CN206638852U - A kind of photon chip structure of controlling temperature based on TEC - Google Patents
A kind of photon chip structure of controlling temperature based on TEC Download PDFInfo
- Publication number
- CN206638852U CN206638852U CN201720295045.5U CN201720295045U CN206638852U CN 206638852 U CN206638852 U CN 206638852U CN 201720295045 U CN201720295045 U CN 201720295045U CN 206638852 U CN206638852 U CN 206638852U
- Authority
- CN
- China
- Prior art keywords
- heat
- photon chip
- tec
- conducting plate
- pcb substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Control Of Temperature (AREA)
Abstract
It the utility model is related to a kind of TEC structure of controlling temperature, a kind of more particularly to photon chip structure of controlling temperature based on TEC, the PCB substrate and heat-conducting plate of electrode are adjusted including temperature control target photon chip, for drawing photon chip heat, the heat-conducting plate is provided with heat conduction boss, and the photon chip is bonded on heat conduction boss；Through hole is offered in the PCB substrate, the photon chip protrudes from the upper surface of PCB substrate, and the heat of photon chip adjusts electrode to lead to PCB substrate；The heat-conducting plate bottom is attached to the cold end of TEC cooling pieces, and the hot junctions of TEC cooling pieces is attached to the upper surface of heat dissipation base, immediately below heat-conducting plate side-wall hole to heat conduction boss, hole built with NTC temperature sensors,.Method of the utility model by integrating TEC and photon chip, solves the problems, such as temperature drift in photon chip heat modulation, and the efficiency for carrying out heat to the photon chip and adjusting coupling and encapsulation is substantially increased, have the advantages that small volume, compact-sized, efficiency high, integrated level are high.
Description
Technical field
It the utility model is related to a kind of TEC structure of controlling temperature, more particularly to a kind of photon chip structure of controlling temperature based on TEC.
Background technology
Semiconductor cooler TEC is made using the Peltier effect of semi-conducting material, so-called Peltier effect
Refer to, when the galvanic couple that direct current is made up of two kinds of semi-conducting materials, its one end heat absorption, the phenomenon of other end heat release.It is based on
TEC temperature control scheme has the advantages that small volume is easily controllable, is had a wide range of applications in semiconductor applications.
Silicon based photon has learnt significant progress in recent years.Due to the manufacture craft and microelectronics of silicon substrate integrated optical device
Technique is completely compatible；And the carrier wave light wave transmitted in photon chip is the biography that a kind of electromagnetic wave of very high frequency can be signal
It is defeated that great bandwidth is provided；In addition with less retardation and great bandwidth room for promotion.Silicon based photon chip exactly exists
Turn into a popular research field under this background, emerged in an endless stream based on the new device of new design thereon.Particularly photoswitch,
These devices based on fuel factor principle such as micro-ring resonant cavity, waveguide delay line, bio-sensing chip, have higher temperature quick
Perception.And the active optical component such as integrated silicon-based laser, detector is required for external electrode to be modulated on piece, and this is just right
The temperature stability of photon chip proposes higher requirement.
Utility model content
The technical problems to be solved in the utility model is to propose a kind of photon chip structure of controlling temperature based on TEC.By this
Structure assembly TEC and photon chip method, solve the problems, such as temperature drift in photon chip heat modulation, and substantially increase to this
Photon chip carries out the efficiency that heat adjusts coupling and encapsulation.
To achieve the above object, the utility model provides following technical scheme：A kind of photon chip temperature control based on TEC
Structure, including temperature control target photon chip, PCB substrate and heat-conducting plate for drawing photon chip heat tune electrode, it is described to lead
Hot plate is provided with heat conduction boss, and the photon chip is bonded on heat conduction boss by heat conduction elargol；Opened up in the PCB substrate
There is through hole, the photon chip is through the through hole and protrudes from the upper surface of PCB substrate, and the heat of photon chip adjusts electrode by drawing
Line bonding mounting method leads to PCB substrate；The heat-conducting plate bottom is attached to the cold end of TEC cooling pieces, TEC by heat-conducting silicone grease
The hot junction of cooling piece is attached to the upper surface of heat dissipation base by heat-conducting silicone grease, immediately below heat-conducting plate side-wall hole to heat conduction boss,
Hole full of heat-conducting silicone grease to place NTC temperature sensors and heat-conducting plate therein abundant built with NTC temperature sensors, in hole
Thermo-contact, NTC temperature sensors are coated exposed copper lead by uv-curable glue.
