CN206610247U - CPU heat conduction structure - Google Patents

Abstract

The utility model relates to a heat dissipation technical field provides a CPU heat conduction structure, including the CPU body, still include the heat dissipation body that in time dispels the heat and solve assembly tolerance to CPU, the heat dissipation body include with CPU body direct contact's copper post and cup joint the spring assembly in the middle of the copper post, the utility model discloses an adopt copper post structural style, fully absorb the heat that high-power consumption CPU during operation produced, and through spring assembly absorbed pressure tolerance, effectually guaranteed CPU not receive the hard power to damage when solving the CPU heat, prolonged CPU's life.

Description

A kind of CPU conductive structures

Technical field

The utility model is related to technical field of heat dissipation, more particularly to a kind of CPU conductive structures.

Background technology

With the continuous improvement of science and technology and living standard, people increasingly be unable to do without computer application field, computer Claim computer, be a kind of feature it is powerful it is computable, can store, can high speed processing mass data and comprehensive modernization Intelligent electronic device.Substantial amounts of hardware device is included in a computer, and most common of which is all operations in CPU, computer All it is responsible for reading instruction by CPU, to Instruction decoding and the core component of execute instruction, because CPU frequency of use is high, causes it Surface can give out substantial amounts of heat, if do not discharged timely to heat, and easily CPU is produced to damage even to trigger and pacified Full accident, simultaneously because fan etc. shakes, then causes CPU to be unclamped with mainboard, causes computer operation troubles.

In the prior art, a kind of fan-free product conductive structure is occurred in that, CPU heats are absorbed using aluminium block, but due to aluminium Again CPU heat derives can be made not abundant enough after absorbing build-up tolerance, increase heat conductive pad equipped with heat conductive pad between block and CPU, And contacted between CPU and conductive structure using hard force easily can cause to damage to CPU.

Utility model content

For above-mentioned technical problem, the purpose of this utility model is to ask for heat derives when effectively solving CPU work Topic can be led there is provided one kind is simple in construction to the CPU that CPU heat fully export and protect CPU not damaged by hard force Heat structure.

In order to solve the above-mentioned technical problem, the technical solution of the utility model is：A kind of CPU conductive structures, including CPU sheets Body, in addition to carry out radiating and solving in time the heat radiator body of build-up tolerance to CPU, described heat radiator body includes and CPU sheets Copper post that body is directly contacted and the spring assembly being socketed in the middle of copper post.

It is preferred that, the heat radiator body also includes upper holder block, lower lock block and copper pipe, and the upper holder block upper surface is provided with Edge set is cased with heat conductive pad and through hole, the through hole, the lower surface of the upper holder block and the upper surface of lower lock block are symmetrically set There is strip groove, the copper pipe is fixed in the strip groove between upper holder block and lower lock block, wherein, heat conductive pad can be to PCB master Plate south bridge or north bridge play a conductive force.

It is preferred that, the copper post is fixedly mounted in the through hole of upper holder block, and the spring assembly is fixed by lock-screw On upper holder block.

It is preferred that, the spring assembly includes spring pressuring plate, spring guide pillar and spring, and the spring guide pillar is fixedly mounted on The middle part of spring pressuring plate, the spring housing is on spring guide pillar.

It is preferred that, the copper pipe is L-shaped, and the tail end of copper pipe is connected with side pressing block, and side pressing block makes CPU conductive structures or so two Together with the radiator of side is brought into close contact with copper pipe, heat is set sufficiently to be distributed and exported.

It is preferred that, the through hole is circle.

Compared with prior art, the beneficial effects of the utility model have：By copper post by CPU heat diffusion to upper pressure Block, upper holder block is diffused into copper pipe, then by copper pipe by the radiator of heat diffusion to CPU conductive structures two ends, serves well Radiating effect；Copper pipe tail end is connected with side pressing block, and the radiator at CPU conductive structures two ends and copper pipe are preferably fitted in into one Rise so that heat is sufficiently spread；By spring assembly absorption pressure tolerance, it is effectively guaranteed CPU and is not damaged by hard force It is bad, extend CPU service life.

