CN206602169U - A kind of ultra wide band low-loss power distributor based on double-deck micro-strip - Google Patents
A kind of ultra wide band low-loss power distributor based on double-deck micro-strip Download PDFInfo
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- CN206602169U CN206602169U CN201720242744.3U CN201720242744U CN206602169U CN 206602169 U CN206602169 U CN 206602169U CN 201720242744 U CN201720242744 U CN 201720242744U CN 206602169 U CN206602169 U CN 206602169U
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Abstract
The utility model provides a kind of ultra wide band low-loss power distributor based on double-deck micro-strip, belongs to technical field of electronic devices.The ultra wide band low-loss power distributor based on double-deck micro-strip, including input port, two output ports, the multistage impedance work(separation structure being arranged between input port and output port, upper micro-strip medium substrate and lower micro-strip medium substrate.The multistage impedance work(separation structure includes two groups of symmetrical more piece stepped impedance transmission lines, it is located at the upper surface of lower micro-strip medium substrate, provided with one group of isolation resistance between two groups of more piece stepped impedance transmission lines, the end that symmetrical two more pieces stepped impedance transmission line is often saved is connected by an isolation resistance.The ultra wide band low-loss power distributor based on double-deck micro-strip that the application is provided, is combined using the cascade of more piece stepped impedance transmission line and multiple isolation resistances, has widened the bandwidth of power splitter, improved the isolation of output end.
Description
Technical field
The utility model is related to technical field of electronic devices, more particularly to a kind of ultra wide band low-loss based on double-deck micro-strip
Power divider.
Background technology
With the rapid development of communication technology, requirement more and more higher of the people to the information transmission system, it is desirable to obtain more
Frequency spectrum resource, come improve data transmission rate and reduce system loss.Thus demand, ultra wide band UWB technology meets the tendency of
And give birth to, super-broadband tech is simple with its system architecture, cost is low, small power consumption, it is safe, be not likely to produce interference, data transfer
A study hotspot of the features such as speed is high as current wireless communication field.Power splitter is that microwave receiving, transmitting and frequency are closed
The indispensable part into system, either microwave communication, radar, remote control remote sensing, electronic reconnaissance, electronic countermeasure or microwave
In measuring system, there is the demand for distributing signal constant power, signal constant power be assigned as multichannel, then be respectively processed,
It is very universal application.By power splitter reversion using being exactly power combiner in emission system, in, powerful transmitting
In source, there is important influence to whole system performance.Especially in multichannel measuring system, even more decision systems performance
Critical component, has strict requirements to amplitude coincidence, phase equalization index, so just can guarantee that the measurement essence of system
Degree.
Ultra wide band UWB technology was lifted a ban, the United States Federal earliest using military radar as main application after on 2 14th, 2002
Federal Communications Commission FCC is provided：" noise specifications value -41.3dBm/MHz is radiated less than the U.S. in transmit power, i.e. power is then
Under conditions of 1mW/MHz, 3.1G~10.6GHz frequency band can be used for the imaging system being scanned to the thing of underground and partition wall
System, automobile collision avoidance radar and progress ranging and RFDC between household electrical appliance terminal and portable terminal ".Ultra-wideband communications
Yin Qigenggao transmission rate, is widely used in the fields such as modern short-distance wireless communication.Radio ultra wide band system passes through
Transmitting and reception radiofrequency signal, are communicated in very wide frequency range, there is the transmission power and very high signal of very little
Transmission rate.
The Sai Wai of in August, 2008 Wong et al. IEEE MICROWAVE AND WIRELESS COMPONENTS
" Ultra-Wideband Power Divider have been delivered on LETTERS periodicals (vol.18, no.8, pp.518-520,2008)
With Good In-Band Splitting and Isolation Performances ", propose a kind of single layer microstrip structure,
The power divider structure that it is made up of a pair of stepped impedance lines, open circuit minor matters line and parallel coupled lines, although it has preferable
Isolation characteristic with interior stalling characteristic and output port, but its bandwidth can only achieve scope that ultra wide band defines and can not open up again
It is wide.In October, 2013, P.O.Afanasiev et al. was in International Conference on Antenna Theory
" A Novel Design ofUltra-wideband have been delivered on and Techniques periodicals (pp.323-325,2013)
Strip-line Power Divider for 2-18GHz ", propose a kind of ultra-wide strip line being made up of three layers of dielectric-slab
Power divider structure, although its bandwidth is relatively wide, but the size of the structure is unfavorable for being minimized than larger.
The content of the invention
The purpose of the application is the deficiency for above-mentioned prior art, proposes that a kind of ultra wide band based on double-deck micro-strip is low
Loss power distributor, can extend to its bandwidth can cover multiple octaves, and can reduce the loss of power divider,
The isolation of output port is improved, and less size can be kept.
