CN206619613U - 发光装置以及包含该发光装置的led灯具 - Google Patents
发光装置以及包含该发光装置的led灯具 Download PDFInfo
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- CN206619613U CN206619613U CN201590000788.4U CN201590000788U CN206619613U CN 206619613 U CN206619613 U CN 206619613U CN 201590000788 U CN201590000788 U CN 201590000788U CN 206619613 U CN206619613 U CN 206619613U
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- 238000004020 luminiscence type Methods 0.000 claims abstract description 127
- 230000003287 optical effect Effects 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 9
- 239000010432 diamond Substances 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 38
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 238000009413 insulation Methods 0.000 claims description 9
- 238000001228 spectrum Methods 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 208000002925 dental caries Diseases 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims 1
- 239000010408 film Substances 0.000 abstract 1
- 239000002966 varnish Substances 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 6
- 239000003086 colorant Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- WABPQHHGFIMREM-YPZZEJLDSA-N lead-205 Chemical compound [205Pb] WABPQHHGFIMREM-YPZZEJLDSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012671 ceramic insulating material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
本实用新型公开了一种发光装置,包括底座(24),至少一个发光芯片(22),至少一个覆盖发光芯片的光学透镜(21),以及导热层(23),所述导热层(23)既可以拥有导电性,例如焊接料、导电银浆、某种金属,也可以拥有绝缘性,例如金刚石膜、清漆、陶瓷。导热层(23)两对面上分别直接接触发光芯片(22)和底座(24)。
Description
技术领域
本实用新型主要涉及发光装置,具体涉及LED照明装置和LED灯具。
背景技术
近年来,应用了发光二极管(“LEDs”)的LED灯具越来越受到人们的青睐。LED灯具日益增加的人气得益于其克服了现有光源例如白炽灯泡、荧光灯管和卤素灯的诸多缺点。
随着半导体发光装置的发展,应用包括LED芯片在内的LED光源在消费者和工业市场的照明灯具中大受欢迎。本申请的发明人意识到LED光源会产生大量的热量,而过热将导致照明灯具的操作元件失效。不仅如此,发明人还意识到包括隐藏式照明灯具在内的各种LED照明灯具的所有元件都是集成在灯具中的,因此,如果其中一个元件损坏,那么更换这个失效的元件是很困难的,通常需要更换整个隐藏式照明灯具。
