CN206401306U - High-power two end surfaces leading foot electronic component stereo encapsulation structure - Google Patents
High-power two end surfaces leading foot electronic component stereo encapsulation structure Download PDFInfo
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- CN206401306U CN206401306U CN201720077006.8U CN201720077006U CN206401306U CN 206401306 U CN206401306 U CN 206401306U CN 201720077006 U CN201720077006 U CN 201720077006U CN 206401306 U CN206401306 U CN 206401306U
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- anode
- electronic component
- negative electrode
- scapus
- multiaspect scapus
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Abstract
The utility model discloses the high-power two end surfaces leading foot electronic component stereo encapsulation structure of one kind, the high-power two end surfaces leading foot electronic component stereo encapsulation structure is by seal cap, anode and multiaspect scapus negative electrode connection composition, multiaspect scapus negative electrode is by multiaspect scapus, boss and connection handle composition integrative-structure, anode is the integrative-structure that cone and cylinder are combined into, anode is enclosed on by its through hole on the multiaspect scapus of multiaspect scapus negative electrode, insulating barrier is filled between anode and the multiaspect scapus and boss of multiaspect scapus negative electrode, insulating barrier is also filled between positive wire and the positive wire through hole of boss and connection handle；Multiaspect scapus and the electronic component chip being pasted and fixed on thereon are all sealed and covered by seal cap.The utility model uses three-dimensional encapsulation mode, effectively increase the power/volume of whole electronic component than with reduce the volume of whole electronic component, and effectively increase the job stability of whole electronic component.
Description
Technical field
The utility model is related to a kind of high-power two end surfaces leading foot electronic component stereo encapsulation structure, belongs to electronics
Component package technical field.
Background technology
The high-power electronic component of two end lead-out wires is widely used.At present, it is often former using monomer in the prior art
The packaged type of part, because the power/volume that monolithic element is encapsulated is smaller, therefore the advantage for not using and developing.In order to
Power/volume ratio is improved, generally uses in the prior art and the electronic component of large, medium and small power is pasted onto same electricity
Be packaged after in road plate plane or printed circuit board (PCB) plane, although this packaged type than monomer original paper packaged type in work(
Improved a lot in terms of rate/volume ratio, but area shared by it or larger, the need for still can not meeting use.
Utility model content
The purpose of this utility model is that there is provided a kind of simple and compact for structure, power/volume is higher and work steady
Qualitative good high-power two end surfaces leading foot electronic component stereo encapsulation structure, to overcome the deficiencies in the prior art.
What the technical solution of the utility model was realized in：
The high-power two end surfaces leading foot electronic component stereo encapsulation structure of one kind of the present utility model is that this is high-power
Two end surfaces leading foot electronic component stereo encapsulation structures are made up of the connection of seal cap, anode and multiaspect scapus negative electrode, multiaspect
Scapus negative electrode constitutes integrative-structure by multiaspect scapus, boss and connection handle, and anode is the one that cone and cylinder are combined into
Structure, is provided with through hole in the cone and cylinder of anode, and anode is enclosed on the polyhedron of multiaspect scapus negative electrode by its through hole
On post, positive wire jack is provided with anode, positive wire is inserted with positive wire jack, and positive wire is inserted in sun
One end in polar conductor jack is welded together by silver soldering, brazing or soldering and anode, multiaspect scapus negative electrode boss and
A positive wire through hole is provided with connection handle, the other end of positive wire is showed outside connection handle after passing through positive wire through hole,
Insulating barrier is filled between anode and the multiaspect scapus and boss of multiaspect scapus negative electrode, in positive wire and boss and connection handle
Positive wire through hole between be also filled with insulating barrier, anode and positive wire are connected as by insulating barrier with multiaspect scapus negative electrode
One；The die bond plane for being used for pasting fixed electronic component chip is provided with the multiaspect scapus of multiaspect scapus negative electrode；It is close
Sealing cap is fastened on anode, and by multiaspect scapus and is pasted and fixed on the whole seal closures of electronic component chip thereon
Firmly.
Above-mentioned multiaspect scapus is regular polygon post.
Above-mentioned multiaspect scapus is positive trihedral post, positive tetrahedron post, regular five-hedron post, regular hexahedron post, regular octahedron post
Or regular dodecahedron post.
