CN206441760U - A kind of dual surface LED lamp plate - Google Patents
A kind of dual surface LED lamp plate Download PDFInfo
- Publication number
- CN206441760U CN206441760U CN201720131472.XU CN201720131472U CN206441760U CN 206441760 U CN206441760 U CN 206441760U CN 201720131472 U CN201720131472 U CN 201720131472U CN 206441760 U CN206441760 U CN 206441760U
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- Prior art keywords
- led lamp
- lamp plate
- ceramic substrate
- composite ceramic
- dual surface
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model belongs to field of LED illumination, more particularly to a kind of dual surface LED lamp plate, its LED chip and circuit for including a substrate and being arranged on substrate tow sides, substrate is provided through at least one through hole of tow sides, circuit on substrate tow sides is connected with each other by through hole, the composite ceramic substrate that substrate is structure as a whole.This kind of dual surface LED lamp plate uses the composite ceramic substrate of integrative-structure, and simple in construction, manufacturing process is simple, thermal resistance is small, heat dispersion is splendid；Two-sided installation LED chip, and the connection of the circuit on tow sides is realized via the through hole being opened on the composite ceramic substrate of integrative-structure, so as to realize the double-side of lamp plate.
Description
Technical field
The utility model belongs to field of LED illumination, more particularly to a kind of dual surface LED lamp plate.
Background technology
The LED lamp panel of prior art is largely the aluminium base or composite ceramics base circuit board of one side, is all single-sided process, is met
To when wanting parallel circuit to need bridging wire, typically all with the wire jumper Chip-R bridging past.But bridging wire is dived
Big in hidden danger, security is low.
The practical new patent CN204739549U of China discloses a kind of dual-side LED lamp of use composite ceramics aluminium base
Plate, this kind of dual surface LED lamp plate is mounted on LED chip in the tow sides of circuit board so that lamp plate energy double-side.The practicality
New two-sided lamp plate coats composite ceramic coat on aluminium base, using the easy machinability of aluminium base in its upper shed, together
Shi Liyong composite ceramic coats improve heat dispersion.But this dual surface LED lamp plate needs to coat composite ceramic on aluminium base
Enamel coating, manufacturing process is complex, and cost is high.
In addition, there is the LED lamp panel that a kind of use composite ceramic material is made into integration in the prior art, but due to ceramics originally
The brittle characteristic of body, it is impossible to be machined, such as drilling, therefore, the LED lamp panel one by substrate of composite ceramic material
As be one side LED lamp panel.
Utility model content
In order to overcome the defect of prior art, the purpose of this utility model is to provide a kind of dual surface LED lamp plate, and this kind double
The substrate of face LED lamp panel is made up of ceramic material integrative-structure, has abandoned the multi-layer compound structure of existing LED lamp panel, has made substrate
Structure is further simplified, and is reduced structure overall thermal resistance, is improved heat conductivility, while can be in ceramic substrate upper shed
So as to which two-sided installation LED chip is to realize double-side.
In order to achieve the above object, the utility model is realized in：
A kind of dual surface LED lamp plate, including a substrate and the LED chip and circuit being arranged on the substrate tow sides,
The circuit that the substrate is provided through at least one through hole of tow sides, the substrate tow sides passes through the through hole
It is connected with each other, the composite ceramic substrate that the substrate is structure as a whole.
Further, the composite ceramic substrate includes the main part of strip and the coupling part of strip, described
Coupling part constitutes the structure of " y " shape with the main part；The main part is used to install the LED chip, the company
Socket part point includes first end and the second end, and the first end is used to installing the fixation composite ceramic substrate, and described the
Two ends are connected to the middle part of the main part.
Further, the composite ceramic substrate is provided with two through holes, and two through holes are arranged on the connection
Part and the close first end, two through holes are connected respectively as the positive pole tie point and negative pole of the circuit
Point.
