CN206355031U - A kind of temperature detection structure and skin-active instrument - Google Patents
A kind of temperature detection structure and skin-active instrument Download PDFInfo
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- CN206355031U CN206355031U CN201620300861.6U CN201620300861U CN206355031U CN 206355031 U CN206355031 U CN 206355031U CN 201620300861 U CN201620300861 U CN 201620300861U CN 206355031 U CN206355031 U CN 206355031U
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- panel
- temperature
- temperature sensor
- detection structure
- temperature detection
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Abstract
The utility model discloses a kind of temperature detection structure and skin-active instrument, and skin-active instrument uses the temperature detection structure.The temperature detection structure includes being used to detect the temperature sensor (22) of the temperature of semiconductor chilling plate (10), the semiconductor chilling plate (10) includes first panel (12) and second panel (14), the first panel (12) and the second panel (14) are configured in opposite directions, and the temperature sensor (22) is folded between the first panel (12) and the second panel (14)., not only can accurately thermometric, and can effectively prevent temperature sensor by damage caused by external force and fail according to temperature detection structure of the present utility model.
Description
Technical field
The utility model is related to a kind of temperature detection structure and the skin-active instrument using the temperature detection structure.
Background technology
Using the temperature on temperature sensor detection device surface industrially using very extensive.Traditionally, for example
In skin-active instrument, the surface for fitting in semiconductor chilling plate is set in temperature sensor.Because external temperature
The position of the probe of sensor is more crisp, and temperature sensor is easily damaged and lost in the case of by external force
Effect, ultimately causes product bad.
Utility model content
The purpose of this utility model is there is provided a kind of temperature detection structure, not only can accurate thermometric, and
And can effectively prevent temperature sensor by damage caused by external force and fail.
The utility model is achieved through the following technical solutions:A kind of temperature detection structure, it is characterised in that including
For the temperature sensor for the temperature for detecting semiconductor chilling plate, the semiconductor chilling plate includes first panel
And second panel, the first panel and the second panel configured in opposite directions, and the temperature sensor is folded in
Between the first panel and the second panel.
As the further improvement of above-mentioned technical proposal, the temperature sensor patch is welded in the first panel
On.
As the further improvement of above-mentioned technical proposal, the temperature sensor patch is welded in the second panel
On.
As the further improvement of above-mentioned technical proposal, the temperature sensor is by bonding agent or passes through support
It is fixedly connected in the first panel.
As the further improvement of above-mentioned technical proposal, the temperature sensor is thermal resistor.
As the further improvement of above-mentioned technical proposal, the first panel is huyashi-chuuka (cold chinese-style noodles) porcelain plate, second face
Plate is hot face porcelain plate.
As the further improvement of above-mentioned technical proposal, the temperature sensor has the first probe wire and the
Two probe wires, semiconductor chilling plate has the first cooling piece wire and the second cooling piece wire, the temperature
Sensor is electrically connected by the first probe wire and the second probe wire with temperature control circuit board;Semiconductor system
Cold is electrically connected by the first cooling piece wire and the second cooling piece wire with temperature control circuit board.
According to another aspect of the present utility model, there is provided a kind of skin-active instrument, including massage head, semiconductor refrigerating
Piece and fin, it also includes being used to detect the temperature sensor of the temperature of semiconductor chilling plate, described partly to lead
Body cooling piece includes first panel and second panel, and the first panel and the second panel are configured in opposite directions,
The temperature sensor is folded between the first panel and the second panel.
As the further improvement of above-mentioned technical proposal, the temperature sensor patch is welded in the first panel
On, the temperature sensor is thermal resistor.Or, the temperature sensor patch is welded in second face
On plate, the temperature sensor is thermal resistor.
As the further improvement of above-mentioned technical proposal, the first panel is huyashi-chuuka (cold chinese-style noodles) porcelain plate, second face
Plate is hot face porcelain plate.
In the utility model, " temperature sensor is folded between first panel and second panel " is interpreted as
Including situations below:(1) temperature sensor is arranged on the inner surface of first panel;(2) temperature sensor
It is arranged in the space between first panel and second panel, with the inner surface of first panel and second panel
Inner surface is not contacted;(3) temperature sensor is arranged on the inner surface of second panel.