由图1可知,申请号为201210006965.2的中国专利公开了一种LED发光组件,所述LED发光组件包含封装部分11、发光芯片12和光源支架13,线路板14和散热器15,其中,封装部分11、发光芯片12和光源支架13组成一个LED组件。由于不具备电力和散热,所述LED组件无法独立使用。该LED组件连接在线路板14并贴附于带有导热材料的散热器15上。LED发光组件的发光芯片所产生的热量需要通过发光芯片、光源支架、线路板、导热材料、散热器散失,所经受的热阻大,不利于热量散失。
发明人进一步认识到,各种高功率LED灯具均由多种零部件装配而成,这些零部件包括LED发光装置、铝基板、散热器、粘结成分和密封外壳。不同的LED灯具由不同的零部件组装而成,零部件的非标准化导致了无法批量生产。没有标准化的零部件和/或批量生产,制造成本则成为了LED灯具行业所需考虑的问题了。
实用新型内容
根据公开实施例的一个方面,发光装置包括底座、至少一个发光芯片、至少一个覆盖所述发光芯片的光学元件、以及导热粘结层。所述导热粘结层的两个对立面上分别直接接触有发光芯片和底座。
根据公开实施例的进一步层面,LED灯具包括了多个LED组件、以及框架,所述LED组件包括底座、铺设于底座上表面的导热粘结层、设置在导热粘结层上的LED芯片、覆盖所述LED芯片的光学元件。所述框架上设置有多个用于容纳LED组件的空腔。
根据公开实施例的另一个方面,发光装置包括底座、铺设于底座上表面的导热粘结层、设置于导热粘结层上的发光芯片、覆盖所述发光芯片的光学元件。所述发光装置无需在底座 和发光芯片之间设置电路板。
附图说明
一个或多个实施例通过举例的方式进行说明,但不构成对本实用新型实施例的限定,附图中所有带有相同附图标记的元件均代表相同的元件,在附图中:
图1为一种现有的LED发光组件的结构示意图;
图2为本实用新型实施例1公开的一种LED发光装置的结构示意图;
图3为图2所示的不显示光学透镜的LED发光装置的俯视图;
图4为图2所示的LED发光装置的发光芯片的结构示意图;
图5为本实用新型实施例2公开的一种LED发光装置的结构示意图;
图6为图5所示的不显示封装胶的LED发光装置的俯视图;
图7为图5所示的LED发光装置的发光芯片的结构示意图;
图8为本实用新型实施例3公开的一种LED发光装置的结构示意图;
图9为图8所示的不显示光学护罩的LED发光装置的俯视图;
图10为图8所示的LED发光装置的发光芯片的结构示意图;
图11为本实用新型实施例4公开的一种LED发光装置的结构示意图;
图12为本实用新型实施例5公开的一种LED发光装置的结构示意图;
图13为本实用新型实施例6公开的一种LED发光装置的结构示意图;
图14为图12所示的LED发光装置的纵向截面图;
图15为图12所示的LED发光装置的仰视图;
图16为本实用新型实施例7公开的一种LED发光装置的结构示意图;
图17为本实用新型实施例8公开的一种LED发光装置的结构示意图;
图18为本实用新型实施例9公开的一种LED发光装置的结构示意图;
图19为本实用新型实施例10公开的一种LED发光装置的结构示意图;
图20为本实用新型实施例11公开的一种LED发光装置的结构示意图;
图21为图20所示的LED发光装置的俯视图;
图22为图20所示的LED发光装置的仰视图;
图23为图20所示的LED发光装置的纵向截面图;
图24为本实用新型实施例12公开的一种LED发光装置的结构示意图;
图25为本实用新型实施例13公开的一种LED发光装置的结构示意图;
图26为本实用新型实施例14公开的一种LED发光装置的结构示意图;
图27为本实用新型实施例15公开的一种LED发光装置的结构示意图;
图28为本实用新型实施例16公开的一种LED发光装置的结构示意图;
图29为本实用新型实施例17公开的一种LED发光装置的结构示意图;
图30为本实用新型实施例18公开的一种LED发光装置的结构示意图;
图31为本实用新型实施例19公开的由一种本实用新型保护的LED发光装置构成的一种LED灯具的结构示意图;
图32为本实用新型实施例20公开的由一种本实用新型保护的LED发光装置构成的另一种LED灯具的结构示意图;
图33为本实用新型实施例21公开的由多个本实用新型保护的LED发光装置构成的一种LED灯具的结构示意图;
图34为图33所示的LED灯具的后视图;
图35为本实用新型实施例22公开的由一种本实用新型保护的LED发光装置所构成的一种LED光源模组的结构示意图;