Further, the positive pole tie point of the circuit is arranged on the wherein one side, the electricity of the composite ceramic substrate
The negative pole tie point on road is arranged on the another side of the composite ceramic substrate, and the positive pole tie point and the negative pole tie point are equal
It is arranged on the coupling part and close to the first end；The electric current loop of the circuit of the tow sides of the composite ceramic substrate
Road is in opposite direction.
Further, the main part is 70-85 degree relative to the angle of the coupling part.
Further, the LED chip is arranged on the composite ceramic substrate by means of COB technologies.
Further, it is provided with elargol between the LED chip and the composite ceramic substrate.
Further, the periphery of the LED chip carries out box dam by box dam glue, fluorescence silica gel is filled in box dam, institute
State fluorescence silica gel and cover the LED chip.
Further, connect conductive by spun gold between the LED chip and the through hole.
Further, the equal direct combination of the tow sides of the composite ceramic substrate has circuit layer.
Compared with prior art, the utility model has the advantages that：
1st, using the composite ceramic substrate of integrative-structure, simple in construction, manufacturing process is simple, thermal resistance is small, heat dispersion pole
It is good；
2nd, two-sided installation LED chip, and two are realized via the through hole being opened on the composite ceramic substrate of integrative-structure
Circuit connection on face, so as to realize the double-side of lamp plate.
Brief description of the drawings
Fig. 1 is the front view of the one of which embodiment of dual surface LED lamp plate；
Fig. 2 is the front view of the another embodiment of dual surface LED lamp plate；
Fig. 3 is the side view of dual surface LED lamp plate；And
Fig. 4 is schematic diagram when dual surface LED lamp plate is assembled into LED lamp.
Embodiment
Fig. 1 to Fig. 4 shows a kind of dual surface LED lamp plate of the present utility model and its application.Below will be to this dual surface LED
Structure, material, application mode and the feature of lamp plate are described in detail.
Substrate
This dual surface LED lamp plate includes the composite ceramic substrate of integrative-structure, rather than general composite ceramic substrate is had
Aluminium+ceramic laminar composite construction.
Preferably, the material of composite ceramic substrate can be the Chinese invention patent application that the applicant is held
A kind of low temperature disclosed in CN105565786A is combined high-heat-conductivity ceramic material.Applicant is this kind low in CN105565786A
The compound high-heat-conductivity ceramic material of temperature is found when for further study, is combined using this kind of low temperature obtained by high-heat-conductivity ceramic material
Composite ceramic substrate has easily drilling, easily progress surface metalation processing and radiating effect splendid, with reference to double in the prior art
Problem encountered during the LED lamp panel manufacture of face, it is believed that it is manufacture dual surface LED lamp plate that this kind of low temperature, which is combined high-heat-conductivity ceramic material,
The splendid selection of substrate.
Chip and circuit on substrate
The tow sides of composite ceramic substrate are provided with LED chip 131 and circuit, the connection circuit of LED chip 131.Just
The LED chip 131 on anti-two sides can be with more than just one, it is preferable that the LED chip on each face has multiple.By means of COB techniques
On composite ceramic substrate.
In the present embodiment, as shown in Figure 3, it is preferable that be provided with elargol between LED chip 131 and composite ceramic substrate,
Elargol is used to fix LED chip 131, and the heat that LED chip 131 is produced leads composite ceramic substrate.Preferably, LED core
The periphery of piece 131 carries out box dam by box dam glue, and fluorescence silica gel 132, the covering LED chip of fluorescence silica gel 132 are filled in box dam
131, luminous need to change different types of fluorescence silica gel 132 according to different.
In this embodiment, connected between LED chip 131 and through hole 111 by spun gold, it is of course also possible in composite ceramics
The equal direct combination circuit layer of tow sides of substrate, the technique such as by etching obtains circuit layer.Above-mentioned replacement each falls within this
Within the protection domain of utility model.
