CN206460490U - Full aluminium smart card module - Google Patents
Full aluminium smart card module Download PDFInfo
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- CN206460490U CN206460490U CN201720082398.7U CN201720082398U CN206460490U CN 206460490 U CN206460490 U CN 206460490U CN 201720082398 U CN201720082398 U CN 201720082398U CN 206460490 U CN206460490 U CN 206460490U
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- smart card
- card module
- hard contact
- dielectric substance
- substance layer
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Abstract
The utility model provides a kind of full aluminium smart card module, the full aluminium smart card module includes a dielectric substance layer and is arranged on the chip of the dielectric substance layer lower surface, the dielectric substance layer upper surface is provided with multiple hard contacts, the hard contact is aluminum metal contact, the dielectric substance layer has multiple through holes, the through hole exposes the portion lower surface of the hard contact, and multiple metal lead wires electrically connect the function weld pad of the chip surface with hard contact through the through hole.The utility model has the advantage of the utility model is using aluminium as the material of hard contact, and compared with traditional copper material, lighter, reliability is higher, manufacturing process is simpler, and cost is lower.
Description
Technical field
The utility model is related to field of intelligent cards, more particularly to a kind of full aluminium smart card module.
Background technology
In Intelligent card package field, domestic and overseas market is all very big to the demand of smart card, at present, smart card row
Industry just develops towards the route of technological innovation, and new technology is continued to bring out, and new manufacture is also more and more, many old manufactures
Technology is also updated and strengthened, so that the lifting of the function and performance to smart card requires also inevitable.
Referring to Fig. 1 and Fig. 2, a kind of structure of existing smart card module is as follows, and chip 100 is pasted onto dielectric substance layer 101
Lower surface, hard contact 102 is provided with the upper surface of dielectric substance layer 101, and dielectric layer 101 is provided with through hole, is deposited in through hole
Metal 107, the metal 107 is connected with hard contact 102, and the function weld pad of chip 100 is connected to gold by metal lead wire 108
Category 107, and then realize the electrical connection of chip 100 and hard contact 102.Under normal circumstances, the hard contact 102 is successively by gold
Layer 103, nickel dam 104,106 layers of composition of layers of copper 105 and nickel.Existing smart card module the disadvantage is that, quality weight, Making programme
Complexity, cost is high, and hard contact is relatively thin, and is made up of more metal layers, in hot humid environment, the layer of multiple layer metal with
It can be migrated between layer, cause hard contact to fail, and then cause the reduction of smart card module reliability.Therefore, one kind is needed badly
New smart card module and its manufacture method overcomes the shortcoming of above-mentioned prior art.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of full aluminium smart card module, itself and traditional copper material
Matter is compared, and lighter, reliability is higher, manufacturing process is simpler, and cost is lower.
In order to solve the above problems, the utility model provide one kind, full aluminium smart card module, including a dielectric substance layer and
The chip of the dielectric substance layer lower surface is arranged on, the dielectric substance layer upper surface is provided with multiple hard contacts, the gold
Category contact is aluminum metal contact, and the dielectric substance layer has multiple through holes, and the through hole exposes the part of the hard contact
Lower surface, multiple metal lead wires electrically connect the function weld pad of the chip surface with hard contact through the through hole.
Further, the metal lead wire is aluminum lead.
Further, the metal lead wire is gold wire.
Further, metal gasket, the metal lead wire and the gold are formed with the surface of the hard contact towards through hole
Category pad electrical connection, the material of the metal gasket is identical with the material of metal lead wire.
Further, the hard contact is made up of one layer of aluminium lamination.
The utility model has the advantage of the utility model is using material of the aluminium as hard contact, with traditional copper material
Matter is compared, and lighter, reliability is higher, manufacturing process is simpler, and cost is lower.
Brief description of the drawings
Fig. 1 and Fig. 2 are the structural representations of existing smart card module；
Fig. 3 is the step flow chart of the full aluminium smart card module manufacture method of the utility model；
Fig. 4 A~Fig. 4 F are the process charts of the full aluminium smart card module manufacture method of the utility model；
Fig. 5 is the schematic diagram of a step of the full aluminium smart card module manufacture method of the utility model the utility model；
Fig. 6 is the schematic diagram of a step of the full aluminium smart card module manufacture method of the utility model the utility model；
Fig. 7 and Fig. 8 are the structural representations of the full aluminium smart card module of the utility model.
