CN206420182U - A kind of semiconductor cooler - Google Patents
A kind of semiconductor cooler Download PDFInfo
- Publication number
- CN206420182U CN206420182U CN201621441824.3U CN201621441824U CN206420182U CN 206420182 U CN206420182 U CN 206420182U CN 201621441824 U CN201621441824 U CN 201621441824U CN 206420182 U CN206420182 U CN 206420182U
- Authority
- CN
- China
- Prior art keywords
- water pipe
- ring bodies
- semiconductor
- chilling plate
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a kind of semiconductor cooler, ring bodies, semiconductor chilling plate, conduction cooling fin, water pipe, the first container, second container, airduct and the fan being made including thin slice, the ring bodies is socketed on water pipe, and the inwall of the ring bodies is mutually adjacent to the outer wall of water pipe；Ring bodies is fixed in the hot junction of the semiconductor chilling plate, and the conduction cooling fin is fixed on the cold end of semiconductor chilling plate；First container is connected by one end of water inlet pipe and water pipe, and the second container is connected by the other end of outlet pipe and water pipe；The duct sleeve connects water pipe, and the ring bodies, conduction cooling fin are respectively positioned in airduct；The fan is installed on one end of airduct.The utility model compact conformation, substantially reduces the volume of whole semiconductor cooler space-consuming；Semiconductor chilling plate is by water-cooling simultaneously, so that the radiating effect of semiconductor cooler is improved, to ensure the refrigeration of semiconductor cooler.
Description
Technical field
The utility model is related to Refrigeration Technique, specifically a kind of semiconductor cooler.
Background technology
China is an energy consumption big country, how to reduce energy consumption, realizes sustainable development, realize and environment close friend and
Humorous gets along, and becomes one of the hot issue of many scholar's research of today's society.Semiconductor refrigerating is used as a kind of new system
Cold mode, develop rapidly at this, people's living standard increasingly improve and people for life comfort level requirement increasingly
It is the refrigeration modes with good development prospect in high society.Because semiconductor refrigerating has cleaning, noiseless dirt
Dye, unharmful substance discharge, long lifespan, firm, reliability is high, stability is good, without using series of advantages such as refrigerants, meets
The theory of environmental protection, has great strategic importance to the sustainable development of national economy.Exactly because semiconductor refrigerating has
The incomparable advantage of traditional mechanical refrigeration, therefore receive the extensive concern of all circles scholar, the semiconductor refrigerating parties concerned
Research also turn into heat subject.
At present, in semiconductor cooler work, then can because the heat that semiconductor chilling plate is produced can not be discharged in time
Cold end is passed back by heat transfer, therefore the radiating mode and radiating effect in semiconductor cooler hot junction are restriction semiconductor refrigeratings
The key factor of energy.Meanwhile, the semiconductor cooler used at present is larger, it has not been convenient to install and use.
Utility model content
The purpose of this utility model be to overcome the shortcomings of above prior art exist there is provided it is a kind of it is simple in construction, account for
With space is small, the semiconductor cooler of good heat dissipation effect and good refrigeration effect.
In order to achieve the above object, the utility model uses following technical scheme：A kind of semiconductor cooler, including thin slice
Ring bodies, semiconductor chilling plate, conduction cooling fin, water pipe, the first container, second container, airduct and the fan being made, it is described
Ring bodies is socketed on water pipe, and the inwall of the ring bodies is mutually adjacent to the outer wall of water pipe；The semiconductor refrigerating
Ring bodies is fixed in the hot junction of piece, and the conduction cooling fin is fixed on the cold end of semiconductor chilling plate；First container is by entering
One end connection of water pipe and water pipe, the second container is connected by the other end of outlet pipe and water pipe；The wind
Pipe is socketed water pipe, and the ring bodies, conduction cooling fin are respectively positioned in airduct；The fan is installed on one end of airduct.
