CN206732787U - A kind of grinding wafer equipment for Electronic products manufacturing - Google Patents
A kind of grinding wafer equipment for Electronic products manufacturing Download PDFInfo
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- CN206732787U CN206732787U CN201720493986.XU CN201720493986U CN206732787U CN 206732787 U CN206732787 U CN 206732787U CN 201720493986 U CN201720493986 U CN 201720493986U CN 206732787 U CN206732787 U CN 206732787U
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Abstract
It the utility model is related to a kind of milling apparatus, more particularly to a kind of grinding wafer equipment for Electronic products manufacturing.The technical problems to be solved in the utility model be to provide it is a kind of simple to operate, can the various sizes of wafer of simultaneous grinding, the high grinding wafer equipment for Electronic products manufacturing of grinding efficiency.In order to solve the above-mentioned technical problem, the utility model provides such a grinding wafer equipment for Electronic products manufacturing, includes bottom plate, left frame, top plate, grinding frame, abrasive sheet, governor motion etc.；Bottom plate top left side is provided with left frame, and left frame top is connected with top plate, and bottom plate top right side is provided with rotating mechanism, grinding frame is connected with rotating mechanism, grinding frame bottom is connected with governor motion, elevating mechanism is provided among top plate bottom, elevating mechanism bottom is connected with abrasive sheet.Different wafers can be positioned in different governor motions by the utility model, then be ground, and reach simple to operate, the high effect of grinding efficiency.
Description
Technical field
The present invention relates to a kind of milling apparatus, more particularly to a kind of grinding wafer equipment for Electronic products manufacturing.
Background technology
Wafer refers to the silicon wafer used in silicon semiconductor production of integrated circuits, because it is shaped as circle, therefore referred to as wafer.
Various circuit component structures can be manufactured on silicon, and turn into the IC products for having specific electrical functionality.The original of wafer
Beginning material is silicon, and there is nexhaustible silica on earth's crust surface.Silica ore refines via electric arc furnaces, hydrochloric acid chlorine
Change, and after distillation, the polysilicon of high-purity has been made, its high purity 99.999999999%.
Wafer needs to be ground surface, and the milling apparatus of grinding crystal wafer can't grind various sizes of crystalline substance at present
Circle, complex operation, grinding efficiency is not high, therefore it is a kind of simple to operate to need research and development badly, can the various sizes of wafer of simultaneous grinding,
The high grinding wafer equipment for Electronic products manufacturing of grinding efficiency.
The content of the invention
(1) technical problems to be solved
For the present invention in order to overcome the milling apparatus of current grinding crystal wafer to grind various sizes of wafer, operation is multiple
It is miscellaneous, the shortcomings that grinding efficiency is not high, the technical problem to be solved in the present invention is to provide a kind of simple to operate, can simultaneous grinding not
With the wafer of size, the high grinding wafer equipment for Electronic products manufacturing of grinding efficiency.
(2) technical scheme
In order to solve the above-mentioned technical problem, the invention provides such a grinding wafer for Electronic products manufacturing to set
It is standby, include bottom plate, left frame, top plate, grinding frame, abrasive sheet, governor motion, elevating mechanism and rotating mechanism, bottom plate top left
Side is provided with left frame, and left frame top is connected with top plate, and bottom plate top right side is provided with rotating mechanism, is connected with and grinds on rotating mechanism
Frame is ground, grinding frame bottom is connected with governor motion, elevating mechanism is provided among top plate bottom, elevating mechanism bottom, which is connected with, grinds
Grinding.
Preferably, governor motion includes the first sliding block, abrasive disk, fixed block, the first latch, the second latch and first and slided
Rail, grinding inframe bottom are provided with the first slide rail, and slidingtype is connected with the first sliding block on the first slide rail, and the first sliding block is connected with grinding
Disk, abrasive disk top are uniformly provided with standing groove, and groove is provided with left and right sides of abrasive disk, is mounted on admittedly at left and right sides of grinding frame
Determine block, fixed block level is provided with the first pin-and-hole, and fixed block is vertically provided with the second pin-and-hole, and bottom is provided with the at left and right sides of grinding frame
One through hole, the first latch being inserted with the first pin-and-hole, being provided with the second through hole in the first latch, the first latch is through the first pin-and-hole, the
One through hole and groove, the second latch are inserted with the second pin-and-hole, the second latch passes through the second pin-and-hole and the second through hole.
