CN206361437U - LED filament and LEDbulb lamp - Google Patents

Abstract

Originally new to disclose a kind of LED filament and LEDbulb lamp, the LED filament includes support, two metal electrodes, LED chip group and the silica gel mixed with fluorescent material.Two metal electrodes are respectively arranged at two sides of the support；LED chip group includes multiple LED chips, and the multiple LED chip is configured in the support, and is respectively and electrically connected to the metal electrode；The LED chip group is wrapped up mixed with the silica gel of fluorescent material and at least part of each electrode of two metal electrode is wrapped up, and wrapped metal electrode is the metallic electrode portion being located in the support.

Description

LED filament and LEDbulb lamp

Technical field

The utility model is related to lighting field, and in particular to a kind of LED filament and LEDbulb lamp.

Background technology

LED has environmental protection, energy-conservation, high efficiency and long-life advantage, therefore is generally taken seriously in recent years, gradually Replace the status of traditional lighting light fixture.But the luminous of LED has directive property, unlike conventional lamp can make big wide angular range Illumination, therefore how to design and reach ultra wide-angle, the LED lamp of all-round optical illumination, make great efforts the mesh of research and development as LED industry then Mark.

In recent years, one kind can allow the similar conventional tungsten silk bulb lamp of LED/light source to light, and reach the LED of full angle illumination Silk is increasingly paid attention to by industry.The making of this LED filament be by plurality of LEDs chip concatenation be fixed on it is a piece of narrow and small elongated On glass substrate, then to wrap up whole branch glass substrate mixed with the silica gel of fluorescent material, then carry out electrical connection and can complete.But Glass substrate heat conduction is not good, and is easily broken because of vibrations, causes the concatenation of LED chip to break and fail.So changing with regard to someone Replaced for metal substrate not easy to break, although metal substrate has preferable thermal conduction characteristic, itself can not printing opacity, meeting Have the defect of shield lights, cause LED filament luminous efficiency low, and can not meet full angle it is luminous the need for.Therefore such as The luminous efficiency what is strengthened the toughness of LED filament and takes into account its thermal conduction characteristic and LED filament simultaneously just turns into LED illumination industry The target of joint efforts.

Utility model content

The utility model embodiment provides a kind of toughness that can strengthen LED filament again while taking into account its luminous efficiency with dissipating The novel LED bulb lamp of heat, whereby to solve problem of the prior art.

To solve the above problems, the utility model embodiment provides a kind of LED filament, including：Including support, two metals electricity Pole, LED chip group and the silica gel mixed with fluorescent material.Two metal electrodes are respectively arranged at two sides of the support；LED chip group Include multiple LED chips, the multiple LED chip is configured in the support, and be respectively and electrically connected to the metal electricity Pole；The LED chip group and the metallic electrode portion in the support are wrapped up mixed with the silica gel of fluorescent material.In other words Say, according to the utility model, each side of multiple LED chips is all contacted with silica gel.

Another embodiment of the utility model provides a kind of LED filament, including：Two flat brackets, two metal electrodes, LED core Piece group and the silica gel mixed with fluorescent material；Two metal electrodes are respectively arranged between two flat bracket；LED chip group includes Multiple LED chips, are respectively and electrically connected to two metal electrode, and be configured at two flat bracket and two metal Between electrode；It is configured at mixed with the silica gel of fluorescent material between two flat bracket, for wrapping up the LED chip group and bag At least part of each electrode of two metal electrode is wrapped up in, wrapped metal electrode is the part gold being located in the support Belong to electrode.In other words, according to the utility model, each side of multiple LED chips is all contacted with silica gel.

Another embodiment of the utility model provides a kind of LEDbulb lamp, including：Lamp housing, metal mandril, radiator, lamp socket, And metallic conduction support, lamp housing has openend；Metal mandril is used to substitute the gas in the LEDbulb lamp and provides institute State the function of LEDbulb lamp heat conduction；Radiator is connected with the openend of the lamp housing, is had in the openend close to the lamp housing Lid version, is thermally conducted to outside the LEDbulb lamp for supporting the metal mandril, and by what the metal mandril was transmitted； Lamp socket, connects the radiator；Metallic conduction support is arranged on the cover plate of the radiator, for connecting and supporting multiple LED filament；The multiple LED filament of each of which includes without lower supporter, is respectively arranged at two sides without lower supporter Two metal electrodes, the LED chip group for including multiple LED chips, are configured at described without in lower supporter, with the silicon mixed with fluorescent material Glue, wraps up at least part of each electrode of the LED chip group and parcel two metal electrode, wrapped metal electricity Pole is the metallic electrode portion being located in the support.In other words, according to the utility model, every side of multiple LED chips Side is all contacted with silica gel.