图36为本实用新型实施例23公开的由图35所示的LED光源模组构成的一种LED灯具的结构示意图。
具体实施方式
为使本实用新型的目的、技术方案和优点更加清楚明白,下面结合实施例和附图,对本实用新型作进一步的详细说明,本实用新型的示意性实施方式及其说明仅用于解释本实用新型,并不作为对本实用新型的限定。
应当理解的是,本实用新型在其应用方面不限于说明书中陈述的、以及附图中举例的结构细节和元件布置。本实用新型能够有其他的实施例,并且能够通过多种途径实施。而且,还应当理解,这里所使用的措辞和术语只是为了达到说明的目的,而非用于限制本实用新型。所使用的“包括”、“包含”、“具有”以及它们的变型均表示包括其后列出的项目、其等同物和额外的项目。除非另外有限定,所使用的“连接”、“联接”以及它们的变型在这里拥有宽泛的意义,包括直接和间接连接、联接和固定。另外,术语“连接”和“联接”以及它们的变型不受限于物理或机械的连接或联接。
进一步地,正如接下来的段落中将会提到的,附图所示的具体的机械结构旨在举例说明本实用新型的实施例,而且其他替换的机械结构也是可行的。
实施例1
如图2和图3所示,一种LED发光装置,包括光学透镜21、发光芯片22、导热层23和底座24。光学透镜21设置于发光芯片22之上,光学透镜21不仅能够防水、防尘,还能够 用于调节LED发光装置的发光效率。导热层23是由导热、导电材料构成的薄层,导热层23覆盖在底座24的上表面,用于将发光芯片22联接在底座24上。光学透镜21的两侧均设置有凹槽,所述凹槽用于容纳导热层23的电路布线。导热层23的每根导线的两端均设置有焊盘25,根据发光芯片22的电力需求设计每根导线的布局。所述LED发光装置包括仅一个发光芯片22和覆盖发光芯片22的光学透镜21,底座24是由陶瓷材料制成的散热器,所述陶瓷材料具备良好散热效果和电绝缘性。与图1所示的发光组件相比,本实施例的LED发光装置无需在底座24和发光芯片22之间设置用于支撑发光芯片22的光源支架。
图4展示了图2和图3中的发光芯片22,发光芯片22的底部具有阳极插针51和阴极插针52,阳极插针51和阴极插针52均焊接至导热层23的导线上。优选地,导热层23包含一层具有良好导热、导电性的焊料层,用于将发光芯片22联接在底座24上。在另外的一个实施例中,导热层23可以是导电银浆。在又一个实施例中,导热层23可以是由钼、锰、钨、银、金、铂、银钯合金、铜、铝、锡中任意一种金属制成。
实施例2
如图5和图6所示,一种LED发光装置,包括封装胶61、发光芯片62、热联接材料和底座64。所述热联接材料是一层金属电路层63,金属电路层63设置在底座64表面,发光芯片62设置在热联接材料上。金属电路层63由钼、锰、钨、银、金、铂、银钯合金、铜、铝、锡中任意一种金属制成。发光芯片62被封装胶61覆盖以达到防水和密封的效果。设置于发光芯片62上表面的阳极插针67通过引线66与焊盘65键合,设置于发光芯片62下表面上的阴极插针68与金属电路层63联接,并通过金属电路层63进一步地与另一个焊盘65键合。封装胶61内填充有荧光粉69,用于改变发光芯片62发出的光的光谱。底座64是由电绝缘的热塑料制成。金属电路层63优选地涂覆有导电银浆,导电银浆具有良好的导热性、导电性、以及用于将发光芯片62粘结在底座64上的粘度。
图7展示了图5和图6中的发光芯片62,发光芯片具有设置在其上表面的阳极插针67和设置在其下表面的阴极插针68。阳极插针67通过引线66与焊盘65键合,阴极插针68焊接至金属电路层63的导线上。
实施例3
如图8、图9和图10所示,一种LED发光装置,包含光学护罩91、发光芯片92、导热膜93和底座94。导热膜93涂覆在底座94表面,导热膜93与发光芯片92的下表面联接。发光芯片92被光学护罩91覆盖以达到防水和密封的效果。发光芯片92的上表面设置有阳极 97和阴极98,阳极97和阴极98通过引线96与设置在导热膜93上的焊盘95键合,引线96穿过光学护罩91实现电路连接。具体地,底座94是照明筒,导热膜93是绝缘体。导热膜93优选地使用金刚石膜,金刚石膜虽然是绝缘体,但是拥有良好的传热效率,能够有效地将热量从发光芯片92传递至底座94。金属电路层和焊盘95设置在导热膜93上,用于实现发光芯片92和电源之间的电路连接。
实施例4