The configuration of substrate
In the present embodiment, as shown in Figure 1 and Figure 4, the composite ceramic substrate of dual surface LED lamp plate 1 includes the master of strip
The coupling part 11 of body portion 12 and strip, main part 12 is used to install LED chip 131, every one side of main part 12
On multiple LED chips 131 along main part 12 length direction arrangement, it is preferable that be uniformly distributed.Coupling part 11 includes
First end and the second end, first end, which is used to the composite ceramic substrate install, to be fixed, the second end and main part 12
Middle part is connected, and the middle part of main part 12 here is not strictly limited at the midpoint of main part, but relative to two ends
Speech, in location roughly halfway up.From the point of view of preferred embodiment of the present utility model, the connection position of main part and coupling part
A segment distance can be deviateed in the middle of main part, or to one of two ends by putting.
Coupling part 11 tilts certain angle relative to main part 12, and coupling part 11 is constituted with main part 12
The structure of " y " shape.Inclination is that, in order to utilize light source to a greater degree, the scope for enabling light to cover is bigger.Inclined angle
It is that as shown in Figure 1 and Figure 4, coupling part 11 is inclined relative to main part 12 depending on the specific lighting angle according to light source
Angle is preferably 70-85 degree.
Dual surface LED lamp plate in the utility model is preferred but is not limited only to this " y " shape structure, but can be according to light fixture
Design requirement be designed.
Through hole on substrate
Composite ceramic substrate is provided through the through hole 111 of its tow sides, and through hole 111 is by composite ceramic substrate
Drilling is obtained, and forms also possible by other integral molding techniques certainly.The positive circuit of composite ceramic substrate passes through
Through hole 111 is connected with the circuit of the reverse side of composite ceramic substrate, so that power supply can drive composite ceramic substrate simultaneously just
The LED chip on anti-two sides lights.
As shown in figure 1, being the one of which embodiment of dual surface LED lamp plate, wherein through hole 111 is preferably set up two,
Two through holes 111 are respectively as positive pole tie point and negative pole tie point, and electric current is on the obverse and reverse of composite ceramic substrate
It is to flow to negative pole from positive pole.In this embodiment, preferably through hole 111 is arranged on coupling part 11 and close to first end.
As shown in Fig. 2 being the one of which embodiment of dual surface LED lamp plate, the positive pole tie point 141 of circuit is arranged on again
The front 101 of ceramic substrate is closed, the negative pole tie point 142 of circuit is arranged on the reverse side 102 of composite ceramic substrate, positive pole tie point
141 and negative pole tie point 142 be arranged at coupling part and close to first end, through hole may be provided on composite ceramic substrate
Optional position, the circuit in the front 101 of composite ceramic substrate connects the electricity of the reverse side 102 of composite ceramic substrate by through hole 111
Road.So, electric current is to flow to through hole 111 from positive pole tie point 141 on the front 101 of composite ceramic substrate, and electric current is compound
It is to flow to negative pole tie point 142 from through hole 111 on the reverse side 102 of ceramic substrate so that the tow sides of composite ceramic substrate
The current loop of circuit is in opposite direction, and the magnetic field produced by can making the circuit on symmetrical tow sides is cancelled out each other, so that
The magnetic interference of lamp plate to external world can be reduced.
Under application mode disclosed in the utility model shown in Fig. 4, the positive pole tie point and negative pole tie point of circuit are equal
In be arranged on the insertion injection molding body 2 of coupling part 11 one section, i.e., close to first end, so wire can be made to be hidden in injection
In body 2, make the electric connection structure of LED lamp not exposed, it is more stable, it is hardly damaged.This certain not required design, that is,
Say that positive pole tie point and negative pole tie point may be provided at non-close to first end, also in non-embedded injection molding body 2 or be hidden in other
In mounting structure, the utility model can be similarly realized.
Above is for the description of dual surface LED lamp plate of the present utility model.It is described below of the present utility model two-sided
LED lamp panel applies a kind of mode in LED lamp.