To achieve the above object, this application provides a kind of ultra wide band low-loss power distributor based on double-deck micro-strip.
The ultra wide band low-loss power distributor based on double-deck micro-strip, including input port, the first output port, the second output end
Mouth, multistage impedance work(separation structure, the upper micro-strip medium base being arranged between input port and an output port, the second output port
Plate and lower micro-strip medium substrate.
The upper micro-strip medium substrate and lower micro-strip medium substrate fit, and the upper surface of upper micro-strip medium substrate is micro- with
Lower surface with medium substrate is metal ground plane.
The multistage impedance work(separation structure includes two groups of symmetrical more piece stepped impedance transmission lines, and it is located at lower micro-strip medium
Provided with one group of isolation resistance, symmetrical two more pieces stepped impedance between the upper surface of substrate, two groups of more piece stepped impedance transmission lines
The end that transmission line is often saved is connected by an isolation resistance.
Further, contact surface, the multistage impedance work(separation structure of the upper micro-strip medium substrate and lower micro-strip medium substrate
Both sides be equipped with metal band.Some metallization vias are provided with the metal band, micro-strip medium substrate is extended through
With lower micro-strip medium substrate, the upper surface of upper micro-strip medium substrate is connected with the lower surface of lower micro-strip medium substrate.
Preferably, some through holes for accommodating isolation resistance are provided with the upper micro-strip medium substrate, the through hole is non-gold
Categoryization via.
Further, the upper micro-strip medium substrate and lower micro-strip medium substrate are that one side covers copper medium substrate, cover copper
Face is metal ground plane, and the non-copper face that covers fits.
Preferably, the upper micro-strip medium substrate and lower micro-strip medium substrate use dielectric constant for 2.2, and thickness of slab is
0.7mm one side covers copper medium substrate.
Preferably, the more piece stepped impedance transmission line is eight section stepped impedance transmission lines, and symmetrical two stepped impedance is passed
The end that defeated line is often saved is connected by an isolation resistance.
The utility model has the advantages and positive effects of：The low damage of the ultra wide band based on double-deck micro-strip that the application is provided
Power divider is consumed, is combined using the cascade of more piece stepped impedance transmission line and multiple isolation resistances, has widened the band of power splitter
Width, improves the isolation of output end.
The ultra wide band low-loss power distributor based on double-deck micro-strip that the application is provided, using double-deck microstrip structure, gold
Belong to band and two row's plated-through holes, form the cavity of a closing, reduce the energy leakage of microstrip structure, reduce work(
Divide the radiation loss of device.
Brief description of the drawings
Fig. 1 is the structural representation of the application.
Fig. 2 is the left view schematic diagram of the application.
Fig. 3 is the elevational schematic view of upper micro-strip medium substrate in the application.
Fig. 4 is the schematic top plan view of lower micro-strip medium substrate in the application.
Fig. 5 is the analogous diagram of the application transmission characteristic.
Fig. 6 is the analogous diagram of the application reflection characteristic and isolation characteristic.
In figure：Micro-strip medium substrate under the upper micro-strip medium substrates of 1-, 2-, 3- vias, 4- metal bands, 5- input ports,
The output ports of 6- first, the output ports of 7- second, 8- multistage impedance work(separation structures, 9- isolation resistances, 10- through holes.
Embodiment
In order to be better understood from the utility model, traveling one is entered to the utility model with reference to specific embodiments and the drawings
The description of step.
As Figure 1-Figure 4, this application provides a kind of ultra wide band low-loss power distributor based on double-deck micro-strip, bag
Input port 5 is included, the first output port 6, the second output port 7 is arranged on the output port 6, second of input port 5 and first defeated
Multistage impedance work(separation structure 8, upper micro-strip medium substrate 1 and lower micro-strip medium substrate 2 between exit port 7.
Upper micro-strip medium substrate 1 and lower micro-strip medium substrate 2 fit, and the upper surface of upper micro-strip medium substrate 1 is micro- with
Lower surface with medium substrate 2 is metal ground plane.Upper micro-strip medium substrate 1 and lower micro-strip medium substrate 2 are that one side covers
Copper medium substrate, covers copper face for metal ground plane, the non-copper face that covers fits.It is used as a kind of embodiment, upper micro-strip medium substrate 1
Dielectric constant is used for 2.2 (ε with lower micro-strip medium substrate 2r=2.2), thickness of slab is 0.7mm (h1=0.7mm) one side cover
Copper medium substrate.
Multistage impedance work(separation structure 8 is arranged on the binding face of micro-strip medium substrate 1 and lower micro-strip medium substrate 2.It is upper micro-
The both sides of contact surface, multistage impedance work(separation structure 8 with medium substrate 1 and lower micro-strip medium substrate 2 are equipped with metal band 4.
