CN206658330U - A kind of pcb board - Google Patents
A kind of pcb board Download PDFInfo
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- CN206658330U CN206658330U CN201720245422.4U CN201720245422U CN206658330U CN 206658330 U CN206658330 U CN 206658330U CN 201720245422 U CN201720245422 U CN 201720245422U CN 206658330 U CN206658330 U CN 206658330U
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- pcb
- pcb board
- coaxial line
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Abstract
The utility model discloses a kind of pcb board, pcb board includes：Base material, form dielectric on the substrate and the first PCB trace laid along the contact surface of the base material and the dielectric, first PCB trace is coaxial line, and the both ends cored wire of the coaxial line is connected with each other with the first PCB elements, the 2nd PCB elements respectively.Coaxial line is embedded between the base material of pcb board and dielectric, this cabling mode is compared with the general impedance cabling of individual layer of the prior art, because the impedance of coaxial line is very small, coaxial line can reduce the transmission loss of signal as PCB trace, and then ensure the stability and integrality of signal.In connection PCB element, the PCB elements on the cored wire and pcb board at coaxial line both ends need to only be connected, it is simple and reliable for the technological design such as various optimization PCB laminated construction, optimization PCB manufacture craft precision relative to prior art, and can be cost-effective.
Description
Technical field
PCB manufacture technology fields are the utility model is related to, more particularly to a kind of pcb board.
Background technology
PCB trace design in, especially run into cabling space it is inadequate in the case of, by increasing PCB laminations, so as to increase
Add wiring aspect, but interlayer needs to set via, the via of interlayer can cause the impedance discontinuity of cabling, bring PCB trace
Impedance mismatch problem.Also can solve the problems, such as cabling space by way of cabling is attenuated, but cabling attenuates, and can increase cabling
Transmission loss, also bring along PCB trace impedance mismatch problem.PCB trace impedance mismatching meeting, reduce the transmission matter quality of signal.
Integrality and the higher circuit of stability requirement to signal transmission can have to PCB trace impedance matching preferably to be required.
Existing PCB trace is made all on pcb board using etching technics, in order to solve PCB trace impedance mistake
With problem, the suitable line width after cabling is attenuated can be calculated according to the size of dense space in the close quarters of board.Together
When, to avoid the impedance discontinuity brought, it is calculated in the case where impedance is constant, is become using the analysis of polar software emulations
The pp thickness sizes that thin line width is referred to.The thickness is added in design, so as to realize that the impedance of signal lead is continuous
Purpose.
By improving PCB manufacture craft precision, change PP thickness while such as cabling is attenuated, reduce material DK values, or
The mode that person optimizes laminated construction optimizes impedance continuity, can increase technology difficulty and improve process costs, moreover, with letter
The rise of number dominant frequency, the demand of PCB trace impedance matching is also difficult in adapt to by the way that cabling is attenuated.
To sum up, for existing PCB trace manufacture craft when solving the problems, such as PCB trace impedance mismatching, there is complex process
Technical problem.
Utility model content
The utility model embodiment provides a kind of pcb board, and there is technique solving existing PCB trace manufacture craft to answer
Miscellaneous technical problem.
The utility model embodiment provides a kind of pcb board, including：
Base material, form dielectric on the substrate and laid along the contact surface of the base material and the dielectric
The first PCB trace, first PCB trace is coaxial line, the both ends cored wire of the coaxial line respectively with the first PCB elements,
2nd PCB elements are connected with each other.
Optionally, depth direction of the coaxial line along the pcb board runs through the pcb board, and the dielectric passes through
The base material is worn, the first PCB elements and the 2nd PCB elements are produced in the opposite face of the pcb board.
Optionally, depth direction of the coaxial line along the pcb board does not run through the pcb board, and
The first PCB elements and the 2nd PCB elements are produced in the pcb board close to the same of the base material
Face；Or
The first PCB elements and the 2nd PCB elements are produced in the pcb board close to the dielectric
The same face.
Optionally, the cored wire ecto-entad of the coaxial line includes protection sleeve, outer conductor, insulation filling medium and interior led
Body；
The ground pad of the coaxial line first end, the outer conductor at the second end respectively with the first PCB elements welds
Connect, the welding of the ground pad of the 2nd PCB elements；
The access radio frequency of the coaxial line first end, the inner wire at the second end respectively with the first PCB elements is believed
Number pad, the 2nd PCB elements incoming radio frequency signal pad solder.