LED lamp application examples
Fig. 4 shows a kind of application mode that LED lamp is assembled into using dual surface LED lamp plate of the present utility model.Using
Polylith dual surface LED lamp plate 1 is assembled into a LED lamp around a central mounting member, and LED lamp, which has, to be suitable to connect with lamp socket
The connection terminal 21 connect.When the circuit is on, LED lamp is realized luminous.Therefore central mounting member should be suitable in LED lamp panel
Circuit and lamp socket electrical communication, and heat conduction, radiating when LED lamp panel is luminous.
In embodiment of the present utility model, LED lamp is generally shaped like in the conduct of the injection molding body 2 of cylinder including one
Heart installing component, the injection molding body 2 is preferred to use the Chinese invention patent application CN105565786A institutes public affairs that the applicant is held
A kind of low temperature opened is combined high-heat-conductivity ceramic material injection and obtained.Polylith dual surface LED lamp plate 1 is uniformly around around it, group
Into a kind of New LED wick.That is the circular array centered on the axis of the injection molding body 2 of polylith dual surface LED lamp plate 1 is uniformly arranged on
The side of the cylinder.Four pieces of dual surface LED lamp plates 1 are provided with the present embodiment.Two of every piece of dual surface LED lamp plate 1 are relative
Face is placed using vertical mode, parallel to the axis of injection molding body 2.So, the main part 12 of four LED lamp panels 1 is limited jointly
Go out a truncated cone shape for surrounding the injection molding body 2.Adopt and configure in such a way, on relative such four pieces of dual surface LED lamp plates 1
Eight light-emitting areas are not only able to 360 degree directions of the covering around injection molding body 2, and can be sent out towards truncated cone shape zenith directions
Light is penetrated, multi-angle illumination is met.
In any one LED lamp product for being completed of the present utility model shown in Fig. 4 it can be seen that, every piece is double
The first end of face LED lamp panel 1 is embedded in injection molding body 2 in 2 injection molding of injection molding body and is fixed therein after forming.LED
Circuit on plate 1 has been carried out the physical connection with external circuit before the injection molding of injection molding body 2, and partial circuit also with
Injection molding embedment injection molding body 2.What injection molding was specifically realized in：Dual surface LED lamp plate 1 is fixed on mould before injection
Have, and the die cavity of mould is inserted in the coupling part 11 of dual surface LED lamp plate 1, coupling part 11 is just directly embedded into after injection molding
And be fixed on injection molding body 2, form integral LED wick.The longitudinally of the coupling part 11 of LED lamp panel 1 and injection molding body 2
Central axis upright so that this kind of LED lamp including multiple LED lamp panels 1 is in tree-shaped, and its structure is more loose, it is internal logical
Wind is good, is conducive to heat energy quickly to be taken away；In addition, dual surface LED lamp plate 1 is directly embedded into injection molding body 2, it is easy to the biography of heat energy
Lead, be conducive to distributing for heat energy.
Injection molding body 2 is provided with connection terminal 21, and connection terminal 21 passes through wire and the positive pole tie point of dual surface LED lamp plate 1
It is that LED chip is powered with the connection of negative pole tie point.The connection terminal 21 is also embedded and is fixed on injection molding body 2, and it is fixed on injection
The method of body 2 is consistent with the method that dual surface LED lamp plate 1 is fixed on injection molding body 21.Wire is arranged within injection molding body 2, so not
The outward appearance of LED lamp is influenceed, wire is also protected.
It will be appreciated that dual surface LED lamp plate 1 of the present utility model, which is not limited to injection, is fixed on this in injection molding body 2
A kind of mounting means, can realize space orientation and the arrangement of dual surface LED lamp plate using any suitable central mounting member,
Such as central mounting member is made of the ceramics or metal material of high thermal conductivity coefficient, as long as can be by the company of dual surface LED lamp plate
One end of socket part point suitably keeps fixing and ensure the joint good coefficient of heat conduction enough.