Some metallization vias 3 are provided with metal band 4, metallization via 3 extends through micro-strip medium substrate 1 and lower micro-strip medium
Substrate 2, the upper surface of upper micro-strip medium substrate 1 is connected with the lower surface of lower micro-strip medium substrate 2, by two metal ground planes
It is connected, serves as electric wall, prevent the leakage of energy, while realizing that the broadband of planar structure is integrated, and can effectively reduces
Radiation loss.
Some through holes 10 for accommodating isolation resistance 9 are provided with upper micro-strip medium substrate 1, through hole 10 is non-metallic via,
It is the space reserved for isolation resistance 9, is easy to welding.
Multistage impedance work(separation structure 8 includes two groups of symmetrical more piece stepped impedance transmission lines, and it is located at lower micro-strip medium base
Provided with one group of isolation resistance 9, symmetrical two more pieces stepped impedance between the upper surface of plate 2, two groups of more piece stepped impedance transmission lines
The end that transmission line is often saved passes through an isolation resistance 9.Input port 5 is transmitted by input port transmission line and more piece stepped impedance
Line be connected, the first output port 6, the second output port 7 pass through output port transmission line and two more piece stepped impedances respectively
The end of transmission line is connected.
As a kind of embodiment, more piece stepped impedance transmission line is eight section stepped impedance transmission lines, symmetrical two ladder
The end that impedance transmission lines are often saved is connected by an isolation resistance 9.Isolation resistance 9 is to be engaged with eight section stepped impedance transmission lines
8.Power distribution bandwidth can be extended to can cover nine octaves, that is, realize 2GHz to 18GHz frequency range, and can
The loss of power divider is reduced, the isolation of output port is improved, and less size can be kept.
The size of isolation resistance 9 determines the isolation characteristic of power splitter.As explanation, present embodiment is altogether provided with eight resistances
It is worth different resistance, i.e.,：R1=100 Ω, R2=160 Ω, R3=430 Ω, R4=430 Ω, R5=510 Ω, R6=560 Ω, R7=
650 Ω, R8=910 Ω.
The effect of the application can be further illustrated by following emulation：
Emulation 1, the transmission characteristic of the ultra wide band low-loss power distributor based on double-deck micro-strip provided the application is entered
Row emulation, as a result as shown in Figure 5.Wherein, S21(dB) transmission that curve is represented between the output port of input port 5 to the first 6 is special
Property；S31(dB) curve represents the transmission characteristic between the output port of input port 5 to the second 7.
Emulation 2, to the application provide the ultra wide band low-loss power distributor based on double-deck micro-strip reflection characteristic with
Isolation characteristic is emulated, as a result as shown in Figure 6.Wherein S11(dB) curve represents the reflection characteristic of input port 5, S23
(dB) the isolation characteristic curve between output port 6 and output port 7 is represented.
The ultra wide band low-loss power distributor based on double-deck micro-strip provided from Fig. 5 and Fig. 6, the application, is realized
Response coverage diagram S in 2-18GHz frequency ranges11Middle maximum is less than isolation S between -15dB, output port23Greatly
In 20dB, S21Insertion loss is less than 3.9dB.
Embodiment of the present utility model is described in detail above, but the content is only of the present utility model preferable
Embodiment, it is impossible to be considered as being used to limit practical range of the present utility model.All impartial changes made according to the utility model scope
Change and improvement etc., all should still be belonged within this patent covering scope.
Claims (6)
1. a kind of ultra wide band low-loss power distributor based on double-deck micro-strip, it is characterised in that：Including input port (5),
One output port (6), the second output port (7), it is arranged on input port (5) and the first output port (6), the second output port
(7) multistage impedance work(separation structure (8), upper micro-strip medium substrate (1) and lower micro-strip medium substrate (2) between；
The upper micro-strip medium substrate (1) and lower micro-strip medium substrate (2) fit, the upper surface of upper micro-strip medium substrate (1)
Lower surface with lower micro-strip medium substrate (2) is metal ground plane；
The multistage impedance work(separation structure (8) includes two groups of symmetrical more piece stepped impedance transmission lines, and it is located at lower micro-strip medium
Provided with one group of isolation resistance (9), symmetrical two more pieces rank between the upper surface of substrate (2), two groups of more piece stepped impedance transmission lines
The end that terraced impedance transmission lines are often saved is connected by an isolation resistance (9).