It is preferred that, the section of the ring bodies is in multiple summits, and the outer wall of the ring bodies is provided with the fixation equal with side number
Plane, the quantity of semiconductor chilling plate and the conduction cooling fin is equal with fixed pan, the hot junction of each semiconductor chilling plate
Corresponding fixed pan is fixed on, each conduction cooling fin is fixed on the cold end of corresponding semiconductor cooling piece.
It is preferred that, the end at the water pipe two ends is provided with flow guiding head, and this flow guiding head is in cone.
It is preferred that, the level height of first container is higher than the level height of second container.
It is preferred that, except the outer surface covered by semiconductor chilling plate is provided with first thermal insulation layer in the ring bodies；The water
Except the outer surface covered by ring bodies sets second thermal insulation layer in flow tube road.
It is preferred that, the thin slice is made of copper or aluminium alloy.
It is preferred that, the inwall of the water pipe is provided with flight.
The utility model has the following advantages relative to prior art：
1st, this semiconductor cooler it is main by ring bodies, semiconductor chilling plate, conduction cooling fin, water pipe, the first container,
Second container, airduct and fan are constituted, wherein ring bodies, semiconductor chilling plate and conduction cooling fin are integrated in airduct, this knot
Structure is compact, substantially reduces the volume of whole semiconductor cooler space-consuming.
2nd, this semiconductor cooler it is main by ring bodies, semiconductor chilling plate, conduction cooling fin, water pipe, the first container,
Second container, airduct and fan, are respectively used to put the water of cooling in the first container and second container and absorb the water of heat, i.e., half
Conductor cooling piece is by water-cooling, so that the radiating effect of semiconductor cooler is improved, to ensure semiconductor cooler
Refrigeration.
3rd, this semiconductor cooler is not in the case of influenceing derived from the energy of semiconductor chilling plate hot junction, using multiaspect ring-type
Body (i.e. section is in polygon) installs semiconductor chilling plate, and ring bodies is socketed with water pipe, and eliminates radiating fin, is reduced
The resistances of the flowing overwhelming majority of current in the duct so that the effect of water-cooling further improves.
4th, this semiconductor cooler employs multiple semiconductor chilling plates parallel connections, ring-type and is uniformly distributed and is installed on ring bodies,
So that the refrigerating capacity of semiconductor cooler has raising by a relatively large margin compared to the refrigerating capacity of traditional semiconductor cooler.
5th, this semiconductor cooler has accomplished that the separation of cold and hot end energy does not pass energy mutually during work, well
Amount, refrigerating efficiency is greatly improved.
Brief description of the drawings
Fig. 1 is the external structure schematic diagram of the utility model semiconductor cooler.
Fig. 2 is the internal structure schematic diagram of the utility model semiconductor cooler；
Fig. 3 is the utility model ring bodies, the structural representation of semiconductor chilling plate and the installation of conduction cooling fin together.
Fig. 4 is the utility model ring bodies, the front view of semiconductor chilling plate and the installation of conduction cooling fin together.
Embodiment
For ease of it will be appreciated by those skilled in the art that below in conjunction with the accompanying drawings and embodiment makees further detailed to the utility model
Describe in detail bright.
As shown in Figures 1 to 4, this semiconductor cooler, including thin slice be made ring bodies 1, semiconductor chilling plate 2, lead
Cold fin 3, water pipe 4, the first container 5, second container 6, airduct 7 and fan 8, the ring bodies 1 are socketed on water pipe
4, and the inwall of the ring bodies 1 is mutually adjacent to the outer wall of water pipe 4；Ring is fixed in the hot junction of the semiconductor chilling plate 2
Shape body 1, the conduction cooling fin 3 is fixed on the cold end of semiconductor chilling plate 2；First container 5 passes through water inlet pipe 9 and water flow pipes
One end connection in road 4, the second container 6 is connected by outlet pipe 10 with the other end of water pipe 4；The airduct 7 is socketed
Water pipe 4, and the ring bodies 1, conduction cooling fin 23 be respectively positioned in airduct 7；The fan 8 is installed on one end of airduct 7.