如图11所示,一种LED发光装置,包含六个发光芯片122,热联接层123和底座124。六个发光芯片122呈三种不同的颜色并按2乘以3的矩阵排列。热联接层123包括金属电路层,热联接层涂覆在底座124表面,用于将发光芯片122联接在底座124上,并且通过金属电路层与两条引线125连接,再进一步与电源连接。光学密封膜121覆盖所有发光芯片122和带有两条引线125的金属线路层,两条引线125延伸至光学密封膜外并与电源连接。底座124由陶瓷绝缘材料构成,发光芯片122产生的热量通过热联接层和底座124传递至周围环境中。所有发光芯片122上均设置有光学材料,用于改变发光芯片122的光谱。
实施例5
如图12、图14和图15所示,一种LED发光装置,包含多个发光芯片132,金属电路层133和底座134。发光芯片132可以如图12中所示为同一颜色,也可以如图13所示为不同颜色。金属电路层133设置于底座134的表面,用于将发光芯片132电连接至引线135,引线135与电源连接。底座134为一种带有辅助散热结构的绝缘中空构件。所述辅助散热结构包括多个散热筋137,散热筋137从底座134沿径向向外延伸,围绕散热筋137的环状结构上设置有散热槽138以形成蜂巢结构。底座134内设置有两个通孔136,引线135穿过通孔136连接至电源。底座134的底部内侧设置有螺纹部分139,用于将底座134联接至电源设备。
实施例6
如图13所示,一种LED发光装置,该LED发光装置与图12中实施例5的LED发光装置的唯一区别在于图13中发光芯片132的颜色不一致。
实施例7
如图16所示,一种LED发光装置,该LED发光装置与图12中实施例5的LED发光装置的唯一区别在于螺纹部份139设置于底座134底部的外侧。
实施例8
如图17所示,一种LED发光装置,包含光学透镜181、封装在光学透镜181内部的发光芯片182、金属电路层183和底座184。金属电路层183设置于底座184上,底座184是由具备热传导性的绝缘塑料材料制成的非规则支撑件,光学透镜181内填充有荧光粉185,用于改变发光芯片182的光谱。
实施例9
如图18所示,一种LED发光装置,包含设置于底座194上的多个颜色不一致的发光芯片192,光学透镜191完全覆盖发光芯片192和底座194的上表面。光学透镜191内填充有荧光粉195以改变发光芯片192的光谱。发光芯片192通过金属电路层193联接在底座194的表面,金属电路层优选地由银浆制成。底座194为陶瓷绝缘盘,底座194上设置有两个孔197,引线196穿过孔197,用于连接金属电路层193和电源。
实施例10
如图19所示,一种LED发光装置,包含四个发光芯片202,发光芯片202呈两排两列的矩阵设置于底座204上,其中,两个发光芯片202为红色,另外两个发光芯片202为蓝色。光学透镜201覆盖四个发光芯片202及底座204的一部分。金属电路层203设置于底座204表面,用于实现发光芯片202与引线205的电连接,引线205穿过光学透镜201与底座204之间的狭槽,并连接至电源。底座204为陶瓷绝缘盘,发光芯片202产生的热量通过金属电路层203、底座204传递至周围环境中。光学透镜201内填充有荧光粉206,用于改变发光芯片202发出的光的光谱。
实施例11
如图20、图21、图22和图23所示,一种LED发光装置,包含多个发光芯片212,发光芯片212设置于底座214的上表面。底座214的形状为,沿底座214底部向底座214的上表面方向逐渐张开,底座214的形状也指喇叭形状。举例来说,该LED发光装置包含四个相同颜色的发光芯片212,发光芯片212在底座214上呈两排两列的矩阵排列。四个发光芯片212中的两个被一个光学护罩211覆盖,另外两个发光芯片212被另一个光学护罩212所覆盖。底座214上铺设有金属导热层213,用于实现发光芯片212与底座214的电连接。底座214为带有辅助散热结构的陶瓷绝缘构件,所述辅助散热结构为散热鳍片216和槽217,用于 提高散热效果。如图22和图23所示,底座214上设置有两个通孔215,两个插针218贯穿两个通孔215用于连接电源。
实施例12
如图24所示,一种LED发光装置,包含六个发光芯片252,发光芯片252设置在底座254上,发光芯片既可以按2乘以3的矩阵排列,也可以是不规则的排列模式。每一个发光芯片252均单独地由一个独立的光学透镜251a覆盖。导热层253铺设于底座254的表面,发光芯片252产生的热量通过导热层253、底座254传递至周围环境中。导热层253优选地采用薄金刚石膜。引线255将发光芯片252电连接至外接电源上。整个底座254和所有发光芯片252均被一层保护膜251b覆盖。
