CN206316557U - A kind of fixture in the encapsulation for semiconductor laser on automatic bonding equipment - Google Patents
A kind of fixture in the encapsulation for semiconductor laser on automatic bonding equipment Download PDFInfo
- Publication number
- CN206316557U CN206316557U CN201621324676.7U CN201621324676U CN206316557U CN 206316557 U CN206316557 U CN 206316557U CN 201621324676 U CN201621324676 U CN 201621324676U CN 206316557 U CN206316557 U CN 206316557U
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- pallet
- semiconductor laser
- fixture
- cover plate
- bonding equipment
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Abstract
The utility model belongs to bonding equipment technical field, the fixture in specifically a kind of encapsulation for semiconductor laser on automatic bonding equipment.Including pallet, cover plate and orientation connecting mechanism, the pallet is provided with multiple groove a matched with semiconductor laser size, the bonding wire hole that the cover plate matches provided with multiple groove a with the pallet, the pallet and cover plate are connected by orientation connecting mechanism.The utility model is encapsulated suitable for small size semiconductor laser bonding wire, and chip stabilization can be kept during production in enormous quantities, has protective effect, simple to operate, cheap welding wire fixture to key position.
Description
Technical field
The utility model belongs to bonding equipment technical field, specifically a kind of to be used in semiconductor laser encapsulation automatically
Fixture on bonding equipment.
Background technology
On traditional bonding equipment, weldment fixes the wire-bonding operations that indenter size is applied to circuit board large-size workpiece.Greatly
Size circuit plate can be transported in orbit, without using fixture.Semiconductor laser chip size is very small, using existing
Equipment and fixture condition can not realize wire-bonding operations.Semiconductor laser in order to realize high power, it is necessary to the quantity of bonding wire is more,
Required precision to position of bonding wire is high, and, it is necessary at utmost reduce defective products rate, improve bonding wire in batch production process
Efficiency, these demands can not all be realized under existence conditions.
Utility model content
Regarding to the issue above, the purpose of this utility model is to provide automatic welding in a kind of encapsulation for semiconductor laser
Fixture on line machine, to solve existing equipment and the problem of fixture condition can not realize wire-bonding operations.
To achieve these goals, the utility model uses following technical scheme：
It is a kind of encapsulated for semiconductor laser in fixture on automatic bonding equipment, including pallet, cover plate and be located by connecting
Mechanism, the pallet is provided with multiple and institute provided with multiple groove a matched with semiconductor laser size, the cover plate
The bonding wire hole that the groove a on pallet matches is stated, the pallet and cover plate are connected by orientation connecting mechanism.
The edge protrusion of groove a on the pallet.
Groove a and rectangle and four sides on the pallet are irregular shape.
The orientation connecting mechanism includes multiple magnetic patch and is arranged to be used for the multiple grooves for housing magnet on the pallet
B, the magnetic patch and the groove b tight fits, pallet and cover plate are compressed by the attraction between the magnetic patch and the cover plate
Between workpiece.
The pallet is provided with alignment pin, and the cover plate is provided with the positioning hole being engaged with the alignment pin, passes through institute
The cooperation of alignment pin and the positioning hole is stated, the positioning between pallet and cover plate is realized.
The both sides of the pallet are provided with guide edge along its length, and the two ends of the guide edge are provided with inclination angle, described to lead
Xiang Bianke is moved along the gathering sill on bonding equipment.Equally spaced via is provided with the guide edge.
The two ends of the pallet are provided with arc notch.The tray surface is provided with one or more guiding arrows.
The cover plate materials are memorizing material.
Advantage and beneficial effect of the present utility model are：The utility model is sealed suitable for small size semiconductor laser bonding wire
Dress, can keep chip stabilization, have protective effect to key position during production in enormous quantities, simple to operate, cheap
Welding wire fixture.
Fixture of the present utility model by the attraction between magnetic patch and cover plate, solve small-size product can not fix,
Vibration in wire bonding process, the problems such as position of bonding wire is inaccurate, with simple in construction, easy to operate, cheap, production effect
The advantages of rate is high, substantially increases yields, cost-effective.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the structural representation of pallet in an embodiment of the present utility model；
Fig. 3 is the structural representation of embodiment cover plate of the present utility model；
Fig. 4 is the structural representation of semiconductor laser workpiece.
