CN206703163U

CN206703163U - A kind of electronic component processing mold

Info

Publication number: CN206703163U
Application number: CN201720583851.2U
Authority: CN
Inventors: 徐建仁
Original assignee: Kunshan Qun Yue Precision Die Co Ltd
Current assignee: Kunshan Qun Yue Precision Die Co Ltd
Priority date: 2017-05-24
Filing date: 2017-05-24
Publication date: 2017-12-05
Anticipated expiration: 2027-05-24

Abstract

A kind of electronic component processing mold is the utility model is related to, it includes：Lower mold assemblies, the lower mold assemblies include infrabasal plate, formed the infrabasal plate upper surface lower template, be opened in the lower template and spaced multiple tracks forming hole, be erected in more leads of the infrabasal plate upper surface and be arranged at the infrabasal plate upper surface and around the lower template more lower convexity；Upper die component, the upper die component include upper substrate, formed the lower substrate surface and the cope plate corresponding with the lower template, the adjustable plate that can be arranged on the cope plate to oscilaltion, the multiple cutting heads for being arranged on the cope plate surface and the adjustable plate being run through, the guide sleeve for being arranged on the upper substrate surface and being engaged with the lead and be arranged on the upper substrate surface and on be engaged with the lower convexity more it is raised.It can realize and once extrude and be punched to obtain the purpose of multiple electronic components, drastically increase production efficiency.

Description

A kind of electronic component processing mold

Technical field

It the utility model is related to a kind of processing mold, and in particular to a kind of electronic component processing mold.

Background technology

Electronic component is electronic component and electric small-sized machine, the part of instrument, and itself is often by some parts Form, can be general in like product；Often refer to electrical equipment, radio, some parts of the industry such as instrument, as electric capacity, transistor, The general name of the sub- device such as hairspring, clockwork spring.It common are diode etc..Due to electronic component very little, being typically when making will Many device integrations carry out cutting to it after the completion of all production processes and cause electronics member one by one on a raw band Device departs from from material strip.Therefore processing mold corresponding to needing to research and develop, can meet clamping to material strip and Multiple cutter heads are punched and synchronously obtain multiple electronic components simultaneously, to improve production efficiency.

The content of the invention

The purpose of the utility model is to provide a kind of electronic component processing mold for overcome the deficiencies in the prior art.

To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of electronic component processing mold, it is wrapped Include：

Lower mold assemblies, the lower mold assemblies include infrabasal plate, formed the infrabasal plate upper surface lower template, be opened in In the lower template and spaced multiple tracks forming hole, be erected in the infrabasal plate upper surface more leads and setting In the infrabasal plate upper surface and around more lower convexity of the lower template；

Upper die component, the upper die component include upper substrate, formed the upper substrate surface and with the lower template phase Corresponding cope plate, the adjustable plate that can be arranged on the cope plate to oscilaltion, it is arranged on the cope plate surface and can Multiple cutting heads through the adjustable plate, be arranged on the upper substrate surface and with guide sleeve that the lead is engaged with And the more upper projections for being arranged on the upper substrate surface and being engaged with the lower convexity, the cutting head and the forming hole It is engaged.

Optimally, the lower mold assemblies also include the elastic component being set on the lead and are set in the guiding The stop collar being connected on post and with the elastic component.

Optimally, offer multiple through holes in the lower template, the cope plate surface be provided with through the adjustable plate and More locating rods being engaged with the through hole.

Optimally, the lower template upper surface sets multiple positioning convex, and the regulation plate surface is provided with and the positioning The positioning hole that projection is engaged.

Because above-mentioned technical proposal is used, the utility model has following advantages compared with prior art：The utility model Electronic component processing mold, coordinated by using the lower mold assemblies and upper die component of specific structure, can be realized to material The clamping of band, and utilize the correspondence of cutting head, adjustable plate and forming hole etc., it is possible to achieve once extrude and be punched to obtain multiple electricity The purpose of sub- component, drastically increases production efficiency.

Brief description of the drawings

Accompanying drawing 1 is the use state figure of the utility model electronic component processing mold；

Accompanying drawing 2 disassembles state diagram for the utility model electronic component processing mold.

Embodiment

The utility model preferred embodiment is described in detail below in conjunction with accompanying drawing：

In the utility model relevant direction be according to the electronic component processing mold when in use, user observes Direction defined.

Electronic component processing mold as depicted in figs. 1 and 2, the main lower mold assemblies 1 for including being engaged and upper module Part 2.