Preferably, rotating mechanism includes support bar, circular slide rail, the 3rd sliding block, motor and the second rotating shaft, bottom plate top
Right side is provided with support bar, and motor is provided with the right side of bottom base plate, and support bar is connected with the at left and right sides of motor at the top of motor
Two rotating shafts, supporting bar top are connected with circular slide rail, and slidingtype is connected with the 3rd sliding block on circular slide rail, and the 3rd slider top connects
Grinding frame is connected to, grinding frame bottom center is connected with the second rotating shaft top.
Preferably, elevating mechanism includes installing plate, the second slide rail, the second sliding block, first bearing seat, first rotating shaft,
One bevel gear, rocking bar, second bearing seat, 3rd bearing seat, screw mandrel, second bevel gear, nut and L-type connecting rod, in top plate bottom
Between be provided with installing plate, installing plate bottom is connected with the second slide rail, and slidingtype is connected with the second sliding block, the second slide rail on the second slide rail
Right upper portion is provided with first bearing seat, is connected with first rotating shaft on the right side of first bearing seat, the first cone is connected with first rotating shaft
Gear, first rotating shaft right-hand member are connected with rocking bar, and the second slide rail right upper portion is provided with second bearing seat, and second bearing seat is located at first
Bearing block bottom, the second slide rail lower right side are provided with 3rd bearing seat, silk are connected between second bearing seat and 3rd bearing seat
Bar, nut is connected with screw mandrel, nut coordinates with screw mandrel, be connected on the left of nut with the second sliding block, and nut right side is connected with L-type and connected
Bar, L-type connecting rod bottom are connected with abrasive sheet, and screw mandrel top is connected with second bevel gear, and second bevel gear is nibbled with first bevel gear
Close.
Preferably, the material of abrasive sheet is silica.
Preferably, motor is high-speed electric expreess locomotive.
Operation principle：When the wafer of Electronic products manufacturing needs grinding, the wafer cut is positioned in governor motion,
Governor motion is fixed on grinding inframe again, regulation elevating mechanism drives abrasive sheet contact wafer, and control rotating mechanism rotates, rotation
Rotation mechanism drives grinding frame and governor motion to rotate, and wafer is ground by rotating, this process operation is simple, can be by difference
Wafer be positioned in different governor motions, improve the grinding efficiency of milling apparatus.
Because governor motion includes the first sliding block, abrasive disk, fixed block, the first latch, the second latch and the first slide rail,
Grinding inframe bottom is provided with the first slide rail, and slidingtype is connected with the first sliding block on the first slide rail, and the first sliding block is connected with abrasive disk,
Standing groove is uniformly provided with the top of abrasive disk, groove is provided with left and right sides of abrasive disk, is mounted on fixing at left and right sides of grinding frame
Block, fixed block level are provided with the first pin-and-hole, and fixed block is vertically provided with the second pin-and-hole, and bottom is provided with first at left and right sides of grinding frame
Through hole, the first latch being inserted with the first pin-and-hole, being provided with the second through hole in the first latch, the first latch is through the first pin-and-hole, first
Through hole and groove, the second latch are inserted with the second pin-and-hole, the second latch passes through the second pin-and-hole and the second through hole, when electronic product system
When the wafer made needs grinding, wafer is positioned in standing groove, the first latch is inserted by the first pin-and-hole and first through hole
In groove, then the second latch inserted into the second pin-and-hole and the second through hole, start to grind after fixed, then pass through the first latch and second
Latch is fixed, and when the wafer size for needing to grind needs change, worker need to only replace the abrasive disk of correspondingly-sized
, simple and fast.
Because rotating mechanism includes support bar, circular slide rail, the 3rd sliding block, motor and the second rotating shaft, bottom plate top right
Side is provided with support bar, and motor is provided with the right side of bottom base plate, and support bar is connected with second at left and right sides of motor at the top of motor
Rotating shaft, supporting bar top are connected with circular slide rail, and slidingtype is connected with the 3rd sliding block, the connection of the 3rd slider top on circular slide rail
There is grinding frame, grinding frame bottom center is connected with the second rotating shaft top, when the wafer of Electronic products manufacturing needs grinding, worker
Controlled motor rotates, the axis of rotation of motor driven second, and the second rotating shaft drives grinding frame to rotate through circular slide rail, because wafer
Contacted with abrasive sheet, so as to be ground to wafer, until after the wafer of grinding is up to standard, worker's controlled motor stops operating.