Another embodiment of the utility model provides a kind of LEDbulb lamp, including：Lamp housing, ceramic stem, radiator, lamp socket, And metallic conduction support, lamp housing has openend；Ceramic stem is used to substitute the gas in the LEDbulb lamp and provides institute State the function of LEDbulb lamp heat conduction；Radiator is connected with the openend of the lamp housing, is had in the openend close to the lamp housing Lid version, is thermally conducted to outside the LEDbulb lamp for supporting the ceramic stem, and by what the ceramic stem was transmitted； Lamp socket, connects the radiator；Metallic conduction support is arranged on the cover plate of the radiator, for connecting and supporting multiple LED filament；The multiple LED filament of each of which includes without lower supporter, is respectively arranged at two sides without lower supporter Two metal electrodes, the LED chip group for including multiple LED chips, are configured at described without in lower supporter, with the silicon mixed with fluorescent material Glue, wraps up at least part of each electrode of the LED chip group and parcel two metal electrode, wrapped metal electricity Pole is the metallic electrode portion being located in the support.In other words, according to the utility model, every side of multiple LED chips Side is all contacted with silica gel.

According to the utility model, in order to reach it is all-round to it is luminous, the material of support and flat bracket is high temperature resistant printing opacity Material.The LED chip is wrapped up mixed with the silica gel of fluorescent material.Compared with prior art, each side of LED chip all with mixed with The silica gel contact of fluorescent material, so that the LEDbulb lamp with LED filament, no matter being provided on support or flat board branch On frame, can omnidirectional it is luminous and lift the luminous efficiency of filament.

Brief description of the drawings

Accompanying drawing described herein is used for providing further understanding to of the present utility model, constitutes the part of the application, Schematic description and description of the present utility model is used to explain the utility model, does not constitute to of the present utility model improper Limit.In the accompanying drawings：

Figure 1A is the LED filament structural representation that the utility model first embodiment has multiple LED chip series connection；

Figure 1B is that the utility model first embodiment has multiple LED chips LED filament knot signal composition in parallel；

Fig. 1 C are the LED filament schematic configuration diagrams with multiple LED chips in the utility model first embodiment, are shown Two metal electrodes are fixed on printing opacity support；

Fig. 1 D are the structural side views of the support of another embodiment LED filament of the utility model；

Fig. 2 is that another embodiment of the utility model has multiple LED chips LED filament knot signal composition in parallel；

Fig. 3 is the LED filament structural representation that another embodiment of the utility model has multiple LED chip series connection；

Fig. 4 shows the partial enlargement structure chart of region A in Fig. 3；

Fig. 5 is that the utility model second embodiment has multiple LED chips LED filament knot signal composition in parallel；

Fig. 6 shows the partial enlargement structure chart of region B in Fig. 5；

Fig. 7 is the LED filament structural representation of the utility model 3rd embodiment；

Fig. 8 shows the partial enlargement structure chart of the LED filament of 3rd embodiment shown in Fig. 7；

Fig. 9 is that the utility model fourth embodiment has multiple LED chips schematic diagram in parallel；

Figure 10 shows the LED lamp bulb structure schematic diagram made by the LED filament using the embodiment of the utility model one；

Figure 11 shows the lamp design figure that radiator is connected in Figure 10；And

Figure 12 shows the amplification assumption diagram of a-quadrant in Figure 11.

Embodiment

Detailed features of the present utility model and advantage are described in detail with specific embodiment in embodiments below, in it Appearance is enough to make any those skilled in the art understand technology contents of the present utility model and can realize, and according to Content, claim and schema disclosed in this specification, any person of an ordinary skill in the technical field can be geographical easily Solve the purpose and advantage of the utility model correlation.Viewpoint of the present utility model is further described in following embodiment, but non- Anyways to limit category of the present utility model.

