CN206725881U - Resin removing device - Google Patents

Resin removing device Download PDF

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Publication number
CN206725881U
CN206725881U CN201720101819.6U CN201720101819U CN206725881U CN 206725881 U CN206725881 U CN 206725881U CN 201720101819 U CN201720101819 U CN 201720101819U CN 206725881 U CN206725881 U CN 206725881U
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China
Prior art keywords
resin
substrate
cover
plate glass
mounting table
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CN201720101819.6U
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Chinese (zh)
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长谷川达也
坂田元之
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Japan Display Central Inc
Japan Display Inc
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Japan Display Central Inc
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Processing Of Solid Wastes (AREA)
  • Cleaning In General (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The purpose of this utility model is to realize the device that after display panel and cover-plate glass stripping, the resin efficiency for residuing in display panel or cover-plate glass will be removed well.Resin removing device is the utility model is related to, it is that will attach to the resin removing device that the thermoplastic resin of substrate (300) removes, it is characterised in that is had:Mounting table (20), the mounting table (20) load the substrate (300);With the instrument of removing (10), the removing instrument (10) contacts with the face for being attached with the resin of the substrate (300), the mounting table (20) is relatively moved relative to the removing instrument (10), is removed so as to will attach to the resin of the substrate (300) using the removing instrument (10).