Embodiment
The embodiment of the full aluminium smart card module provided below in conjunction with the accompanying drawings the utility model elaborates.
The utility model provides a kind of manufacture method of full aluminium smart card module, referring to Fig. 3, and methods described includes following step
Suddenly：Step S30, offer dielectric substance layer, aluminium lamination is formed in the dielectric substance layer upper surface；Step S31, the graphical aluminium lamination,
Form multiple hard contacts；Step S32, in the dielectric substance layer and the hard contact contact position, formed and multiple run through institute
State the through hole of dielectric substance layer；Step S33, in the dielectric substance layer lower surface chip, the chip has function weld pad
Surface exposure；Step S34, wire bonding, metal lead wire pass through the through hole by the function weld pad and hard contact of the chip
Electrical connection；Chip and metal lead wire described in step S35, plastic packaging, form full aluminium smart card module.
Fig. 4 A~Fig. 4 F are the process charts of the manufacture method of the full aluminium smart card module of the utility model.
Referring to step S30 and Fig. 4 A there is provided dielectric substance layer 400, aluminium lamination 401 is formed in the upper surface of dielectric substance layer 400.
Those skilled in the art can obtain the material and forming method of the dielectric substance layer 400, the dielectric substance layer from the prior art
400 material can be epoxy resin Polymer material.The aluminium lamination 401 can using metal deposit etc. method be deposited on Jie
The upper surface of electric matter layer 400.The thickness of the aluminium lamination 401 can be set according to the demand thickness of subsequent metal contact, i.e., follow-up gold
The thickness of category contact is the thickness of aluminium lamination 401.
Referring to step S31 and Fig. 4 B, the graphical aluminium lamination 401 forms multiple hard contacts 402.The graphical aluminium
The method of layer 401 such as includes but is not limited to etch, is cut by laser at the method.During patterned, part aluminium lamination 401 is protected
Stay, form hard contact 402.The arrangement of the hard contact 402 can be according to the Demand Design in practice.For example, specific at this
In embodiment, referring to Fig. 5, after graphical operation, six hard contacts 402 are formed.The material of the hard contact 402 is
Aluminium, relative to multi-layer metal structure of the prior art, the full aluminium smart card module of the utility model is lighter, reliability is higher,
Manufacturing process is simpler, and cost is lower.Preferably, in this embodiment, the hard contact 402 is by one layer of aluminium lamination group
Into.
Referring to step S32 and Fig. 4 C, in the dielectric substance layer 400 and the contact position of hard contact 402, formed multiple
Through the through hole 403 of the dielectric substance layer 400, further, one through hole 403 of each correspondence of hard contact 402, i.e., in the dielectric
The lower surface of matter layer 400, through the portion lower surface of the visible hard contact 402 of the through hole 403.Form the through hole 403
Method including but not limited to forms through hole 402 from the lower surface of the dielectric substance layer 400 using laser cutting.
Referring to step S33 and Fig. 4 D, in the lower surface chip 404 of dielectric substance layer 400, the chip 404 has
The surface exposure of function weld pad (not indicated in accompanying drawing).Include in the method for the lower surface chip 404 of dielectric substance layer 400
But it is not limited to chip 404 being pasted onto the lower surface of dielectric substance layer 400 using binding agent.The set location of chip 404 is not
Through hole 403 should be blocked, to avoid influenceing follow-up routing processing procedure.Preferably, the through hole 403 is set around the chip 404
Put.
Referring to step S34 and Fig. 4 E, wire bonding, metal lead wire 405 passes through the through hole 403 by the chip 404
Function weld pad is electrically connected with hard contact 402.The method of the wire bonding is this area conventional method, is repeated no more herein.
The metal lead wire 405 is aluminum lead or gold wire.
If the metal lead wire 405 be gold wire, formed through hole step S32 after, chip step S33 it
Before, in addition to one the hard contact 402 towards through hole 403 surface formed metal gasket 406 the step of, the metal gasket
406 forming method includes but is not limited to metal deposit.It is shown in Figure 6, the metal lead wire 405 and the metal gasket 406
Electrical connection, the material of the metal gasket 406 is identical with the material of metal lead wire 405, for example, being golden material, and then can improve
The reliability of electrical connection of metal lead wire 405 and hard contact 402.