Some vocabulary have such as been used among specification and claim to censure particular element, but are not intended to limit this Utility model." one " or " described " used in the description, although present in the singular, unless otherwise specified, Also plural form is included in explanation.In addition, using " comprising ", "comprising", " having " etc. or its any other change in specification Body is intended to including for nonexcludability, so that process, method, commodity or system including a series of key elements are not only wrapped Those key elements, but also other key elements including being not expressly set out are included, or also include being this process, method, commodity Or the intrinsic key element of system.In the absence of more restrictions, the key element limited by sentence "including a ...", and It is not precluded within the process including the key element, method, commodity or system and also there is other identical element.

Figure 1A show an embodiment of the LED filament 11 that the utility model is arranged in LEDbulb lamp.The utility model The LED filament 11 of embodiment includes：Support 115, two metal electrodes 112 for being respectively arranged on 115 liang of sides of support, located at support The LED chip group with multiple LED chips 111 in 115, the gold thread 113 being connected with the LED chip 111 in LED chip group, And the silica gel 114 of LED chip 111 and gold thread 113 is lived located at the internal package of support 115.

Support 115 includes two support side edges 1152 and two non-supported sides 1151.Support 115 is bottomless side Frame, length can be between 10mm between 40mm, and width can be between 2mm between 5mm, and thickness can be between 0.3mm between 2mm. The light transmittance of support 115 may be defined as being more than 50% to the light transmittance of visible ray.The material of support 115 can be high temperature resistant printing opacity material Material, can select high temperature resistant translucent silica gel or other various plastics with same nature, its optical index is between parcel LED chip Between 111 silica gel and air.Because support 115 is without bottom, it is whole it is comprehensive on do not have doubting for shield lights Consider, can be all-round to the luminous efficiency for lighting and being lifted filament.In one embodiment, can also appropriateness mix in the support 115 Fluorescent material, makes the support (i.e. printing opacity support) that can be lighted.In other words, according to the utility model, multiple LED chips 111 Each side is all contacted with silica gel 114.There are support 115 two parallel pairs of 1151 and two parallel pairs of non-supported sides set to set Support side edge 1152, pre-embedding metal part is used as the metal electrode 112 of LED filament 11, metalwork respectively in support side edge 1152 Size be about 3 × 1mm, thickness is 0.4mm.Some predeterminable holes (not shown) in the middle of metalwork, to be for example embedded in into During type (insert molding) fabrication techniques support 115, metalwork can be embedded in die cavity, allowed as support 115 Material condensed again through these holes, so have to metal electrode 112 in the steadiness in the support side edge 1152 of support 115 Good help.A hole or hook (not shown) can be set in the outboard end of metal electrode 112 on support 115, for LED filament 11 use when assembling LEDbulb lamp as electrical connection.Metallic conduction circuit also can be set in support 115 above, for being placed on LED chip 111 in the middle of support 115 is electrically connected.

The LED chip group can be previously positioned on a carrier, the shape of plurality of LEDs chip 111 of being connected with gold thread routing Into LED string.Then by LED string dislocation in the centre of support 115, with gold thread routing by the LEDs core of head and the tail two of LED string Piece 111 and the metal electrode 112 at the two ends of support 115 do electrical connection.Again from the top of support 115 by mixed with the high heat conduction of fluorescent material Silica gel 114 is coated on the centre of support 115 and covers all LED chip groups and the metal electrode 112 inside support 115.Connect And remove carrier under LED chip group, then continue from the back side of support 115 (above corresponding foregoing support) will be mixed with fluorescence The high heat conduction silica gel 114 of powder injects the centre of support 115 and the metal inside fully wrapped around firmly LED chip group and support 115 Electrode 112.The cooling of silica gel 114 completes the LED filament 11 with support 115 after condensing and made.Foregoing carrier also may be used From the higher silica gel plate of hardness, to be reused into strips by processing cutting, so avoid the need for removing carrier and from support 115 back sides reinject high heat conduction silica gel 114, can simplify the fabrication steps of filament.

LED chip group can be that single LEDs chip is constituted or two LEDs chips are constituted, naturally it is also possible to such as preceding institute State is formed by the plurality of LEDs chip portfolio more than or equal to three.In one embodiment, the shape of long strip type can be used as LED A kind of selection of chip.The problem of chip of long strip type is uniformly distributed compared with no current diffusion, so being not necessarily intended on primary electrode Current spread is helped along with extension electrode.And excessive electrode can cover LED chip and light, its luminous efficiency is influenceed.Example It is very applicable if the LED chip of 10 × 20 specifications, by taking a LED filament up to 40mm as an example, between deduction LED chip After spacing, it should can place 18 LEDs chips above.In addition, the surface plating last layer in LED chip 111 is conductive Light indium tin oxide (Indium Tim Oxide, ITO), the uniform diffusion profile of electric current for chip can also have with luminous efficiency Lifted.