实施例13
如图25所示,一种LED发光装置,该LED发光装置与实施例12中的LED发光装置类似。具体地,本实施例的LED发光装置包含六个发光芯片262,发光芯片262设置于底座264上并按照2乘以3的矩阵排列。每一个发光芯片262均单独地被一个独立的光学透镜261a覆盖。光学透镜261b覆盖底座264的整个上表面,起到保护发光芯片262和光学透镜261a的作用。底座264为陶瓷绝缘体,底座264中部设置有通孔265,底座264表面铺设有金属电路层263,用于将发光芯片262电连接至引线266上,引线266穿过通孔265与电源连接。
实施例14
如图26所示,一种LED发光装置,包含四个颜色一致的发光芯片272,发光芯片272呈2乘以2矩阵排列在底座274上。每个发光芯片272均单独地被一个封装胶271a覆盖。一个较封装胶271a更大的光学护罩271b完全覆盖整个底座274和四个发光芯片272。金属电路层273铺设于底座274表面,用于将四个发光芯片272电连接在一起,并进一步与通往外部的引线276连接。底座274是绝缘塑料长方体结构,底座274中心设置有通孔275。引线276贯穿通孔275并形成两股引线束,每一股引线束表面均涂覆有绝缘漆。两股引线束分别连接阳极和阴极。底座274的底部设置有与其相匹配的套筒277,引线276延伸至套筒277内。套筒277内设置有LED驱动装置,LED驱动装置与引线276电连接。
实施例15
如图27所示,一种LED发光装置,包含发光组件292,发光组件292被封装胶包裹。整个发光组件292被第一光学护罩291a覆盖,光学护罩291a内填充有荧光粉295,起到改变发光组件292光谱的作用。还包括一个较光学护罩291a更大的第二光学护罩291b,第二光学护罩291b覆盖第一光学护罩291a,用于防水和防尘。发光组件292通过金属电路层293联接在底座294的表面,金属电路层293优选地由导热银浆构成。发光组件292的芯片所产生的热量通过金属电路层293散至底座294上,之后进一步散逸至周围环境中。底座294为陶瓷绝缘中空构件,底座294设置有两个通孔298,底座294还带有辅助散热结构,所述辅助散热结构包括多个散热筋296,散热筋296从底座294沿径向向外延伸,还包括一个圆环结构,圆环结构带有散热槽297,散热槽297围绕散热筋296分布。
实施例16
如图28所示,一种LED发光装置,包含发光组件301,发光组件301具有发光芯片302、用于封装的光学护罩303、光源支架304。绝缘的导热材料层305铺设于底座306的上表面,用于联接发光芯片302和底座306。优选地,导热材料层305是一种绝缘漆,并涂覆于底座306的整个外表面。金属电路层307将发光组件301连接至两个焊盘308上,焊盘308设置于底座306上。底座306为涂覆有导热材料层305的照明筒。光学护罩303内填充有荧光粉309,用于改变发光组件301的光谱。
实施例17
如图29所示,一种LED发光装置,包含四个发光组件312,发光组件312颜色一致,并以2乘以2的矩阵形式排列在底座314上。所有四个发光组件312被一个通用的光学护罩311覆盖,用于防水和防尘,光学护罩311内填充有荧光粉315以达到改变发光组件312的光谱的目的。金属电路层313铺设于底座314上,将四个发光组件312连接在一起。底座314是带有辅助散热结构的陶瓷绝缘中空构件,所述辅助散热结构包括多个散热筋316,散热筋316沿径向从底座314向外延伸,还包括一个圆环结构,所述圆环结构上设置有散热槽317,散热槽317围绕散热筋316分布。
实施例18
如图30所示,一种LED发光装置,包含两个发光芯片322,两个发光芯片322被光学透镜321覆盖,光学透镜312起到防水和防尘的作用。底座324表面铺设有金属电路层323,用于将两个发光芯片322连接到一起,金属电路层323优选地采用导热银浆。底座324为陶 瓷绝缘构件,底座324背面安装有辅助发光散热结构325。底座324具有通孔326,引线327贯穿通孔326连接至LED驱动装置328,LED驱动装置328设置于辅助发光散热结构325内。
实施例19
如图31所示,一种LED灯泡,包含LED组件331和E型连接头332。LED组件331包括光学护罩、发光芯片333、热联接材料和底座。热联接材料为金刚石膜,金刚石膜设置于底座的上表面上,底座是涂覆有金刚石膜的发光构件,金属薄层铺设于金刚石膜的表面用于电路连接。底座上安装有辅助散热结构,底座内设置有LED驱动装置。E型连接头332安装在底座上以组成LED灯泡。