Optionally, the more coaxial lines are equipped with along the contact surface of the base material and the dielectric, described in more
Coaxial line is that individual layer is set or multilayer is set.
Optionally, there are multiple routing regions on the pcb board, each routing region is laid the first PCB and walked
Line.
Optionally, at least one first routing region and at least one second routing region are included on the pcb board, it is described
First PCB trace is laid in first routing region, and the second PCB trace is laid in second routing region, wherein, described second
PCB trace is the impedance tracks of the non-coaxial line formed on the substrate according to etching technics.
Optionally, first routing region is arranged at intervals with second routing region, or the first cabling area
Domain overlaps with second routing region part.
In the utility model embodiment, the first PCB trace is a part of PCB trace on pcb board, and the first PCB trace is simultaneously
It is not the common general impedance cabling formed using etching technics, but it is embedded in the substrate using coaxial line as PCB trace,
This cabling mode is compared with the general impedance cabling of individual layer of the prior art, because the impedance of coaxial line is very small, coaxially
Line can reduce the transmission loss of signal as PCB trace, and then ensure the stability and integrality of signal.First PCB trace
For coaxial line when, only coaxial line need to be embedded between the base material of pcb board and dielectric, only by the cored wire at coaxial line both ends with
PCB elements connection on pcb board, relative to the various optimization PCB laminated construction of prior art, optimization PCB manufacture crafts
It is simple and reliable for the technological designs such as precision, and can be cost-effective.
Brief description of the drawings
Fig. 1 is a kind of structural representation for pcb board that the utility model embodiment provides；
Fig. 2 is a kind of structural representation for pcb board that the utility model embodiment provides；
Fig. 3 is a kind of structural representation for coaxial line that the utility model embodiment provides；
Fig. 4 is a kind of structural representation for pcb board that the utility model embodiment provides；
Fig. 5 is a kind of structural representation for pcb board that the utility model embodiment provides；
Fig. 6 is a kind of structural representation for pcb board that the utility model embodiment provides；
The knot for the pcb board that Fig. 7 to Figure 10 is formed by a kind of preparation method for pcb board that the utility model embodiment provides
Structure schematic diagram；
The pcb board that Figure 11 to Figure 14 is formed by a kind of preparation method for pcb board that the utility model embodiment provides
Structural representation；
The pcb board that Figure 15 to Figure 18 is formed by a kind of preparation method for pcb board that the utility model embodiment provides
Structural representation.
Embodiment
The utility model embodiment provides a kind of pcb board, including：
Base material, the dielectric formed on base material and the first PCB along the laying of the contact surface of base material and dielectric are walked
Line, the first PCB trace are coaxial line, and the both ends cored wire of coaxial line is connected with each other with the first PCB elements, the 2nd PCB elements respectively.
In the utility model embodiment, the first PCB trace is a part of PCB trace on pcb board, and the first PCB trace is simultaneously
It is not the common general impedance cabling formed using etching technics, but it is embedded in the substrate using coaxial line as PCB trace,
This cabling mode is compared with the general impedance cabling of individual layer of the prior art, because the impedance of coaxial line is very small, coaxially
Line can reduce the transmission loss of signal as PCB trace, and then ensure the stability and integrality of signal.
In addition, the PCB laminated construction being made up of in the prior art common impedance tracks needs to set via, layer in interlayer
Between via can cause the impedance discontinuity of cabling, bring PCB trace impedance mismatch problem.This pcb board of the present utility model
Cabling mode compared with PCB laminations of the prior art, impedance continuity can be kept, can solve PCB trace impedance mistake
With problem.
In addition, when the first PCB trace is coaxial line, coaxial line need to be only embedded in pcb board base material and dielectric it
Between, only the PCB elements on the cored wire and pcb board at coaxial line both ends are connected, relative to the various optimization PCB of prior art
It is simple and reliable for the technological designs such as laminated construction, optimization PCB manufacture craft precision, and can be cost-effective.
In the utility model embodiment, the first PCB elements and the 2nd PCB elements are connected with two cored wires of coaxial line
Any one possible PCB element, specifically any element are not specifically limited.
In the utility model embodiment, dielectric is covered in coaxial line surface, is to be used as the planarization layer of pcb board and same
The protective layer of axis.Dielectric can make organic resin.
