CN206741510U - A kind of modified form fingerprint recognition home key - Google Patents

A kind of modified form fingerprint recognition home key Download PDF

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Publication number
CN206741510U
CN206741510U CN201720494242.XU CN201720494242U CN206741510U CN 206741510 U CN206741510 U CN 206741510U CN 201720494242 U CN201720494242 U CN 201720494242U CN 206741510 U CN206741510 U CN 206741510U
Authority
CN
China
Prior art keywords
film
fingerprint
outward appearance
identification sensor
fingerprint identification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720494242.XU
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Chinese (zh)
Inventor
金钟佑
柳国桓
金钟哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
World Opto Electric (dongguan) Co Ltd
Original Assignee
World Opto Electric (dongguan) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201720494242.XU priority Critical patent/CN206741510U/en
Application granted granted Critical
Publication of CN206741510U publication Critical patent/CN206741510U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of modified form fingerprint recognition home key, it includes the fingerprint Identification sensor that carrying is installed in FPCB printed circuit substrates top and shape is adapted with fingerprint recognition home key shape, the upper end side of fingerprint Identification sensor is equiped with the outward appearance film of flexible deformable, the lower surface of outward appearance film is printed with back up layer, the lower surface bonds of back up layer have a bonding film, and the lower surface of bonding film is Nian Jie with fingerprint Identification sensor;The upper surface of outward appearance film is coated formed with the anti-fingerprint coat for preventing fingerprint.By said structure design, the utility model can also improve bonding flat board and workability while improving attractive in appearance.

