CN206611137U - A kind of vertically arranged heat sinking chip bus duct - Google Patents
A kind of vertically arranged heat sinking chip bus duct Download PDFInfo
- Publication number
- CN206611137U CN206611137U CN201720329920.7U CN201720329920U CN206611137U CN 206611137 U CN206611137 U CN 206611137U CN 201720329920 U CN201720329920 U CN 201720329920U CN 206611137 U CN206611137 U CN 206611137U
- Authority
- CN
- China
- Prior art keywords
- bus duct
- fin
- shroud
- plate
- back shroud
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Installation Of Bus-Bars (AREA)
Abstract
The utility model discloses a kind of vertically arranged heat sinking chip bus duct, including front shroud and back shroud, left plate and right plate;The conducting copper of parcel insulating materials is provided between the left plate and right plate, left plate and right plate before and after conducting copper with being provided with front shroud and back shroud, fin fixing hole is provided with the front shroud and back shroud, is provided between front shroud and back shroud and is close to the fin that side plate lateral surface is longitudinally arranged.The utility model is not on the premise of influenceing assembly technology and live anchor ear to install, the radiating effect of bus duct can be effectively improved, change the bad radiating mode of conventional busbars groove radiating, the Novel bus duct made using the copper bar of same cross-sectional, the electric current bigger than the bus duct that traditional heat-dissipating mode makes can be flowed through, the electrical efficiency of copper bar is improved, social resources have been saved.
Description
Technical field
The utility model is related to bus duct technical field, specially a kind of vertically arranged heat sinking chip bus duct.
Background technology
With the development of society, modern high-rise building and large-scale workshop need huge electric energy, hundreds and thousands of peaces can be transmitted
The bus duct for training powerful electric current is widely applied.Latest model bus duct is the conductor outer wrapping using high-purity copper bar as conductor
Insulating materials, then the high strength sectional material drawn with almag make shell, and three phase lines in electrical voltage system are arranged into (ABC phases
Row), zero-emission (N rows), a ground protection row (PE rows) combine the power distribution equipment of the efficient conveying electric current being assembled into.
Due to the presence of resistance and impedance in conductor, bus duct, which is powered in operation, can produce heat, each position temperature of bus duct
Degree can gradually rise, to enable bus duct safe operation, it is ensured that its each spot temperature meets the requirement of national standard, it is necessary to by it
The heat of generation is distributed.
It is known that the influence in order to eliminate conductor kelvin effect, conductor copper bar must make flat thin rectangle shape as far as possible
Shape, but due to busway inserting case tapping unit, jointing and assembly technology the need for, it is necessary to wider front and rear covers are set
Plate, such bus duct cross section has just been designed to dies.Copper bar is produced during vertically arranged bus duct energization operation
Heat be transmitted to the side plate of bus duct shell from copper bar side, then distributed to conduct, in the way of convection current.Because air is
Thermal conductivity very low heat-insulating material, heat loss through conduction does not have effect substantially.Because bus duct is right angle setting, connect with side plate lateral surface
Tactile air heats rise, and air is formed effective convection current, so the main heat sink mode of vertically arranged bus duct is convection current
Radiating.But because five conducting coppers are arranged superposeds, and radiating surface is only two lateral surfaces of left and right side plate, radiating effect
It is unsatisfactory.In order to improve radiating effect, traditional approach is to add radiating along longitudinal direction on the outside of side plate when drawing busbar side board
Muscle, but due to the restriction of assembly production technique, radiating ribs can only very little, highly no more than 3 millimeters, the shadow to improving radiating effect
Sound is limited.Due to the thermal Finite distributed in the bus duct unit interval to external environment, to make each spot temperature of bus duct not surpass
The requirement of national standard is crossed, the heat produced in the bus duct unit interval is only reduced, that is, reduces in bus duct conductor copper bar and flows
The electric current crossed.The corresponding utilization ratio for reducing copper bar, causes the waste of material.How not influence assembly technology and show
On the premise of field anchor ear is installed, increase the area of dissipation of bus duct, the radiating effect of bus duct is improved, so as to improve leading for copper bar
Electrical efficiency, saving social resources, are always a great problem for perplexing bus duct industry.
Utility model content
The purpose of this utility model is to provide a kind of vertically arranged heat sinking chip bus duct, to solve the above-mentioned back of the body
The problem of being proposed in scape technology.
