CN206624867U - Conducting-heat elements and heater - Google Patents

Conducting-heat elements and heater Download PDF

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Publication number
CN206624867U
CN206624867U CN201720340203.4U CN201720340203U CN206624867U CN 206624867 U CN206624867 U CN 206624867U CN 201720340203 U CN201720340203 U CN 201720340203U CN 206624867 U CN206624867 U CN 206624867U
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China
Prior art keywords
conducting
baffle plate
substrate
heating
thermal conductive
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CN201720340203.4U
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Chinese (zh)
Inventor
戴立忠
范旭
卓红俞
吴岭
彭龙
昌雄
傅国
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Sansure Biotech Inc
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Sansure Biotech Inc
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Abstract

A kind of conducting-heat elements and heater, it includes substrate, baffle plate and multiple cylinders, the substrate is provided with heating zone, periphery of the baffle plate along the heating zone and set, the multiple cylinder is located at the heating zone and in the baffle plate, the heating is distinguished into multiple heating installation positions by the multiple cylinder and the baffle plate, and the multiple cylinder, the baffle plate and the substrate are used to carry out heat transfer to the thermal part to be added on the heating installation position.Above-mentioned conducting-heat elements, the heating of heater block is waited suitable for deep-well plates.Thermal part to be added is on heating installation position, and it can be contacted with conducting-heat elements and to form honeycomb parcel heat transfer type, make thermal part to be added bottom and side wall by heat transfer, therefore the conduction of heat of the conducting-heat elements is uniform, the being heated evenly property and the efficiency of heating surface of thermal part to be added are improved, avoid only causes the problem of heat transfer is uneven and the efficiency of heating surface is low by the mode of heating of bottom heat transfer.

