CN206697313U - A kind of inductance - Google Patents
A kind of inductance Download PDFInfo
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- CN206697313U CN206697313U CN201720273314.8U CN201720273314U CN206697313U CN 206697313 U CN206697313 U CN 206697313U CN 201720273314 U CN201720273314 U CN 201720273314U CN 206697313 U CN206697313 U CN 206697313U
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Abstract
The utility model discloses a kind of inductance, including winding, magnetic core and base, base is fixed on magnetic core, the weld part that base is provided with includes the paster pad at the positive lead-out wire pad and back side for being arranged on base for being arranged on base, wherein, lead-out wire pad is correspondingly arranged with paster pad, and lead-out wire pad in correspondence with each other is interconnected with paster pad；The lead-out wire for the winding being wound on magnetic core can be welded on lead-out wire pad, realize the through-flow demand of inductance.Understructure of the present utility model is simple so that it is small that inductance accounts for plate suqare, occupies little space, and does not influence the radiating of inductance also, effectively solves the inductance Surface Mounting Technology critical technological point in existing scheme.
Description
Technical field
The present invention relates to electronic technology field, and in particular to a kind of inductance.
Background technology
Common mode inductance, common mode choke is also, is usually used in filtering the electromagnetic interference signal of common mode in Switching Power Supply.With electricity
The Surface Mounting Technology of the device such as propulsion, common mode inductance of raising and the industry 4.0 of source veneer device layout design density, miniaturization have been
Active demand.
It is big that existing plug-in type common mode inductance accounts for plate suqare, and packaging technology is complicated；Existing paster common mode inductance is generally adopted
With skeleton structure, and paster welding end is set on skeleton, it is poor coplane degree to be present, the problems such as solderability difference；After increasing skeleton, common mode
The volume of inductance becomes big, causes to account for plate suqare change greatly, while skeleton can also stop air channel, influence common mode inductance radiating；Due to existing
With the presence of paster common mode inductance shortcomings, to ensure manufacturability and reliability, common mode inductance often is being selected, especially greatly
During electric current common mode inductance, designer tends to select dongle configuration common mode inductance.
The content of the invention
The technical problem underlying to be solved of the embodiment of the present invention is to provide a kind of inductance, solves high current in the prior art
It is big that plate suqare is accounted for existing for chip inductor, space-consuming is big, radiating is difficult, the problem of coplane degree difference.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of inductance, including winding, magnetic core and base；
Base is fixed on magnetic core, and base is provided with weld part, and weld part includes the positive lead-out wire for being arranged on base
Pad and be arranged on base the back side paster pad, lead-out wire pad is correspondingly arranged with paster pad, and in correspondence with each other
Lead-out wire pad is interconnected with paster pad；Winding is wound on magnetic core, and the lead-out wire of winding is welded in corresponding lead-out wire
Pad.
The embodiment of the invention discloses a kind of inductance, base is fixed on magnetic core, and the weld part that base is provided with includes setting
The positive lead-out wire pad in base and the paster pad at the back side for being arranged on base are put, wherein, lead-out wire pad and patch
Piece pad is correspondingly arranged, and lead-out wire pad in correspondence with each other is interconnected with paster pad；The winding being wound on magnetic core
Lead-out wire can be welded on lead-out wire pad, realize the through-flow demand of inductance.The understructure of the embodiment of the present invention is simple so that
It is small that inductance accounts for plate suqare, occupies little space, and does not influence the radiating of inductance also, effectively solves the inductance paster in existing scheme
Change critical technological point.
Brief description of the drawings
Fig. 1 is a kind of front view for inductance that the embodiment of the present invention one provides；
Fig. 2 is the front view of the base for the inductance that the embodiment of the present invention one provides；
Fig. 3 is the rear view of the base for the inductance that the embodiment of the present invention one provides；
Fig. 4 is the front view for another inductance that the embodiment of the present invention one provides；
Fig. 5 is the U-shaped sheet metal that the embodiment of the present invention one provides；
Fig. 6 is the front view for another inductance that the embodiment of the present invention one provides.
Embodiment
The present invention is described in further detail below by embodiment combination accompanying drawing.