Figure 1B is the LED filament structural representation in parallel of the utility model first embodiment LED chip 111.Figure 1A and figure 1B difference is that Figure 1A LED chip 111 is to be connected in series to, and Figure 1B LED chip 111 is with parallel connection Mode is connected.The production method of Figure 1B LED filament structure is similar to Figure 1A, refers to the explanation of Figure 1A embodiment, therefore This is repeated no more.

In the present embodiment, support 115 by it is hollow without bottom framework exemplified by, as illustrated in figures 1A and ib, but the utility model Not limited to this, support 115 can also have other forms.Other embodiment is exemplified below to illustrate.

Fig. 1 C are the LED filament schematic configuration diagrams with multiple LED chips 111, show that two metal electrodes 112 are fixed on On support 115.The structure of Fig. 1 C LED filament 11 can also be applied to Figure 1A or Figure 1B LED filament.

Fixing device includes the protuberance 115A that is formed on support 115 and 115A's and formed corresponding to protuberance In the hole 112A on metal electrode 112.When LED filament 11 are assembled, the metal electrode 112 with hole 112A is placed on On the protuberance 115A of support 115, so as to metal electrode 112 is fixed on support 115, to simplify the process of assembling.

Fig. 1 D are the structural side views of another embodiment medium-height trestle of the utility model.In Fig. 1 D, the shape of two support platform 119 Into in two support side edges 1152 of support 115, for supporting two metal electrodes 112 respectively.LED chip group is by gold thread 113 routings, which are connected into, to be connected and is connected with the metal electrode 112 in support platform 119, and injection silica gel 114 so as to wrap completely Wrap LED chip 111 and gold thread 113.In other words, according to the utility model, each sides of multiple LED chips 111 all with Silica gel 114 is contacted.The structure of two metal electrode 112 of the present embodiment can also be applied to Figure 1A and Figure 1B electrode structure.

Fig. 2 is that another embodiment of the utility model has multiple LED chips LED filament knot signal composition in parallel.In Fig. 2 In, support 115 is two flat brackets 117,118 arranged in parallel, and with multiple LED chips 111 and metal electrode 112 It is configured between two flat brackets 117 and 118, and LED chip 111 connects metal by the routing of gold thread 113 in parallel Electrode 112.Silica gel 114 injection support 115 two flat brackets 117 and 118 between and it is fully wrapped around live LED chip 111 with Gold thread 113.In this embodiment, the first wire 117a is formed on flat bracket 117, so that by the positive pole of LED chip 111 End is electrically connected to one of metal electrode 112, and the negative pole end of LED chip 111 is electrically connected to gold by the second wire 118a Belong to electrode 112 wherein another.In one embodiment, fixing device is arranged to two metal electrodes 112 being fixed on two Between flat bracket 117 and 118.

In one embodiment, LED filament has further included printing opacity auxiliary carrier, for supporting LED chip group.

In one embodiment, flat bracket 117 and 118 includes multiple auxiliary support frames, each auxiliary support frame difference Support each LED chip 111.

Fig. 3-6 show another embodiment of the utility model LED filament, holds above-mentioned preparation method and slightly makes and changes. The metal electrode 212 at LED string and the two ends of support 215 is done with gold thread routing after electrical connection, can be by under LED chip 211 Carrier first remove, then LED string is put into mould together with support 215, will be mixed with glimmering in the way of model (molding) The injection of high heat conduction silica gel 214 of light powder is filled up inside support 215 and fully wrapped around firmly LED string, you can complete have support 215 LED filament 21 make.But during injection 215 inside of support of silica gel 214, be not necessarily to fill up the whole inside institute of support 215 There is space, as long as all LED chips 211 can moderately be wrapped, such as shown in Fig. 3 to Fig. 6.Pass through setting by modelling mould The change of meter or coating silica gel method, is only complete to wrap LED core inside the silica gel 214 and unfilled support 215 of injection Metal electrode 212 inside piece 211, gold thread 213 and support 215.In another embodiment, it can be formed in chip outer layer Lens adjust lighting angle.By way of support 215 is not fully filled with, the space being available allows LED string to be easier to dissipate Heat.Because the LED chip 211 in LED filament 21 is connected with gold thread 213, and gold thread 213 itself has splendid extension Property, the stress that LED chip 211 is extruded in LED string can be discharged in good time, the problem of being less likely to occur electrical connection broken string.