Description

Conducting-heat elements and heater
Technical field
Technical field of heating is the utility model is related to, more particularly to a kind of conducting-heat elements and heater.
Background technology
In the research such as genetic recombination, DNA sequence analysis, biochip technology and gene diagnosis and therapy, gene expands Increase the basic skills and means that (PCR) and the quantitative analysis to target dna are scientific research, clinical diagnosis, and gene magnification and Quantitative detection process needs to extract nucleic acid from the blood of human body, body fluid or other secretion.Extract the currently used instrument of nucleic acid Device is nucleic acid automatic extracting instrument, wherein deep-well plates be it is a kind of be applied to processing, transfer and storing liquid sample orifice plate, deep-well plates Have become the conventional tool in analysis and research and clinical diagnosis test laboratory.The each hole of deep-well plates usually can accommodate tens of Microlitre several milliliters of liquid is arrived, it can be used for low temperature and long period storage liquid sample, can also be heated to control wherein The temperature of liquid sample.Due to the special structure of deep-well plates, in general mode of heating heat transfer is uneven, and the efficiency of heating surface It is low.
Utility model content
Based on this, it is necessary to provide the conducting-heat elements and heater that a kind of heat transfer is uniform, the efficiency of heating surface is high.
A kind of conducting-heat elements, including substrate, baffle plate and multiple cylinders, the substrate are provided with heating zone, and the baffle plate is along institute State the periphery of heating zone and set, the multiple cylinder located at the heating zone and in the baffle plate, the multiple cylinder and The heating is distinguished into multiple heating installation positions by the baffle plate, and the multiple cylinder, the baffle plate and the substrate are used for pair Thermal part to be added on the heating installation position carries out heat transfer.
Above-mentioned conducting-heat elements, the heating of heater block is waited suitable for deep-well plates.Thermal part to be added is located at heating installation position On, and can be contacted with conducting-heat elements to be formed honeycomb parcel heat transfer type, make thermal part to be added bottom and side wall by heat Conduction, therefore the conduction of heat of the conducting-heat elements is uniform, improves the being heated evenly property and the efficiency of heating surface of thermal part to be added, keeps away Exempt from only to cause the problem of heat transfer is uneven and the efficiency of heating surface is low by the mode of heating of bottom heat transfer.
In one of the embodiments, the multiple cylinder is array distribution, and the side wall of the cylinder is provided with four first Thermal conductive surface, four first thermal conductive surfaces are distributed in the circumference of the side wall of the cylinder, and four first thermal conductive surfaces are used respectively Heat transfer is carried out in the side wall of the thermal part to be added to four on the heating installation position, the inner side of the baffle plate corresponds to multiple institutes State heating installation position and be provided with multiple second thermal conductive surfaces;At the middle part of the baffle plate, the heating installation position is by the four of four cylinders Individual first thermal conductive surface and the substrate cooperatively form;Close to the edge of the baffle plate, the heating installation position is by described second Thermal conductive surface, first thermal conductive surface and the substrate cooperatively form.
In one of the embodiments, first thermal conductive surface and second thermal conductive surface are strip globoidal structure.
In one of the embodiments, the bottom wall of the heating installation position is spherical globoidal structure.
In one of the embodiments, the outside dimension of the cylinder from one end with the substrate connection to the other end by Decrescence small, second thermal conductive surface is from one end of the baffle plate and the substrate connection to the other end gradually outward-dipping setting.
In one of the embodiments, the end face of the one end of the cylinder away from the substrate and each first thermal conductive surface Between be respectively equipped with First Transition inclined-plane, the end face of the one end of the baffle plate away from the substrate and each second thermal conductive surface it Between be respectively equipped with the second intermediate incline.
In one of the embodiments, the baffle plate is provided with strip breach.
In one of the embodiments, there is interval to form substrate between the heating zone and the edge of the substrate Shirt rim.
In one of the embodiments, the substrate is additionally provided with the positioning hole for installing heater block.
A kind of heater, including heater block and above-mentioned conducting-heat elements, the conducting-heat elements connect with the heater block Connect.
Above-mentioned heater, conducting-heat elements are conducted heat to by heater block, conducting-heat elements, which conduct heat to, to be added Thermal part to be added on hot installation position, the conduction of heat of the conducting-heat elements is uniform, improves being heated evenly for thermal part to be added Property and the efficiency of heating surface, avoid only causes that heat transfer is uneven and the efficiency of heating surface is low by the mode of heating of bottom heat transfer Problem.
Brief description of the drawings
Fig. 1 is the structure chart of the conducting-heat elements of an embodiment;
Fig. 2 is the top view of conducting-heat elements shown in Fig. 1;
Fig. 3 be conducting-heat elements shown in Fig. 2 A-A to sectional view;
Fig. 4 is enlarged drawing at the B of conducting-heat elements shown in Fig. 2.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings State.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can come in fact in many different forms It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to public affairs of the present utility model Open the understanding more thorough and comprehensive of content.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein "and/or" includes The arbitrary and all combination of one or more related Listed Items.
Reference picture 1, the conducting-heat elements 100 of the embodiment of the utility model one, including substrate 110, baffle plate 120 and multiple posts Body 130.
Substrate 110 is provided with heating zone (figure is not marked).Baffle plate 120 is set along the periphery of heating zone, and multiple cylinders 130, which are located at, to be added Hot-zone and in the baffle plate 120, heating is distinguished into multiple heating installation positions 101, Duo Gezhu by multiple cylinders 130 and baffle plate 120 Body 130, baffle plate 120 and substrate 110 are used to carry out heat transfer to the thermal part to be added on heating installation position 101.
Heat installation position 101 to be used to wait heater block to coordinate with deep-well plates, cylinder 130, baffle plate 120 can be used for heating The side wall of thermal part to be added on installation position 101 carries out heat transfer, and substrate 110 is used for to be heated on heating installation position 101 The bottom wall of part carries out heat transfer, and then controls the temperature of the liquid sample in deep-well plates wait heater block.
Optionally, the substrate 110 of conducting-heat elements 100, baffle plate 120 and cylinder 130 are using thermal conductivity factors such as aluminium alloy, copper Big material is made.What deserves to be explained is heating zone refers to that substrate 110 is provided with the region of heating installation position 101, its not generation Other regions are unable to heat conduction on table substrate 110, and in the present embodiment, conducting-heat elements 100 are overall can be with heat conduction.
Above-mentioned conducting-heat elements 100, the heating of heater block is waited suitable for deep-well plates.Thermal part to be added is installed located at heating On position 101, and it can be contacted with conducting-heat elements 100 and to form honeycomb parcel heat transfer type, make bottom and the side wall of thermal part to be added By heat transfer, therefore the conduction of heat of the conducting-heat elements 100 is uniform, improve thermal part to be added being heated evenly property and The efficiency of heating surface, avoid only causes heat transfer is uneven and the efficiency of heating surface is low to ask by the mode of heating of bottom heat transfer Topic.