In practical work process, the first container 5 put for cooling water, this cooling water is used to absorb semiconductor chilling plate
The heat produced during 2 work；And these cooling waters inhale after after heat again according to the will be entered after water pipe 4 and outlet pipe 10
Two containers 6.And the cold produced during the work of semiconductor chilling plate 2 is delivered to conduction cooling fin 3, the fan 8 then rotated advertises gas
Body flows into airduct 7, and gas absorbs cold so that gas cools when passing through conduction cooling fin 3, and the gas then cooled leads to again
The one end for crossing airduct 7 flows out to local accordingly cooled.Semiconductor chilling plate 2 is by water-cooling, so as to improve half
The radiating effect of conductor refrigerator, to ensure the refrigeration of semiconductor cooler.
The section of the ring bodies 1 is in multiple summits, and the outer wall of the ring bodies 1 is provided with the fixed pan equal with side number
11, the quantity of the semiconductor chilling plate 2 and conduction cooling fin 3 is equal with fixed pan 11, the heat of each semiconductor chilling plate 2
Corresponding fixed pan 11 is fixed at end, and each conduction cooling fin 3 is fixed on the cold end of corresponding semiconductor cooling piece 2.This setting makes ring
Shape body 1 is arranged to multiaspect ring bodies, then has larger contact area between the hot junction of semiconductor chilling plate 2 and ring bodies 1, with
Ensure that heat is quickly delivered in the water in water pipe.The section of ring bodies 1 is in regular hexagon, i.e. ring bodies in the present embodiment
For six face ring bodies.In real work, the face number of ring bodies 1 is not limited only to six faces, can be also five faces, octahedral etc..
The end at the two ends of water pipe 4 is provided with flow guiding head 12, and this flow guiding head 12 is in cone.Flow guiding head 12 is to fan
8 gases advertised have the effect of guiding, so that gas improves refrigeration in the more smooth of the interior flowing of airduct 7.
The level height of first container 5 is higher than the level height of second container 6.This structure can reduce the use of pump,
I.e. cooling water can flow to the second container 6 of lower by gravity directly from the first container 5 of eminence.
Except the outer surface covered by semiconductor chilling plate 2 is provided with first thermal insulation layer in the ring bodies 1；The water pipe
Except the outer surface covered by ring bodies 1 sets second thermal insulation layer in 4.This structure avoids heat from escaping in airduct, to reduce semiconductor
The refrigeration of refrigerator.
The thin slice is made of copper or aluminium alloy.The material of thin slice is not limited only to copper or aluminium alloy, can also agree for other
The metal material of Thermal conductivity.The thin slice being made of the material of good heat transfer effect, and make of this thin slice circlewise 1,
Further to improve radiating effect.
The inwall of the water pipe 4 is provided with flight.Flight can increase the turbulent water in water pipe, cause whirlpool
Turbulence is flowed, the heat-transfer effect between ring bodies and current is further improved, to improve the radiating effect of semiconductor cooler.
Above-mentioned embodiment is preferred embodiment of the present utility model, and the utility model can not be defined,
Other any changes made without departing from the technical solution of the utility model or other equivalent substitute modes, are included in
Within protection domain of the present utility model.
Claims (7)
1. a kind of semiconductor cooler, it is characterised in that：The ring bodies that is made including thin slice, semiconductor chilling plate, conduction cooling fin,
Water pipe, the first container, second container, airduct and fan, the ring bodies are socketed on water pipe, and the ring bodies
The outer wall of inwall and water pipe is mutually adjacent to；Ring bodies is fixed in the hot junction of the semiconductor chilling plate, and the conduction cooling fin is consolidated
Due to the cold end of semiconductor chilling plate；First container is connected by one end of water inlet pipe and water pipe, and described second holds
Device is connected by the other end of outlet pipe and water pipe；The duct sleeve connects water pipe, and the ring bodies, conduction cooling fin
It is respectively positioned in airduct；The fan is installed on one end of airduct.