Description

Resin removing device
Technical field
The manufacture device of display device is the utility model is related to, the bonding cover-plate glass more particularly in step for regeneration and aobvious Show the removing device of the resin of panel.
Background technology
For liquid crystal display device, formed to be following:Be configured with TFT substrate and counter substrate, and in TFT substrate and Liquid crystal is clamped between opposite electrode, pixel electrode and thin film transistor (TFT) (TFT) etc. are formed as rectangular in the TFT substrate, The counter substrate is relative with TFT substrates.Also, pass through the transmitance as each pixel control light as caused by liquid crystal molecule And form image.
In liquid crystal display device, cover-plate glass is used in order to protect surface.After the completion of liquid crystal display panel, use is ultraviolet Line solidified resin etc., cover-plate glass is adhered to liquid crystal display panel.After being bonded cover-plate glass, if being sent out in liquid crystal display device Existing problem, then regenerate the liquid crystal display device or discard.
If being intended to regenerate liquid crystal display device, cover-plate glass and liquid crystal display panel must be separated.The side of the separation Method is different according to the resin of bonding cover-plate glass and liquid crystal display panel.Go bad if resin under low temperature, bonding force loses this The resin of sample, then take the method that liquid crystal display device is put into refrigerator-freezer cooling to peel off.But according to liquid crystal display device Specification is different, it is impossible to which the situation of resin as use is also a lot.
On the other hand, when resin is thermoplastic resin, can take resin is cut off with the cutting off tool of wire-shaped Method.Such cutting-off method is documented in such as patent document 1.
It is promising in the remained on surface of cover-plate glass or liquid crystal display panel after cover-plate glass and liquid crystal display panel separation Bonding and the resin used.In order to which cover-plate glass or liquid crystal display panel are regenerated, it is necessary to which the resin is removed.Patent document In 2, the surface for recording oriented cover-plate glass or liquid crystal display panel blows and sprays dry ice particles (dry ice pellet) and removes tree The composition of fat.
Prior art literature
Patent document
Patent document 1:Japanese Unexamined Patent Publication 2011-048055 publications
Patent document 2:Japanese Unexamined Patent Publication 2013-196531 publications
The content of the invention
The invention problem to be solved
As the method that after cover-plate glass and liquid crystal display panel separation, the resin for residuing in surface will be removed, exist Means shown in patent document 2.But for such means, the device for blowing and spraying dry ice particles be it is required, In addition, because dry ice particles must be prepared, therefore it is also required to operating cost.Further, since dry ice is blowed and sprayed, therefore LCD The surface of plate or cover-plate glass is easily injured, in order to prevent that surface is injured, it is necessary in advance by surface cure.
In the case of such device, people are using appropriate solvent to each cover-plate glass or LCD Plate one by one wipes resin, is skillfully necessary, while can spend the time in the operation.
The utility model is tackles the utility model of the problem of such, to realize in step for regeneration, by cover-plate glass and liquid After LCD panel separation, device that the resin for residuing in cover-plate glass or liquid crystal display panel is efficiently removed.Need Bright, such problem is not only present in liquid crystal display device, is shown in organic EL of bonding device substrate and hermetic sealing substrate Similarly exist in the step for regeneration of device.
Means for solving the problems
The utility model is the utility model to solve the above problems a little, representational to form as described below.That is, resin removes Device, it is that will attach to the resin removing device that the thermoplastic resin of substrate removes, it is characterised in that is had:Mounting table, The mounting table loads the substrate;With the instrument of removing, the face for being attached with the resin of the removing instrument and the substrate Contact, the mounting table are described so as to will attach to using the removing instrument relative to the relative movement of the removing instrument The resin of substrate removes.
Brief description of the drawings
Fig. 1 is the top view of liquid crystal display device.
Fig. 2 is Fig. 1 A-A sectional views.
Fig. 3 is the schematic diagram for the cutting off tool for separating liquid crystal display panel and cover-plate glass.
Fig. 4 is the sectional view for the liquid crystal display panel for remaining resin.
Fig. 5 is the sectional view for the cover-plate glass for remaining resin.
Fig. 6 A are the side view of resin removing device of the present utility model.
Fig. 6 B are the side view of the resin removing device of the present utility model for the state for showing mounting table movement.
Fig. 6 C are the side view for showing to remove the resin removing device of the state of resin.
Fig. 7 is the schematic sectional view of mounting table.
Fig. 8 is the sectional view of state for showing to wipe resin from cover-plate glass using removing instrument.
Fig. 9 is the sectional view of state for showing to wipe resin from liquid crystal display panel using removing instrument.
Figure 10 is the sectional view of removing instrument.
Figure 11 is the stereogram of the block of removing instrument.
Figure 12 is the sectional view for the other examples for showing removing instrument.
Figure 13 is the sectional view of organic EL display.
Description of reference numerals
10 ... remove instruments, 11 ... blocks, 12 ... cover sheets, 20 ... mounting tables, 21 ... suction holes, 22 ... blast pipes, 23 ... heaters, 30 ... move up and down mechanism, 40 ... controllers, 50 ... tracks, 60 ... mechanism for adjusting parallelism, 70 ... removings Head, 100 ... TFT substrates, 101 ... lower polarizing plates, 150 ... driving IC, 160 ... flexible wiring substrates, 200 ... counter substrates, 201 ... upper deflection boards, 250 ... resins, 300 ... cover-plate glass, 400 ... liquid crystal display panels, 500 ... cutting off tools, 501 ... gold Belong to silk, 502 ... supporting members, 600 ... device substrates, 610 ... organic EL luminous elements, 650 ... sealing resins, 700 ... sealing bases Plate