Wherein：1 is pallet, and 11 be groove a, and 12 be alignment pin, and 13 be groove b, and 14 lack to be oriented to arrow, 15 for arc
Mouthful, 16 be guide edge, and 17 be inclination angle, and 18 be through hole, and 2 be cover plate, and 21 be bonding wire hole, and 22 be positioning hole, and 3 be semiconductor laser
Device workpiece, 31 be chip.
Embodiment
On traditional bonding equipment, weldment fixes the wire-bonding operations that indenter size is applied to circuit board large-size workpiece.Greatly
Size circuit plate can be transported in orbit, without using fixture.Semiconductor laser chip size is very small, using existing
Equipment and fixture condition can not realize wire-bonding operations.
Design concept of the present utility model is：Semiconductor laser core can not be realized for existing equipment and fixture condition
The problem of piece wire-bonding operations, the utility model is by the pallet provided with multiple grooves matched with semiconductor laser size and sets
The cover plate for having multiple bonding wire holes matched with the tray slots is located by connecting, and makes pallet keep being fitted close with cover plate, protects
Hold stabilization of the workpiece in wire bonding process.Solve small-size product and can not fix, the vibration in wire bonding process, position of bonding wire
Inaccurate the problems such as.
In order that the purpose of this utility model, technical scheme and advantage are clearer, below in conjunction with the accompanying drawings and specific implementation
The utility model is described in detail example.
As Figure 1-4, in a kind of encapsulation for semiconductor laser that the utility model is provided on automatic bonding equipment
Fixture, including pallet 1, cover plate 2 and orientation connecting mechanism, pallet 1 match provided with multiple and semiconductor laser size
Groove a11, the bonding wire hole 21 that cover plate 2 matches provided with multiple groove a11 with pallet 1, the pallet 1 and cover plate 2 lead to
Cross orientation connecting mechanism connection.
As shown in figure 1, the orientation connecting mechanism includes multiple magnetic patch and is arranged on pallet 1 to be used to house many of magnet
Individual groove b13, the magnetic patch and groove b13 tight fits, by the attraction between the magnetic patch and cover plate 2 compress pallet 1 and
Workpiece between cover plate 2.
Further, pallet 1 is provided with alignment pin 12, and cover plate 2 is provided with the positioning hole 22 being engaged with alignment pin 12, such as
Shown in Fig. 2.By the cooperation of alignment pin 12 and positioning hole 22, the positioning between pallet 1 and cover plate 2 is realized.
In an embodiment of the present utility model, alignment pin 12 is two, is respectively arranged at the diagonal angle of pallet 1, multiple recessed
Groove b13 is distributed on the surface with the pallet 1 of groove a11 the same sides.
The groove b13 size for being dimensioned slightly smaller than magnetic patch, can be tightly fixed magnetic patch on pallet 1, be inhaled by magnetic
Gravitation, keeps the tight fit of cover plate 2 and pallet 1, keeps stabilization of the workpiece in wire bonding process.The attraction of multiple magnetic patch is covered
Cover on whole pallet 1, while compressing whole workpiece
Further, Fig. 3 is the structural representation of semiconductor laser workpiece；As shown in Figure 3, it is contemplated that protection semiconductor
The material of chip 31 of laser 3 is more crisp, and high to purity requirements, in order to protect semiconductor laser 3 not because assembling improper make
Into damage, the shape of groove 11 on pallet 1 is set to rectangle and four sides are irregular, corner and four sides protrusion, plays protection workpiece and makees
With, it is to avoid damage chip 31 when picking and placeing workpiece；Groove a11 depth is slightly less than workpiece height, is easy to increase compression dynamics.
The both sides of the pallet 1 are provided with guide edge 16 along its length, and guide edge 16 can be moved along the gathering sill on bonding equipment
It is dynamic.Equally spaced via 18 is provided with guide edge 16, auxiliary bonding equipment recognizes the position of workpiece.