Optionally, dielectric is also coated with green oil away from the surface of base material, and base material deviates from the one side of dielectric
Green oil is also coated with, the pad of PCB elements and PCB elements can be made on the green oil on the two surfaces.
The cabling mode of the pcb board provided with reference to specific embodiment the utility model embodiment illustrates.
As shown in figure 1, a kind of pcb board that the utility model embodiment provides, including：Base material 10, formed on base material 10
Dielectric 20 and along the contact surface of base material 10 and dielectric 20 lay the first PCB trace, the first PCB trace is coaxial
Line 30, the both ends cored wire of coaxial line 30 is connected with each other with the first PCB elements 40, the 2nd PCB elements 50 respectively, and coaxial line 30
Run through pcb board along the depth direction of pcb board, and dielectric 20 runs through base material 10, the first PCB elements 40 and the 2nd PCB elements
50 are produced in the opposite face of pcb board.First PCB elements 40 are produced on one side of the pcb board close to base material 10, the 2nd PCB members
Part 50 is produced on one side of the pcb board close to dielectric 20.
Optionally, in pcb board, the first PCB elements 40 include the pad GND1 of ground connection and the pad of incoming radio frequency signal
PAD1, the 2nd PCB elements 50 include the pad GND2 of ground connection and the pad PAD2 of incoming radio frequency signal.
When the both ends cored wire of coaxial line 30 is connected with each other with the first PCB elements 40, the 2nd PCB elements 50 respectively, such as Fig. 2
It is shown, the pad of the cored wire of the first end of coaxial line 30 the ground pad GND1 with the first PCB elements 40, incoming radio frequency signal respectively
PAD1 welds, the cored wire at the end of coaxial line 30 second the ground pad GND2 with the 2nd PCB elements 50, incoming radio frequency signal respectively
Pad PAD2 is welded.
It is situated between as shown in figure 3, the cored wire ecto-entad of coaxial line 30 includes protection sleeve 304, outer conductor 303, insulation filling
Matter 302 and inner wire 301.
First PCB elements 40, the 2nd PCB elements 50 are generally connected by pad with the cored wire at the both ends of coaxial line 30, and first
PCB elements 40, the pad of the 2nd PCB elements 50 generally include ground pad and the pad for transmitting radio frequency signal.
Specifically, when the both ends cored wire of coaxial line 30 is connected with each other with the first PCB elements 40, the 2nd PCB elements 50 respectively,
The first end of coaxial line 30, the outer conductor 303 at the second end weld with the ground pad GND1 of the first PCB elements 40 respectively, the 2nd PCB
Element 50 ground pad GND2 welding, the first end of coaxial line 30, the second end inner wire 301 respectively with the first PCB elements 40
The pad PAD1 of incoming radio frequency signal, the 2nd PCB elements 50 incoming radio frequency signal pad PAD2 welding.
As shown in figure 4, the utility model embodiment also provides a kind of pcb board, including：Base material 10, formed on base material 10
Dielectric 20 and along the contact surface of base material 10 and dielectric 20 lay the first PCB trace, the first PCB trace is coaxial
Line 30, the both ends cored wire of coaxial line 30 is connected with each other with the first PCB elements 40, the 2nd PCB elements 50 respectively, also, coaxial line
30 do not run through pcb board along the depth direction of pcb board, and the first PCB elements 40 and the 2nd PCB elements 50 are produced in pcb board and leaned on
The same face of nearly base material 10.
As shown in figure 5, the utility model embodiment also provides a kind of pcb board, including：Base material 10, formed on base material 10
Dielectric 20 and along the contact surface of base material 10 and dielectric 20 lay the first PCB trace, the first PCB trace is coaxial
Line 30, depth direction of the coaxial line 30 along pcb board do not run through pcb board, the both ends cored wire of coaxial line 30 respectively with the first PCB elements
40th, the 2nd PCB elements 50 are connected with each other, and depth direction of the coaxial line 30 along pcb board does not run through pcb board, the first PCB elements
40 and the 2nd PCB elements 50 be produced in the same face of the pcb board close to dielectric 20.