Description

A kind of modified form fingerprint recognition home key
Technical field
It the utility model is related to fingerprint identification technology field, more particularly to a kind of modified form fingerprint recognition home key.
Background technology
Fingerprint identification technology is the technology that can prevent various security accidents by user's registration and authentication procedure;It is more detailed Carefully, fingerprint identification technology is applied to the protecting of personal and tissue network protection, various contents and data, the access control of safety System etc..
With being increased sharply using the user of the various portable units such as smart mobile phone and tablet personal computer, user continually occurs and does not wish The accident occurred is hoped, i.e., the personal information and content stored on a portable device is to external leakage.Fig. 1 is common portable unit generation The schematic diagram of table, as shown in figure 1,
Smart mobile phone 10 or tablet personal computer are filled by the display of main body, the large area for being formed at before each main body center The home key 11 for putting, being formed at the side of each display device is formed;It should further be noted that home key 11 is to be embodied in intelligent hand The composition of the action of setting in machine 10 or tablet personal computer, there is provided press or touch home key 11 when using portable unit, you can Recover to the facilitating functions such as picture at initial stage of device.It need to be explained further, the fingerprint identification technology of electrostatic means is to utilize skin Conductive characteristic read each user different intrinsic fingerprint shapes electrical signals mode.
In addition, Fig. 2 is the sectional view of existing fingerprint recognition home key, as shown in Fig. 2 existing fingerprint recognition home key 11 It is the solution of coated with resins adhesive 113 and to bond glass 112 on fingerprint Identification sensor 111 and form, but is set in coating During the solution adhering glass 112 of fat adhesive 113, no normal direction glass 112, which applies strength, makes its bonding;Therefore, it is existing There is the phenomenon that fingerprint Identification sensor 111 and glass 112 can not be bonded correctly in fingerprint recognition home key 11, or cause glass 112 cause fingerprint recognition rate bad because the flatness of glass 112 is uneven below.It is in addition, molten in coated with resins adhesive 113 Glass 112 is placed after liquid in the above, workability is bad.
Utility model content
The purpose of this utility model is to provide a kind of modified form fingerprint recognition home key, the modified form fingerprint recognition one's own department or unit Bond energy is enough can also to improve bonding flat board and workability while improving attractive in appearance.
To reach above-mentioned purpose, the utility model is achieved through the following technical solutions.
A kind of modified form fingerprint recognition home key, include carrying be installed in FPCB printed circuit substrates top and shape with The fingerprint Identification sensor that fingerprint recognition home key shape is adapted, the upper end side of fingerprint Identification sensor are equiped with flexible variable The outward appearance film of shape, the lower surface of outward appearance film are printed with back up layer, and the lower surface bonds of back up layer have bonding Film, the lower surface of bonding film are Nian Jie with fingerprint Identification sensor;
The upper surface of outward appearance film is coated formed with the anti-fingerprint coat for preventing fingerprint;
Protection knot of the thin film component that outward appearance film, back up layer, bonding film are formed as fingerprint Identification sensor Structure, for finger when outward appearance film upper surface applies touch pressure, fingerprint Identification sensor identifies the fingerprint shape of finger, and fingerprint The analog signal of detection is converted to data signal and transmits numerical signal to FPCB printed circuit substrates by identification sensor.
Wherein, the mark evaporation layer formed with arbitrary shape mark is deposited in the lower surface of the back up layer, described viscous Close upper surface and the lower surface bonds of mark evaporation layer of film.
Wherein, the fingerprint Identification sensor upper surface masking printing and formed with masking printing layer, the bonding film Lower surface it is Nian Jie with masking printing layer upper surface.
Wherein, the outward appearance film is plastic sheeting or film injection article with capacitivity, the thickness of outward appearance film For 10-200.
Wherein, the bonding film is OCA films and OCA films are nesa coating, is had above OCA films and separately below viscous The property and electric conductivity, the thickness of OCA films is 10-200;During work, OCA films are intrinsic by the fingerprint transmitted from the outward appearance film Shape transmits to the fingerprint Identification sensor.
The beneficial effects of the utility model are:A kind of modified form fingerprint recognition home key described in the utility model, it is wrapped Include the fingerprint recognition that carrying is installed in FPCB printed circuit substrates top and shape is adapted with fingerprint recognition home key shape Sensor, the upper end side of fingerprint Identification sensor are equiped with the outward appearance film of flexible deformable, the lower surface print of outward appearance film Brushed with back up layer, the lower surface bonds of back up layer have bonding film, the lower surface of bonding film and fingerprint Identification sensor Bonding;The upper surface of outward appearance film is coated formed with the anti-fingerprint coat for preventing fingerprint;Outward appearance film, the back side Protection structure of the thin film component that printing layer, bonding film are formed as fingerprint Identification sensor, finger is in outward appearance film upper table When face applies touch pressure, fingerprint Identification sensor identifies the fingerprint shape of finger, and fingerprint Identification sensor is by the mould of detection Intend signal to be converted to data signal and transmit numerical signal to FPCB printed circuit substrates.Pass through said structure design, this reality With new bonding flat board and workability can be also improved while improving attractive in appearance.
Brief description of the drawings
The utility model is further detailed below with accompanying drawing, but the embodiment in accompanying drawing is not formed pair Any restrictions of the present utility model.