Brief description of the drawings

Fig. 1 is overall structure diagram of the present utility model；

Fig. 2 is sectional view of the present utility model；

Wherein, 1 is copper post；2 be upper holder block；3 be lower lock block；4 be copper pipe；5 be heat conductive pad；6 be through hole；7 be that bar shaped is recessed Groove；8 be lock-screw；9 be side pressing block；10 be spring assembly；101 be spring pressuring plate；102 be spring guide pillar；103 be spring； 11 be cylindrical hole.

Embodiment

In order that those skilled in the art is better understood from the technical solution of the utility model, below in conjunction with the accompanying drawings to this The technical scheme of utility model is further elaborated.

As shown in Figure 1-2, a kind of CPU conductive structures, including CPU bodies, in addition to CPU is carried out to radiate and solve in time The heat radiator body of build-up tolerance, heat radiator body includes the copper post 1 directly contacted with CPU bodies, the spring being socketed in the middle of copper post 1 Component 10, upper holder block 2, lower lock block 3 and copper pipe 4, spring assembly 10 are fixed on upper holder block 2 by lock-screw 8, upper holder block 2 upper surfaces are provided with heat conductive pad 5 and through hole 6, and heat conductive pad 5 can play a conductive force, through hole to PCB main board south bridge or north bridge Edge set is cased with 5, the lower surface of upper holder block 2 and the upper surface of lower lock block 3 are arranged with strip groove 7, and copper pipe 4 is fixed on In strip groove 7 between upper holder block 2 and lower lock block 3, copper post 1 is fixedly mounted in the through hole 6 of upper holder block 2.

Spring assembly 10 includes spring pressuring plate 101, spring guide pillar 102 and spring 103, and spring guide pillar 102 is fixedly mounted on The middle part of spring pressuring plate 101, spring 103 is enclosed on spring guide pillar 102；Copper pipe 4 is L-shaped, and the tail end of copper pipe 4 is connected with side pressing block 9, side pressing block 9 makes together with the radiator of the CPU conductive structures left and right sides is brought into close contact with copper pipe 4, to make heat obtain sufficiently Distribute and export；In an assembling process, spring assembly 10 is socketed in the middle of copper post 1, and the upper surface of copper post 1 is contacted with CPU, heat conduction Pad 5 is contacted with the south bridge or north bridge of PCB main board, and copper post 1 plays a part of heat conduction with heat conductive pad 5, and heat is expanded by upper holder block 2 Copper pipe 4 is scattered to, then the radiator of heat diffusion to CPU conductive structures two ends is served into good radiating effect by copper pipe 4, And because the elastic force of spring 103 is acted on, be effectively guaranteed CPU and do not damaged by hard force.

Described above is the utility model preferably embodiment, in the case of the utility model design is not departed from, is carried out Any obvious deformation and replacement, belong to protection domain of the present utility model.

Claims (6)

1. a kind of CPU conductive structures, including CPU bodies, it is characterised in that：It also includes carrying out CPU radiating and solving in time The heat radiator body of build-up tolerance, described heat radiator body includes the copper post directly contacted with CPU bodies（1）And it is socketed in copper Post（1）Middle spring assembly（10）.

2. CPU conductive structures according to claim 1, it is characterised in that：The heat radiator body also includes upper holder block（2）、 Lower lock block（3）And copper pipe（4）, the upper holder block（2）Upper surface is provided with heat conductive pad（5）And through hole（6）, the through hole（6） On be cased with edge set, the upper holder block（2）Lower surface and lower lock block（3）Upper surface be arranged with strip groove（7）, institute State copper pipe（4）It is fixed on upper holder block（2）With lower lock block（3）Between strip groove（7）It is interior.

3. CPU conductive structures according to claim 2, it is characterised in that：The copper post（1）It is fixedly mounted on upper holder block （2）Through hole（6）It is interior, the spring assembly（10）Pass through lock-screw（8）It is fixed on upper holder block（2）On.

4. CPU conductive structures according to claim 3, it is characterised in that：The spring assembly（10）Including spring pressuring plate （101）, spring guide pillar（102）And spring（103）, the spring guide pillar（102）It is fixedly mounted on spring pressuring plate（101）In Portion, the spring（103）It is enclosed on spring guide pillar（102）On.

5. CPU conductive structures according to claim 4, it is characterised in that：The copper pipe（4）It is L-shaped, copper pipe（4）Tail End is connected with side pressing block（9）.

6. CPU conductive structures according to claim 4, it is characterised in that：The through hole（6）For circle.