Optionally, in the utility model embodiment, the first PCB trace includes more coaxial lines 30, i.e., along base material 10 and absolutely
The contact surface of edge medium 20 is equipped with more coaxial lines 30, and more coaxial lines 30 are that individual layer is set or multilayer is set.To pcb board
Thickness meets to require that coaxial line 30 can also be laid to multilayer in low scene.
Optionally, in the utility model embodiment, if the signal transmitted on pcb board is required for meeting higher signal matter
Amount, then each routing region on pcb board can lay the first PCB trace.
Optionally, in the utility model embodiment, at least one first routing region and at least one the are included on pcb board
The first PCB trace is laid in two routing regions, the first routing region, and the second PCB trace is laid in the second routing region, wherein, second
PCB trace is the impedance tracks of the non-coaxial line 30 formed according to etching technics on base material 10.
Optionally, the first routing region is arranged at intervals with the second routing region, or the first routing region and the second cabling
Region part overlaps.
Optionally, the cabling of coaxial line 30 can be used in the routing region high to semaphore request, be walked for semaphore request is low
Line region, common impedance tracks can be laid, can so save the cabling cost of pcb board.
As shown in fig. 6, a kind of pcb board that the utility model embodiment provides includes a routing region A, routing region B
The first PCB trace is laid with routing region C, routing region A, routing region B and routing region C lay the second PCB trace.Cabling
Region A is the routing region high to semaphore request, and routing region B and routing region C are the routing regions not high to semaphore request.
Optionally, for the low routing region of semaphore request, if individual layer general impedance cabling can not meet semaphore request,
Multilayer can also be laid.
Conceived based on identical utility model, the utility model embodiment also provides a kind of preparation method of pcb board, wraps
Include：
Step S1, the figure 60 of the first PCB trace of laying is formed on base material 10, wherein, the first PCB trace is coaxial line
30；
Optionally, as shown in fig. 7, depth direction of the figure 60 formed on base material 10 along base material 10 extends completely through base material
10, the figure 60 formed on base material 10 is the region that base material 10 is etched away.
Step S2, coaxial line 30 is laid along the surface of figure 60；
Optionally, the section of the coaxial line 30 for the region surface laying being etched away along base material 10 is as shown in figure 8, coaxial line
Upper and lower surface of the cored wire continuation at 30 both ends to base material 10.
Step S3, laid in base material 10 and dielectric 20 is formed on the surface of coaxial line 30, obtained same along depth direction
The pcb board that axis 30 runs through；
Optionally, the pcb board run through along depth direction by coaxial line 30 is as shown in figure 9, coaxial line 30 and dielectric 20
All it is embedded in the region that base material 10 is etched away.
Step S4, make the first PCB elements 40, the 2nd PCB elements 50 respectively on pcb board；
Optionally, pcb board is run through in depth direction of the coaxial line 30 along pcb board, and when dielectric 20 runs through base material 10,
The first PCB elements 40 and the 2nd PCB elements 50 are made respectively in the apparent surface of pcb board.
The apparent surface of pcb board refers to one side of the pcb board close to dielectric 20, and pcb board close to the one of base material 10
Face.First PCB elements 40 are produced on one side of the pcb board close to dielectric 20, and it is close that the 2nd PCB elements 50 are produced on pcb board
The one side of base material 10, the pcb board structure of formation referring to Figure 10, wherein, dielectric 20 deviates from the surface of base material 10, and base material
10 are also also coated with green oil 70 away from the surface of dielectric 20, and the first PCB elements 40, the 2nd PCB elements 50 are produced in
The surface of green oil 70.
Step S5, the both ends cored wire of coaxial line 30 is attached with the first PCB elements 40, the 2nd PCB elements 50 respectively.
Specifically, the ground pad of the outer conductor of the first end of coaxial line 30 and the first PCB elements 40 is welded；By coaxial line
The pad pad solder of the incoming radio frequency signal of the inner wire of 30 first ends and the first PCB elements 40；By the end of coaxial line 30 second
Outer conductor and the 2nd PCB elements 50 ground pad weld；By the inner wire and the 2nd PCB elements 50 at the end of coaxial line 30 second
Incoming radio frequency signal pad solder.
Optionally, the ground pad GND1 of the first PCB elements 40, the pad PAD1 of incoming radio frequency signal are produced on insulation and are situated between
Matter 20 is on the green oil on the surface of base material 10.Ground pad GND2, the pad of incoming radio frequency signal of 2nd PCB elements 50
PAD2 is produced on base material 10 on the green oil on the surface of dielectric 20.