2. semiconductor cooler according to claim 1, it is characterised in that：The section of the ring bodies is in multiple summits, institute
The outer wall for stating ring bodies is provided with the fixed pan equal with side number, and the quantity of semiconductor chilling plate and the conduction cooling fin is with consolidating
Allocate that face is equal, corresponding fixed pan is fixed in the hot junction of each semiconductor chilling plate, and each conduction cooling fin is fixed on corresponding half
The cold end of conductor cooling piece.
3. semiconductor cooler according to claim 1, it is characterised in that：The end at the water pipe two ends is provided with and led
Head is flowed, this flow guiding head is in cone.
4. semiconductor cooler according to claim 1, it is characterised in that：The level height of first container is higher than the
The level height of two containers.
5. semiconductor cooler according to claim 1, it is characterised in that：Removed in the ring bodies by semiconductor chilling plate
The outer surface of covering is provided with first thermal insulation layer；Except the outer surface covered by ring bodies sets second thermal insulation layer in the water pipe.
6. semiconductor cooler according to claim 1, it is characterised in that：The thin slice is made of copper or aluminium alloy.
7. semiconductor cooler according to claim 1, it is characterised in that：The inwall of the water pipe is provided with spiral
Piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621441824.3U CN206420182U (en) | 2016-12-26 | 2016-12-26 | A kind of semiconductor cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621441824.3U CN206420182U (en) | 2016-12-26 | 2016-12-26 | A kind of semiconductor cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206420182U true CN206420182U (en) | 2017-08-18 |
Family
ID=59576154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621441824.3U Expired - Fee Related CN206420182U (en) | 2016-12-26 | 2016-12-26 | A kind of semiconductor cooler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206420182U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106546032A (en) * | 2016-12-26 | 2017-03-29 | 华南理工大学 | A kind of semiconductor cooler |
-
2016
- 2016-12-26 CN CN201621441824.3U patent/CN206420182U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106546032A (en) * | 2016-12-26 | 2017-03-29 | 华南理工大学 | A kind of semiconductor cooler |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106546032A (en) | A kind of semiconductor cooler | |
| CN107731468A (en) | A kind of heat abstractor of transformer | |
| CN202420024U (en) | Temperature-controllable water-cooling type small semiconductor cold-hot dual-purpose box | |
| CN203442998U (en) | Airplane ground air conditioning unit | |
| CN201844486U (en) | Semiconductor refrigerating air-conditioning device | |
| CN206420182U (en) | A kind of semiconductor cooler | |
| CN207572189U (en) | A kind of radiator of transformer | |
| CN104976859A (en) | Electronic cold-hot integrated cabinet | |
| TWI458924B (en) | Energy Saving Device and Method of Air Cooling in Room | |
| CN104976810B (en) | Four air port refrigerating plants and its refrigeration module | |
| CN206449955U (en) | Modular, semiconductor refrigerator | |
| CN111588110A (en) | Portable refrigeration clothes | |
| CN204045331U (en) | A kind of transformer forced air cooler | |
| CN206831862U (en) | A kind of circular semiconductor ring-type parallel connection refrigerator | |
| CN206895114U (en) | A kind of positioning radiator of communication apparatus | |
| CN206399263U (en) | A kind of reinforced air radiator | |
| CN206016995U (en) | Stirling thermal engine operating cooler using liquid metal heat radiation | |
| CN107702570A (en) | One kind heat exchange cooling device | |
| CN205830227U (en) | Cooling mechanism | |
| CN204787990U (en) | Heat exchange tube on evaporation cooling formula heat exchanger | |
| CN206889359U (en) | A kind of boiler water circulating pump of high heat exchange efficiency | |
| CN206055834U (en) | Geothermal heat pump air-conditioner structure | |
| CN206058088U (en) | A kind of CPU heat abstractors | |
| CN205779191U (en) | A kind of chiller of electromotor | |
| CN209026992U (en) | Electronic cooling air-conditioning |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170818 Termination date: 20191226 |