Because elevating mechanism includes installing plate, the second slide rail, the second sliding block, first bearing seat, first rotating shaft, the first cone
Gear, rocking bar, second bearing seat, 3rd bearing seat, screw mandrel, second bevel gear, nut and L-type connecting rod, top plate are set among bottom
There is installing plate, installing plate bottom is connected with the second slide rail, and slidingtype is connected with the second sliding block, the second slide rail right side on the second slide rail
Top is provided with first bearing seat, is connected with first rotating shaft on the right side of first bearing seat, first bevel gear is connected with first rotating shaft,
First rotating shaft right-hand member is connected with rocking bar, and the second slide rail right upper portion is provided with second bearing seat, and second bearing seat is located at clutch shaft bearing
Seat bottom, the second slide rail lower right side are provided with 3rd bearing seat, screw mandrel, silk are connected between second bearing seat and 3rd bearing seat
Nut is connected with bar, nut coordinates with screw mandrel, is connected on the left of nut with the second sliding block, and L-type connecting rod, L are connected with the right side of nut
Type connecting rod bottom is connected with abrasive sheet, and screw mandrel top is connected with second bevel gear, and second bevel gear engages with first bevel gear, when
When the wafer of Electronic products manufacturing needs grinding, rocking bar is shaken clockwise, and rocking bar drives first rotating shaft to rotate clockwise, first turn
Axle drives first bevel gear to rotate clockwise, and first bevel gear drives second bevel gear to rotate counterclockwise, and second bevel gear drives
Screw mandrel rotates counterclockwise, and screw mandrel drives nut to move downward, and nut drives L-type connecting rod to move downward, and L-type connecting rod drives abrasive sheet
Moving downward until contact wafer, when grinding up to standard, shakes rocking bar counterclockwise, rocking bar drives first rotating shaft to rotate counterclockwise,
First rotating shaft drives first bevel gear to rotate counterclockwise, and first bevel gear drives second bevel gear to rotate clockwise, the second cone tooth
Wheel drives screw mandrel to rotate clockwise, and screw mandrel drives nut to move upwards, and nut drives L-type connecting rod to move upwards, and L-type connecting rod drives
Abrasive sheet moves away from grinding frame upwards.
Because the material of abrasive sheet is silica, silica being capable of more preferable grinding crystal wafer.
Because motor is high-speed electric expreess locomotive, high-speed electric expreess locomotive can improve grinding efficiency.
(3) beneficial effect
Different wafers can be positioned in different governor motions by the present invention, then be ground, and reach simple to operate,
The high effect of grinding efficiency.
Brief description of the drawings
Fig. 1 is the main structure diagram of the present invention.
Fig. 2 is the main structure diagram of governor motion of the present invention.
Fig. 3 is the main structure diagram that governor motion of the present invention detaches abrasive disk.
Fig. 4 is the main structure diagram of abrasive disk of the present invention.
Fig. 5 is the main structure diagram of the first latch of the invention.
Fig. 6 is the main structure diagram of elevating mechanism of the present invention.
Fig. 7 is the main structure diagram of rotating mechanism of the present invention.
Mark in accompanying drawing for：1- bottom plates, the left framves of 2-, 3- top plates, 4- grinding frames, 5- abrasive sheets, 6- governor motions, 61-
First sliding block, 62- abrasive disks, 63- standing grooves, 64- fixed blocks, the latches of 65- first, the latches of 66- second, the slide rails of 67- first,
68- first through hole, the pin-and-holes of 69- first, the pin-and-holes of 610- second, 611- grooves, the through holes of 612- second, 7- elevating mechanisms, 71- installations
Plate, the slide rails of 72- second, the sliding blocks of 73- second, 74- first bearing seats, 75- first rotating shafts, 76- first bevel gears, 77- rocking bars,
78- second bearing seats, 79- 3rd bearing seats, 710- screw mandrels, 711- second bevel gears, 712- nuts, 713-L type connecting rods, 8- rotations
Rotation mechanism, 81- support bars, 82- circle slide rails, the sliding blocks of 83- the 3rd, 84- motors, the rotating shafts of 85- second.
Embodiment
The present invention is further illustrated with reference to the accompanying drawings and examples.