It is above-mentioned to be enclosed in anode by its through hole on the multiaspect scapus of multiaspect scapus negative electrode and the other end of positive wire is worn
Cross after positive wire through hole, between anode and the multiaspect scapus and boss of multiaspect scapus negative electrode and positive wire and positive wire
Glass paste is perfused between through hole, the insulating barrier of insulator style is formed after the glass paste is sintered, the insulating barrier is by anode
It is mutually isolated with positive wire and multiaspect scapus negative electrode.
Provided with the screw thread being connected with mounting seat or radiator on the connection handle of above-mentioned multiaspect scapus negative electrode.
Above-mentioned seal cap is hollow type barrel cover structure or is with being poured into a mould by sealed multiaspect scapus and electronic component chip
Solid construction together.
Above-mentioned seal cap is transparent or opaque structure.
By adopting the above-described technical solution, the utility model according to the need for use by different large, medium and small power
Electronic component chip is packaged after being pasted and fixed on the multiaspect scapus of multiaspect scapus negative electrode and forming one has negative electrode
With the high-power two end surfaces leading foot electronic component of anode, this three-dimensional encapsulation mode that the utility model is used, no
It is only capable of effectively improving the power/volume ratio of whole electronic component, but also significantly reduces the body of whole electronic component
Product and the job stability for improving whole electronic component.The utility model is matched somebody with somebody using large, medium and small power electronic element chip
Power integration packaging is taken, lump radiating temperature control can flexibly realize the technical requirements of various electrical parameters, lifting environmental work
Reliability.Three-dimensional encapsulation of the present utility model can greatly reduce and be transversely mounted area.The utility model can be applied to high-power
Rectifier cell, high-power voltage-stabilizing tube, great power LED（3D light sources）, Power Resistor, great-power electronic fuse etc. it is high-power
The making of two end surfaces leading foot electronic components.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is multiaspect scapus cathode construction schematic diagram of the present utility model；
Fig. 3 is structural representation of the major diameter of the cone of the utility model anode with cylinder diameter when identical；
Fig. 4 is less than structural representation during cylinder diameter for the major diameter of the cone of the utility model anode；
Fig. 5 is Fig. 1 A-A cross section structure diagrams（Multiaspect scapus shown in Fig. 5 is regular hexahedron post）.
Description of reference numerals：1- seal caps, 2- anodes, 2.1- positive wire jacks, 2.2- positive wires, 3- polyhedrons
Post, 3.1- die bond planes, 4- boss, 5- connection handles, 5.1- screw threads, 6- insulating barriers, 7- electronic component chips.
Embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples, but not as new to this practicality
Any limitation of type.
Embodiment of the present utility model：The utility model is according to a kind of following high-power two end surfaces leading foot electronics
Constructed by component three-dimensional encapsulation method, this method is the electronic component chip of separation is high-power by encapsulating composition
During two end surfaces leading foot electronic components, one multiaspect scapus negative electrode of pre-production can be by the multiaspect scapus negative electrode during making
Multiaspect scapus surface be made as conductive surface or be fabricated to heat conductive insulating surface, when by the multiaspect scapus table of multiaspect scapus negative electrode
When face is made as heat conductive insulating surface, printed in a conventional manner and according to requirements in etching on the heat conductive insulating surface
Circuit；Then an anode is fixed on the multiaspect scapus negative electrode, and makes anode and multiaspect scapus negative electrode mutually insulated；Then again
The electronic component chip of more than three is pasted and fixed in the multiaspect scapus plane of multiaspect scapus negative electrode（Electronic component core
The quantity and watt level of piece can be selected according to the need for use）, use requirement is then pressed again by each electronic component core
After piece is connected with each other and is connected with multiaspect scapus negative electrode and anode, envelope is emitted into fixed cover on anode, and emit envelope will be many
All sealing is covered for the multiaspect scapus and electronic component chip of face scapus negative electrode.