To achieve the above object, the utility model provides following technical scheme:A kind of vertically arranged heat sinking chip
Bus duct, including front shroud and back shroud, left plate and right plate, it is characterised in that:Set between the left plate and right plate
Be equipped with the conducting copper of parcel insulating materials, left plate and right plate with being provided with front shroud and back shroud before and after conducting copper,
Fin fixing hole is provided with the front shroud and back shroud, is provided between front shroud and back shroud and is close to side plate lateral surface
Fin, be provided with fixing hole on fin on fin.
It is preferred that, fixed between the front shroud and back shroud and left plate and right plate by rivet.
It is preferred that, the width of the front shroud and back shroud is set to 128mm, and left plate, right plate and conducting copper are thick
Degree sum is 25mm.
It is preferred that, the high setting of the fin is high 50mm.
It is preferred that, pass through fixing hole on fin fixing hole and fin between the fin and left plate and right plate
Fixed with self-tapping screw.
Compared with prior art, the beneficial effects of the utility model are:The utility model is not influenceing assembly technology and showed
On the premise of field anchor ear is installed, the area of dissipation of bus duct is considerably increased, the radiating effect of bus duct is effectively increased, changed
The bad radiating mode of conventional busbars groove radiating, the Novel bus duct made using the copper bar of same cross-sectional, can flow through than passing
The bigger electric current of bus duct that radiating mode of uniting makes, improves the electrical efficiency of conductor copper bar, has saved social resources.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is sectional drawing of the present utility model.
Fig. 3 is the cross-sectional view of the utility model front and rear cover plate.
Fig. 4 is the partial structural diagram of the utility model bus duct front and rear cover plate.
Fig. 5 is the structural representation of the utility model fin.
Fig. 6 is the structural representation of fixing hole on the utility model fin.
In figure:1- front shrouds;2- back shrouds;3- left plates;4- right plates;5- self-tapping screws;6- rivets;7- fin;
8- conducting coppers;9- front and rear cover plate fin fixing holes;Fixing hole on 10- fin.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Fig. 1-6 are referred to, the utility model provides a kind of technical scheme:A kind of vertically arranged heat sinking chip bus
Groove, including front shroud 1 and back shroud 2, left plate 3 and right plate 4, are provided with parcel insulation material between left plate 3 and right plate 4
The conducting copper 8 of material, left plate 3 and right plate 4 before and after conducting copper with being provided with front shroud 1 and back shroud 2, the He of front shroud 1
Fin fixing hole 9 is provided with back shroud 2, the fin for being close to side plate lateral surface is provided between front shroud 1 and back shroud 2
7, fixing hole 10 on fin are provided with fin 7, are passed through between front shroud 1 and back shroud 2 and left plate 3 and right plate 4
Rivet 6 is fixed, and the width of front shroud 1 and back shroud 2 is set to 128mm, left plate 3, right plate 4 and the thickness of conducting copper 8 it
It is high 50mm with the high setting for 25mm, fin 7, the heat that bus duct energization operation is produced is transmitted to fin 7, makes radiating
Air heats around piece 7 rise, and because the height of fin 7 is much larger than traditional heat-dissipating muscle, considerably increase dissipating for bus duct
Hot area, therefore the effect of good heat loss through convection is generated, fin 7 passes through front and rear covers between front shroud 1 and back shroud 2
Plate fin fixing hole 9 is fixed with fixing hole on fin 10 with self-tapping screw 5.
Operation principle:Assemble before bus duct, front shroud 1 and back shroud 2 are processed into fin fixing hole 9 with mould, so
Each parts of bus duct are traditionally riveted into molding assembly afterwards, the fin fixing hole of front shroud 1 and back shroud 2 during assembling
9 note keeping corresponding to up and down, and the bottom of fin 7 processed by certain size then is smeared into heat-conducting silicone grease, is allowed to and left side
Plate 3 and the outside of right plate 4 are brought into close contact, then are fixed with four self-tapping screws 5 by the fin on front shroud 1 and back shroud 2
Fin 7 is fixed in hole 9;The bus duct heat that operation produces that is powered is transmitted to fin 7, make air around fin 7 by
Heat rises, and generates good heat loss through convection effect.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out in the case where not departing from principle of the present utility model and spirit a variety of changes, repaiies
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of vertically arranged heat sinking chip bus duct, including front shroud (1) and back shroud (2), left plate (3) and the right side
Side plate (4), it is characterised in that:The conducting copper of parcel insulating materials is provided between the left plate (3) and right plate (4)
(8), left plate (3) and right plate (4) before and after conducting copper with being provided with front shroud (1) and back shroud (2), the front shroud
(1) fin fixing hole (9) and on back shroud (2) is provided with, is provided between front shroud (1) and back shroud (2) and is close to side plate
The fin (7) of lateral surface, fin direction is provided with fixing hole on fin (10) to be longitudinally arranged on fin (7).