Preferably, PCB substrate is fastened on heat-conducting plate by bolt.
Preferably, heat-conducting plate uses fine copper of the thermal conductivity factor for 398W/m.K.
Preferably, heat-conducting plate is fastened by bolts with heat dissipation base, and be provided between heat-conducting plate and heat dissipation base with TEC etc.
High anti-compression leg.
Preferably, heat dissipation base is made of aluminium alloy.
Preferably, heat dissipation base bottom array is arranged the radiating surface that 35 thickness are 0.5mm intervals mm, and centre is reserved
The longitudinal ventilation road of 4mm width.
Preferably, heat dissipation base bottom design has supporting construction and remains for the bolt hole of fastening in advance.
It is of the present utility model to have technical effect that：Method of the utility model by integrating TEC and photon chip, is solved
In photon chip heat modulation the problem of temperature drift, and the efficiency for carrying out heat to the photon chip and adjusting coupling and encapsulation is substantially increased,
Have the advantages that small volume, compact-sized, efficiency high, integrated level are high.Meanwhile the photon chip for being integrated with TEC is also based on it
Derivative device move towards practical effective way be provided.
Brief description of the drawings
Fig. 1 is photon chip structure of controlling temperature main body three-dimensional separation figure of the utility model based on TEC；
Fig. 2 is photon chip structure of controlling temperature main body graphics of the utility model based on TEC；
Fig. 3 is photon chip structure of controlling temperature of the utility model based on TEC, the heat conduction boss signal with NTC sensor
Figure；
Fig. 4 is photon chip structure of controlling temperature of the utility model based on TEC, PCB substrate schematic diagram；
Fig. 5 is photon chip structure of controlling temperature of the utility model based on TEC, heat dissipation base structural representation.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining this
Utility model, it is not used to limit the utility model.
As shown in Fig. 1,2,3,4,5, for the photon chip temperature control based on TEC of the preferred embodiment of the utility model offer
Structural representation.A kind of photon chip structure of controlling temperature based on TEC, including temperature control target photon chip 1, for drawing photon core
The heat of piece 1 adjusts the PCB substrate 2 and heat-conducting plate 3 of electrode, and the heat-conducting plate 3 is provided with heat conduction boss 4, and the photon chip 1 passes through
Heat conduction elargol is bonded on heat conduction boss 4；Through hole is offered in the PCB substrate 2, the photon chip 1 passes through the through hole simultaneously
The upper surface of PCB substrate 2 is protruded from, the heat of photon chip 1 adjusts electrode to lead to PCB substrate 2 by wire bonding mounting method；
The bottom of heat-conducting plate 3 is attached to the cold end of TEC cooling pieces 6 by heat-conducting silicone grease 5, and the hot junction of TEC cooling pieces 6 passes through heat-conducting silicone grease
5 are attached to the upper surface of heat dissipation base 7, and the side-wall hole 8 of heat-conducting plate 3 is to the underface of heat conduction boss 4, and hole 8 is built with NTC TEMPs
Device 9, make it that placing NTC temperature sensors 9 and heat-conducting plate 3 therein fully thermally contacts full of heat-conducting silicone grease 5 in hole 8, NTC temperature
Sensor 9 is coated exposed copper lead by uv-curable glue.
The utility model is not limited to above-mentioned embodiment, and the device main body material can also be that other heat conductivilitys are excellent
Material, two anti-compression legs of rectangle can also be cylinder or other structures on heat dissipation base.Therefore, it is every in the utility model
Any simple deformation made on the basis of claim technical scheme is all intended to the row of protection domain in the utility model.
The thickness of PCB substrate 2 is h2, and connecing clamshell soft arranging wire under the 0.5mm spacing of each reserved 26 pins of upper and lower ends connects
Mouthful, greatly facilitate the extraction of the Top electrode of photon chip thickness h 1.
PCB substrate 2 is placed on 4 screws for aliging reserved on heat conduction boss, is fixed using M2 hexagon socket head cap screws.
The height h3 of heat conduction boss 4, liquid heat conductive elargol is first being coated thereon, place photon chip 1 and be directed at PCB substrate 2
On through hole 21.High-temperature baking case is then placed according to heat conduction elargol specification set temperature value, light is reached after some time
The effect that sub- chip and heat conduction boss are permanently fixed.It should ensure that h1+h3 is slightly larger than h2 herein.
The Top electrode of photon chip 1 and PCB substrate 2 are connected using Wire Bonding Technology.
For TEC refrigerators 6 from 17 pairs of thermocouples are possessed, tolerance 10A current work voltages are that 2V maximum cooling capacities are 4.8W,
Size 15mm*15mm 01710 type.In the uniform coated with thermally conductive silicone grease 5 of the upper and lower surface of TEC refrigerators 6.Cold end is attached to heat-conducting plate 3
Lower end, hot junction are attached to the upper end of heat dissipation base 7, and cause the alignment of the fixing threaded hole of heat-conducting plate 3 and heat dissipation base 7, first tighten against pressure
Two bolts in post 71, two bolts of the other end are then slowly alternately tightened, can so eliminate the processing of anti-compression leg 71
Error causes TEC refrigerators 6 to contact untight problem.The height h4 of anti-compression leg 71 should be equal to the thickness of TEC refrigerators 6, protect
Demonstrate,prove the close thermal contact of TEC refrigerators 6 and up-down structure.
The NTC temperature sensors 9 for carrying out real time temperature feedback are drawn by bare copper wire.To prevent NTC lead-out wires and leading
The short circuit of hot plate 3, appropriate uv-curable glue causes the bare copper wire in heat conduction boss to cover all in the drop of NTC roots, ultraviolet
30 seconds fixed lines are irradiated under lamp, 50 DEG C of high-temperature cabinets is then placed in and toasts progress aging in 1 hour.
Heat-conducting silicone grease is irrigated into heat conduction plateau sidewall perforate 8, NTC is inserted in the lateral orifices of heat-conducting plate 3, accurately detects photon
The real time temperature of chip 1.
Preferably, heat-conducting plate 3 uses fine copper of the thermal conductivity factor for 398W/m.K.It is provided between heat-conducting plate 3 and heat dissipation base 7
The contour anti-compression leg 71 with TEC.Heat dissipation base 7 is made of aluminium alloy.The bottom array of heat dissipation base 7 35 thickness of arranging are
0.5mm intervals 1mm radiating surface 72, the longitudinal ventilation road 75 of the reserved 4mm width in centre.The bottom design of heat dissipation base 7 has support
Structure 73 and the bolt hole 74 for remaining for fastening in advance.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (7)
- A kind of 1. photon chip structure of controlling temperature based on TEC, it is characterised in that：Including temperature control target photon chip (1), for drawing Go out PCB substrate (2) and heat-conducting plate (3) that photon chip (1) heat adjusts electrode, the heat-conducting plate (3) is provided with heat conduction boss (4), the photon chip (1) is bonded on heat conduction boss (4) by heat conduction elargol；Through hole is offered on the PCB substrate (2) (21), the photon chip (1) through the through hole (21) and protrudes from the upper surface of PCB substrate (2), the heat of photon chip (1) Electrode is adjusted to lead to PCB substrate (2) by wire bonding mounting method；Pasted by heat-conducting silicone grease (5) heat-conducting plate (3) bottom Cold end in TEC cooling pieces (6), the hot junction of TEC cooling pieces (6) are attached to the upper end of heat dissipation base (7) by heat-conducting silicone grease (5) Face, heat-conducting plate (3) side-wall hole (8) is to heat conduction boss (4) underface, and hole (8) are built with NTC temperature sensors (9), hole (8) In cause to place the fully thermo-contact of NTC temperature sensors (9) therein and heat-conducting plate (3), NTC temperature full of heat-conducting silicone grease (5) Sensor (9) is coated exposed copper lead by uv-curable glue.
- 2. the photon chip structure of controlling temperature based on TEC as claimed in claim 1, it is characterised in that：PCB substrate (2) passes through bolt It is fastened on heat-conducting plate (3).
- 3. the photon chip structure of controlling temperature based on TEC as claimed in claim 1, it is characterised in that：Heat-conducting plate (3) uses heat conduction Coefficient is 398W/m.K fine copper.
- 4. the photon chip structure of controlling temperature based on TEC as claimed in claim 1, it is characterised in that：Heat-conducting plate (3) and radiating bottom Seat (7) is fastened by bolts, and the anti-compression leg (71) contour with TEC is provided between heat-conducting plate (3) and heat dissipation base (7).
- 5. the photon chip structure of controlling temperature based on TEC as claimed in claim 1, it is characterised in that：Heat dissipation base (7) uses aluminium Alloy is made.
- 6. the photon chip structure of controlling temperature based on TEC as claimed in claim 1, it is characterised in that：Heat dissipation base (7) bottom battle array Arrange the radiating surface (72) that 35 thickness are 0.5mm intervals 1mm of arranging, the longitudinal ventilation road (75) of the reserved 4mm width in centre.
- 7. the photon chip structure of controlling temperature based on TEC as claimed in claim 1, it is characterised in that：Heat dissipation base (7) bottom is set Remain in respect of supporting construction (73) and in advance the bolt hole (74) of fastening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720295045.5U CN206638852U (en) | 2017-03-24 | 2017-03-24 | A kind of photon chip structure of controlling temperature based on TEC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720295045.5U CN206638852U (en) | 2017-03-24 | 2017-03-24 | A kind of photon chip structure of controlling temperature based on TEC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206638852U true CN206638852U (en) | 2017-11-14 |
Family
ID=60258755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720295045.5U Active CN206638852U (en) | 2017-03-24 | 2017-03-24 | A kind of photon chip structure of controlling temperature based on TEC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206638852U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106814422A (en) * | 2017-03-24 | 2017-06-09 | 中国电子科技集团公司第三十八研究所 | A kind of photon chip structure of controlling temperature based on TEC |
| WO2020042365A1 (en) * | 2018-08-30 | 2020-03-05 | 崔来 | Ultraviolet sterilization lamp device and sterilization apparatus |
| CN113406468A (en) * | 2021-06-17 | 2021-09-17 | 中国科学院半导体研究所 | Optoelectronic device test platform based on TEC |
-
2017
- 2017-03-24 CN CN201720295045.5U patent/CN206638852U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106814422A (en) * | 2017-03-24 | 2017-06-09 | 中国电子科技集团公司第三十八研究所 | A kind of photon chip structure of controlling temperature based on TEC |
| CN106814422B (en) * | 2017-03-24 | 2023-05-16 | 中国电子科技集团公司第三十八研究所 | Photon chip temperature control structure based on TEC |
| WO2020042365A1 (en) * | 2018-08-30 | 2020-03-05 | 崔来 | Ultraviolet sterilization lamp device and sterilization apparatus |
| CN113406468A (en) * | 2021-06-17 | 2021-09-17 | 中国科学院半导体研究所 | Optoelectronic device test platform based on TEC |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106814422A (en) | A kind of photon chip structure of controlling temperature based on TEC | |
| CN102460861B (en) | Semiconductor light modulating device | |
| CN206638852U (en) | A kind of photon chip structure of controlling temperature based on TEC | |
| CN100581333C (en) | Cooling substrate of micro heat pipe | |
| US9041502B2 (en) | Heat dissipating electromagnetic device arrangement | |
| CN203415815U (en) | Coaxial packaged refrigeration type laser tube core | |
| CN202759153U (en) | High-thermal-load large-power semiconductor laser | |
| CN102570293A (en) | High thermal load large power semiconductor laser | |
| US7939919B2 (en) | LED-packaging arrangement and light bar employing the same | |
| CN102376845A (en) | Packaging structure of light-emitting diode | |
| KR20080023744A (en) | Electronic module assembly with heat spreader | |
| CN101350390A (en) | LED encapsulation structure | |
| CN106783753A (en) | Semiconductor devices | |
| KR101022485B1 (en) | Heat radiation structure of led illuminating device using heat pipe module | |
| CN203351644U (en) | Flip-chip LED support and surface mounted LED | |
| CN109244225B (en) | A kind of packaging method of flip-over type LED chip | |
| CN101720407A (en) | A light-emitting diode lighting device | |
| CN211125695U (en) | L ED support with ceramic dam | |
| US9935251B1 (en) | LED chip packaging with high performance thermal dissipation | |
| CN202454612U (en) | Chip packaging structure | |
| CN105070703A (en) | Rectifier bridge packaging structure with high heat radiating performance | |
| CN206432253U (en) | Semiconductor devices | |
| CN201884987U (en) | High-heat-conducting integrated light-emitting diode (LED) structure | |
| CN105244432A (en) | LED point-like COB module and manufacturing method thereof | |
| CN204792772U (en) | U -shaped pin rectifier bridge packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201204 Address after: No. 28-2, Xiyuan 1st Road, Shapingba District, Chongqing 400030 Patentee after: UNITED MICROELECTRONICS CENTER Co.,Ltd. Address before: 230000, 199 camphor Road, hi tech Development Zone, Anhui, Hefei Patentee before: 38th Research Institute, China Electronics Technology Group Corp. |