Wherein, lower mold assemblies 1 include infrabasal plate 11, formed the upper surface of infrabasal plate 11 lower template 12（Can be fixed Or it is integrally formed）, be opened in lower template 12 and spaced multiple tracks strip forming hole 13, be erected on infrabasal plate 11 The more leads 16 on surface and be arranged on the upper surface of infrabasal plate 11 and around lower template 12 more lower convexity 19.Upper module Part 2 is typically mounted on lower mold assemblies 1, and it includes upper substrate 21, formed on the surface of upper substrate 21（When lower mold assemblies 1 and upper mould When component 2 is in assembled state, surface described here is the lower surface of upper substrate 21）And the cope plate corresponding with lower template 12 22nd, can oscilaltion be arranged on cope plate 22 on adjustable plate 23, be arranged on the surface of cope plate 22 and adjustable plate 23 can be run through Multiple cutting heads 25, the guide sleeve 28 that is arranged on the surface of upper substrate 21 and is engaged with lead 16 and be arranged on upper substrate 21 surfaces and more upper projections 27 being engaged with lower convexity 19, cutting head 25 is engaged with forming hole 13.In the present embodiment, Multiple through holes 14 are offered in lower template 12, and the lower surface of cope plate 22 is provided with what is run through adjustable plate 23 and be engaged with through hole 14 More locating rods 24, so as to realize the coarse positioning of lower template 12, cope plate 22 and adjustable plate 23；And adjustable plate 23 and cope plate Elastic component is installed between 22 and adjustable plate 23 is pushed away into cope plate 22 so that the free end of cutting head 25 is without departing from adjustable plate 23 Lower surface.When electronic component processing mold when in use, upper substrate 21 is extruded and moved down, and then with moving platen 22nd, cutting head 25 synchronously moves down so that template 22 and adjustable plate 23 are in contact and cutting head 25 protrudes from the following table of adjustable plate 23 Face and stretch into forming hole 13, realize the punching to material strip；When acting on the active force on processing mold and being removed, template 22 Departing from again in the presence of elastic component with adjustable plate 23 causes cutting head 25 to reset.

In the present embodiment, lower mold assemblies 1 also include the elastic component 18 being set on lead 16 and are set in lead The stop collar 17 being connected on 16 and with elastic component 18, stop collar 17 are slightly coarser than guide sleeve 28, so stop collar 17 when in use It is limited between infrabasal plate 11 and upper substrate 21, and is used for the reset of upper die component 2.It is multiple fixed that the upper surface of lower template 12 is set Position projection 15, the lower surface of adjustable plate 23 is provided with the positioning hole 26 being engaged with positioning convex 15, for forming hole 13 and cutting head 25 precision positioning.The upper surface of upper substrate 21 is formed with the connecting portion 29 being connected with lathe, so as to pacify on lathe Fill the electronic component processing mold and active force is applied to lower mold assemblies 1 to realize.

For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this, All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it It is interior.

Claims

1. a kind of electronic component processing mold, it is characterised in that it includes：

Lower mold assemblies（1）, the lower mold assemblies（1）Including infrabasal plate（11）, formed in the infrabasal plate（11）Under upper surface Template（12）, be opened in the lower template（12）Upper and spaced multiple tracks forming hole（13）, be erected in the infrabasal plate （11）More leads of upper surface（16）And it is arranged at the infrabasal plate（11）Upper surface and surround the lower template（12） More lower convexity（19）；

Upper die component（2）, the upper die component（2）Including upper substrate（21）, formed in the upper substrate（21）Surface and with institute State lower template（12）Corresponding cope plate（22）, can be arranged on the cope plate to oscilaltion（22）On adjustable plate （23）, be arranged on the cope plate（22）Surface and the adjustable plate can be run through（23）Multiple cutting heads（25）, be arranged on institute State upper substrate（21）Surface and with the lead（16）The guide sleeve being engaged（28）And it is arranged on the upper substrate（21） Surface and with the lower convexity（19）More upper projections being engaged（27）, the cutting head（25）With the forming hole（13）Phase Coordinate.

2. electronic component processing mold according to claim 1, it is characterised in that：The lower mold assemblies（1）Also include It is set in the lead（16）On elastic component（18）And it is set in the lead（16）It is upper and with the elastic component （18）The stop collar being connected（17）.

3. electronic component processing mold according to claim 1, it is characterised in that：The lower template（12）On offer Multiple through holes（14）, the cope plate（22）Surface, which is provided with, runs through the adjustable plate（23）And with the through hole（14）It is engaged More locating rods（24）.

4. electronic component processing mold according to claim 1, it is characterised in that：The lower template（12）Upper surface is set Put multiple positioning convex（15）, the adjustable plate（23）Surface is provided with and the positioning convex（15）The positioning hole being engaged （26）.