Embodiment one：
Referring to Fig. 1, Fig. 1 shows the front view for the inductance that the present embodiment provides, as can be seen from the figure the present embodiment
Inductance, including winding 1, magnetic core 2 and base 3；Base 3 is fixed on magnetic core 2.Fig. 2 and Fig. 3 is the front view and the back of the body of base
Face view, base 3 are provided with weld part, weld part include being arranged on the positive lead-out wire pad 31 (referring to Fig. 2) of base with
And the paster pad 32 (referring to Fig. 3) at the back side of base is arranged on, wherein, lead-out wire pad is correspondingly arranged with paster pad, and
Lead-out wire pad in correspondence with each other is interconnected with paster pad；It is wound in referring to Fig. 1 windings 1 on magnetic core 2, the extraction of winding 1
Line 11 (Fig. 1) is welded in corresponding lead-out wire pad 31.
Inductance in the present embodiment can be polytype inductance, including but not limited to common mode inductance.
It is contemplated that the number of lead-out wire pad on base and the quantity of lead-out wire of winding are relative, because one
As winding there are 4 lead-out wires, it is assumed that the number of the lead-out wire pad of the present embodiment be 4.Certainly, lead-out wire here
Pad number is 4 only to facilitate follow-up explanation, does not make restriction to the lead-out wire pad number of the present embodiment, if
The number of the lead-out wire of winding is not four, and the quantity of the lead-out wire pad on base can be set with being actually needed, bottom
The specific position setting of lead-out wire pad can be depending on the quantity of lead-out wire pad on seat.
Referring to Fig. 2, the front view of 4 bases is shown.Its center base needs to be fixed on magnetic core, wherein, can
So that base is fixed on magnetic core using bonding agent；Or screw is set on the correspondence position of magnetic core and base, will using screw
Magnetic core and base are fixed together；Or magnetic core and base are fixed together using other feasible modes and structure.
Wherein, the shape of the base of the present embodiment can be the rectangle in Fig. 2, or other shapes, such as round
Shape etc., it is contemplated that inductance is regular fixed to the shape after motherboard, rectangle is than more preferably shape.Wherein, extraction is worked as
When the number of wire bonding disk is 4, it is preferred that 4 pads can be separately positioned on the position at 4 angles of base front surface, can entered
One step reduces the spatial volume of base and accounts for plate suqare on motherboard.
Paster pad corresponding with lead-out wire pad is additionally provided with the back side of base, correspondence here includes pair of quantity
Should, i.e. the corresponding paster pad of a lead-out wire pad.More excellent, lead-out wire pad is corresponding with paster pad, can also be
Lead-out wire pad is corresponding with the position of paster pad, including but not limited to the position of lead-out wire pad and paster pad on base
It is symmetrical on base to put.Wherein, paster pad is for the pad by induction soldering on motherboard, and it not only acts as fixation
The effect of inductance, the effect of connection inductance and the circuit on motherboard is also acted, so the paster pad and bottom plate at the bottom plate back side
Lead-out wire pad is interconnected corresponding to front.It is more to realize that the interconnected structure of lead-out wire pad and paster pad has
Kind, two corresponding pads are connected for example, being respectively welded at metal wire between lead-out wire pad and paster pad using both ends
Get up, the material of metal wire includes but is not limited to gold, silver, copper, iron etc..
When lead-out wire pad is illustrated in figure 24,4 paster pads are correspondingly set in base back surface, and use can
Capable structure connects paster pad with corresponding lead-out wire pad.Wherein, it is preferred in the paster pad of base back surface referring to Fig. 3
Using with lead-out wire pad identical set-up mode in Fig. 2, base back surface 4 angles set paster pad.On each angle
Lead-out wire pad connection corresponding with paster pad, it is possible to reduce the complexity that lead-out wire pad is realized with paster pad connectivity structure
Degree.
Wherein, in practice, the material of base can have a variety of, such as plastic plate, pcb board, resin plate etc., can be pre-
See, if base only on four angles set paster pad, the bonding area between base and motherboard with regard to smaller, base back surface
Joint Strength is smaller.When the vibrations that inductance is subject to are larger, paster pad be possible to can and motherboard depart from, or paster pad with
The firmness of welding between template reduces, and influences the performance of inductance.In order to further enhance the shock resistance of base, this reality
Apply in example sets extra pad to be welded with template on the back side of base, by increasing the bonding area with template, solves bottom
Seat back side Joint Strength is weak, the problem of inductance shock resistance difference.