In the utility model, so-called " semiconductor chilling plate " is also thermoelectric module, it utilizes semiconductor
The Pe lt ier effects (peltier effect) of material, when direct current is connected by two kinds of different semi-conducting materials
Into galvanic couple when, can be absorbed respectively at the two ends of galvanic couple heat and release heat, it is possible to achieve the mesh of refrigeration
's.
The beneficial effects of the utility model are:In temperature detection structure of the present utility model, temperature sensor folder
It is located between the first panel and the second panel, not only can accurately thermometric, and can effectively preventing
Only temperature sensor is by damage caused by external force and fails.
Brief description of the drawings
Fig. 1 is the floor map of the temperature detection structure according to first embodiment of the present utility model;
Fig. 2 is the schematic cross-section of the temperature detection structure according to first embodiment of the present utility model;
Fig. 3 is the schematic cross-section of the temperature detection structure according to second embodiment of the present utility model;
Fig. 4 is that the three-dimensional of a part for using the skin-active instrument according to temperature detection structure of the present utility model is illustrated
Figure;
Fig. 5 is the decomposing schematic representation of Fig. 4 skin-active instrument;
10- semiconductor chilling plates;12- first panels;14- second panels;16- the first cooling piece wires;18-
Second cooling piece wire;22- temperature sensors;The probe wires of 26- first;The probe wires of 28- second;30-
Massage head;40- fin.
Embodiment
Below in conjunction with accompanying drawing in embodiment of the present utility model, to the technical side in the utility model embodiment
Case is clearly and completely described, it is clear that described embodiment is only that the utility model part is real
Apply example, rather than whole embodiments.The utility model being generally described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and designed with a variety of configurations.Therefore, below in the accompanying drawings providing
The detailed description of embodiment of the present utility model is not intended to limit claimed scope of the present utility model,
But it is merely representative of selected embodiment of the present utility model.Based on embodiment of the present utility model, this area skill
The every other embodiment that art personnel are obtained on the premise of creative work is not made, belongs to this reality
With novel protected scope.
First embodiment
First, the temperature detection structure that first embodiment of the present utility model is related to is entered referring to figs. 1 to Fig. 2
Row explanation.
Such as Fig. 1 to Fig. 2, the temperature detection structure includes being used to detect the temperature of the temperature of semiconductor chilling plate 10
Sensor 22 is spent, to realize the accurate temperature controlling for semiconductor chilling plate 10.Wherein, the semiconductor
Cooling piece 10 includes first panel 12 and second panel 14.The first panel 12 is huyashi-chuuka (cold chinese-style noodles) porcelain plate, institute
Second panel 14 is stated for hot face porcelain plate.The first panel 12 and the second panel 14 are configured in opposite directions.
The structure of semiconductor chilling plate is well known to those of ordinary skill in the art, is not repeated.
Wherein, the temperature sensor 22 be folded in the first panel 12 and the second panel 14 it
Between.In the present embodiment, the patch of temperature sensor 22 is welded in the first panel 12.TEMP
Device 22 forms as one with semiconductor chilling plate 10, and temperature sensor 22 is located at semiconductor chilling plate 10
Inside.In the present embodiment, the temperature sensor 22 is thermal resistor.
Temperature sensor 22 passes through the first probe wire 26 and the second probe wire 28 and temperature-control circuit
Plate (not shown) is electrically connected.Semiconductor chilling plate 10 passes through the first cooling piece wire 16 and the second system
Cold wire 18 is electrically connected with temperature control circuit board (not shown).Temperature control circuit board is based on
The temperature results that temperature sensor 22 is detected are controlled to semiconductor chilling plate 10.
A kind of temperature detection according to built in the temperature detection structure of first embodiment there is provided temperature sensor
Structure, can not only realize the effect of accurate temperature controlling, and the external exposed caused damage of temperature sensor can be prevented again
Wound and failure.Mode built in temperature sensor, can effectively solve that temperature sensor is external and temperature control inaccurate and
The situation that temperature sensor probe sensing point (being typically all melting welding point) is easily subject to crushing, effectively reduction product are not
Good and loss.Moreover, more saving space than traditional structure, product design structure can be simplified, can be from whole
The sensitization of product is realized on body, minimizes, assemble efficient function.