In the pcb board made using the above method, when the first PCB trace is coaxial line 30, coaxial line 30 need to only be embedded
Between the base material 10 and dielectric 20 of pcb board, only the PCB elements on the cored wire and pcb board at the both ends of coaxial line 30 are connected
, for the technological design such as various optimization PCB laminated construction relative to prior art, optimization PCB manufacture craft precision, letter
It is single reliable, and can be cost-effective.
In this pcb board made using the above method, the first PCB trace is a part of PCB trace on pcb board, than
When transmitting the signal high to demand on signal quality such as the first PCB trace, base material is embedded in using coaxial line 30 as the first PCB trace
In 10, this cabling mode is compared with the general impedance cabling of individual layer of the prior art, because the impedance of coaxial line is very small,
Coaxial line can reduce the transmission loss of signal as PCB trace, and then ensure the stability and integrality of signal.In addition, adopt
The cabling mode of this pcb board made in aforementioned manners can keep impedance continuous compared with PCB laminations of the prior art
Property, can solve PCB trace impedance mismatch problem.
Conceived based on identical utility model, the utility model embodiment also provides a kind of preparation method of pcb board, wraps
Include：
Step S10, the figure 60 of the first PCB trace of laying is formed on base material 10, wherein, the first PCB trace is coaxial
Line 30；
Optionally, as shown in figure 11, depth direction of the figure 60 formed on base material 10 along base material 10 extends completely through base material
10, the shape in the region that figure 60 is etched for the upper surface of base material 10.
Step S20, coaxial line 30 is laid along the surface of figure；
Optionally, the section such as Figure 12 institutes for the coaxial line 30 that the region surface being etched along the upper surface of base material 10 is laid
Show, the cored wire continuation at the both ends of coaxial line 30 is to the diverse location of the lower surface of base material 10, and the cored wire continuation at the both ends of coaxial line 30 is extremely
The lower surface of base material 10.
Step S30, base material 10 lay coaxial line 30 surface on formed dielectric 20, obtain along depth direction not by
The pcb board that coaxial line 30 runs through；
Optionally, the pcb board not run through along depth direction by coaxial line 30 is as shown in figure 13, coaxial line 30 and dielectric
20 are all embedded in the region that base material 10 is etched away, and the cored wire continuation at the both ends of coaxial line 30 is to the lower surface of base material 10.
Step S40, make the first PCB elements 40, the 2nd PCB elements 50 respectively on pcb board；
Optionally, as shown in figure 14, when depth direction of the coaxial line 30 along pcb board does not run through pcb board, leaned in pcb board
The same face of nearly base material 10 makes the first PCB elements 40 and the 2nd PCB elements 50 respectively；Wherein, dielectric 20 deviates from base material
10 surface is also coated with green oil 70, and the first PCB elements 40, the 2nd PCB elements 50 are produced in base material 10 and be situated between away from insulation
The surface of green oil 70 on the surface of matter 20.
Step S50, the both ends cored wire of coaxial line 30 is connected with the first PCB elements 40, the 2nd PCB elements 50 respectively
Connect.
Specifically, the ground pad of the outer conductor of the first end of coaxial line 30 and the first PCB elements 40 is welded；By coaxial line
The pad pad solder of the incoming radio frequency signal of the inner wire of 30 first ends and the first PCB elements 40；By the end of coaxial line 30 second
Outer conductor and the 2nd PCB elements 50 ground pad weld；By the inner wire and the 2nd PCB elements 50 at the end of coaxial line 30 second
Incoming radio frequency signal pad solder.
Optionally, the ground pad GND1 of the first PCB elements 40, the pad PAD1 of incoming radio frequency signal are produced on base material 10
On the green oil on the surface of dielectric 20.Ground pad GND2, the pad of incoming radio frequency signal of 2nd PCB elements 50
PAD2 is produced on base material 10 on the green oil on the surface of dielectric 20.
In the pcb board made using the above method, when the first PCB trace is coaxial line 30, coaxial line 30 need to only be embedded
Between the base material 10 and dielectric 20 of pcb board, only the PCB elements on the cored wire and pcb board at the both ends of coaxial line 30 are connected
, for the technological design such as various optimization PCB laminated construction relative to prior art, optimization PCB manufacture craft precision, letter
It is single reliable, and can be cost-effective.