Referring to Fig. 3, to strengthen the Joint Strength of base back surface, at least one reinforcing pad 33 is set up in base back surface.Its
In, reinforcing the quantity of pad can carry on the back according to the shape and base of the weight of inductance itself, actual antidetonation demand and base
The information such as face area are set.In addition, reinforce pad base back surface position can according to the shape of base back surface, area and add
Gu the quantity of pad is set.When paster pad is arranged on four angles of base back surface as shown in Figure 3, reinforcing weldering can be
It is uniformly arranged on base, but for the convenience of welding.Referring to Fig. 3, it is preferred that reinforce pad 33 and set along the edge of base back surface
Put.Wherein, any limit edge that pad can be arranged on the four edges of base is reinforced.Further, in order to avoid in vibrations,
Multiple reinforcing discontinuity of pad 33, reduce consolidation effect.Reinforce pad 33 can along base back surface edge uniformly and
It is symmetrically arranged, and on symmetrical side, the quantity for reinforcing pad is consistent substantially.In Fig. 3, reinforce pad be arranged on two it is right
Claim edge, the quantity of the reinforcing pad 33 on both sides is identical, and reinforces pad 33 and be uniformly distributed on edge, such reinforcing pad
33 have stronger reinforcement effect.In another embodiment, reinforcing pad can also be uniformly right on the symmetrical side on other both sides
Claim distribution, or reinforce pad and be all uniformly distributed on four edges, and the reinforcing pad on symmetrical side is symmetrical arranged..
It is contemplated that if base has metal level in itself, it can weld and conductive, then weld part can be by base in itself
Structure is formed, if base does not have metal level in itself, it is impossible to directly welding and conduction, such as base is a plastic plate, then welds
Portion can be fixed on base as dismountable structure, and lead-out wire pad and paster pad are provided for base.
In one embodiment, the base in Fig. 2 can be printed circuit board (PCB) (PCB, Printed Circuit Board),
It is well known that coming with copper plate on pcb board, the copper plate can provide lead-out wire pad and paster in weld part for base
Pad.The pad of printed circuit board (PCB) front and back, lead-out wire pad are respectively arranged in lead-out wire pad and paster pad
With corresponding paster pad by setting metallic connection parts on a printed circuit to connect.Wherein, it is preferred that PCB bases are set
Below magnetic core and coil, i.e., pcb board is fixed on side close with lead-out wire on magnetic core.
Referring to Fig. 2, PCB base front surfaces set 4 lead-out wire pads, and 4 lead-out wires of winding 1 pass through scolding tin and 4 in Fig. 1
Individual lead-out wire pad weldering one-to-one corresponding is connected together.
Wherein, it is preferred that lead-out wire pad on pcb board be arranged on paster pad be separately positioned on pcb board just, the back of the body
On four angles on two sides.
Wherein, metallic connection parts can be realized with the metal wire of lead-out wire pad and paster pad solder respectively by both ends,
It is contemplated that base area is limited, the limited size of lead-out wire pad, also needs to weld lead-out wire on lead-out wire pad, use
The mode of welded wire, which connects lead-out wire pad and paster pad, to be influenceed to the welded bands of lead-out wire.In consideration of it, it is preferred that
By the way of without welding.The present embodiment can provide 3 kinds of structures and realize connecting for lead-out wire pad and paster pad.
The first structure：In such a structure, lead-out wire pad has lap in the projection of base back surface with paster pad,
Metallic connection parts include being arranged on the metallic vias of the lap on pcb board.If the lead-out wire pad on pcb board welds with paster
The setting of disk such as Fig. 2 and Fig. 3, then metallic vias is the metallic vias for being arranged on lead-out wire pad or paster pad locations.The gold
Category via is connected to the lead-out wire pad and paster pad at the positive back side of pcb board, forms complete conductive channel, realizes conductive logical
Stream.
Second of structure：Metallic connection parts include metallization connect band, and the metallization connect band one end is in printed circuit board (PCB)
Front connection lead-out wire pad, the back side from side of the other end along printed circuit board (PCB) to printed circuit board (PCB) extend, and with extraction
Paster pad corresponding to wire bonding disk connects.If setting such as Fig. 2 and Fig. 3 of the lead-out wire pad and paster pad on pcb board, gold
Categoryization connect band is metallized by the PCB sides being connected with each lead-out wire pad and realized.It is clipped in lead-out wire pad and paster pad
Metallization side connection PCB base front surfaces and the back side pad, form complete conductive channel, realize conductive through-flow.
The third structure：The first structure and second of structure are combined, had both set metallic vias to be also provided with metallization and has connected
Tape splicing.
When base is pcb board, the reinforcing pad 33 in Fig. 3 can be realized directly by the copper plate on pcb board.Reinforce weldering
The quantity of disk can integrate base area and Joint Strength demand is set.
