CN206611569U - Microspeaker and the electronic installation comprising the Microspeaker - Google Patents
Microspeaker and the electronic installation comprising the Microspeaker Download PDFInfo
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- CN206611569U CN206611569U CN201720254250.7U CN201720254250U CN206611569U CN 206611569 U CN206611569 U CN 206611569U CN 201720254250 U CN201720254250 U CN 201720254250U CN 206611569 U CN206611569 U CN 206611569U
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- 238000009434 installation Methods 0.000 title abstract 2
- 238000005452 bending Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000000605 extraction Methods 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
The utility model provides a kind of Microspeaker and the electronic installation comprising the Microspeaker, and Microspeaker therein includes vibrating diaphragm and voice coil loudspeaker voice coil；Voice coil loudspeaker voice coil includes voice coil loudspeaker voice coil body and voice coil leads；Supporting pad is provided between vibrating diaphragm and voice coil loudspeaker voice coil；Wire lead slot is provided with supporting pad, voice coil leads are placed in wire lead slot, are drawn by wire lead slot；Wherein, position of the wire lead slot on supporting pad is corresponding with the extraction location of voice coil leads.The utility model ensure that the smooth of the adhesive surface of voice coil loudspeaker voice coil, and then improve the cohesive force and flatness of voice coil loudspeaker voice coil and vibrating diaphragm.
Description
Technical Field
The utility model relates to an acoustoelectric conversion technology field, more specifically relates to a miniature speaker and contain this miniature speaker's electron device.
Background
The micro-speaker is an important acoustic component of the portable electronic device, is used for completing the conversion between electric energy and sound energy, and is an energy conversion device. The conventional micro-speaker includes a magnetic circuit system and a vibration system. The vibration system comprises a vibrating diaphragm and a voice coil which is fixedly bonded with the vibrating diaphragm; the magnetic circuit system comprises a washer and a magnet. In order to ensure that the micro-speaker can work normally, the voice coil needs to be electrically connected with the conductive piece through a lead, and the conductive piece is electrically connected with an external circuit through a conduction structure, so that the external circuit supplies alternating current to the inside of the micro-speaker. When the voice coil receives the current signal, the voice coil can do reciprocating cutting motion of magnetic lines of force under the action of an electromagnetic field, and the sound production displacement changes, so that the vibrating diaphragm connected with the voice coil is driven to vibrate, and the air is driven to produce sound.
In order to realize the electrical connection between the voice coil lead and the conductive piece, the voice coil lead needs to be led out from the inner side of the voice coil. Fig. 1 shows a structure of a lead-out portion of a conventional voice coil lead. As shown in fig. 1, the voice coil lead 22 needs to be led out from the inner side of the voice coil body 21 along the outer edge of the voice coil body 21, so as to electrically connect the voice coil and the conductive member. The method easily causes uneven bonding surface of the voice coil, thereby affecting the bonding force and flatness of the voice coil and the diaphragm, and the problem is particularly serious when various leads need to be led out from the inner side of the voice coil.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, an object of the present invention is to provide a micro-speaker and an electronic device including the same, so as to solve the problems of low adhesion and poor flatness between a voice coil and a diaphragm caused by uneven adhesion of the voice coil.
The utility model provides a micro loudspeaker, which comprises a vibrating diaphragm and a voice coil; the voice coil comprises a voice coil body and a voice coil lead; a supporting pad is arranged between the vibrating diaphragm and the voice coil; a lead groove is formed in the support pad, and a voice coil lead is placed in the lead groove and led out from the lead groove; the position of the lead groove on the supporting pad corresponds to the lead-out position of the voice coil lead.
Further, a preferable structure is: the number of the lead grooves is not more than that of the voice coil leads.
Further, a preferable structure is: the lead groove is of a quadrilateral structure.
Further, a preferable structure is: the shape of the supporting pad is matched with that of the voice coil.
Further, a preferable structure is: the supporting pad is of a square or round structure.
Further, a preferable structure is: the vibrating diaphragm comprises a central part and a bending ring part arranged around the central part.