Second embodiment
Then, reference picture 3, say to the temperature detection structure that second embodiment of the present utility model is related to
It is bright.In addition, unless stated otherwise, the composition for the temperature detection structure that second embodiment is related to is real with first
Apply the composition illustrated in example referring to figs. 1 to Fig. 2 identical.Hereinafter, the temperature being mainly related to second embodiment
Detect that composition parts different from first embodiment are illustrated in the composition of structure, pair related to first embodiment
And temperature detection structure identical structure carry out schematic illustration.
As shown in figure 3, in the temperature detection structure of second embodiment, the patch of temperature sensor 22 is welded in
In the second panel 14.That is, the described patch of temperature sensor 22 is welded on hot face porcelain plate.Second embodiment
Temperature detection structure, it is possible to achieve the temperature detection structure identical effect with first embodiment.
3rd embodiment
Then, the temperature detection structure that 3rd embodiment of the present utility model is related to is illustrated.In addition,
Unless stated otherwise, the composition for the temperature detection structure that 3rd embodiment is related to, with reference in first embodiment
The composition that Fig. 1 to Fig. 2 illustrates is identical.Hereinafter, the temperature detection structure being mainly related to 3rd embodiment
The composition part different from first embodiment is illustrated in composition, pair temperature being related to first embodiment inspection
Geodesic structure identical structure carries out schematic illustration.
In the temperature detection structure of 3rd embodiment, the temperature sensor 22 is connected to institute by bonding agent
On the inner surface for stating first panel 12.The temperature detection structure of 3rd embodiment, it is possible to achieve real with first
Apply the temperature detection structure identical effect of example.
Fourth embodiment
Then, the temperature detection structure that fourth embodiment of the present utility model is related to is illustrated.In addition,
Unless stated otherwise, the composition for the temperature detection structure that fourth embodiment is related to, with reference in first embodiment
The composition that Fig. 1 to Fig. 2 illustrates is identical.Hereinafter, the temperature detection structure being mainly related to fourth embodiment
The composition part different from first embodiment is illustrated in composition, pair temperature being related to first embodiment inspection
Geodesic structure identical structure carries out schematic illustration.
In the temperature detection structure of 3rd embodiment, the temperature sensor 22 passes through support (not shown)
On the inner surface for being indirectly coupled to the first panel 12.The temperature detection structure of fourth embodiment, can be with
Realize the temperature detection structure identical effect with first embodiment.
According to another aspect of the present utility model, there is provided a kind of skin-active instrument.As shown in Figure 4 and Figure 5, the work
Skin instrument includes massage head 30, semiconductor chilling plate 10 and fin 40.The skin-active instrument is using above-described
Temperature detection structure.
Specifically, the skin-active instrument also includes being used to detect the TEMP of the temperature of semiconductor chilling plate 10
Device 22.The semiconductor chilling plate 10 includes first panel 12 and second panel 14.The first panel
12 be huyashi-chuuka (cold chinese-style noodles) porcelain plate, and the second panel 14 is hot face porcelain plate.The first panel 12 and second face
Plate 14 is configured in opposite directions.The temperature sensor 22 is folded in the first panel 12 and the second panel
Between 14.
In a concrete application example, the patch of temperature sensor 22 is welded in the first panel 12, institute
Temperature sensor 22 is stated for thermal resistor.Certainly, it will appreciated by the skilled person that this reality
New not limited to this is used, is welded in for example, the temperature sensor 22 can also be pasted in the second panel 14.
At least there is skin-active instrument the temperature with acoustic vibration to apply, the big function of cold compress two, make skin compact exquisiteness, rich
It is flexible.Temperature, which is applied, can accelerate blood circulation, promote skin care products to absorb;Cold compress can tighten up pore and capillary
Blood vessel, strengthens collagenous fibres, reaches fine, soft fur hole, flat microgroove, the effect for sensitive and swelling of releiving.
In addition, temperature detection structure of the present utility model can apply in other instruments, such as physiotherapeutic instruments,
Physiotherapeutic instruments can include controller and physiotherapy heating plate, and under the control of the controller, physiotherapy heating plate can
Heating, physiotherapy heating plate is covered on collaterals of human point, and moxa-moxibustion is carried out to human body or is heated to treat.
In description of the present utility model, it is to be understood that term " first ", " second " etc. are only used for
Purpose is described, and it is not intended that indicating or implying relative importance.For one of ordinary skill in the art
For, concrete meaning of the above-mentioned term in the utility model can be understood with concrete condition.In addition, in this reality
With in new description, unless otherwise indicated, " multiple " are meant that two or more.