In such scheme, because PCB is the composite of fiberglass fiber and resin composition, used in surface-mounted device welding
Reflow soldering process in, PCB self stabilities are high, it is not easy to deform, ensure PCB manufacturing process and Reflow Soldering welding process
In solderability and coplane degree, reduce production and processing defect.Because base uses PCB material, such as FR4, and the mother of welding inductance
Material is identical used by plate, efficiently avoid due to material difference and the wind that CTE mismatch causes paster solder joint failure occurs
Danger.Meanwhile PCB bases will not only block the air channel of magnetic core and coil, moreover it is possible to help magnetic core and coil to radiate, it is ensured that device
Itself good heat-sinking capability.
Referring to Fig. 4, in another embodiment, weld part can be integrally fixed at the detachable metal part 34 of base, base
Can be nonconducting bottom plate, such as plastic plate.Using detachable metal part structure when, pad can not be set on base, profit
The function of pad is realized with the structure in detachable metal part.
Wherein, detachable metal part 34 includes the sheet metal of two panels connection, and detachable metal part is fixed on base
Afterwards, piece of metal piece is located at the front of base, and as lead-out wire pad, another sheet metal is located at the back side of base, as paster
Pad.
Wherein, sheet metal is preferably the good fine copper of electric conductivity.Detachable metal part 34 is as shown in figure 5, can do
Into U-shaped sheet metal.The design of dovetail clip is may be referred to, the openings of sizes of U-shaped is reasonably set so that U-shaped
The distance of the two panels sheet metal of sheet metal is slightly less than the thickness of base, and U-shaped sheet metal is clipped on base, utilizes U-shaped gold
Power caused by belonging to the deformation of piece is fixed on base.It is corresponding when lead-out wire has 4,4 U-shaped gold are set on base
Belong to piece.
Wherein, in order to which the fixation of U-shaped sheet metal is more firm.Projection can be set on the inner surface of U-shaped sheet metal,
Set on base and correspond to the raised groove, utilize raised and groove cooperation, the connection of reinforcing sheet metal and base.
In addition, detachable metal part can be I-shaped metalwork, connected by upper and lower two panels sheet metal and middle metal
Post composition is connect, base is provided with the neck through the positive back side of base, and neck one end is in communication with the outside, two above and below I-shaped metalwork
Connecting pole between piece sheet metal is connected in neck.
Wherein, when need to set up on base reinforce pad when, can use U-shaped or or I-shaped sheet metal realize plus
Gu the setting of pad.
Using detachable metal part structure when, because sheet metal is thick many compared with PCB copper facing, through-current capability is strong, more closes
The inductance of suitable larger current requirement.
In another embodiment, the mode of above-mentioned pcb board and detachable metal part can be combined, realized more
Excellent through-flow function.
Wherein, base is pcb board, and weld part includes fixed detachable metal part on a printed circuit.Detachably
Metal parts includes two panels sheet metal, respectively positioned at printed circuit board (PCB) front and printed circuit back；
Front and back on printed circuit board (PCB) be respectively equipped with corresponding to lead-out wire pad and paster pad, lead-out wire pad and
By setting metallic connection parts on a printed circuit to connect between corresponding paster pad；Detachable metal part is positioned at printing
The positive sheet metal of circuit board connects with the lead-out wire pad of printed circuit board (PCB)；Detachable metal part is located at printed circuit backboard
The sheet metal in face connects with the paster pad of printed circuit board (PCB).
Wherein, the shape of detachable metal part can be U-shaped, I-shaped, its corresponding fixed structure, may be referred to
The description for the relevant portion stated.It will not be repeated here.
Lead-out wire pad and the set location of paster pad and attachment structure etc. related are remembered with reference to above-mentioned on pcb board
Carry.
It is located at it is understood that lead-out wire is welded on detachable metal piece on the sheet metal of base front surface.Sheet metal exists
Paster end of the base back surface part as inductance component, because sheet metal is thick compared with PCB copper facing a lot, through-current capability is strong, more properly
The inductance of more high current requirement.
In such scheme, because PCB is the composite of fiberglass fiber and resin composition, adopted in surface-mounted device welding
In reflow soldering process, PCB self stabilities are high, it is not easy to deform, ensure that PCB manufacturing process and Reflow Soldering were welded
Solderability and coplane degree in journey, reduce production and processing defect.Because base uses PCB material, such as FR4, and weld inductance
Material is identical used by motherboard, efficiently avoid due to material is different and CTE mismatch occur causes paster solder joint failure
Risk.