实施例20
如图32所示,一种LED灯泡,包含LED组件341和MR型连接头342。LED组件341包括光学元件、四个发光芯片343、热联接材料和底座。四个发光芯片343包含不同颜色的芯片,并且按照2乘以2的矩阵形式排列在底座上。热联接材料是一层导热银浆,热联接材料铺设于底座的上表面用于电连接四个发光芯片343。底座是带有内部空腔的陶瓷构件,所述空腔用于放置LED驱动装置。MR型连接头342安装在底座上以组成LED灯泡。
实施例21
如图33和图34所示,一种LED灯具,包含多个LED组件351,LED组件351设置在灯具框架352上。LED组件351可以焊接、粘接、或插接于灯具框架352上。LED组件351可以永久地或者可拆卸地固定在灯具框架352上。灯具框架352为蜂巢状构件,灯具框架352的底面设置有LED驱动装置353,用于固定LED组件351,以及将LED组件351电连接至LED驱动装置353上。LED驱动装置353贴附于灯具框架352上,两者的连接方式既可以是永久连接,例如焊接,也可以是可拆卸式连接,例如螺钉固定。
实施例22
如图35所示,一种LED灯具373,包含多个LED组件371,LED组件371呈矩阵排列在矩形框架372上构成LED光源模组。矩形框架372优选地由陶瓷制成,矩形框架372上设置有多个空腔,用于容纳LED组件371。LED组件371可以焊接、粘接或插接在矩形框架372上。LED组件371可以以任意的矩阵形式排列,而不受限于图35所示的2乘以3的矩阵结构。
实施例23
如图36所示,一种LED灯具,包含灯具壳体374,灯具壳体374内装配有多个实施例22中所保护的LED光源模组。灯具壳体374上设置有LED驱动装置375,用于提供电力,并且能够驱动LED组件371的电路。LED光源模组能够以任何结构组合,例如,2乘以3的矩阵,3乘以3的矩阵,而不限于图36中的结构。
与传统的发光装置相比,本实用新型无需在发光芯片和底座之间设置用于向发光芯片提供电力的电路板,从而达到降低热阻,进而显著提高散热效果的目的。
虽然本实用新型的优选实施例已被用于说明本实用新型而公开,但是,本领域的技术人员应当意识到,凡在权利要求书中公开的本实用新型的范围和精神之内,所做的任何修改、改进、等同替换均是可行的。
Claims (19)
1.一种发光装置,包括:
底座;
至少一个发光芯片;
至少一个光学元件,所述光学元件覆盖发光芯片;及
导热粘结层,所述导热粘结层的两个对立面分别直接与发光芯片和所述底座接触;
其特征在于,所述导热粘结层包括导线,发光芯片的阳极插针和阴极插针均焊接在导热粘结层的导线上;
所述底座包括辅助散热结构,所述辅助散热结构包含:
多个散热筋,所述散热筋沿径向从底座向外延伸,及
环形结构,所述环形结构上设置有多个散热槽,所述散热槽围绕散热筋分布。
2.根据权利要求1所述的一种发光装置,其特征在于,所述光学元件被配置为用于改变所述发光芯片所发出的光的光谱。
3.根据权利要求2所述的一种发光装置,其特征在于,所述光学元件包含荧光粉。
4.根据权利要求1所述的一种发光装置,其特征在于,所述光学元件包含光学透镜。
5.根据权利要求1所述的一种发光装置,其特征在于,所述光学元件包含封装胶。
6.根据权利要求1所述的一种发光装置,其特征在于,所述底座是电绝缘的,所述导热粘结层电联接至所述发光芯片上。
7.根据权利要求6所述的一种发光装置,其特征在于,所述底座由陶瓷材料制成。
8.根据权利要求6所述的一种发光装置,其特征在于,所述导热粘结层包含电路层。
9.根据权利要求8所述的一种发光装置,其特征在于,所述电路层由导电银浆制成。
10.根据权利要求8所述的一种发光装置,其特征在于,所述电路层由金属组中的任意金属制成,所述金属组由钼、锰、钨、银、金、铂、银钯合金、铜、铝、锡构成。
11.根据权利要求1所述的一种发光装置,其特征在于,所述底座是导电的。
12.根据权利要求11所述的一种发光装置,其特征在于,所述导热粘结层包含位于所述底座上的电绝缘涂层。
13.根据权利要求12所述的一种发光装置,其特征在于,绝缘的导热粘结层包含金刚石膜、绝缘漆或陶瓷层。
14.根据权利要求1所述的一种发光装置,其特征在于,所述发光芯片包含LED芯片。
15.根据权利要求1所述的一种发光装置,其特征在于,所述导热粘结层上设置有多个发光芯片;所述光学元件也为多个,并且每个光学元件分别覆盖至少一个发光芯片;所述发光装置还包括通用的光学护罩,所述光学护罩罩住设置于所述底座上表面的发光芯片和光学元 件。