Referring to step S35 and Fig. 4 F, chip 404 described in plastic packaging and metal lead wire 405 form full aluminium smart card module.This
Art personnel can obtain plastic package method from the prior art, repeat no more herein.
The utility model also provides a kind of full aluminium smart card module, shown in Figure 7, and the full aluminium smart card module includes
One dielectric substance layer 700 and the chip 704 for being arranged on the lower surface of dielectric substance layer 700, the chip 704 can be viscous by binding agent
The lower surface of dielectric substance layer 700 is attached to, the chip 704 has the surfaces facing outward of function weld pad (not indicated in accompanying drawing) exposed.
Multiple hard contacts 702 are provided with the upper surface of dielectric substance layer 700, the hard contact 702 is aluminum metal contact, enters one
Step, the hard contact 702 is shaped as by one layer of aluminium.The dielectric substance layer 700 has multiple through holes 703, and the through hole 703 is sudden and violent
Expose the portion lower surface of the hard contact 702, multiple metal lead wires 705 pass through the through hole 703 by the table of chip 704
The function weld pad in face is electrically connected with hard contact 702.Further, the metal lead wire 705 is aluminum lead or gold wire.If described
Metal lead wire is gold wire, then is formed with metal gasket 706 on the surface of the hard contact towards through hole, referring to Fig. 8, the gold
Category lead 705 is electrically connected with the metal gasket 706, and the material of the metal gasket 706 is identical with the material of metal lead wire 705, example
Such as, it is golden material.
Described above is only preferred embodiment of the present utility model, it is noted that for the common skill of the art
Art personnel, on the premise of the utility model principle is not departed from, can also make some improvements and modifications, these improvements and modifications
Also it should be regarded as protection domain of the present utility model.
Claims (5)
1. a kind of full aluminium smart card module, including a dielectric substance layer and the chip for being arranged on the dielectric substance layer lower surface, it is special
Levy and be, multiple hard contacts are provided with the dielectric substance layer upper surface, the hard contact is aluminum metal contact, is given an account of
Electric matter layer has multiple through holes, and the through hole exposes the portion lower surface of the hard contact, and multiple metal lead wires pass through institute
Through hole is stated to electrically connect the function weld pad of the chip surface with the hard contact.
2. full aluminium smart card module according to claim 1, it is characterised in that the metal lead wire is aluminum lead.
3. full aluminium smart card module according to claim 1, it is characterised in that the metal lead wire is gold wire.
4. full aluminium smart card module according to claim 3, it is characterised in that the hard contact towards through hole table
Face is formed with metal gasket, and the metal lead wire is electrically connected with the metal gasket, the material of the metal gasket and the material of metal lead wire
Matter is identical.
5. full aluminium smart card module according to claim 1, it is characterised in that the hard contact is by one layer of aluminium lamination group
Into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720082398.7U CN206460490U (en) | 2017-01-20 | 2017-01-20 | Full aluminium smart card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720082398.7U CN206460490U (en) | 2017-01-20 | 2017-01-20 | Full aluminium smart card module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206460490U true CN206460490U (en) | 2017-09-01 |
Family
ID=59696293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720082398.7U Active CN206460490U (en) | 2017-01-20 | 2017-01-20 | Full aluminium smart card module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206460490U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106650903A (en) * | 2017-01-20 | 2017-05-10 | 上海伊诺尔信息技术有限公司 | All-aluminum intelligent card module and manufacturing method thereof |
-
2017
- 2017-01-20 CN CN201720082398.7U patent/CN206460490U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106650903A (en) * | 2017-01-20 | 2017-05-10 | 上海伊诺尔信息技术有限公司 | All-aluminum intelligent card module and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190904 Address after: Room 301, Room 3, Building 2, No. 3576 Zhaolou Road, Minhang District, Shanghai, 201112 Patentee after: Shanghai Inore Information Electronics Co., Ltd. Address before: Room 1001, No. 1628 Suzhao Road, Minhang District, Shanghai 201100 Patentee before: Shanghai Eternal Information Technology Co., Ltd. |
|
| TR01 | Transfer of patent right |