Inductance is drawn for the ease of chip mounter, automatic assembling is completed, referring to Fig. 1 or Fig. 4, the chip inductor of the present embodiment
Also including top cover 4, the top cover is provided with the absorption face that inductance component is drawn for chip mounter suction nozzle, and the top cover is fixed on magnetic core, with
Base is relative.
In the present embodiment, the fixed form of top cover and base and magnetic core can be fixed using mechanical structure, such as pushed up
Hole is threaded on lid, base, blind hole corresponding to setting, magnetic core is fixed on using screw by top cover and base on magnetic core, but
The finite volume of top cover and base and magnetic core is allowed for, mechanical structure realizes that space is limited, it is preferred that top cover and base and magnetic
Dispensing mode is used between core, is fixed by binding agent, because inductance needs to bear reflow soldering, it is necessary to select heat-resisting quantity
The good binding agent of energy, binding agent includes high temperature modification epoxy glue, such as the G500 glue of Le Tai companies.
Wherein, the preferred epoxy glass-fiber-plate of the top cover of the present embodiment, secondary to select the materials such as plastic cement, the absorption face of top cover can be with root
According to device significant design size, preferred rectangle plane in structure, the other shapes such as circle are may be designed as.The present embodiment to this not
It is construed as limiting.The structure of the inductance of the present embodiment is simple, and top cover and PCB bases will not block the air channel of magnetic core and coil, be advantageous to
The radiating of inductance.
Further, it is contemplated that the depth of parallelism is high between the top cover and base of inductance, is more suitable for SMT machine pasters.In order to
Avoid the top cover of inductance and the coplane degree of base and the depth of parallelism changes increase paster difficulty, the inductance in the present embodiment also wraps
Fixed structure is included, the fixed structure is used to be relatively fixed top cover and base, that is, ensures relative between top cover and base
Position it is constant.The fixed structure can be a kind of shell for being adapted to inductance in one embodiment, the shell can by top cover,
Base, winding, magnetic core are included in.In another embodiment, fixed structure can be top cover is connected with base it is integral
Structure, for example, with reference to Fig. 6, fixed structure 5 is integrally formed with top cover and base, is extended sideways from one of top cover to base
Corresponding side surface on.It is understood that the fixed structure in Fig. 6 is a kind of preferable example, the fixed structure can be with
Extend to winding front, formed winding, magnetic core, the open architecture being included in.Wherein, for the weight to inductance and into
Originally it is controlled, the material of fixed structure is preferably plastic cement, if there are other needs to select as other materials certainly, such as
Ceramics etc..This integrally formed structure preferred mold injection molding technique is realized.Further, this integrally formed knot
Structure, simplifies device architecture, reduces device self-assembles technology difficulty, also ensure that the coplane degree and between the two of top cover and base
The depth of parallelism, be adapted to SMT machine pasters, ensure assembly precision.
Using the inductance of the present embodiment, the base being fixed on magnetic core is provided with the lead-out wire pad of welding lead-out wire, and this draws
Outlet pad connects with the paster pad of base back surface, ensure that inductance cocurrent flow demand, and the structure design of base is meeting paster
During demand, space-consuming is smaller, does not influence also to radiate, and solves chip inductor in the prior art and uses body caused by skeleton structure
Product increase, it is big to account for plate suqare, the problem of weak heat-dissipating.
Further, by setting top cover at the top of inductance, chip mounter is facilitated to draw.
Further；Base is realized by pcb board, it is possible to achieve demand that larger inductance is through-flow；It is steady using PCB material itself
The advantages of qualitative good, ensure the coplane degree and solderability of inductance paster structure；PCB bases are arranged on below magnetic core and coil, knot
Structure is compact, and occupancy inductance space is small, and it is small to account for plate suqare similar to QFN solder joints for the solder joint on PCB bases.
Further, according to inductance own wt and anti-vibration design requirement, increase in base back surface and reinforce pad.Help
In fastness of the increase induction soldering on motherboard.
Above content is to combine specific embodiment further description made for the present invention, it is impossible to assert this hair
Bright specific implementation is confined to these explanations.For general technical staff of the technical field of the invention, do not taking off
On the premise of from present inventive concept, some simple deduction or replace can also be made, should all be considered as belonging to the protection of the present invention
Scope.