Fig. 1 is the structural representation of smart mobile phone.
Fig. 2 is the diagrammatic cross-section of fingerprint recognition home key of the prior art.
Fig. 3 is structural representation of the present utility model.
Include in Fig. 1 into Fig. 3:
10 --- smart mobile phone 11 --- home keys
111 --- fingerprint Identification sensor 112 --- glass
113 --- resin binder 210 --- fingerprint Identification sensors
220 --- masking printing layer 230 --- OCA films
240 --- mark forming layer 250 --- back up layers
260 --- exterior membrane 270 --- anti-fingerprint coats.
Embodiment
The utility model is illustrated with reference to specific embodiment.
As shown in figure 3, a kind of modified form fingerprint recognition home key, includes carrying and is installed on FPCB printed circuit substrates The fingerprint Identification sensor 210 that portion and shape are adapted with fingerprint recognition home key shape, the upper end of fingerprint Identification sensor 210 Side is equiped with the outward appearance film of flexible deformable, and the lower surface of outward appearance film is printed with back up layer 250, back up layer 250 lower surface bonds have a bonding film, and the lower surface of bonding film is be bonded with fingerprint Identification sensor 210.
Further, the upper surface of outward appearance film is coated formed with the anti-fingerprint coat for preventing fingerprint 270。
Wherein, the thin film component that outward appearance film, back up layer 250, bonding film are formed is as fingerprint Identification sensor 210 protection structure, for finger when outward appearance film upper surface applies touch pressure, fingerprint Identification sensor 210 identifies finger Fingerprint shape, and fingerprint Identification sensor 210 by the analog signal of detection be converted to data signal and by numerical signal transmit to FPCB printed circuit substrates.
Further, the mark evaporation layer formed with arbitrary shape mark is deposited in the lower surface of back up layer 250, glues Close upper surface and the lower surface bonds of mark evaporation layer of film.
Also it is exactly that the upper surface masking of fingerprint Identification sensor 210 is printed formed with masking printing layer 220, is bonded The lower surface of film is Nian Jie with masking printing layer 220 upper surface.
It need to be explained further, outward appearance film is plastic sheeting or film injection article with capacitivity, outward appearance film Thickness is 10-200.Bonding film is OCA films 230 and OCA films 230 are nesa coating, above OCA films 230 and following point Not Ju You adherence and electric conductivity, the thickness of OCA films 230 is 10-200;During work, OCA films 230 will transmit from outward appearance film Fingerprint intrinsic shape transmitted to fingerprint Identification sensor 210;Certainly, above-mentioned bonding membrane material is not formed to the utility model Limitation, i.e., bonding film of the present utility model can also be by OCR films, DAF films or the membrane structure formed by adhesive.
It should further be noted that the film section that the utility model is made up of outward appearance film, back up layer 250, bonding film Part easily can bend or deform, and for existing glass protection structure, the utility model has workability superior The advantages of.
For masking printing layer 220 of the present utility model, it is formed at the upper surface of fingerprint Identification sensor 210, with Thin film component is set to be firmly attached;Masking printing layer 220 also has shielding function, so that thin film component is firmly adhered to Fingerprint Identification sensor 210, and prevent that the color of fingerprint Identification sensor 210 is exposed to outside.Wherein, screening of the present utility model Cover printing layer 220 and be applicable resin of binding property opaque and with cohesive, it is preferable that suitable polyethylenes, polypropylene etc. synthesize Resin.
For mark evaporation layer of the present utility model, it is formed by evaporation, can be carved or be formed at sun quarter solid by the moon There is the mark of shape;Wherein, the thickness of mark evaporation layer is 3-20.
Also be exactly, the utility model by two sides optics adherence dielectric bonding film by printed back printing layer Together with 250 outward appearance film is bonded in fingerprint Identification sensor 210, the structure design can effectively improve aesthetic feeling, and carry Height bonds flat board.
In addition, modified form fingerprint recognition home key of the present utility model can use following manufacture method production prepare and Into specifically, a kind of manufacture method of modified form fingerprint recognition home key, it includes following processing step, specifically:
1st step, the finger being adapted with fingerprint recognition home key shape is carried in the upper surface of FPCB printed circuit substrates Line identification sensor 210;
Second step, outward appearance film the back side carry out back up, with the outward appearance film back side formed back up layer 250;
The lower surface attachment OCA films 230 of third step, overleaf printing layer 250;
4th step, in the upper surface of outward appearance film coat to form anti-fingerprint coat 270 by surface, to prevent producing Raw fingerprint;
5th step, punching interception is carried out with home key shape to the outward appearance film for being attached with OCA films 230, cause outward appearance The shape of film is adapted with the shape of fingerprint Identification sensor 210;
6th step, fingerprint Identification sensor 210 will be attached to by OCA films 230 by the outward appearance film for being punched interception Upper surface.
Further, second step also includes 2-1 steps, i.e., overleaf the lower surface of printing layer 250 forms evaporation times The mark evaporation layer of meaning shape mark.
Further, by before the 5th step, in addition to 5-1 steps, i.e. the upper surface in fingerprint Identification sensor 210 Cover printing and form masking printing layer 220, and cause the lower surface of OCA films 230 to be attached to the upper surface of masking printing.
In addition, bonding film is OCA films 230 and OCA films 230 are nesa coating, above OCA films 230 and separately below With adherence and electric conductivity, the thickness of OCA films 230 is 10-200;During work, OCA films 230 will transmit from outward appearance film Fingerprint intrinsic shape transmits to fingerprint Identification sensor 210.
Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality With new thought, there will be changes, this specification content should not be construed as in specific embodiments and applications To limitation of the present utility model.