In another aspect, the present invention provides an electronic device, which includes the above-mentioned micro speaker.
Utilize the aforesaid to according to the utility model discloses a miniature speaker and contain electronic device of this speaker through set up the supporting pad between voice coil loudspeaker voice coil and vibrating diaphragm to set up the lead wire groove that is used for acceping the voice coil loudspeaker voice coil lead wire on the supporting pad, thereby guarantee the level and smooth of the bonding surface of voice coil loudspeaker voice coil, improve the cohesive force and the roughness of voice coil loudspeaker voice coil and vibrating diaphragm.
Drawings
Other objects and results of the invention will be more apparent and readily appreciated by reference to the following description taken in conjunction with the accompanying drawings, and as the invention is more fully understood. In the drawings:
fig. 1 is a schematic structural view of a lead-out portion of a conventional voice coil lead;
fig. 2 is an exploded schematic view of a voice coil and a diaphragm of a micro-speaker according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a lead-out portion of a voice coil lead of a micro-speaker according to an embodiment of the present invention;
fig. 4 is a schematic view of a combination structure of a voice coil and a diaphragm of a micro-speaker according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a partially enlarged structure of a lead-out portion of a voice coil lead of a micro-speaker according to an embodiment of the present invention.
In the figure: the voice coil comprises a diaphragm 1, a center part 11, a corrugated rim part 12, a voice coil 2, a voice coil body 21, voice coil leads 22, a supporting pad 3 and lead grooves 31.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
To aforementioned current micro loudspeaker because of the voice coil loudspeaker voice coil that the bonding surface of voice coil loudspeaker voice coil leads to is uneven with the problem that the cohesive force of vibrating diaphragm is low, the roughness is poor, the utility model discloses a set up the supporting pad between voice coil loudspeaker voice coil and vibrating diaphragm to set up the lead wire groove that is used for placing the voice coil loudspeaker voice coil lead wire on the supporting pad, thereby guarantee the level and smooth of the bonding surface of voice coil loudspeaker voice coil, improve the cohesive force and the roughness of voice coil loudspeaker voice coil and vibrating diaphragm.
In order to illustrate the micro-speaker provided by the present invention, fig. 2 shows an exploded structure of a voice coil and a diaphragm of the micro-speaker according to an embodiment of the present invention, and fig. 3 shows a structure of a lead-out portion of a voice coil lead of the micro-speaker according to an embodiment of the present invention; fig. 4 shows a combination structure of a voice coil and a diaphragm of a micro-speaker according to an embodiment of the present invention; fig. 5 shows a partially enlarged structure of a lead-out portion of a voice coil lead of a micro-speaker according to an embodiment of the present invention.
As shown in fig. 2 to 5, the micro-speaker of the present invention includes a diaphragm 1 and a voice coil 2; the voice coil 2 includes a voice coil body 21 and a voice coil lead 22. A supporting pad 3 is arranged between the vibrating diaphragm 1 and the voice coil 2, a lead groove 31 is arranged on the supporting pad 3, and a voice coil lead is placed in the lead groove 31 and led out from the lead groove 31; wherein, the position of the lead wire groove 31 on the supporting pad corresponds to the lead-out position of the voice coil lead. That is to say, the voice coil lead 22 can be directly led out from the inner side of the voice coil body 21 through the lead groove 31, so that the voice coil lead is not led out from the inner side of the voice coil body 21 along the outer edge of the voice coil body any more, and the problem of unevenness of the bonding surface of the voice coil is avoided.
Further, the diaphragm includes a central portion 11 and a corrugated portion 12 disposed around the central portion 11, where the central portion 11 is used for enhancing the acoustic performance of the diaphragm at high frequencies, and the corrugated portion 12 is used for supporting the diaphragm.
Since the lead grooves 31 provided in the support pad 3 are located at positions corresponding to the lead-out positions of the voice coil leads 22, the voice coil leads 22 are led out through the lead grooves 31 provided in the support pad 3, and the adhesion and flatness between the voice coil 2 and the diaphragm 1 can be improved.