In this pcb board made using the above method, the first PCB trace is a part of PCB trace on pcb board, than
When transmitting the signal high to demand on signal quality such as the first PCB trace, base material is embedded in using coaxial line 30 as the first PCB trace
In 10, this cabling mode is compared with the general impedance cabling of individual layer of the prior art, because the impedance of coaxial line is very small,
Coaxial line can reduce the transmission loss of signal as PCB trace, and then ensure the stability and integrality of signal.In addition, adopt
The cabling mode of this pcb board made in aforementioned manners can keep impedance continuous compared with PCB laminations of the prior art
Property, can solve PCB trace impedance mismatch problem.
Conceived based on identical utility model, the utility model embodiment also provides a kind of preparation method of pcb board, wraps
Include：
Step S100, the figure 60 of the first PCB trace of laying is formed on base material 10, wherein, the first PCB trace is coaxial
Line 30；
Optionally, as shown in figure 15, base material is run through in depth direction part of the figure 60 formed on base material 10 along base material 10
10, the region that the figure 60 formed on base material 10 is etched for the upper surface of base material 10.
Step S200, coaxial line 30 is laid along the surface of figure 60；
Optionally, the section for the coaxial line 30 laid along the surface of figure 60 is as shown in figure 16, and coaxial line 30 is along base material 10
The region surface laying that is etched of upper surface, the different positions of the cored wire continuation at the both ends of coaxial line 30 to the upper surface of base material 10
Put.
Step S300, laid in base material 10 and dielectric 20 is formed on the surface of coaxial line 30, obtained along depth direction not
The pcb board run through by coaxial line 30；
Optionally, the pcb board not run through along depth direction by coaxial line 30 is as shown in figure 17, coaxial line 30 and dielectric
20 are all embedded in the region that base material 10 is etched away, and the cored wire continuation at the both ends of coaxial line 30 is to the upper table of dielectric 20
Face.
Step S400, make the first PCB elements 40, the 2nd PCB elements 50 respectively on pcb board；
Optionally, as shown in figure 18, when depth direction of the coaxial line 30 along pcb board does not run through pcb board, leaned in pcb board
The same face of nearly dielectric 20 makes the first PCB elements 40 and the 2nd PCB elements 50 respectively.Wherein, dielectric 20 deviates from
The surface of base material 10 is also coated with green oil 70, and the first PCB elements 40, the 2nd PCB elements 50 are produced in dielectric 20 and carried on the back
From the surface of green oil 70 on the surface of base material 10.
Step S500, the both ends cored wire of coaxial line 30 is connected with the first PCB elements 40, the 2nd PCB elements 50 respectively
Connect.
Specifically, the ground pad of the outer conductor of the first end of coaxial line 30 and the first PCB elements 40 is welded；By coaxial line
The pad solder of the incoming radio frequency signal of the inner wire of 30 first ends and the first PCB elements 40；By the outer of the end of coaxial line 30 second
The ground pad of conductor and the 2nd PCB elements 50 welds；By the inner wire at end of coaxial line 30 second and connecing for the 2nd PCB elements 50
Enter the pad solder of radiofrequency signal.
Optionally, the ground pad GND1 of the first PCB elements 40, the pad PAD1 of incoming radio frequency signal are produced on insulation and are situated between
Matter 20 is on the green oil on the surface of base material 10.Ground pad GND2, the pad of incoming radio frequency signal of 2nd PCB elements 50
PAD2 is produced on dielectric 20 on the green oil on the surface of base material 10.
Optionally, after above-mentioned steps S5, step S50, step S500, in addition to：
The second PCB trace is formed according to etching technics on base material 10, the second PCB trace is walked for the impedance of non-coaxial line 30
Line；Wherein, the region where the second PCB trace is arranged at intervals with the region where the first PCB trace, or part is overlapping.
In the pcb board made using the above method, when the first PCB trace is coaxial line 30, coaxial line 30 need to only be embedded
Between the base material 10 and dielectric 20 of pcb board, only the PCB elements on the cored wire and pcb board at the both ends of coaxial line 30 are connected
, for the technological design such as various optimization PCB laminated construction relative to prior art, optimization PCB manufacture craft precision, letter
It is single reliable, and can be cost-effective.