Claims (5)

  1. A kind of 1. modified form fingerprint recognition home key, it is characterised in that:Include carrying to be installed on FPCB printed circuit substrates The fingerprint Identification sensor that portion and shape are adapted with fingerprint recognition home key shape(210), fingerprint Identification sensor(210)'s Upper end side is equiped with the outward appearance film of flexible deformable, and the lower surface of outward appearance film is printed with back up layer(250), the back side Printing layer(250)Lower surface bonds have bonding film, the lower surface of bonding film and fingerprint Identification sensor(210)Bonding;
    The upper surface of outward appearance film is coated formed with the anti-fingerprint coat for preventing fingerprint(270);
    Outward appearance film, back up layer(250), the thin film component that is formed of bonding film is as fingerprint Identification sensor(210)'s Protection structure, finger is when outward appearance film upper surface applies touch pressure, fingerprint Identification sensor(210)Identify the fingerprint of finger Shape, and fingerprint Identification sensor(210)By the analog signal of detection be converted to data signal and by numerical signal transmit to FPCB printed circuit substrates.
  2. A kind of 2. modified form fingerprint recognition home key according to claim 1, it is characterised in that:The back up layer (250)Lower surface the mark evaporation layer formed with arbitrary shape mark is deposited, the upper surface of the bonding film is deposited with mark The lower surface bonds of layer.
  3. A kind of 3. modified form fingerprint recognition home key according to claim 1, it is characterised in that:The fingerprint recognition sensing Device(210)Upper surface masking printing and formed with masking printing layer(220), lower surface and the masking printing layer of the bonding film (220)Upper surface is bonded.
  4. A kind of 4. modified form fingerprint recognition home key according to claim 1, it is characterised in that:The outward appearance film is tool There are the plastic sheeting or film injection article of capacitivity, the thickness of outward appearance film is 10-200.
  5. A kind of 5. modified form fingerprint recognition home key according to claim 1, it is characterised in that:The bonding film is OCA Film(230)And OCA films(230)For nesa coating, OCA films(230)Above and there is adherence and electric conductivity separately below, OCA films(230)Thickness be 10-200;During work, OCA films(230)The intrinsic shape of fingerprint that will be transmitted from the outward appearance film Shape is to the fingerprint Identification sensor(210)Transmission.
CN201720494242.XU 2017-05-05 2017-05-05 A kind of modified form fingerprint recognition home key Expired - Fee Related CN206741510U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720494242.XU CN206741510U (en) 2017-05-05 2017-05-05 A kind of modified form fingerprint recognition home key

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720494242.XU CN206741510U (en) 2017-05-05 2017-05-05 A kind of modified form fingerprint recognition home key

Publications (1)

Publication Number Publication Date
CN206741510U true CN206741510U (en) 2017-12-12

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106960205A (en) * 2017-05-05 2017-07-18 世擎光电(东莞)有限公司 A kind of modified form fingerprint recognition home key and its manufacture method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106960205A (en) * 2017-05-05 2017-07-18 世擎光电(东莞)有限公司 A kind of modified form fingerprint recognition home key and its manufacture method

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171212

Termination date: 20190505

CF01 Termination of patent right due to non-payment of annual fee