Embodiment 1
A kind of grinding wafer equipment for Electronic products manufacturing, as shown in figs. 1-7, include bottom plate 1, left frame 2, top plate
3rd, frame 4, abrasive sheet 5, governor motion 6, elevating mechanism 7 and rotating mechanism 8, the top left side of bottom plate 1 are ground and left frame 2 is installed, it is left
The top of frame 2 is connected with top plate 3, and the top right side of bottom plate 1 is provided with rotating mechanism 8, and grinding frame 4, grinding are connected with rotating mechanism 8
The bottom of frame 4 is connected with governor motion 6, and elevating mechanism 7 is provided among the bottom of top plate 3, and the bottom of elevating mechanism 7 is connected with abrasive sheet
5。
Embodiment 2
A kind of grinding wafer equipment for Electronic products manufacturing, as shown in figs. 1-7, include bottom plate 1, left frame 2, top plate
3rd, frame 4, abrasive sheet 5, governor motion 6, elevating mechanism 7 and rotating mechanism 8, the top left side of bottom plate 1 are ground and left frame 2 is installed, it is left
The top of frame 2 is connected with top plate 3, and the top right side of bottom plate 1 is provided with rotating mechanism 8, and grinding frame 4, grinding are connected with rotating mechanism 8
The bottom of frame 4 is connected with governor motion 6, and elevating mechanism 7 is provided among the bottom of top plate 3, and the bottom of elevating mechanism 7 is connected with abrasive sheet
5。
Governor motion 6 includes the first sliding block 61, abrasive disk 62, fixed block 64, the first latch 65, the second latch 66 and
One slide rail 67, the grinding inner bottom part of frame 4 are provided with the first slide rail 67, and slidingtype is connected with the first sliding block 61 on the first slide rail 67, and first
Sliding block 61 is connected with abrasive disk 62, and the top of abrasive disk 62 is uniformly provided with standing groove 63, and the left and right sides of abrasive disk 62 is provided with groove
611, the left and right sides of grinding frame 4 is mounted on fixed block 64, and the level of fixed block 64 is provided with the first pin-and-hole 69, and fixed block 64 is vertically opened
There is the second pin-and-hole 610, grinding frame 4 left and right sides bottom is provided with first through hole 68, the first latch 65 is inserted with the first pin-and-hole 69,
It is provided with the second through hole 612 in first latch 65, the first latch 65 passes through the first pin-and-hole 69, first through hole 68 and groove 611, and second
The second latch 66 is inserted with pin-and-hole 610, the second latch 66 passes through the second pin-and-hole 610 and the second through hole 612.
Embodiment 3
A kind of grinding wafer equipment for Electronic products manufacturing, as shown in figs. 1-7, include bottom plate 1, left frame 2, top plate
3rd, frame 4, abrasive sheet 5, governor motion 6, elevating mechanism 7 and rotating mechanism 8, the top left side of bottom plate 1 are ground and left frame 2 is installed, it is left
The top of frame 2 is connected with top plate 3, and the top right side of bottom plate 1 is provided with rotating mechanism 8, and grinding frame 4, grinding are connected with rotating mechanism 8
The bottom of frame 4 is connected with governor motion 6, and elevating mechanism 7 is provided among the bottom of top plate 3, and the bottom of elevating mechanism 7 is connected with abrasive sheet
5。
Governor motion 6 includes the first sliding block 61, abrasive disk 62, fixed block 64, the first latch 65, the second latch 66 and
One slide rail 67, the grinding inner bottom part of frame 4 are provided with the first slide rail 67, and slidingtype is connected with the first sliding block 61 on the first slide rail 67, and first
Sliding block 61 is connected with abrasive disk 62, and the top of abrasive disk 62 is uniformly provided with standing groove 63, and the left and right sides of abrasive disk 62 is provided with groove
611, the left and right sides of grinding frame 4 is mounted on fixed block 64, and the level of fixed block 64 is provided with the first pin-and-hole 69, and fixed block 64 is vertically opened
There is the second pin-and-hole 610, grinding frame 4 left and right sides bottom is provided with first through hole 68, the first latch 65 is inserted with the first pin-and-hole 69,
It is provided with the second through hole 612 in first latch 65, the first latch 65 passes through the first pin-and-hole 69, first through hole 68 and groove 611, and second
The second latch 66 is inserted with pin-and-hole 610, the second latch 66 passes through the second pin-and-hole 610 and the second through hole 612.