Foregoing LED string is combined in the way of being electrically coupled, but the connected mode between LED chip 211 A pattern is not herein limited, the electrical connection of chip also can be by the metallic conduction circuit (not shown) laid on support 215 To complete.For example the positive electrode of all LED chips 211 can be connected to the metal of the top of support 215 by gold thread 213 in Figure 5 Conducting wire, then it is connected to by metallic conduction circuit the metal electrode 212 of the support side edge 2152 positioned at support 215.Likewise, The negative electrode of all LED chips 211 is connected to the metallic conduction circuit of the lower section of support 215 by gold thread 213, then by metallic conduction Metal electrode 212 of the connection to another support side edge 2152 of support 215.Therefore it is with electrically in parallel to form LED string Mode combine.But the electrical connection of the chip of LED string is not limited to both patterns, can also use many cores Piece is composed in series after a junior unit, then multiple junior units are connected to the metallic conduction circuit of support 215 with gold thread 213 On, form parallel coupled electrical connection and combine.

Fig. 7 and Fig. 8 is the schematic diagram of the LED filament of another embodiment of the present utility model.The support 315 of filament is also nothing The frame at bottom, its material is high temperature resistant light transmissive material, can select high temperature resistant translucent silica gel or other various with same nature Plastics.

As illustrated in figs. 7 and 8, it is that the inside of support 315 there are many auxiliary stands with the different part of previous embodiment 3153, protruded by two non-supported sides 3151 correspondence of support 315, its function is primarily used to support LED chip 311.Cause It is the no bottom of support 315, so not having the doubt of shield lights, the luminous efficiency of LED filament 31 can be lifted.With previous reality Apply described in example, pre-embedding metal part is used as the metal electrode 312 of filament 31, metalwork in the two ends support side edge 3152 of support 315 Size as it was previously stated, predeterminable some holes in the middle of it, then with such as insert molding (insert molding) fabrication techniques In stent procedures, metalwork can be embedded in die cavity, allow and condensed again through these holes as the material of support 315, so There is good help in the steadiness on support to metal electrode 312.The non-supported side 3152 of support 315 and the auxiliary of protrusion Also metallic conduction circuit can be set above support 3153, be subsequently placed on the LED chip 311 in the middle of support 315 and be electrically connected. Due to can also be furnished with metallic conduction circuit on auxiliary stand 3153, thus the present embodiment LED chip 311 except being beaten with gold thread The mode of line is formed outside electrical connection, can also select to form electrical connection in the way of flip (flip-chip) structure, Exclude the not convenient of gold thread routing.The coating method of silica gel 314 can also only be coated with the periphery of single LEDs chip 311, be not required to fill out Inside full whole support 315, be only it is complete wrap LED chip 311, or even can be in the formation lens adjustment of chip outer layer Lighting angle, and the space being available allows LED to be easier radiating.

Traditional LED filament is after all chip making technologies are completed, it is necessary to which epitaxial wafer is cut apart into many LED chip.In embodiment of the present utility model, it is not necessarily to LED cutting apart into many completely LED chip is used.In one embodiment, plurality of LEDs chip portfolio can also be used into a junior unit, plurality of LEDs Arrangements of chips is grown up bar shaped LED light bar, is more suitable for for making LED/light source, so not only can be with LED chip making technology Multiple tracks chip cutting step is saved, the number of times of die bond routing can also be reduced in LED chip packaging technology, to overall processing procedure Yield increased quality is very helpful.In addition, the Sapphire Substrate of epitaxial wafer may be substituted for the usual glass base of in the market Plate, it is not necessary to again that LED chip is cemented on other substrates or support in addition, and the thermal conductivity factor of sapphire substrate is up to 120W/mK, the 1W/mK more than traditional glass is not bad.Radiating effect and luminous efficiency lifting for LED chip on filament have Very big benefit.And gold thread can be stamped with packaging technology between the LED chip group on LED light bar and be electrically connected, also may be used Connected with plating plain conductor between LED core blade unit by manufacture of semiconductor technique.