2. the ultra wide band low-loss power distributor according to claim 1 based on double-deck micro-strip, it is characterised in that：It is described
The contact surface of upper micro-strip medium substrate (1) and lower micro-strip medium substrate (2), the both sides of multistage impedance work(separation structure (8) are equipped with
Metal band (4)；
Some metallization vias (3) are provided with the metal band, micro-strip medium substrate (1) and lower micro-strip medium is extended through
Substrate (2), the upper surface of upper micro-strip medium substrate (1) is connected with the lower surface of lower micro-strip medium substrate (2).
3. the ultra wide band low-loss power distributor according to claim 1 based on double-deck micro-strip, it is characterised in that：It is described
Some through holes (10) for accommodating isolation resistance (9) are provided with upper micro-strip medium substrate (1), the through hole (10) is non-metallic mistake
Hole.
4. according to any described ultra wide band low-loss power distributors based on double-deck micro-strip of claim 1-3, its feature exists
In：The upper micro-strip medium substrate (1) and lower micro-strip medium substrate (2) are that one side covers copper medium substrate, cover copper face for metal
Ground plane, the non-copper face that covers fits.
5. the ultra wide band low-loss power distributor according to claim 4 based on double-deck micro-strip, it is characterised in that：It is described
Upper micro-strip medium substrate (1) and lower micro-strip medium substrate (2) use dielectric constant for 2.2, and thickness of slab is that 0.7mm one side covers
Copper medium substrate.
6. according to any described ultra wide band low-loss power distributors based on double-deck micro-strip of claim 1-3, its feature exists
In：The more piece stepped impedance transmission line is eight section stepped impedance transmission lines, the end that symmetrical two stepped impedances transmission line is often saved
End is connected by an isolation resistance (9).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720242744.3U CN206602169U (en) | 2017-03-14 | 2017-03-14 | A kind of ultra wide band low-loss power distributor based on double-deck micro-strip |
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| CN201720242744.3U CN206602169U (en) | 2017-03-14 | 2017-03-14 | A kind of ultra wide band low-loss power distributor based on double-deck micro-strip |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108123203A (en) * | 2017-12-18 | 2018-06-05 | 刘伟 | A kind of black coating power splitter of resistance |
| CN108123197A (en) * | 2017-12-18 | 2018-06-05 | 刘伟 | A kind of transition line power splitter |
| WO2018171225A1 (en) * | 2017-03-18 | 2018-09-27 | 深圳市景程信息科技有限公司 | Multi-section cascade coupling line structure |
| CN109411861A (en) * | 2018-12-11 | 2019-03-01 | 天津七六四通信导航技术有限公司 | A kind of one point of 14 multistage impedance power splitter |
| CN111969958A (en) * | 2020-08-26 | 2020-11-20 | 中国电子科技集团公司第四十一研究所 | Double-layer four-path power synthesis broadband frequency tripler and solid-state signal generator |
| CN113782937A (en) * | 2021-10-08 | 2021-12-10 | 广东分数维无线科技有限公司 | Low-insertion-loss miniaturized high-frequency-ratio millimeter wave dual-band power divider and design method |
| CN114335962A (en) * | 2022-01-13 | 2022-04-12 | 中国人民解放军63660部队 | Transient electromagnetic pulse power divider |
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2017
- 2017-03-14 CN CN201720242744.3U patent/CN206602169U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018171225A1 (en) * | 2017-03-18 | 2018-09-27 | 深圳市景程信息科技有限公司 | Multi-section cascade coupling line structure |
| CN108123203A (en) * | 2017-12-18 | 2018-06-05 | 刘伟 | A kind of black coating power splitter of resistance |
| CN108123197A (en) * | 2017-12-18 | 2018-06-05 | 刘伟 | A kind of transition line power splitter |
| CN109411861A (en) * | 2018-12-11 | 2019-03-01 | 天津七六四通信导航技术有限公司 | A kind of one point of 14 multistage impedance power splitter |
| CN111969958A (en) * | 2020-08-26 | 2020-11-20 | 中国电子科技集团公司第四十一研究所 | Double-layer four-path power synthesis broadband frequency tripler and solid-state signal generator |
| CN111969958B (en) * | 2020-08-26 | 2023-05-02 | 中国电子科技集团公司第四十一研究所 | Double-layer four-way power synthesis broadband tripler and solid-state signal generator |
| CN113782937A (en) * | 2021-10-08 | 2021-12-10 | 广东分数维无线科技有限公司 | Low-insertion-loss miniaturized high-frequency-ratio millimeter wave dual-band power divider and design method |
| CN113782937B (en) * | 2021-10-08 | 2022-07-12 | 广东分数维无线科技有限公司 | Low-insertion-loss miniaturized high-frequency-ratio millimeter wave dual-band power divider and design method |
| CN114335962A (en) * | 2022-01-13 | 2022-04-12 | 中国人民解放军63660部队 | Transient electromagnetic pulse power divider |
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