Rotating mechanism 8 includes support bar 81, circular slide rail 82, the 3rd sliding block 83, the rotating shaft 85 of motor 84 and second, bottom plate
1 top right side is provided with support bar 81, and the bottom right of bottom plate 1 is provided with motor 84, and support bar 81 is in the left and right sides of motor 84, electricity
The top of machine 84 is connected with the second rotating shaft 85, and the top of support bar 81 is connected with circular slide rail 82, and slidingtype connects on circular slide rail 82
There is the 3rd sliding block 83, the top of the 3rd sliding block 83 is connected with grinding frame 4, and the grinding bottom centre of frame 4 is connected with the top of the second rotating shaft 85.
Embodiment 4
A kind of grinding wafer equipment for Electronic products manufacturing, as shown in figs. 1-7, include bottom plate 1, left frame 2, top plate
3rd, frame 4, abrasive sheet 5, governor motion 6, elevating mechanism 7 and rotating mechanism 8, the top left side of bottom plate 1 are ground and left frame 2 is installed, it is left
The top of frame 2 is connected with top plate 3, and the top right side of bottom plate 1 is provided with rotating mechanism 8, and grinding frame 4, grinding are connected with rotating mechanism 8
The bottom of frame 4 is connected with governor motion 6, and elevating mechanism 7 is provided among the bottom of top plate 3, and the bottom of elevating mechanism 7 is connected with abrasive sheet
5。
Governor motion 6 includes the first sliding block 61, abrasive disk 62, fixed block 64, the first latch 65, the second latch 66 and
One slide rail 67, the grinding inner bottom part of frame 4 are provided with the first slide rail 67, and slidingtype is connected with the first sliding block 61 on the first slide rail 67, and first
Sliding block 61 is connected with abrasive disk 62, and the top of abrasive disk 62 is uniformly provided with standing groove 63, and the left and right sides of abrasive disk 62 is provided with groove
611, the left and right sides of grinding frame 4 is mounted on fixed block 64, and the level of fixed block 64 is provided with the first pin-and-hole 69, and fixed block 64 is vertically opened
There is the second pin-and-hole 610, grinding frame 4 left and right sides bottom is provided with first through hole 68, the first latch 65 is inserted with the first pin-and-hole 69,
It is provided with the second through hole 612 in first latch 65, the first latch 65 passes through the first pin-and-hole 69, first through hole 68 and groove 611, and second
The second latch 66 is inserted with pin-and-hole 610, the second latch 66 passes through the second pin-and-hole 610 and the second through hole 612.
Rotating mechanism 8 includes support bar 81, circular slide rail 82, the 3rd sliding block 83, the rotating shaft 85 of motor 84 and second, bottom plate
1 top right side is provided with support bar 81, and the bottom right of bottom plate 1 is provided with motor 84, and support bar 81 is in the left and right sides of motor 84, electricity
The top of machine 84 is connected with the second rotating shaft 85, and the top of support bar 81 is connected with circular slide rail 82, and slidingtype connects on circular slide rail 82
There is the 3rd sliding block 83, the top of the 3rd sliding block 83 is connected with grinding frame 4, and the grinding bottom centre of frame 4 is connected with the top of the second rotating shaft 85.
Elevating mechanism 7 includes installing plate 71, the second slide rail 72, the second sliding block 73, first bearing seat 74, first rotating shaft
75th, first bevel gear 76, rocking bar 77, second bearing seat 78,3rd bearing seat 79, screw mandrel 710, second bevel gear 711, nut
712 and L-type connecting rod 713, be provided with installing plate 71 among the bottom of top plate 3, the bottom of installing plate 71 is connected with the second slide rail 72, the second cunning
Slidingtype is connected with the second sliding block 73 on rail 72, and the right upper portion of the second slide rail 72 is provided with first bearing seat 74, first bearing seat
74 right sides are connected with first rotating shaft 75, first bevel gear 76 are connected with first rotating shaft 75, the right-hand member of first rotating shaft 75, which is connected with, to be shaken
Bar 77, the right upper portion of the second slide rail 72 are provided with second bearing seat 78, and second bearing seat 78 is located at the bottom of first bearing seat 74, and second
The lower right side of slide rail 72 is provided with 3rd bearing seat 79, and screw mandrel 710, silk are connected between second bearing seat 78 and 3rd bearing seat 79
Nut 712 is connected with bar 710, nut 712 coordinates with screw mandrel 710, and the left side of nut 712 is connected with the second sliding block 73, nut 712
Right side is connected with L-type connecting rod 713, and the bottom of L-type connecting rod 713 is connected with abrasive sheet 5, and the top of screw mandrel 710 is connected with second bevel gear
711, second bevel gear 711 engages with first bevel gear 76.