In this pcb board made using the above method, the first PCB trace is a part of PCB trace on pcb board, than
When transmitting the signal high to demand on signal quality such as the first PCB trace, base material is embedded in using coaxial line 30 as the first PCB trace
In 10, this cabling mode is compared with the general impedance cabling of individual layer of the prior art, because the impedance of coaxial line is very small,
Coaxial line can reduce the transmission loss of signal as PCB trace, and then ensure the stability and integrality of signal.In addition, adopt
The cabling mode of this pcb board made in aforementioned manners can keep impedance continuous compared with PCB laminations of the prior art
Property, can solve PCB trace impedance mismatch problem.
Obviously, those skilled in the art can to the utility model embodiment carry out it is various change and modification without departing from
Spirit and scope.So, if these modifications and variations of the utility model embodiment belong to the application right and wanted
Ask and its equivalent technologies within the scope of, then the application be also intended to comprising these change and modification including.
Claims (10)
- A kind of 1. pcb board, it is characterised in that including：Base material, form dielectric on the substrate and the along the laying of the contact surface of the base material and the dielectric One PCB trace, first PCB trace are coaxial line, the both ends cored wire of the coaxial line respectively with the first PCB elements, second PCB elements are connected with each other.
- 2. pcb board as claimed in claim 1, it is characterised in that depth direction of the coaxial line along the pcb board runs through institute Pcb board is stated, and the dielectric runs through the base material, the first PCB elements and the 2nd PCB elements are produced in The opposite face of the pcb board.
- 3. pcb board as claimed in claim 1, it is characterised in that depth direction of the coaxial line along the pcb board does not run through The pcb board, andThe first PCB elements and the 2nd PCB elements are produced in the same face of the pcb board close to the base material； OrThe first PCB elements and the 2nd PCB elements are produced in the pcb board close to the same of the dielectric Face.
- 4. pcb board as claimed in claim 1, it is characterised in thatThe cored wire ecto-entad of the coaxial line includes protection sleeve, outer conductor, insulation filling medium and inner wire；The coaxial line first end, the outer conductor at the second end weld with the ground pad of the first PCB elements respectively, institute State the ground pad welding of the 2nd PCB elements；The coaxial line first end, the second end the inner wire respectively with the incoming radio frequency signal of the first PCB elements Pad, the 2nd PCB elements incoming radio frequency signal pad solder.
- 5. pcb board as claimed in claim 1, it is characterised in that laid along the contact surface of the base material and the dielectric There are the more coaxial lines, the more coaxial lines are that individual layer is set or multilayer is set.
- 6. the pcb board as any one of claim 1 to 5, it is characterised in that there are multiple routing regions on the pcb board, Lay first PCB trace in each routing region.
- 7. the pcb board as any one of claim 1 to 5, it is characterised in that include at least one the on the pcb board One routing region and at least one second routing region, the first routing region laying first PCB trace, described second The second PCB trace is laid in routing region, wherein, second PCB trace is formed on the substrate according to etching technics The impedance tracks of non-coaxial line.
- 8. pcb board as claimed in claim 7, it is characterised in that between first routing region and second routing region Overlapped every setting, or first routing region with second routing region part.
- 9. the pcb board as any one of claim 1 to 5, it is characterised in that the dielectric is organic resin.
- 10. the pcb board as any one of claim 1 to 5, it is characterised in that the dielectric deviates from the base material Surface, and the base material is also coated with green oil away from the surface of the dielectric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720245422.4U CN206658330U (en) | 2017-03-14 | 2017-03-14 | A kind of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720245422.4U CN206658330U (en) | 2017-03-14 | 2017-03-14 | A kind of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206658330U true CN206658330U (en) | 2017-11-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106912160A (en) * | 2017-03-14 | 2017-06-30 | 上海摩软通讯技术有限公司 | A kind of pcb board and preparation method thereof |
| CN114916133A (en) * | 2022-05-20 | 2022-08-16 | 维沃移动通信有限公司 | Flexible circuit board and electronic equipment |
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2017
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106912160A (en) * | 2017-03-14 | 2017-06-30 | 上海摩软通讯技术有限公司 | A kind of pcb board and preparation method thereof |
| CN114916133A (en) * | 2022-05-20 | 2022-08-16 | 维沃移动通信有限公司 | Flexible circuit board and electronic equipment |
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