16.根据权利要求15所述的一种发光装置,其特征在于,每个所述光学元件覆盖至少两个所述发光芯片。
17.根据权利要求16所述的一种发光装置,其特征在于,所述底座的形状为,沿底座底部向底座的上表面方向逐渐张开,所述底座内设置有至少两个通孔,底座内还设置有至少两个插针,所述插针贯穿通孔,并与电源连接。
18.一种LED灯具,包含多个LED组件,每个LED组件包含:
底座;
导热粘结层,所述导热粘结层涂覆于所述底座的上表面;
LED芯片,所述LED芯片设置在导热粘结层上;及
光学元件,所述光学元件覆盖LED芯片;
所述LED灯具还包括框架,所述框架设置有多个用于容纳LED组件的空腔;
其特征在于,所述导热粘结层包括导线,LED芯片的阳极插针和阴极插针均焊接在导热粘结层的导线上;
所述底座包括辅助散热结构,所述辅助散热结构包含:
多个散热筋,所述散热筋沿径向从底座向外延伸,及
环形结构,所述环形结构上设置有多个散热槽,所述散热槽围绕散热筋分布。
19.一种发光装置,包含:
底座;
导热粘结层,所述导热粘结层涂覆于所述底座的上表面;
发光芯片,所述发光芯片设置在导热粘结层上;及
光学元件,所述光学元件覆盖发光芯片;
其特征在于,所述导热粘结层包括导线,发光芯片的阳极插针和阴极插针均焊接在导热粘结层的导线上;
所述发光装置无需在底座和发光芯片之间设置电路板;
所述底座包括辅助散热结构,所述辅助散热结构包含:
多个散热筋,所述散热筋沿径向从底座向外延伸,及
环形结构,所述环形结构上设置有多个散热槽,所述散热槽围绕散热筋分布。
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US14/323,014 US10024530B2 (en) | 2014-07-03 | 2014-07-03 | Lighting device and LED luminaire |
PCT/US2015/039046 WO2016004341A1 (en) | 2014-07-03 | 2015-07-02 | Lighting device and led luminaire incorporating the same. |
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JP (1) | JP6366045B2 (zh) |
CN (1) | CN206619613U (zh) |
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CN109931512A (zh) * | 2019-03-21 | 2019-06-25 | 苏州源泽光电科技集团有限公司 | 一种内置铝箔蜂窝散热led灯 |
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-
2014
- 2014-07-03 US US14/323,014 patent/US10024530B2/en active Active
-
2015
- 2015-07-02 EP EP15739433.9A patent/EP3164895A1/en not_active Withdrawn
- 2015-07-02 MY MYPI2016704896A patent/MY173621A/en unknown
- 2015-07-02 CA CA2954058A patent/CA2954058C/en active Active
- 2015-07-02 EP EP20209296.1A patent/EP3823051A1/en active Pending
- 2015-07-02 CN CN201590000788.4U patent/CN206619613U/zh active Active
- 2015-07-02 JP JP2017501323A patent/JP6366045B2/ja active Active
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CA2954058C (en) | 2019-02-12 |
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