Embodiment
The utility model is described in detail following with embodiment.Although in the following description, to liquid crystal Showing device is illustrated, but the utility model is not limited to liquid crystal display device, and organic EL display is also suitable.
[embodiment 1]
Fig. 1 is the top view of Liquid Crystal Module, and Fig. 2 is the sectional view of Liquid Crystal Module.In Fig. 1, upside is configured with cover-plate glass 300.Although cover-plate glass 300 is to be formed with the 100 identical size of TFT substrate in liquid crystal display panel, this is Example, also there is the situation that cover-plate glass 300 is bigger than liquid crystal display panel, also have cover-plate glass 300 smaller than liquid crystal display panel Situation.
Fig. 2 is Fig. 1 A-A sectional views.In Fig. 2, TFT substrate 100 and counter substrate 200 are glued using encapsulant Connect, liquid crystal is clamped between TFT substrate 100 and counter substrate 200.TFT substrate 100 is formed larger than counter substrate 200, TFT substrate 100 is that the part of 1 is portion of terminal, is configured with the driving IC150 for driving liquid crystal display panel, in addition, connection There is the flexible wiring substrate 160 for being externally supplied power supply, signal.
In the downside of TFT substrate 100, lower polarizing plate 101 is pasted with, is pasted with and polarizes in the upside of counter substrate 200 Plate 201.Liquid crystal display panel 400 is formed by TFT substrate 100, counter substrate 200, lower polarizing plate 101, upper deflection board 201. On upper deflection board 201, cover-plate glass 300 is pasted with using resin 250.This is to mechanically protect liquid crystal display panel 400.In this specification, the state that liquid crystal display panel 400 is provided with to cover-plate glass is referred to as Liquid Crystal Module 500 or liquid crystal Showing device.
In Fig. 2, the thickness of cover-plate glass 300 is following for more than 0.5mm, 1.5mm or so.In addition, TFT substrate 100 and right The thickness for putting substrate 200 is 0.2mm to 0.5mm or so, and the thickness of upper deflection board 201 and lower polarizing plate 101 is 0.13mm or so. The thickness for being bonded the resin 250 of upper deflection board 201 and cover-plate glass 300 is 30 μm or so to 170 μm or so.
Resin 250 is UV (ultraviolet) solidified resin, can be initially highly viscous liquid or film.As tree Adipose membrane, can be used for example, OCA (Optical Clear Adhesive), as the resin for being initially liquid, can be used for example, OCR(Optical Clear Resin).No matter how, resin is thermoplastic resin.
If being pinpointed the problems in the state of Liquid Crystal Module is become, the Liquid Crystal Module is decomposed, and by a part portion Part regenerates.The process is referred to as step for regeneration.In step for regeneration, first of all, it is necessary to by cover-plate glass 300 and liquid crystal display panel 400 Separation.As cover-plate glass 300 and the separation method of liquid crystal display panel 400, the method for example shown in Fig. 3 be present.
In Fig. 3, liquid crystal display panel 400 and cover-plate glass 300 are bonded using resin 250 and form Liquid Crystal Module.Will After Liquid Crystal Module is heated to defined temperature, because resin 250 is thermoplastic resin, therefore resin 250 softens, and utilizes cutoff tool Tool 500 can be cut off.Cutting off tool 500 is the wire 501 that will be used as cutting edge cutting of being installed on that supporting member 502 forms Breaking has.Make cutting off tool 500 as shown in Figure 3 along the main surface parallel direction with cover-plate glass 300 or liquid crystal display panel 400 It is mobile, so as to which resin 250 is cut off.
Fig. 4 is the liquid crystal after by this way peeling off cover-plate glass 300 and liquid crystal display panel 400 in step for regeneration The sectional view of display panel 400.In Fig. 4, resin 250 is remained on upper deflection board 201.Fig. 5 is by cover-plate glass 300 and liquid crystal The sectional view of cover-plate glass 300 after the stripping of display panel 400.Resin device of the present utility model is that will residue in liquid crystal display The resin device that the resin on the surface of panel 400 or cover-plate glass 300 efficiently removes.
Fig. 6 A to Fig. 6 C are the signal for showing to be worked according to the outline and its device of resin removing device of the present utility model Side view.In Fig. 6 A to Fig. 6 C, to the situation of the resin removing of cover-plate glass 300 is illustrated, but it will residue in The situation that the resin of liquid crystal display panel 400 removes is also the same.
In Fig. 6 A, cover-plate glass 300 is placed in mounting table 20.Mounting table 20 is guided by track 50, can the shifting of left and right ground It is dynamic.The mounting table 20 shown in Fig. 6 A has the function that the fixation of cover-plate glass 300 and the heating of cover-plate glass 300.
Fig. 7 is to show that the cover-plate glass 300 for being attached with resin 250 is placed in the schematic sectional of the state of mounting table 20 Figure.Because the resin 250 of bonding cover-plate glass 300 and liquid crystal display panel 400 is thermoplastic, therefore it is made by heating Softening is removed.Therefore, heater 23 is configured in the inside of mounting table 20 in advance, mounting table 20 has hot plate (hot Plate effect).In the state, cover-plate glass 300 is heated to 70 DEG C or so.It should be noted that it is not desired to take time to add In the case of heat, it is possible to use other methods heat cover-plate glass 300, the heater of mounting table 20 is only had and maintain The effect of temperature.
In Fig. 7, cover-plate glass 300 is fixed in mounting table 20 by vacuum suction.Therefore, in mounting table 20 formed with In the suction hole 21 of vacuum suction, suction hole 21 is connected with blast pipe 22.
Fig. 6 A are returned to, is configured with the right side of Fig. 6 A and removes decaptitating 70 with removing instrument 10 and mechanism for adjusting parallelism 60. Except decaptitating 70 by the up and down action mechanism 30 with pressure cylinder and up and down action.Removing device is integrally controlled by controller 40.
In Fig. 6 A, after cover-plate glass 300 is placed in mounting table 20, mounting table 20 moves along the direction of arrow, and is set It is placed in except under decaptitating 10.Fig. 6 B are the side view for the removing device for showing the state.In Fig. 6 B, cover-plate glass 300 is set Behind defined position, except decaptitating 70 shown in arrow to decline, and defined position is arranged at.