Further, in order to ensure flatness of the bonding surface of the voice coil 2, the number of the lead grooves 31 may be not more than the number of the voice coil leads 22. Specifically, in an example of the utility model, when the quantity of the voice coil loudspeaker voice coil lead wire that needs to draw forth has many, can set up the lead wire groove of corresponding quantity on the back-up pad and draw forth the voice coil loudspeaker voice coil lead wire. For example, when 5 voice coil leads need to be led out, 5 lead grooves can be arranged on the supporting pad to lead out the 5 voice coil leads respectively; of course, the number of the lead slots can be set according to actual conditions; for example, when the positions of three voice coil leads in the 5 led-out voice coil leads are close, the three voice coil leads can be led out together by using one lead slot, so that the situation that too many lead slots are formed in the support pad is avoided, and the working procedure and time are saved.
Wherein, the lead groove is of a quadrilateral structure. For example, it may be a rectangular or a parallelogram structure. The quadrilateral structure of the lead slot is determined according to the actual situation, and will not be described herein.
In addition, the shape of the supporting pad is matched with the shape of the voice coil. For example, when the voice coil is a square structure, the support pad is a square structure; when the voice coils are all of a circular structure, the supporting pad is of a circular structure.
Furthermore, the present invention provides an electronic device, which comprises the above-mentioned micro speaker. The electronic device can be a mobile phone, a tablet and other terminal equipment.
According to the above, the utility model provides a micro loudspeaker and contain this micro loudspeaker's electron device, it is through setting up the supporting pad between voice coil loudspeaker voice coil and vibrating diaphragm to set up the lead wire groove that is used for acceping the voice coil loudspeaker voice coil lead wire on the supporting pad, thereby can guarantee the level and smooth of the bonding surface of voice coil loudspeaker voice coil, and then improve the cohesive force and the roughness of voice coil loudspeaker voice coil and vibrating diaphragm.
The micro-speaker and the electronic device including the same according to the present invention are described above by way of example with reference to the accompanying drawings. However, it should be understood by those skilled in the art that various modifications can be made to the micro-speaker and the electronic device including the same without departing from the scope of the invention. Therefore, the scope of the present invention should be determined by the content of the appended claims.
Claims (7)
1. A micro speaker comprises a diaphragm and a voice coil; the voice coil comprises a voice coil body and a voice coil lead; it is characterized in that the preparation method is characterized in that,
a supporting pad is arranged between the vibrating diaphragm and the voice coil;
a lead groove is formed in the support pad, and the voice coil lead is placed in the lead groove and led out from the lead groove; wherein,
the position of the lead groove on the supporting pad corresponds to the lead-out position of the voice coil lead.
2. The micro-speaker of claim 1,
the number of the lead grooves is not more than that of the voice coil leads.
3. The micro-speaker of claim 1,
the lead groove is of a quadrilateral structure.
4. The micro-speaker of claim 1,
the shape of the supporting pad is matched with that of the voice coil.
5. The micro-speaker of claim 4,
the supporting pad is of a square or round structure.
6. The micro-speaker of claim 1,
the diaphragm comprises a central part and a bending ring part surrounding the central part.
7. An electronic device comprising the micro-speaker according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720254250.7U CN206611569U (en) | 2017-03-15 | 2017-03-15 | Microspeaker and the electronic installation comprising the Microspeaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720254250.7U CN206611569U (en) | 2017-03-15 | 2017-03-15 | Microspeaker and the electronic installation comprising the Microspeaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206611569U true CN206611569U (en) | 2017-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720254250.7U Active CN206611569U (en) | 2017-03-15 | 2017-03-15 | Microspeaker and the electronic installation comprising the Microspeaker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206611569U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020073490A1 (en) * | 2018-09-21 | 2020-04-16 | 歌尔股份有限公司 | Loudspeaker |
-
2017
- 2017-03-15 CN CN201720254250.7U patent/CN206611569U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020073490A1 (en) * | 2018-09-21 | 2020-04-16 | 歌尔股份有限公司 | Loudspeaker |
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