Specifically, when thermal part to be added is deep-well plates, heating installation position 101 is just adapted with the hole wall of deep-well plates, i.e., Form heating installation position 101 substrate 110 and cylinder 130, or with substrate 110, cylinder 130 and baffle plate 120 just with deep-well plates Hole wall fit.
Specifically, side opposite with baffle plate 120 on substrate 110 is planar structure, consequently facilitating conducting-heat elements 100 are put Put.
Further, multiple cylinders 130 are in array distribution.The side wall of cylinder 130 is provided with four the first thermal conductive surfaces 131, and four Individual first thermal conductive surface 131 is distributed in the circumference of the side wall of cylinder 130.This four the first thermal conductive surfaces 131 are respectively used to add four The side wall of thermal part to be added on hot installation position 101 carries out heat transfer.The inner side of baffle plate 120 corresponds to multiple heating installation positions 101 Provided with multiple second thermal conductive surfaces 121.
At the middle part of baffle plate 120, four first thermal conductive surfaces 131 and substrate of the installation position 101 by four cylinders 130 are heated 110 cooperatively form.Close to baffle plate 120 edge, heating installation position 101 by the second thermal conductive surface 121, the first thermal conductive surface 131 and Substrate 110 cooperatively forms.The heating installation position 101 being thusly-formed is in array distribution, according further to needing to set, makes it can Coordinate with the deep-well plates in 24 holes, 48 holes, 96 holes, 192 holes, 384 holes.
Reference picture 1 and Fig. 2, specifically, the first thermal conductive surface 131 and the second thermal conductive surface 121 are strip globoidal structure.More Body, cylinder 130 is the cylinder of near-rhombic or approximating square, the area occupied of cylinder 130 is so advantageously reduced, same More heating installation positions 101 can be set on the substrate 110 of sample.
It is appreciated that in other embodiments, the first thermal conductive surface 131 and the second thermal conductive surface 121 are alternatively other shapes Structure, so that heating installation position 101 is the structures such as square column type.
Reference picture 2 and Fig. 3, specifically, the outside dimension of cylinder 130 from one end that substrate 110 is connected to the other end by Decrescence small, the second thermal conductive surface 122 of baffle plate 120 is gradually outward-dipping to the other end with one end that substrate 110 is connected from baffle plate 120 Set.So that heating installation position 101 gradually increases from bottom to top, increase and the adaptability of thermal part to be added.
Reference picture 2 and Fig. 4, further, the end face of the one end of cylinder 130 away from substrate 110 and each first thermal conductive surface 131 Between be respectively equipped with First Transition inclined-plane 132, the end face of the one end of baffle plate 120 away from substrate 110 and each second thermal conductive surface 121 it Between be respectively equipped with the second intermediate incline 122.The intermediate incline 122 of First Transition inclined-plane 131 and second, be advantageous to deep-well plates wait When heater block is with conducting-heat elements 100, wait heater block to be oriented to deep-well plates, avoid capturing deep-well plates wait heating part Occurs Caton phenomenon during part.
Further, the outside of baffle plate 120 is planar structure, and it is flat that the side of heater block can be so waited with deep-well plates Face respective outer side edges.It is appreciated that structure setting of the outside of baffle plate 120 according to the side of deep-well plates, consequently facilitating deep-well plates etc. Thermal part to be added coordinates with conducting-heat elements 100 so that the hole wall of deep-well plates is surrounded completely.For example, the side of deep-well plates is half During cylindrical structural, the outside of baffle plate 120 is correspondingly set to half cylindrical structure.
Specifically, the bottom wall for heating installation position 101 is spherical globoidal structure.More specifically, spherical globoidal structure is minimum Place is provided with circular groove 102.So be advantageous to improve heating installation position 101 and the compatible degree of the hole wall of spherical bottom.
It is noted that multiple cylinders 130 of above-mentioned conducting-heat elements 100 are independently arranged, therefore adjacent heating is installed Position 101 can communicate, therefore the conducting-heat elements 100 both can be suitably used for the deep-well plates that adjacent hole wall is connected with each other, and can also be applicable In the separate deep-well plates of adjacent hole wall, and then cause the strong adaptability of the conducting-heat elements 100.
With continued reference to Fig. 1, further, baffle plate 120 is provided with strip breach 123, and the strip breach 123 can increase baffle plate 120 deformation adaptability, and then increase adaptability of the conducting-heat elements 100 for thermal part to be added, while the strip breach 123 is also Heat dissipation channel can be used as, avoid the local temperature at the edge of baffle plate 120 too high.
Further, in the present embodiment, the heating zone of substrate 110 is rectangle.The array that multiple cylinders 130 are formed is 7 rows 11 arrange.It is divided into 7 rows in the width of substrate 110, is divided into 11 row, the heating installation of formation in the length direction of substrate 110 Position 101 is 96, is heated suitable for the deep-well plates in 96 holes.Baffle plate 120 corresponds to each column heating installation in the length direction of substrate 110 Position 101 is respectively equipped with a strip breach 123, i.e. 12 strip breach 123.Baffle plate 120 is corresponding in the width of substrate 110 Wherein 3 row cylinders are respectively equipped with a strip breach 123.It is appreciated that length direction and width of the baffle plate 120 in substrate 110 The position for the strip breach 123 that direction is provided with can be with identical.
Further, substrate 110 is additionally provided with the positioning hole 111 for being connected with heater block.It is appreciated that heater block Substrate 110 is removably attachable to by the positioning hole 111.Specifically, positioning hole 111 substitutes one of place of cylinder 130 Position and set.
Further, positioning hole 111 can be located at the position at the middle part of substrate 110 or four angles of substrate 110, positioning hole 111 position can be set according to real needs.For example, when conducting-heat elements 100 are directly connected to heater block, positioning hole 111 is excellent Bit selecting is big in the position at four angles, the bonding strength of the positioning method.And for example, it is provided between conducting-heat elements 100 and heater block During heat conduction film, positioning hole 111 is preferably placed at the middle part of substrate 110, and which is keeping the complete of heat conduction film to greatest extent On the basis of whole property, advantageously ensure that even heat is transmitted to conducting-heat elements 100 everywhere.
Further, there is interval, so as to form substrate shirt rim 112 between heating zone and the edge of substrate 110.Substrate skirt Side 112 is advantageous to Stability Analysis of Structures when conducting-heat elements 100 coordinate with deep-well plates.
Specifically, substrate 110, baffle plate 120 and cylinder 130 are formed in one formula structure.
The utility model additionally provides the heater (figure is to show) of an embodiment, including heater block (figure is to show) and Conducting-heat elements 100, conducting-heat elements 100 are connected with heater block.
Specifically, heater block is removably installed in positioning hole 111, so that heater block is removably attachable to Substrate 110.It is appreciated that heater block also can be by the substrate 110, baffle plate 120 and cylinder that are directly arranged in conducting-heat elements 100 The other modes such as 130 inside are connected with conducting-heat elements 100.
Above-mentioned heater, conducting-heat elements 100 are conducted heat to by heater block, conducting-heat elements 100 pass heat The thermal part to be added on heating installation position 101 is led, the conduction of heat of the conducting-heat elements 100 is uniform, improves portion to be heated The being heated evenly property and the efficiency of heating surface of part, avoid only cause heat transfer uneven by the mode of heating of bottom heat transfer and The problem of efficiency of heating surface is low.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed, But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (10)