Fig. 6 C show the state that removing instrument 10 contacts with cover-plate glass 300.In Fig. 6 C, by being fixed with cover-plate glass 300 mounting table 20 moves along the direction of arrow, can remove the resin residued on cover-plate glass 300.Because resin is Thermoplastic, cover-plate glass 300 is heated, therefore can be removed instrument 10 and be wiped.
Though resin is softening, removed for wiping, it is necessary to be pressed against with defined pressure to cover-plate glass 300 Instrument 10.The pressure is such as 8Kg.In Fig. 6 C, comprising mechanism for adjusting parallelism 60 except the weight of decaptitating 70 is 8Kg, only will When removing instrument 10 is placed on cover-plate glass 300, it becomes possible to pressure as defined in application.
In addition, in order to which resin is equably wiped from cover-plate glass 300, removing instrument 10 must be with uniform pressure and lid Glass sheet 300 contacts.Mechanism for adjusting parallelism 60 be for enable removing instrument 10 relative to cover-plate glass setting state, Such as tilt etc. and follow, the structure for making removing instrument 10 be contacted with uniform pressure with cover-plate glass 300.
After removing instrument 10 to be arranged to the surface of cover-plate glass 300 as described above, the load of cover-plate glass 300 is fixed with The direction for putting arrow of the platform 20 along Fig. 6 C is moved, and the resin on cover-plate glass surface is wiped.At this moment the mobile speed of mounting table 20 Spend for 10 to the 30mm/ seconds.That is, if the cover-plate glass 300 for small-sized liquid crystal display panel, then will can just be set below the several seconds Fat removes.Although the situation citing to cover-plate glass 300 is illustrated above, the situation of liquid crystal display panel 400 It is the same.
Fig. 8 is the schematic sectional of state for showing to wipe the resin on the surface of cover-plate glass 300 using removing instrument 10 Figure.In Fig. 8, moved to the left with 10 to 30mm/ seconds speed by the mounting table 20 for securing cover-plate glass 300, so as to remove Instrument 10 is gone to wipe resin from cover-plate glass 300.Because resin softens, therefore can simply remove.
Fig. 9 is the schematic sectional view for showing to carry out liquid crystal display panel 400 state of identical process.In Fig. 9, remove The resin 250 that instrument 10 will attach to the upper deflection board 201 of liquid crystal display panel 400 is wiped.In the case of Fig. 9, and pass through The mounting table 20 for securing liquid crystal display panel 400 is moved with 10 to 30mm/ seconds speed to the left, so as to remove instrument 10 Resin 250 is wiped from upper deflection board 201.Because resin is softening, therefore can simply remove.
Figure 10 is the sectional view of removing instrument 10, and Figure 11 is the stereogram of the block 11 used in removing instrument 10.Figure 10 In, it is the block 11 relative to the length with formation such as metals to remove instrument 10, cover sheets 12 cover the block 11 with lid The composition in the face of the side of glass sheet or liquid crystal display panel contact.Cover sheets 12 are to prevent removing instrument 10 and cover plate glass Cover-plate glass may be caused to damage with the block of the formation such as metal when glass contacts and used.Cover sheets 12 can be used for example Polyimides etc..
As shown in figure 11, block 11 is for example with the corner post of metal formation.The metal is using such as SUS440C, superhard The metals such as alloy and formed.If it should be noted that being able to ensure that hardness, metal is not limited to, it is possible to use resin.Such as Figure 10 Shown, in the section of block 11, the angle, θ with cover-plate glass opposite side is 90 degree.Also, block 11 with cover-plate glass phase The coated cover sheet 12 in 2 faces of side is covered.
The thickness of cover sheets 12 is 10 μm to 50 μm or so, is 30 μm in the present embodiment.Even if block 11 with cover plate Glass opposite side has sharp angle, can also utilize cover sheets 12 to form R (arc chord angle).The R and cover sheets plate Thick roughly the same degree.Therefore, cover-plate glass is not damaged by block.
Cover sheets 12 are preferably difficult to the material adhered to the resin for being attached to cover-plate glass etc..Further, since cover plate glass Glass etc. can be heated when removing resin, therefore cover sheets 12 are necessary for the material that is at least never degenerated at 70 DEG C or so.
Can also be other shapes although the block 11 in Figure 10 or Figure 11 is corner post.Figure 12 is to show other Block 11 example sectional view.In Figure 12, the section of block 11 is pentagon, the relative part with cover-plate glass etc. Angle, θ is, for example, 90 degree.In addition, in block 11,2 faces relative with cover-plate glass etc. are coated to cover sheet 12 and covered.Reason and figure As illustrating in 10.
More than, it is illustrated to device of the present utility model to be used for the situation of regeneration of liquid crystal display device.This reality It is not limited to be used in the regeneration of liquid crystal display device with the device in new, also can be used in organic EL display again It is raw.Figure 13 is the sectional view of organic EL display.In Figure 13, organic EL luminous element 610 is formed on device substrate 600 Deng.Sealing resin 650 is formed in order to protect organic EL luminous element 610, in addition, sealing resin 650 has bonding element base The effect of plate 600 and hermetic sealing substrate 700.Hermetic sealing substrate is usually formed with glass, is to separate the intrusion of moisture.Seal base Plate 700 also has the function that to be used as cover-plate glass.
After adhering and sealing substrate 700, when being pinpointed the problems in organic EL display, it is necessary to by organic EL display point Solve and regenerate.In this case, sealing resin 650 is cut off using the cutting off tool 500 for example shown in Fig. 3.Device substrate 600 or The shape shown in hermetic sealing substrate 700 and Fig. 4 or Fig. 5 equally remains sealing resin 650.Said using Fig. 6 A into Figure 12 Bright removing device can remove the sealing resin 650 of the residual.
As described above, by using according to resin removing device of the present utility model, can efficiently be shown The step for regeneration of showing device, furthermore it is possible to improve the regeneration rate of part.