The material of abrasive sheet 5 is silica.
Motor 84 is high-speed electric expreess locomotive 84.
Operation principle：When the wafer of Electronic products manufacturing needs grinding, the wafer cut is positioned over governor motion 6
It is interior, then governor motion 6 is fixed in grinding frame 4, regulation elevating mechanism 7 drives abrasive sheet 5 to contact wafer, controls rotating mechanism
8 are rotated, and rotating mechanism 8 drives grinding frame 4 and governor motion 6 to rotate, and wafer is ground by rotating, the letter of this process operation
It is single, different wafers can be positioned in different governor motions 6, improve the grinding efficiency of milling apparatus.
Because governor motion 6 includes the first sliding block 61, abrasive disk 62, fixed block 64, the first latch 65, the second latch 66
With the first slide rail 67, the grinding inner bottom part of frame 4 is provided with the first slide rail 67, and slidingtype is connected with the first sliding block 61 on the first slide rail 67,
First sliding block 61 is connected with abrasive disk 62, and the top of abrasive disk 62 is uniformly provided with standing groove 63, and the left and right sides of abrasive disk 62 is provided with
Groove 611, the left and right sides of grinding frame 4 are mounted on fixed block 64, and the level of fixed block 64 is provided with the first pin-and-hole 69, and fixed block 64 hangs down
The second pin-and-hole 610 is headed straight for, grinding frame 4 left and right sides bottom is provided with first through hole 68, and first is inserted with the first pin-and-hole 69 and is inserted
Pin 65, the second through hole 612 is provided with the first latch 65, the first latch 65 passes through the first pin-and-hole 69, first through hole 68 and groove
611, the second latch 66 is inserted with the second pin-and-hole 610, and the second latch 66 passes through the second pin-and-hole 610 and the second through hole 612, works as electronics
When the wafer of product manufacturing needs grinding, wafer is positioned in standing groove 63, the first latch 65 is passed through into the He of the first pin-and-hole 69
First through hole 68 is inserted in groove 611, then the second latch 66 is inserted into the second pin-and-hole 610 and the second through hole 612, is started after fixed
Grinding, then be fixed by the first latch 65 and the second latch 66, when the wafer size for needing to grind needs change,
Worker need to only replace the abrasive disk 62 of correspondingly-sized, simple and fast.
Because rotating mechanism 8 includes support bar 81, circular slide rail 82, the 3rd sliding block 83, the rotating shaft 85 of motor 84 and second,
The top right side of bottom plate 1 is provided with support bar 81, and the bottom right of bottom plate 1 is provided with motor 84, and support bar 81 is in motor 84 or so two
Side, the top of motor 84 are connected with the second rotating shaft 85, and the top of support bar 81 is connected with circular slide rail 82, slidingtype on circular slide rail 82
The 3rd sliding block 83 is connected with, the top of the 3rd sliding block 83 is connected with grinding frame 4, the grinding bottom centre of frame 4 and the top of the second rotating shaft 85
Connection, when the wafer of Electronic products manufacturing needs grinding, worker's controlled motor 84 rotates, and motor 84 drives 85 turns of the second rotating shaft
Dynamic, the second rotating shaft 85 drives grinding frame 4 to rotate through circular slide rail 82, because wafer contacts with abrasive sheet 5, so as to enter to wafer
Row grinding, until after the wafer of grinding is up to standard, worker's controlled motor 84 stops operating.