1. a kind of conducting-heat elements, it is characterised in that including substrate, baffle plate and multiple cylinders, the substrate is provided with heating zone, described Periphery of the baffle plate along the heating zone and set, the multiple cylinder is described more located at the heating zone and in the baffle plate The heating is distinguished into multiple heating installation positions, the multiple cylinder, the baffle plate and the base by individual cylinder and the baffle plate Plate is used to carry out heat transfer to the thermal part to be added on the heating installation position.
2. conducting-heat elements as claimed in claim 1, it is characterised in that the multiple cylinder is array distribution, the cylinder Side wall is provided with four the first thermal conductive surfaces, and four first thermal conductive surfaces are distributed in the circumference of the side wall of the cylinder, described four The side wall for the thermal part to be added that first thermal conductive surface is respectively used on heating installation position described to four carries out heat transfer, the baffle plate Inner side correspond to it is multiple it is described heating installation positions be provided with multiple second thermal conductive surfaces;At the middle part of the baffle plate, the heating installation Position is cooperatively formed by four the first thermal conductive surfaces of four cylinders and the substrate;Close to the edge of the baffle plate, the heating Installation position is cooperatively formed by second thermal conductive surface, first thermal conductive surface and the substrate.
3. conducting-heat elements as claimed in claim 2, it is characterised in that first thermal conductive surface and second thermal conductive surface are Strip globoidal structure.
4. conducting-heat elements as claimed in claim 3, it is characterised in that the bottom wall of the heating installation position is spherical cambered surface knot Structure.
5. conducting-heat elements as claimed in claim 2, it is characterised in that the outside dimension of the cylinder from the substrate connection One end to the other end be gradually reduced, second thermal conductive surface from one end of the baffle plate and the substrate connection to the other end by Gradually outward-dipping setting.
6. conducting-heat elements as claimed in claim 2, it is characterised in that the end face of the one end of the cylinder away from the substrate with Be respectively equipped with First Transition inclined-plane between each first thermal conductive surface, the end face of the one end of the baffle plate away from the substrate with it is each The second intermediate incline is respectively equipped between second thermal conductive surface.
7. the conducting-heat elements as described in any one of claim 1~6, it is characterised in that the baffle plate is provided with strip breach.
8. the conducting-heat elements as described in any one of claim 1~6, it is characterised in that the heating zone and the side of the substrate There is interval to form substrate shirt rim between edge.
9. the conducting-heat elements as described in any one of claim 1~6, it is characterised in that the substrate is additionally provided with to be added for installing The positioning hole of thermal part.
A kind of 10. heater, it is characterised in that the heat-conducting part including heater block and as described in any one of claim 1~9 Part, the conducting-heat elements are connected with the heater block.
CN201720340203.4U 2017-03-31 2017-03-31 Conducting-heat elements and heater Active CN206624867U (en)