2. heat sinking chip bus duct according to claim 1, it is characterised in that:The front shroud (1) and back shroud
(2) it is fixed by rivet (6) between left plate (3) and right plate (4).
3. heat sinking chip bus duct according to claim 1, it is characterised in that:The front shroud (1) and back shroud
(2) width is set to 128mm, and left plate (3), right plate (4) and conducting copper (8) thickness sum are 25mm.
4. heat sinking chip bus duct according to claim 1, it is characterised in that:The high setting of the fin (7)
For high 50mm.
5. heat sinking chip bus duct according to claim 1, it is characterised in that:The fin (7) is in front shroud
(1) self-tapping screw is used by fixing hole (10) on front and rear cover plate fin fixing hole (9) and fin between back shroud (2)
(5) it is fixed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720329920.7U CN206611137U (en) | 2017-03-31 | 2017-03-31 | A kind of vertically arranged heat sinking chip bus duct |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720329920.7U CN206611137U (en) | 2017-03-31 | 2017-03-31 | A kind of vertically arranged heat sinking chip bus duct |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206611137U true CN206611137U (en) | 2017-11-03 |
Family
ID=60173947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201720329920.7U Active CN206611137U (en) | 2017-03-31 | 2017-03-31 | A kind of vertically arranged heat sinking chip bus duct |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206611137U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114006336A (en) * | 2021-11-25 | 2022-02-01 | 青岛东山集团电气科技有限公司 | Take U type aluminum heat dissipation board copper conductor compact busway |
-
2017
- 2017-03-31 CN CN201720329920.7U patent/CN206611137U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114006336A (en) * | 2021-11-25 | 2022-02-01 | 青岛东山集团电气科技有限公司 | Take U type aluminum heat dissipation board copper conductor compact busway |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201417912Y (en) | High power photovoltaic junction box with good heat dissipation effect | |
CN207201211U (en) | Homogeneous temperature type air-cooled radiator and photovoltaic DC-to-AC converter | |
CN205029278U (en) | Bus slot | |
CN206611137U (en) | A kind of vertically arranged heat sinking chip bus duct | |
CN109245003B (en) | High-efficient heat dissipation formula bus duct | |
CN206673523U (en) | A kind of heat sinking chip bus duct | |
CN206865074U (en) | A kind of vertically arranged novel air flow-guiding type bus duct | |
CN218040691U (en) | Fire-resistant intensive bus duct | |
CN204836913U (en) | Compound radiator and heat dissipation module | |
CN208060644U (en) | A kind of electronic load test device | |
CN206023119U (en) | Waterproof cooling bus mounting structure | |
CN210724127U (en) | Novel high-voltage common-box bus | |
CN107845844A (en) | A kind of track traffic lithium ion battery module | |
CN106452112A (en) | Power amplifier board for motor controller | |
CN201799792U (en) | Radiating structure for inversion welder | |
CN203378193U (en) | Heat dissipation sheet | |
CN209562110U (en) | A kind of concentration bus duct with rapid cooling performance | |
CN203118519U (en) | Large-area self- heat-dissipation copper busbar | |
CN206237098U (en) | A kind of band radiator air type bus duct | |
CN207560621U (en) | A kind of high-power SKIVING cooling fins of charging pile | |
CN208523123U (en) | A kind of copper bar bridging arrangement and its copper bar component, copper bar radiator | |
CN205105457U (en) | High -quality PCB board | |
CN206952346U (en) | A kind of direct-current inverter welding machine radiator structure | |
CN206022348U (en) | Radiator and electric locomotive commutator for thyristor | |
CN209329639U (en) | A kind of band radiator air type bus duct |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |