CN206332968U - A kind of CPU directional heat radiators - Google Patents
A kind of CPU directional heat radiators Download PDFInfo
- Publication number
- CN206332968U CN206332968U CN201621416635.0U CN201621416635U CN206332968U CN 206332968 U CN206332968 U CN 206332968U CN 201621416635 U CN201621416635 U CN 201621416635U CN 206332968 U CN206332968 U CN 206332968U
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- cpu
- conducting pipe
- heat conducting
- heat
- adhesive
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Abstract
The utility model discloses a kind of CPU directional heat radiators, including：Housing, at least one heat conducting pipe and adhesive-bonded fabric thermal insulation layer；The adhesive-bonded fabric thermal insulation layer is fitted completely wraps up the CPU and the heat conducting pipe；The first end of the heat conducting pipe stretches out the hull outside close to the CPU, the second end.CPU is isolated from other components by the utility model with thermal insulation layer, then the heat produced by heat conducting pipe orients rapidly export.Heat no longer by being disseminated again to outside after airborne to whole mainboard, improves CPU passive radiating efficiency, also no longer influences other components and then improves the overall radiating effect of miniaturized electronics.
Description
Technical field
The utility model is related to miniaturized electronics technical field of heat dissipation, and heat is not to be related to a kind of CPU directional heat radiators.
Background technology
In electronic technology full-blown today, its size is gradually reduced in all kinds of electronic components, and electronic equipment is therewith
Small-sized or even miniaturization.
Current most widely used electronic equipment mobile phone, intelligent watch etc., because its overall size is limited, often
CPU can not be cooled by the way of active heat removal, cause these product radiating effects poor.CPU heat can pass through sky
Gas is delivered to whole mainboard so that all component temperature rise in a period of time, while having influence on some other non-to temperature
Normal sensitive component operating efficiency, such as crystal oscillator.
Existing passive radiating mode can cause the operating accuracy of equipment to reduce, and therefore, how improve what CPU passively radiated
Effect is urgent problem to be solved.
The content of the invention
It is to provide a kind of CPU directional heat radiators in the purpose of this utility model, to improve the effect that CPU passively radiates.
A kind of CPU directional heat radiators, including：Housing, at least one heat conducting pipe and adhesive-bonded fabric thermal insulation layer；
The adhesive-bonded fabric thermal insulation layer is fitted completely wraps up the CPU and the heat conducting pipe；
The first end of the heat conducting pipe stretches out the hull outside close to the CPU, the second end.
Preferably, the adhesive-bonded fabric thermal insulation layer is：Super porous silica and polyester fiber synthesize adhesive-bonded fabric.
Preferably, there is radiator liquid inside the heat conducting pipe.
Preferably, the radiator liquid is specially 4 milliliters.
Preferably, the thickness of the heat conducting pipe is 0.4 millimeter and is and a diameter of 1.2 millimeters.
Preferably, the adhesive-bonded fabric insulation thickness is：0.3 millimeter.
Preferably, the heat conducting pipe is one.
Therefore, the utility model has the advantages that：
CPU is isolated from other components by the utility model with thermal insulation layer, then the heat produced by heat conducting pipe is fast
Speed orientation export.Heat no longer by being disseminated again to outside after airborne to whole mainboard, improves CPU passive radiating effect
Rate, also no longer influences other components and then improves the overall radiating effect of miniaturized electronics.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, drawings in the following description are these
Some embodiments of utility model, for those of ordinary skill in the art, on the premise of not paying creative work, also
Other accompanying drawings can be obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation of CPU directional heat radiators disclosed in the utility model.
Embodiment
This core is to provide a kind of CPU directional heat radiators.
In order that those skilled in the art more fully understand scheme of the present utility model, it is below in conjunction with the accompanying drawings and specific real
Applying mode, the utility model is described in further detail.
Detail is elaborated in the following description to fully understand the utility model.But the utility model can
It is different from other manner described here with a variety of and implements, those skilled in the art can be without prejudice to the utility model intension
In the case of do similar popularization.Therefore the utility model is not limited by following public specific embodiment.
In the technical scheme for the CPU directional heat radiators that the utility model is provided, referring to Fig. 1, the embodiment includes following
Content：
Housing 10, at least one heat conducting pipe 20 and adhesive-bonded fabric thermal insulation layer 30.
By taking an actual scene as an example, the CPU40 and heat conducting pipe 20 of laminating parcel completely of adhesive-bonded fabric thermal insulation layer 30.When
So, the utility model is not intended to limit the particular number of heat conducting pipe, is only to be illustrated using a heat conducting pipe as instantiation herein.
Wherein, the first end of heat conducting pipe 20 is close to CPU40, and the outside of the housing 10 is stretched out at the second end.
Certainly it should be noted is that, housing 10 is only the housing parts for covering CPU, rather than whole mainboard or
The housing of whole electronic equipment.Wherein the second end of heat conducting pipe 20 stretches out the part of housing 10 can be arranged in as needed can be with
The position of radiating, without the outside of fully extended whole equipment.