Because elevating mechanism 7 includes installing plate 71, the second slide rail 72, the second sliding block 73,74, first turns of first bearing seat
Axle 75, first bevel gear 76, rocking bar 77, second bearing seat 78,3rd bearing seat 79, screw mandrel 710, second bevel gear 711, nut
712 and L-type connecting rod 713, be provided with installing plate 71 among the bottom of top plate 3, the bottom of installing plate 71 is connected with the second slide rail 72, the second cunning
Slidingtype is connected with the second sliding block 73 on rail 72, and the right upper portion of the second slide rail 72 is provided with first bearing seat 74, first bearing seat
74 right sides are connected with first rotating shaft 75, first bevel gear 76 are connected with first rotating shaft 75, the right-hand member of first rotating shaft 75, which is connected with, to be shaken
Bar 77, the right upper portion of the second slide rail 72 are provided with second bearing seat 78, and second bearing seat 78 is located at the bottom of first bearing seat 74, and second
The lower right side of slide rail 72 is provided with 3rd bearing seat 79, and screw mandrel 710, silk are connected between second bearing seat 78 and 3rd bearing seat 79
Nut 712 is connected with bar 710, nut 712 coordinates with screw mandrel 710, and the left side of nut 712 is connected with the second sliding block 73, nut 712
Right side is connected with L-type connecting rod 713, and the bottom of L-type connecting rod 713 is connected with abrasive sheet 5, and the top of screw mandrel 710 is connected with second bevel gear
711, second bevel gear 711 engages with first bevel gear 76, when the wafer of Electronic products manufacturing needs grinding, shakes clockwise
Rocking bar 77, rocking bar 77 drive first rotating shaft 75 to rotate clockwise, and first rotating shaft 75 drives first bevel gear 76 to rotate clockwise, the
One bevel gear 76 drives second bevel gear 711 to rotate counterclockwise, and second bevel gear 711 drives screw mandrel 710 to rotate counterclockwise, screw mandrel
710 drive nuts 712 move downward, and nut 712 drives L-type connecting rod 713 to move downward, L-type connecting rod 713 drive abrasive sheet 5 to
Lower motion when grinding up to standard, shakes rocking bar 77, rocking bar 77 drives first rotating shaft 75 to turn counterclockwise counterclockwise until contact wafer
Dynamic, first rotating shaft 75 drives first bevel gear 76 to rotate counterclockwise, and first bevel gear 76 drives second bevel gear 711 to turn clockwise
Dynamic, second bevel gear 711 drives screw mandrel 710 to rotate clockwise, and screw mandrel 710 drives nut 712 to move upwards, and nut 712 drives L
Type connecting rod 713 moves upwards, and L-type connecting rod 713 drives abrasive sheet 5 to move away from grinding frame 4 upwards.
Because the material of abrasive sheet 5 is silica, silica being capable of more preferable grinding crystal wafer.
Because motor 84 is high-speed electric expreess locomotive 84, high-speed electric expreess locomotive 84 can improve grinding efficiency.
Embodiment described above only expresses the preferred embodiment of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformations can also be made, improves and substitutes, these belong to this hair
Bright protection domain.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. a kind of grinding wafer equipment for Electronic products manufacturing, it is characterised in that include bottom plate (1), left frame (2), top
Plate (3), grinding frame (4), abrasive sheet (5), governor motion (6), elevating mechanism (7) and rotating mechanism (8), bottom plate (1) top left
Side is provided with left frame (2), and left frame (2) top is connected with top plate (3), and bottom plate (1) top right side is provided with rotating mechanism (8), rotation
Grinding frame (4) is connected with rotation mechanism (8), grinding frame (4) bottom is connected with governor motion (6), installed among top plate (3) bottom
There is elevating mechanism (7), elevating mechanism (7) bottom is connected with abrasive sheet (5).
A kind of 2. grinding wafer equipment for Electronic products manufacturing according to claim 1, it is characterised in that regulation machine
Structure (6) includes the first sliding block (61), abrasive disk (62), fixed block (64), the first latch (65), the second latch (66) and first
Slide rail (67), grinding frame (4) inner bottom part are provided with the first slide rail (67), and slidingtype is connected with the first sliding block on the first slide rail (67)
(61), the first sliding block (61) is connected with abrasive disk (62), and uniformly standing groove (63), abrasive disk (62) are provided with the top of abrasive disk (62)
The left and right sides is provided with groove (611), is mounted on fixed block (64) at left and right sides of grinding frame (4), fixed block (64) level is opened
There is the first pin-and-hole (69), fixed block (64) is vertically provided with the second pin-and-hole (610), and bottom is provided with the at left and right sides of grinding frame (4)
One through hole (68), the first pin-and-hole (69) is interior to be inserted with the first latch (65), and the second through hole (612) is provided with the first latch (65), the
One latch (65) passes through the first pin-and-hole (69), first through hole (68) and groove (611), and second is inserted with the second pin-and-hole (610) and is inserted
Sell (66), the second latch (66) passes through the second pin-and-hole (610) and the second through hole (612).