It is three-dimensional according to the high-power two end surfaces leading foot electronic component of one kind of the present utility model that the above method is built
Encapsulating structure, as Figure 1-Figure 5, the high-power two end surfaces leading foot electronic component stereo encapsulation structure by seal cap 1,
Anode 2 and multiaspect scapus negative electrode connection composition, multiaspect scapus negative electrode constitute integral knot by multiaspect scapus 3, boss 4 and connection handle 5
Structure（As shown in Figure 2）, anode 2 is the integrative-structure that cone and cylinder are combined into, and can be cone by anode 2 during making
Taper diameter is fabricated to as cylinder diameter（As shown in Figure 3）, or the major diameter of the cone of anode is made smaller than
Cylinder diameter（As shown in Figure 4）, through hole is produced in the cone and cylinder of anode 2, anode 2 is passed through into its through hole set
On the multiaspect scapus 3 of multiaspect scapus negative electrode, a positive wire jack 2.1 is produced on anode 2, in positive wire jack
Positive wire 2.2 is plugged in 2.1, and one end that positive wire 2.2 is inserted in positive wire jack 2.1 passes through traditional silver
Weldering, brazing or soldering and anode 2 weld together, and during silver soldering, can carry out silver soldering, positive wire with existing silver paste sintering processing
2.2 can be made using plain conductors such as copper cash, aluminum steel, iron wires；Then it is pre- in the boss 4 and connection handle 5 of multiaspect scapus negative electrode
A positive wire through hole is first produced, the other end of positive wire 2.2 is passed through and showed after the positive wire through hole in connection
Outside handle 5（As shown in Figure 1）, insulating barrier 6 is filled between anode 2 and the multiaspect scapus 3 and boss 4 of multiaspect scapus negative electrode,
Insulating barrier 6 is also filled between the positive wire through hole of positive wire 2.2 and boss 4 and connection handle 5（As shown in Figure 1）, anode 2
Connected as one with positive wire 2.2 by insulating barrier 6 with multiaspect scapus negative electrode；On the multiaspect scapus 3 of multiaspect scapus negative electrode
Provided with the die bond plane 3.1 for pasting fixed electronic component chip 7；By seal cap 1 using cast, bonding or tight fit
Mode be fastened on anode 2, and by multiaspect scapus 3 and electronic component chip 7 thereon can be pasted and fixed on
All sealing is covered.
During making, can according to the need for using and installing by multiaspect scapus 3 be fabricated to positive trihedral post, positive tetrahedron post,
Regular five-hedron post, regular hexahedron post, regular octahedron post or regular dodecahedron post；Anode 2 is being enclosed on polyhedron by its through hole
On the multiaspect scapus 3 of post negative electrode and positive wire 2.2 the other end pass through positive wire through hole after, preferably in anode 2 and multiaspect
Full glass paste is irrigated between the multiaspect scapus 3 and boss 4 of scapus negative electrode and between positive wire 2.2 and positive wire through hole,
By the glass paste it is sintered in a conventional manner after can form the insulating barrier 6 of insulator style, the insulating barrier 6 can be by anode 2
It is mutually isolated with positive wire 2.2 and multiaspect scapus negative electrode；Insulating barrier 6 can also use silica gel, epoxy resin, insulating cement or plastics
Made Deng insulating materials.In order that with more facilitating, when making multiaspect scapus negative electrode, in the connection handle 5 of multiaspect scapus negative electrode
On produce the screw thread 5.1 that can be connected with the screwed hole in mounting seat or radiator., can be by seal cap 1 the need for according to use
It is made as hollow type barrel cover structure or is made as together with being poured into a mould by sealed multiaspect scapus 3 and electronic component chip 7
Solid construction；And according to seal cap 1 to be made as to transparent or opaque knot using transparent or opaque material the need for use
Structure.