Heat produced by adhesive-bonded fabric thermal insulation layer makes CPU discharges housing along the direction of heat conducting pipe, and always along heat conducting pipe
Direction is discharged, and has reached the purpose of oriented heat dissipating.Wherein, the arrangement of heat conducting pipe can be avoided pair according to specific circuit design
Temperature sensitive element, such as crystal oscillator, thermistor.Specifically, the utility model to the length of heat conducting pipe and direction not
Make specific limitation.
CPU is isolated from other components by the utility model with thermal insulation layer, then the heat produced by heat conducting pipe is fast
Speed orientation export.Heat no longer by being disseminated again to outside after airborne to whole mainboard, improves CPU passive radiating effect
Rate, also no longer influences other components and then improves the passive radiating effect of the miniaturized electronics entirety of no active cooling system
Rate, and then ensured the operating efficiency of its overall electronic component.
In another specific embodiment, the embodiment includes herein below：
Housing, a heat conducting pipe and super porous silica and polyester fiber synthesize the thermal insulation layer of adhesive-bonded fabric.Wherein, do not knit
Cloth thermal insulation layer is fitted completely wraps up the CPU and the heat conducting pipe.The first end of the heat conducting pipe is close to the CPU, second
The hull outside is stretched out at end.Specifically, heat conducting pipe can be copper heat conducting pipe.
When general electronic product is normally run, cpu temperature can be raised to more than 75 degree in 5 minutes.And cover super
The cpu temperature of the heat-barrier material and heat conducting pipe of porous silica and polyester fiber synthesis adhesive-bonded fabric kept 65 degree in 40 minutes
Hereinafter, effectively solve CPU to be brought rapidly up and cause the problem of mainboard is overheated, further ensure CPU working frequency not
Reduced because being brought rapidly up.
In other examples, there is radiator liquid inside heat conducting pipe.Certainly, according to specific circumstances, can also not
Using radiator liquid, and use hollow copper heat conducting pipe.
Under a specific scene, heat conducting pipe has radiator liquid, specially 4 milliliters.
In another embodiment, it is 1.2 and a diameter of millimeter that the thickness of heat conducting pipe, which is 0.4 millimeter,.Specifically, at one
Under practical scene, adhesive-bonded fabric insulation thickness is 0.3 millimeter.Due to adhesive-bonded fabric thermal insulation layer, thickness itself is small, its every square metre
Quality is also only 37g, will not substantially increase the mainboard weight of miniaturized electronics.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or deposited between operating
In any this actual relation or order.
A kind of CPU directional heat radiators provided by the utility model are described in detail above.It is used herein
Specific case is set forth to principle of the present utility model and embodiment, and the explanation of above example is only intended to help and managed
Solve principle of the present utility model and its core concept.It should be pointed out that for those skilled in the art, not
On the premise of departing from the utility model principle, some improvement and modification can also be carried out to the utility model, these improve and repaiied
Decorations are also fallen into the utility model scope of the claims.
Claims (7)
1. a kind of CPU directional heat radiators, it is characterised in that including：Housing, at least one heat conducting pipe and adhesive-bonded fabric thermal insulation layer；
The adhesive-bonded fabric thermal insulation layer is fitted completely wraps up the CPU and the heat conducting pipe；
The first end of the heat conducting pipe stretches out the hull outside close to the CPU, the second end.
2. CPU directional heat radiators according to claim 1, it is characterised in that the adhesive-bonded fabric thermal insulation layer is：Super porous two
Silica and polyester fiber synthesis adhesive-bonded fabric.
3. CPU directional heat radiators according to claim 1, it is characterised in that there is radiator liquid inside the heat conducting pipe.
4. CPU directional heat radiators according to claim 1, it is characterised in that the radiator liquid is specially 4 milliliters.
5. CPU directional heat radiators according to claim 1, it is characterised in that the thickness of the heat conducting pipe be 0.4 millimeter and
A diameter of 1.2 millimeters.
6. CPU directional heat radiators according to claim 1, it is characterised in that the adhesive-bonded fabric insulation thickness is：0.3
Millimeter.
7. CPU directional heat radiators according to claim 1, it is characterised in that the heat conducting pipe is one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621416635.0U CN206332968U (en) | 2016-12-25 | 2016-12-25 | A kind of CPU directional heat radiators |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621416635.0U CN206332968U (en) | 2016-12-25 | 2016-12-25 | A kind of CPU directional heat radiators |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206332968U true CN206332968U (en) | 2017-07-14 |
Family
ID=59290784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621416635.0U Active CN206332968U (en) | 2016-12-25 | 2016-12-25 | A kind of CPU directional heat radiators |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206332968U (en) |
-
2016
- 2016-12-25 CN CN201621416635.0U patent/CN206332968U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 100144 three floor, 6 building, 49 Badachu Road, Shijingshan District, Beijing. Patentee after: Beijing Xiaolong Technology Co. Ltd. Address before: 100086 Beijing Haidian District Zhongguancun South Street 2 A block 28 28 3209 Patentee before: Beijing Xiaolong Technology Co. Ltd. |
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| CP02 | Change in the address of a patent holder |