The LED light bar completed with high-heat-conductivity glue or tin cream can affix metal electrode in its two ends bottom, then to encapsulate The technique of routing stamps gold thread between the LED chip and metal electrode at LED light bar two ends and does electrical connection, can also cover in addition The mode of crystalline substance encapsulation binds the metal electrode at LED light bar two ends.The LED light bar for carrying metal electrode is finally put into mould again In, superscribe the silica gel mixed with fluorescent material on LED light bar periphery in the way of model, you can complete the making of LED filament.Metal The size of electrode is as it was previously stated, its some middle predeterminable hole, silica gel can again coagulate through these holes in model processing procedure Knot, so has good help to the steadiness of metal electrode.

Further, in all embodiments of the present utility model, LED core blade unit is selected by one kind of long strip type.Such as Preceding described, LED chip group can be that single LEDs chip is constituted or formed by plurality of LEDs chip portfolio.Long strip type The problem of LED chip is uniformly distributed compared with no current diffusion, so being not necessarily intended on primary electrode help along with extension electrode Current spread.Excessive electrode can cover LED chip and light, and influence its luminous efficiency.And the LED chip group of long strip type can more be accorded with Close the planform demand of LED filament.In one embodiment, LED chip group Aspect Ratio can be set in 2:1~10:1.In addition, LED chip arrangement in the problem of in view of radiating, strip LED chip group should not be excessively intensive, and distance each other is extremely Less should be for 1 to 3mm, or the LED chip being designed in LED chip group is lighted when lighting when different, but light in turn, All LED chips in LED chip group can not also be lighted, the generation of thermal source is reduced, and the LED chip that part is not lighted can So as to used in other purposes, such as can select plurality of LEDs chip portfolio into bridge rectifier, the alternating current that market is supplied Direct current LED chip is converted to use.In another embodiment, the parallel coupled electrical connection of LED chip group can also be adjusted, is such as schemed Shown in 9.In Fig. 2 and Fig. 5 LED chip group parallel coupled electrical connected mode, make the positive and negative electrode of LED chip group 411 of part inverse To the conducting wire being parallel on support.When this LED filament connects AC power, the only LED chip in forward current Group 411 can be bright, and the LED chip group 411 in backward current then will not be bright.Therefore between the positive and negative periodic conversion of AC power All LED chip groups 411 can be lighted in turn, and the thermal source that can reduce LED chip group 411 is produced, while rectification can also be reduced The cost of electronic device.

In another embodiment, LED core blade unit can also use high-power LED chip, then be grasped with low current Make, although such LED core blade unit is maintained under the situation of low current density, can still possess enough brightness, and LED chip Substantial amounts of thermal source will not be produced, makes overall luminous efficiency good.

But the LED core blade unit that can use of the utility model creation be not limited to it is described previously and LED chip kind Class scope, such as AC type light emitting diode (AC LED) are also to make LED filament with high-pressure type light emitting diode (HV LED) Selection.Because LED illumination utensil must use civil power, and the power supply provided on the market is high-voltage ac power, and uncomfortable Conjunction is directly used on LED/light source, it is necessary to the electronic component of extra increase rectification and decompression on LED illumination utensil.Due to LED Itself it is a kind of diode assembly, appropriate combination has effects that rectification, and the concatenation of plurality of LEDs is similar many electricity Resistance is cascaded, and can bear high-tension current, therefore AC type light emitting diode is also fitted very much with high-pressure type light emitting diode For making LED filament, it is possible to reduce rectification and the cost of electronic pressure device.