Claims (7)
1. a kind of high-power two end surfaces leading foot electronic component stereo encapsulation structure, it is characterised in that：High-power two end
Surface leading foot electronic component stereo encapsulation structure is by seal cap（1）, anode（2）Connect and constitute with multiaspect scapus negative electrode, it is many
Face scapus negative electrode is by multiaspect scapus（3）, boss（4）And connection handle（5）Constitute integrative-structure, anode（2）For cone and cylinder
The integrative-structure that body is combined into, in anode（2）Cone and cylinder in be provided with through hole, anode（2）It is enclosed on by its through hole
The multiaspect scapus of multiaspect scapus negative electrode（3）On, in anode（2）It is provided with positive wire jack（2.1）, in positive wire jack
（2.1）In be inserted with positive wire（2.2）, and positive wire（2.2）It is inserted in positive wire jack（2.1）In one end pass through silver
Weldering, brazing or soldering and anode（2）Weld together, in the boss of multiaspect scapus negative electrode（4）And connection handle（5）In provided with one sun
Polar conductor through hole, positive wire（2.2）The other end pass through positive wire through hole after show in connection handle（5）Outside, in anode（2）
With the multiaspect scapus of multiaspect scapus negative electrode（3）And boss（4）Between be filled with insulating barrier（6）, in positive wire（2.2）With boss
（4）And connection handle（5）Positive wire through hole between be also filled with insulating barrier（6）, anode（2）And positive wire（2.2）Pass through
Insulating barrier（6）Connected as one with multiaspect scapus negative electrode；In the multiaspect scapus of multiaspect scapus negative electrode（3）Being provided with is used to paste solid
Determine electronic component chip（7）Die bond plane（3.1）；Seal cap（1）It is fastened on anode（2）On, and by polyhedron
Post（3）And it is pasted and fixed on electronic component chip thereon（7）All sealing is covered.
2. high-power two end surfaces leading foot electronic component stereo encapsulation structure according to claim 1, its feature exists
In：The multiaspect scapus（3）For regular polygon post.
3. high-power two end surfaces leading foot electronic component stereo encapsulation structure according to claim 2, its feature exists
In：The multiaspect scapus（3）For positive trihedral post, positive tetrahedron post, regular five-hedron post, regular hexahedron post, regular octahedron post or
Regular dodecahedron post.
4. high-power two end surfaces leading foot electronic component stereo encapsulation structure according to claim 1, its feature exists
In：In anode（2）The multiaspect scapus of multiaspect scapus negative electrode is enclosed on by its through hole（3）Upper and positive wire（2.2）The other end
Through after positive wire through hole, in anode（2）With the multiaspect scapus of multiaspect scapus negative electrode（3）And boss（4）Between and anode lead
Line（2.2）Glass paste is perfused between positive wire through hole, the insulation of insulator style is formed after the glass paste is sintered
Layer（6）, the insulating barrier（6）By anode（2）And positive wire（2.2）It is mutually isolated with multiaspect scapus negative electrode.
5. high-power two end surfaces leading foot electronic component stereo encapsulation structure according to claim 1, its feature exists
In：In the connection handle of multiaspect scapus negative electrode（5）Provided with the screw thread being connected with mounting seat or radiator（5.1）.
6. high-power two end surfaces leading foot electronic component stereo encapsulation structure according to claim 1, its feature exists
In：The seal cap（1）For hollow type barrel cover structure or for by sealed multiaspect scapus（3）And electronic component chip（7）
The solid construction of cast together.
7. high-power two end surfaces leading foot electronic component stereo encapsulation structure according to claim 6, its feature exists
In：The seal cap（1）For transparent or opaque structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720077006.8U CN206401306U (en) | 2017-01-19 | 2017-01-19 | High-power two end surfaces leading foot electronic component stereo encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720077006.8U CN206401306U (en) | 2017-01-19 | 2017-01-19 | High-power two end surfaces leading foot electronic component stereo encapsulation structure |
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| Publication Number | Publication Date |
|---|---|
| CN206401306U true CN206401306U (en) | 2017-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720077006.8U Active CN206401306U (en) | 2017-01-19 | 2017-01-19 | High-power two end surfaces leading foot electronic component stereo encapsulation structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601701A (en) * | 2017-01-19 | 2017-04-26 | 贵州煜立电子科技有限公司 | Stereoscopic packaging method and structure for high-power two-end surface leading foot electronic component |
-
2017
- 2017-01-19 CN CN201720077006.8U patent/CN206401306U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601701A (en) * | 2017-01-19 | 2017-04-26 | 贵州煜立电子科技有限公司 | Stereoscopic packaging method and structure for high-power two-end surface leading foot electronic component |
| CN106601701B (en) * | 2017-01-19 | 2023-03-28 | 贵州煜立电子科技有限公司 | Three-dimensional packaging method and structure of high-power electronic component with two end surface lead-out pins |
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