。
作为进一步优选,本实施例顶盖3为铜质或者铝材。
作为进一步优选,本实施高密度翅片底板1的翅片之间的间隙为0.1-0.2mm。
作为更进一步优选,本实施高密度翅片底板1和顶盖3之间采用真空焊接。
本实施例的组装过程为:
首先将高密度翅片底板,弹簧密封片,顶盖,从下往上依次放置,然后再将整组产品装上焊接夹具上压紧后,弹簧密封片被挤压变形并填补间隙,安装好后放入真空焊接炉。
尽管上述实施例已对本实用新型作出具体描述,但是对于本领域的普通技术人员来说,应该理解为可以在不脱离本实用新型的精神以及范围之内基于本实用新型公开的内容进行修改或改进,这些修改和改进都在本实用新型的精神以及范围之内。

Claims (8)

1.一种用于高温真空焊接液冷板中的密封结构,其特征在于,该密封结构包括高密度翅片底板(1),弹簧密封片(2),顶盖(3),所述弹簧密封片(2)位于高密度翅片底板(1)与顶盖(3)之间,在高密度翅片底板的上基面(9)上设有高密度翅片顶面(8),所述弹簧密封片(2)包括弹簧密封片顶部浮动面(6)和弹簧密封片底面(7),在顶盖的下基面(5)上设有顶盖的定位槽(4),所述弹簧密封片顶部浮动面(6)与顶盖的定位槽(4)接触,弹簧密封片底面(7)与高密度翅片顶面(8)紧密贴合,高密度翅片底板的上基面(9)与顶盖的下基面(5)通过高温真空焊接连接。
2.根据权利要求1所述的用于高温真空焊接液冷板中的密封结构,其特征在于,所述高密度翅片底板(1)为铜质或者铝材。
3.根据权利要求1所述的用于高温真空焊接液冷板中的密封结构,其特征在于,所述弹簧密封片(2)为冲压成的具有弹性的密封片。
4.根据权利要求1所述的用于高温真空焊接液冷板中的密封结构,其特征在于,所述弹簧密封片(2)为不锈钢材质。
5.根据权利要求1所述的用于高温真空焊接液冷板中的密封结构,其特征在于,所述弹簧密封片(2)的厚度为0.1-0.2mm。
6.根据权利要求1所述的用于高温真空焊接液冷板中的密封结构,其特征在于,所述顶盖(3)为铜质或者铝材。
7.根据权利要求1所述的用于高温真空焊接液冷板中的密封结构,其特征在于,所述高密度翅片底板(1)的翅片之间的间隙为0.1-0.2mm。
8.根据权利要求1所述的用于高温真空焊接液冷板中的密封结构,其特征在于,所述高密度翅片底板(1)和顶盖(3)之间采用真空焊接。
CN201720502689.7U 2017-05-08 2017-05-08 一种用于高温真空焊接液冷板中的密封结构 Active CN206893612U (zh)

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US15/972,592 US20180320993A1 (en) 2017-05-08 2018-05-07 Liquid cold plate heat exchanger
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