Finally it should be noted that：Above-described each embodiment is merely to illustrate the technical solution of the utility model, rather than
It is limited；Although the utility model is described in detail with reference to the foregoing embodiments, one of ordinary skill in the art
It should be understood that：It can still modify to the technical scheme described in previous embodiment, or to which part or whole
Technical characteristic carries out equivalent substitution；And these modifications or substitutions, the essence of appropriate technical solution is departed from the utility model
The scope of each embodiment technical scheme.
Claims (10)
1. a kind of dual surface LED lamp plate, including a substrate and the LED chip and circuit that are arranged on the substrate tow sides, institute
The circuit stated at least one through hole that substrate is provided through tow sides, the substrate tow sides passes through the through hole phase
Connect, it is characterised in that：
The composite ceramic substrate that the substrate is structure as a whole.
2. dual surface LED lamp plate according to claim 1, it is characterised in that：
The main part of the composite ceramic substrate including strip and the coupling part of strip, the coupling part with it is described
Main part constitutes the structure of " y " shape；
The main part is used to install the LED chip, and the coupling part includes first end and the second end, and described the
One end is used to install the fixed composite ceramic substrate, and the second end is connected to the middle part of the main part.
3. dual surface LED lamp plate according to claim 2, it is characterised in that：The composite ceramic substrate is provided with two and led to
Hole, two through holes are arranged on the coupling part and close to the first end, two through holes respectively as
The positive pole tie point and negative pole tie point of the circuit.
4. dual surface LED lamp plate according to claim 2, it is characterised in that：The positive pole tie point of the circuit is arranged on institute
The wherein one side of composite ceramic substrate is stated, the negative pole tie point of the circuit is arranged on the another side of the composite ceramic substrate,
The positive pole tie point and the negative pole tie point are arranged at the coupling part and close to the first end；It is described compound
The current loop of the circuit of the tow sides of ceramic substrate is in opposite direction.
5. dual surface LED lamp plate according to claim 2, it is characterised in that：The main part is relative to the connecting portion
The angle divided is 70-85 degree.
6. dual surface LED lamp plate according to claim 1, it is characterised in that：The LED chip is installed by means of COB technologies
On the composite ceramic substrate.
7. dual surface LED lamp plate according to claim 1, it is characterised in that：The LED chip and the composite ceramic substrate
Between be provided with elargol.
8. dual surface LED lamp plate according to claim 1, it is characterised in that：The periphery of the LED chip is entered by box dam glue
Row box dam, fills fluorescence silica gel in box dam, and the fluorescence silica gel covers the LED chip.
9. dual surface LED lamp plate according to claim 1, it is characterised in that：Pass through between the LED chip and the through hole
Spun gold connection is conductive.
10. dual surface LED lamp plate according to claim 1, it is characterised in that：The tow sides of the composite ceramic substrate are equal
Direct combination has circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720131472.XU CN206441760U (en) | 2017-02-14 | 2017-02-14 | A kind of dual surface LED lamp plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720131472.XU CN206441760U (en) | 2017-02-14 | 2017-02-14 | A kind of dual surface LED lamp plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206441760U true CN206441760U (en) | 2017-08-25 |
Family
ID=59634291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720131472.XU Withdrawn - After Issue CN206441760U (en) | 2017-02-14 | 2017-02-14 | A kind of dual surface LED lamp plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206441760U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784255A (en) * | 2017-02-14 | 2017-05-31 | 广东昭信照明科技有限公司 | A kind of dual surface LED lamp plate and its manufacture method |
| CN108766234A (en) * | 2018-07-10 | 2018-11-06 | 合肥惠科金扬科技有限公司 | The display equipment of light leakage |
-
2017
- 2017-02-14 CN CN201720131472.XU patent/CN206441760U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784255A (en) * | 2017-02-14 | 2017-05-31 | 广东昭信照明科技有限公司 | A kind of dual surface LED lamp plate and its manufacture method |
| CN108766234A (en) * | 2018-07-10 | 2018-11-06 | 合肥惠科金扬科技有限公司 | The display equipment of light leakage |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170825 Effective date of abandoning: 20190312 |