Traditional bulb lamp is in manufacturing process, and in order to avoid tungsten filament, in combustion synthesis in air, oxidation scission fails, therefore The glass structure thing that a loudspeaker stem can be designed is enclosed at the opening of glass lamp housing and is sintered sealing, and loudspeaker core is then passed through again Air inside lamp housing is substituted into nitrogen by the port connection vavuum pump of post, it is to avoid the tungsten filament combustion oxidation inside lamp housing, again finally The port of loudspeaker stem is sintered into sealing.In addition, substituting while also aerial water can will be spread inside lamp housing by gas Mist is removed in the lump.Further, Figure 10 is refer to, Figure 10 shows the LEDbulb lamp 1 of the LED filament 11 using previous process. LEDbulb lamp 1 includes lamp housing 12, a plurality of LED filament 11, for connect and support LED filament 11 metallic conduction support 13, For substituting the gas in LEDbulb lamp 1 and providing the metal mandril 14 of function of heat conduction, connection metal mandril 14 and by metal What stem 14 was transmitted be thermally conducted to outside LEDbulb lamp plastic lamp base 16, radiator 15, lamp holder 17 and located at lamp holder 17 In drive circuit (not shown).In order to which the light efficiency for improving LEDbulb lamp 1 is showed, lamp housing 12, which must possess, preferable printing opacity Degree and heat-conducting effect, therefore, the present embodiment are preferred using glass lamp housing, possess the plastic lantern of high printing opacity and high heat conduction effect in addition Shell also may be selected, and consider demand of the market segment to low colour temperature bulb lamp, moderately can be adulterated in lamp housing with golden yellow Material, or plate the golden yellow film of last layer, the indigo plant that the micro absorption part LED chip of appropriateness is sent in envelope inner surface Light, is showed with the colour temperature for downgrading LEDbulb lamp 1.As it was previously stated, vavuum pump can be by the sky inside lamp housing 12 through metal mandril 14 Gas substitutes the ratio mixing for helping nitrogen or nitrogen and helium appropriateness, to improve the thermal conductivity of gas in lamp housing 12, while Eliminate the water smoke hidden in air.In addition, lacking the heat conduction auxiliary of metallic support, the heat that LED filament 11 is produced is difficult directly Connect and be transmitted to outside lamp housing, but pass through metal mandril 14 to absorb the thermal source that LED filament 11 is radiated, it is possible to rapidly will Radiator 15 is thermally conducted to discharge outside lamp housing 12.If in addition, in view of improving the problem of light efficiency is showed, can also use tradition The not glass stem of extinction, and plate last layer light-permeable on its surface has the graphene of high heat conduction characteristic can improved heat radiation again Problem.Radiator 15 is slightly centered around the openend of lamp housing 12 in hollow cylinder, and inside can place the driving electricity of LED filament 11 The metal with good heat conductive effect, ceramics or high heat conduction plastics are can select in road, material.When from metal material (such as Al Aluminium) when coming as radiator 15, because the thermal conduction characteristic of metal material is very well, but very poor (such as aluminium of its thermal radiation property Radiance only about 0.1), so surface needs coating to strengthen thermal radiation effect, such as aluminum oxide (radiance about 0.4) just has Preferable thermal radiation effect.Radiator 15 is additionally provided with a cover plate 1501 in the open end close to lamp housing 12, and its surface can be applied The reflecting coating of upper aluminum oxide or white, can so increase the heat-conducting area of radiator 15 with improving thermal radiation property, fully inhale Receive heat that LED filament 11 produces and conduct extraneous to spherical shell, two light that LED filament 11 can be sent reflect outside lamp housing with Improve light efficiency.In addition, being provided with the hole (not shown) passed through for metal mandril 14 and metallic conduction support 13 on cover plate 1501. Drive circuit can pass through metallic conduction support 13 and is electrically connected with a plurality of LED filament 11 there is provided power supply with lightening LED lamp silk 11 On LED chip, the lamp holder 17 of the input lead of the drive circuit other end then with the tail end of LEDbulb lamp 1 is electrically connected with.

As it was previously stated, traditional bulb lamp is in manufacturing process, it can be enclosed at the opening of glass lamp housing and added with loudspeaker stem To sinter sealing, because both materials are all glass, therefore it can mutually be melted after high temperature sintering and reach sealed purpose.But The utility model creation changes using after metal mandril 14, and the sintering sealing effectiveness of metal and glass is compared with can not reach image glass loudspeaker The effect of stem, thus the present embodiment for connection metal mandril 14 the structure of radiator 15 adjusted, to reach sealing The purpose of bulb lamp lamp housing.As shown in figure 11, the external form of radiator 15 is covered in the openend of lamp housing 12 just as a bottle cap, its There is kink 1502 to be connected with the openend glass of lamp housing 12 at edge.It refer to tool in the middle of Figure 12, the port of kink 1502 There is a depressed part 1503 of indent, the rough openend thickness of glass than lamp housing 12 of its width is a little big, therefore lamp housing 12 is whole Openend can be enveloped by the complete covering of depressed part 1503.The sealing of sealing well can be moderately inserted in depressed part 1503 Glue, allows the connection more shape of radiator 15 and lamp housing 12 to consolidate.Plastic lamp base 16 can be set up between radiator 15 and lamp holder 17 again, With the safety of attendant's device or removal bulb lamp.