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Application Number Priority Date Filing Date Title
CN201720340203.4U CN206624867U (en) 2017-03-31 2017-03-31 Conducting-heat elements and heater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720340203.4U CN206624867U (en) 2017-03-31 2017-03-31 Conducting-heat elements and heater

Publications (1)

Publication Number Publication Date
CN206624867U true CN206624867U (en) 2017-11-10

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108165458A (en) * 2018-01-24 2018-06-15 深圳市赛格诺生物科技有限公司 A kind of 96 mesoporous metal modules and application method
CN109269873A (en) * 2018-10-10 2019-01-25 东南大学 Magneto separate heating device for the processing of high-throughput biological sample

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108165458A (en) * 2018-01-24 2018-06-15 深圳市赛格诺生物科技有限公司 A kind of 96 mesoporous metal modules and application method
CN109269873A (en) * 2018-10-10 2019-01-25 东南大学 Magneto separate heating device for the processing of high-throughput biological sample

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GR01 Patent grant
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CP01 Change in the name or title of a patent holder

Address after: 410205 Changsha province high and New Technology Industrial Development Zone, Lu Pine Road, No. 680, Hunan

Patentee after: Shengxiang Biotechnology Co., Ltd

Address before: 410205 Changsha province high and New Technology Industrial Development Zone, Lu Pine Road, No. 680, Hunan

Patentee before: Sansure Biotech Inc.

CP01 Change in the name or title of a patent holder