A kind of 3. grinding wafer equipment for Electronic products manufacturing according to claim 2, it is characterised in that whirler
Structure (8) includes support bar (81), circular slide rail (82), the 3rd sliding block (83), motor (84) and the second rotating shaft (85), bottom plate
(1) top right side is provided with support bar (81), and bottom plate (1) bottom right is provided with motor (84), and support bar (81) is in motor
(84) left and right sides, motor (84) top are connected with the second rotating shaft (85), and support bar (81) top is connected with circular slide rail (82),
Slidingtype is connected with the 3rd sliding block (83) on circular slide rail (82), and grinding frame (4) is connected with the top of the 3rd sliding block (83), grinds frame
(4) bottom centre is connected with the second rotating shaft (85) top.
A kind of 4. grinding wafer equipment for Electronic products manufacturing according to claim 3, it is characterised in that lift
Structure (7) include installing plate (71), the second slide rail (72), the second sliding block (73), first bearing seat (74), first rotating shaft (75),
First bevel gear (76), rocking bar (77), second bearing seat (78), 3rd bearing seat (79), screw mandrel (710), second bevel gear
(711), nut (712) and L-type connecting rod (713), top plate (3) bottom centre are provided with installing plate (71), and installing plate (71) bottom connects
The second slide rail (72) is connected to, slidingtype is connected with the second sliding block (73), the second slide rail (72) right upper portion on the second slide rail (72)
First bearing seat (74) is installed, is connected with first rotating shaft (75) on the right side of first bearing seat (74), first rotating shaft connects on (75)
There is first bevel gear (76), first rotating shaft (75) right-hand member is connected with rocking bar (77), and the second slide rail (72) right upper portion is provided with second
Bearing block (78), second bearing seat (78) are located at first bearing seat (74) bottom, and the second slide rail (72) lower right side is provided with the 3rd
Bearing block (79), is connected with screw mandrel (710) between second bearing seat (78) and 3rd bearing seat (79), screw mandrel connects on (710)
There is nut (712), nut (712) coordinates with screw mandrel (710), is connected on the left of nut (712) with the second sliding block (73), nut
(712) right side is connected with L-type connecting rod (713), and L-type connecting rod (713) bottom is connected with abrasive sheet (5), the connection of screw mandrel (710) top
There is second bevel gear (711), second bevel gear (711) engages with first bevel gear (76).
A kind of 5. grinding wafer equipment for Electronic products manufacturing according to claim 4, it is characterised in that abrasive sheet
(5) material is silica.
A kind of 6. grinding wafer equipment for Electronic products manufacturing according to claim 5, it is characterised in that motor
(84) it is high-speed electric expreess locomotive (84).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720493986.XU CN206732787U (en) | 2017-05-05 | 2017-05-05 | A kind of grinding wafer equipment for Electronic products manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720493986.XU CN206732787U (en) | 2017-05-05 | 2017-05-05 | A kind of grinding wafer equipment for Electronic products manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206732787U true CN206732787U (en) | 2017-12-12 |
Family
ID=60564118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720493986.XU Expired - Fee Related CN206732787U (en) | 2017-05-05 | 2017-05-05 | A kind of grinding wafer equipment for Electronic products manufacturing |
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| Country | Link |
|---|---|
| CN (1) | CN206732787U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110576387A (en) * | 2019-09-30 | 2019-12-17 | 靖江先锋半导体科技有限公司 | surface grinding device for plasma CVD wafer heater |
| CN111185846A (en) * | 2020-01-09 | 2020-05-22 | 徐绪友 | Multi-size compatible wafer grinding equipment |
-
2017
- 2017-05-05 CN CN201720493986.XU patent/CN206732787U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110576387A (en) * | 2019-09-30 | 2019-12-17 | 靖江先锋半导体科技有限公司 | surface grinding device for plasma CVD wafer heater |
| CN110576387B (en) * | 2019-09-30 | 2024-03-12 | 江苏先锋精密科技股份有限公司 | Surface grinding device for plasma CVD wafer heater |
| CN111185846A (en) * | 2020-01-09 | 2020-05-22 | 徐绪友 | Multi-size compatible wafer grinding equipment |
| CN111185846B (en) * | 2020-01-09 | 2021-06-29 | 徐绪友 | Multi-size compatible wafer grinding equipment |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171212 Termination date: 20200505 |