While there has been shown and described that embodiment of the present utility model, one of ordinary skill in the art can be with
Understand:These embodiments can be carried out in the case where not departing from principle of the present utility model and objective a variety of
Change, modification, replacement and modification, scope of the present utility model is limited by claim and its equivalent.
Claims (10)
1. a kind of temperature detection structure, it is characterised in that including for detecting semiconductor chilling plate (10)
The temperature sensor (22) of temperature, the semiconductor chilling plate (10) includes first panel (12) and the
Two panels (14), the first panel (12) and the second panel (14) are configured in opposite directions, the temperature
Degree sensor (22) is folded between the first panel (12) and the second panel (14).
2. temperature detection structure according to claim 1, it is characterised in that the temperature sensor
(22) patch is welded in the first panel (12).
3. temperature detection structure according to claim 1, it is characterised in that the temperature sensor
(22) patch is welded in the second panel (14).
4. temperature detection structure according to claim 1, it is characterised in that the temperature sensor
(22) it is fixedly connected on by bonding agent or by support in the first panel (12).
5. temperature detection structure according to claim 1, it is characterised in that the temperature sensor
(22) it is thermal resistor.
6. the temperature detection structure according to any one of claim 1 to 5, it is characterised in that described
First panel (12) is huyashi-chuuka (cold chinese-style noodles) porcelain plate, and the second panel (14) is hot face porcelain plate.
7. temperature detection structure according to claim 6, it is characterised in that the temperature sensor
(22) there is the first probe wire (26) and the second probe wire (28), the semiconductor chilling plate (10)
With the first cooling piece wire (16) and the second cooling piece wire (18), the temperature sensor (22)
Electrically connected by the first probe wire (26) and the second probe wire (28) with temperature control circuit board;Half
Conductor cooling piece (10) passes through the first cooling piece wire (16) and the second cooling piece wire (18) and temperature
Control board is electrically connected.
8. a kind of skin-active instrument, including massage head (30), semiconductor chilling plate (10) and fin (40),
Characterized by further comprising the temperature sensor (22) of the temperature for detecting semiconductor chilling plate (10),
The semiconductor chilling plate (10) includes first panel (12) and second panel (14), first face
Plate (12) and the second panel (14) are configured in opposite directions, and the temperature sensor (22) is folded in described
Between first panel (12) and the second panel (14).
9. skin-active instrument according to claim 8, it is characterised in that the temperature sensor (22)
Patch is welded in the first panel (12), and the temperature sensor (22) is thermal resistor.
10. skin-active instrument according to claim 8 or claim 9, it is characterised in that the first panel (12)
For huyashi-chuuka (cold chinese-style noodles) porcelain plate, the second panel (14) is hot face porcelain plate.
Priority Applications (1)
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CN201620300861.6U CN206355031U (en) | 2016-04-12 | 2016-04-12 | A kind of temperature detection structure and skin-active instrument |
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CN201620300861.6U CN206355031U (en) | 2016-04-12 | 2016-04-12 | A kind of temperature detection structure and skin-active instrument |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109646273A (en) * | 2018-11-13 | 2019-04-19 | 厦门泰特橡塑科技有限公司 | A kind of controller and its control method for massage bar |
CN112533554A (en) * | 2020-04-02 | 2021-03-19 | 深圳市予一电子科技有限公司 | Appearance and semiconductor refrigeration piece moult |
WO2021196506A1 (en) * | 2020-04-02 | 2021-10-07 | 深圳市予一电子科技有限公司 | Hair removal instrument and semiconductor refrigeration slice |
-
2016
- 2016-04-12 CN CN201620300861.6U patent/CN206355031U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109646273A (en) * | 2018-11-13 | 2019-04-19 | 厦门泰特橡塑科技有限公司 | A kind of controller and its control method for massage bar |
CN112533554A (en) * | 2020-04-02 | 2021-03-19 | 深圳市予一电子科技有限公司 | Appearance and semiconductor refrigeration piece moult |
WO2021196506A1 (en) * | 2020-04-02 | 2021-10-07 | 深圳市予一电子科技有限公司 | Hair removal instrument and semiconductor refrigeration slice |
CN112533554B (en) * | 2020-04-02 | 2023-09-22 | 深圳市予一电子科技有限公司 | Dehairing instrument and semiconductor refrigerating sheet |
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