Claims (11)
- A kind of 1. inductance, it is characterised in that including：Winding, magnetic core and base；The base is fixed on the magnetic core, and the base is provided with weld part, and the weld part includes being arranged on the bottom The positive lead-out wire pad of seat and the paster pad at the back side for being arranged on the base, the lead-out wire pad and the patch Piece pad is correspondingly arranged, and lead-out wire pad in correspondence with each other is interconnected with paster pad；The winding is wound in the magnetic On core, the lead-out wire of the winding is welded in corresponding lead-out wire pad.
- 2. inductance as claimed in claim 1, it is characterised in that the base is printed circuit board (PCB), the lead-out wire pad and The paster pad is respectively to be arranged on the pad of the printed circuit board (PCB) front and back, the lead-out wire pad and corresponding Paster pad is by setting metallic connection parts on the printed circuit board to connect.
- 3. inductance as claimed in claim 2, the lead-out wire pad has weight in the rear projection of the base with paster pad Folded part, the metallic connection parts include at least one metallic vias, the metallic vias be arranged on the lead-out wire pad and The corresponding lap of corresponding paster pad；And/or the metallic connection parts include metallization connect band, described metallization connect band one end is in the printed circuit board (PCB) Front connect the lead-out wire pad, side of the other end along the printed circuit board (PCB) is prolonged to the back side of the printed circuit board (PCB) Stretch, and paster pad corresponding with lead-out wire pad connection.
- 4. inductance as claimed in claim 1, it is characterised in that the weld part is detachable metal part, described detachable Metal parts is fixed on the base, includes the sheet metal of two panels connection, and the sheet metal positioned at the base front surface is extraction Wire bonding disk, the sheet metal positioned at the base back surface are paster pad.
- 5. inductance as claimed in claim 1, it is characterised in that the base is printed circuit board (PCB), and the weld part includes solid Fixed detachable metal part on the printed circuit board, the detachable metal part include two panels sheet metal, respectively position In the positive and described printed circuit back of the printed circuit board (PCB)；The positive back side on the printed circuit board (PCB) is respectively equipped with corresponding lead-out wire pad and paster pad, the lead-out wire pad By setting metallic connection parts on the printed circuit board to connect between corresponding paster pad；The detachable metal portion Part is located at the positive sheet metal of the printed circuit board (PCB) and connected with the lead-out wire pad of the printed circuit board (PCB)；The detachable gold The sheet metal that category part is located at the printed circuit back connects with the paster pad of the printed circuit board (PCB).
- 6. the inductance as described in claim 4 or 5, it is characterised in that the detachable metal part includes being fixed on base U-shaped sheet metal；Or the detachable metal part includes I-shaped metalwork, the base, which is provided with, runs through the positive back side of the base Neck, described neck one end is in communication with the outside, the I-shaped metalwork connecting pole clamping between two panels sheet metal up and down In the neck.
- 7. the inductance as described in claim any one of 1-5, it is characterised in that absorption face also is provided with including top cover, the top cover, The top cover is fixed on the magnetic core, relative with the base.
- 8. inductance as claimed in claim 7, it is characterised in that the top cover and the base pass through binding agent and the magnetic core Fixed, the binding agent includes high temperature modification epoxy glue.
- 9. inductance as claimed in claim 7, it is characterised in that the material of the top cover includes epoxy glass-fiber-plate and plastic cement.
- 10. inductance as claimed in claim 7, it is characterised in that the back side of the base is additionally provided with least one reinforcing pad.
- 11. inductance as claimed in claim 7, it is characterised in that be also used for including fixed structure, the fixed structure to described Top cover is relatively fixed with the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720273314.8U CN206697313U (en) | 2017-03-20 | 2017-03-20 | A kind of inductance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720273314.8U CN206697313U (en) | 2017-03-20 | 2017-03-20 | A kind of inductance |
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| Publication Number | Publication Date |
|---|---|
| CN206697313U true CN206697313U (en) | 2017-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201720273314.8U Active CN206697313U (en) | 2017-03-20 | 2017-03-20 | A kind of inductance |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117500155A (en) * | 2023-12-26 | 2024-02-02 | 荣耀终端有限公司 | Frame plate, circuit board assembly, terminal device and manufacturing method of frame plate |
-
2017
- 2017-03-20 CN CN201720273314.8U patent/CN206697313U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117500155A (en) * | 2023-12-26 | 2024-02-02 | 荣耀终端有限公司 | Frame plate, circuit board assembly, terminal device and manufacturing method of frame plate |
| CN117500155B (en) * | 2023-12-26 | 2024-05-24 | 荣耀终端有限公司 | Frame plate, circuit board assembly, terminal device and manufacturing method of frame plate |
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