Claims (9)

1. resin removing device, it is that will attach to the resin removing device that the thermoplastic resin of substrate removes, and its feature exists In having:
Mounting table, the mounting table load the substrate;With
Removing instrument, the removing instrument contact with the face for being attached with the resin of the substrate,
The mounting table relatively moves relative to the removing instrument, so as to will attach to the base using the removing instrument The resin of plate removes.
2. resin removing device as claimed in claim 1, it is characterised in that the mounting table has heater, can be to institute Substrate is stated to be heated.
3. resin removing device as claimed in claim 1, it is characterised in that the mounting table has suction hole, and with warp By the suction hole by the mechanism of the substrate vacuum suction.
4. resin removing device as claimed in claim 1, it is characterised in that the removing instrument is installed on the depth of parallelism Governor motion is removed in decaptitating,
The mechanism for adjusting parallelism removing instrument can be made relative to the inclination of the substrate and with uniform pressure with The substrate contact.
5. the resin removing device as any one of Claims 1-4, it is characterised in that the removing instrument is by block Formed with cover sheets, the block has long side in the direction parallel with the side of the substrate, and the section of the block is in institute Stating substrate-side has angle, and 2 faces relative with the substrate are covered by the cover sheets, the cover sheets and the base Plate contacts.
6. resin removing device as claimed in claim 5, it is characterised in that the block is formed with metal.
7. resin removing device as claimed in claim 5, it is characterised in that the cover sheets are formed with resin.
8. resin removing device as claimed in claim 5, it is characterised in that the thickness of the cover sheets is 10 to 50 μm.
9. resin removing device as claimed in claim 1, it is characterised in that the mounting table is relative to the removing instrument phase The translational speed moved over the ground is 10 to 30mm/ seconds.
CN201720101819.6U 2016-02-02 2017-01-25 Resin removing device Active CN206725881U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016017748A JP2017136534A (en) 2016-02-02 2016-02-02 Resin removing device
JP2016-017748 2016-02-02

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CN206725881U true CN206725881U (en) 2017-12-08

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CN (1) CN206725881U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113351530A (en) * 2021-05-20 2021-09-07 四川旭虹光电科技有限公司 Dry wiping machine
CN114472273A (en) * 2020-11-13 2022-05-13 杰宜斯科技有限公司 Display unit cleaning device and control method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114472273A (en) * 2020-11-13 2022-05-13 杰宜斯科技有限公司 Display unit cleaning device and control method thereof
CN113351530A (en) * 2021-05-20 2021-09-07 四川旭虹光电科技有限公司 Dry wiping machine

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