Upright symmetrical pattern arrangement can be presented in the arrangement mode of a plurality of LED filament 11 around metal mandril 14.But In view of the demand of all-round optical illumination, filament preferably using tiltedly put and non-parallel to metal mandril 14 by the way of it is preferable.LED filament 11 Interior LED chip moderately can be driven shinny from jumbo chip with low current, to reach the purpose of relatively low heating, be allowed The light efficiency of LED filament 11 can exceed 180lm/W, can so allow the whole lamp brightness of LEDbulb lamp 1 to surmount 700lm easily.This Outside, for whole bulb lamp, the ornaments optimum position of lamp source is the ball immediate vicinity of lamp housing, and long filament can not All ornaments can reach more preferable all-round light effect in this region, therefore from several more shorter LED filaments, at this The length of LED filament is ideal with below 20mm in embodiment, and 15~10mm is optimal selection.In addition, lamp source is disperseed Into a plurality of short filament thermal source can be allowed to disperse, can not only increase the overall radiating effect of LEDbulb lamp, most be pushed up even in lamp housing 12 At the position at end, light rate of change can also be far below 50%, i.e. the brightness of lamp housing top is not less than the most bright position of LEDbulb lamp The 50% of brightness.

Foregoing metal mandril can also be changed to ceramic stem in the present embodiment into, the material of ceramic material can be oxidation Aluminium or aluminium nitride, its thermal radiation absorption rate are high more than glass, therefore can more effectively absorb the heat that LED filament is sent, will Outside heat derives LEDbulb lamp.In other embodiments, the material of radiator (together with the screw socket of LEDbulb lamp) is also optional With the ceramic material with good heat conductive effect, it is possible to integrally formed with ceramic stem, the screw socket of LEDbulb lamp can be removed from Need to be glued with radiator and increase the thermal resistance of LED filament heat dissipation path, with more preferable radiating effect.

In the present embodiment, the luminous efficiency of LEDbulb lamp is, for example, 30~400lm/W, preferably 50~250lm/ W.The whole lamp brightness of LEDbulb lamp is for example up to 800lm.The colour temperature of LEDbulb lamp is 2200K~6500K, preferably 2500K~4000K.In addition, the shape of gel coated LED chip can be square or rectangular, its vertical and horizontal ratio Such as it is 1:1~1:100.

Embodiment of the present utility model is the foregoing is only, the utility model is not limited to, for this area Technical staff for, the utility model can have various modifications and variations.It is all it is of the present utility model spirit and principle within, Any modification, equivalent substitution and improvements made etc., should be included within right of the present utility model.

Claims (10)

1. a kind of LED filament, it is characterised in that including：

Support；

Two metal electrodes, are respectively arranged at two sides of the support；

LED chip group, includes multiple LED chips, and the multiple LED chip is configured in the support, and is electrically connected respectively It is connected to the metal electrode；

At least part of each electrode of wherein described LED chip group and two metal electrode is by the silica gel mixed with fluorescent material Parcel, wrapped metal electrode is the metallic electrode portion being located in the support.

2. LED filament according to claim 1, it is characterised in that the support includes two support side edges and two non-branch Side is supportted, two metal electrode is respectively arranged at two support side edge.

3. LED filament according to claim 2, it is characterised in that further included fixing device, being configured to will be described Two metal electrodes are fixed in two support side edge of the support.

4. LED filament according to claim 2, it is characterised in that be respectively formed with two in two support side edge Platform is supportted, for supporting two metal electrode.

5. LED filament according to claim 4, it is characterised in that further included fixing device, being configured to will be described Two metal electrodes are fixed in two support side edge of the support.

6. LED filament according to claim 2, it is characterised in that two metal electrode is respectively embedded into the support Two support side edge.

7. LED filament according to claim 1, it is characterised in that two metal electrode include respectively it is multiple with it is described The hole that support is combined.

8. LED filament according to claim 1, it is characterised in that the support is made up of light transmissive material.

9. LED filament according to claim 8, it is characterised in that the material of the support is silica gel.

10. LED filament according to claim 1, it is characterised in that each contact aside institute of the multiple LED chip State the silica gel containing phosphor powder.