Because the suction between pallet 1 and cover plate 2 is larger, after the completion of wire-bonding operations, it is larger to remove the difficulty of cover plate 2, in support
The two ends of disk 1 are provided with arc notch 15, conveniently clamp and pick and place the operation of cover plate 2.For the ease of transporting operation, the two of guide edge 16
End is provided with inclination angle 17, and angle of inclination facilitates transport track of the guide edge 16 along bonding equipment to move to be advisable no more than 45 degree.Support
The surface of disk 1 determines the direction that workpiece is transported provided with one or more guiding arrows 14 during convenient operation.
The material of cover plate 2 is memorizing material, and thickness is 0.3mm or so, can be attracted by magnetic bodies.
The suction of pallet 1 and cover plate 2 can be substituted by modes such as negative pressure, screws.The groove that workpiece is placed in pallet 1 can
To design different shape according to sample size, the protection domain of the patent is belonged to.
The fixture that the utility model is provided is by the attraction between magnetic patch and cover plate, and solving small-size product can not consolidate
The fixed, vibration in wire bonding process, the problems such as position of bonding wire is inaccurate, with simple in construction, easy to operate, cheap, raw
The advantages of producing efficiency high, substantially increases yields, cost-effective.
Embodiment of the present utility model is the foregoing is only, protection domain of the present utility model is not intended to limit.It is all
Any modifications, equivalent substitutions and improvements, extension made within spirit of the present utility model and principle etc., is all contained in this reality
With in new protection domain.
Claims (10)
1. the fixture in a kind of encapsulation for semiconductor laser on automatic bonding equipment, it is characterised in that：Including pallet, cover plate and
Orientation connecting mechanism, the pallet is provided with provided with multiple groove a matched with semiconductor laser size, the cover plate
The bonding wire hole that multiple groove a with the pallet match, the pallet and cover plate are connected by orientation connecting mechanism.
2. the fixture in the encapsulation according to claim 1 for semiconductor laser on automatic bonding equipment, it is characterised in that：
The edge protrusion of groove a on the pallet.
3. the fixture in the encapsulation according to claim 2 for semiconductor laser on automatic bonding equipment, it is characterised in that：
Groove a on the pallet is rectangle and four sides are irregular shape.
4. the fixture in the encapsulation according to claim 1 for semiconductor laser on automatic bonding equipment, it is characterised in that：
The orientation connecting mechanism includes multiple magnetic patch and is arranged to be used for the multiple groove b for housing magnet, the magnetic on the pallet
Block and the groove b tight fits, the work between pallet and cover plate is compressed by the attraction between the magnetic patch and the cover plate
Part.
5. the fixture in the encapsulation according to claim 1 for semiconductor laser on automatic bonding equipment, it is characterised in that：
The pallet is provided with alignment pin, and the cover plate is provided with the positioning hole being engaged with the alignment pin, passes through the alignment pin
With the cooperation of the positioning hole, the positioning between pallet and cover plate is realized.
6. the fixture in the encapsulation according to claim 1 for semiconductor laser on automatic bonding equipment, it is characterised in that：
The both sides of the pallet are provided with guide edge along its length, and the two ends of the guide edge are provided with inclination angle, and the guide edge can edge
Gathering sill movement on bonding equipment.
7. the fixture in the encapsulation according to claim 6 for semiconductor laser on automatic bonding equipment, it is characterised in that：
Equally spaced via is provided with the guide edge.
8. the fixture in the encapsulation according to claim 1 for semiconductor laser on automatic bonding equipment, it is characterised in that：
The two ends of the pallet are provided with arc notch.
9. the fixture in the encapsulation according to claim 1 for semiconductor laser on automatic bonding equipment, it is characterised in that：
The tray surface is provided with one or more guiding arrows.
10. the fixture in the encapsulation according to claim 1 for semiconductor laser on automatic bonding equipment, its feature exists
In：The cover plate materials are memorizing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621324676.7U CN206316557U (en) | 2016-12-05 | 2016-12-05 | A kind of fixture in the encapsulation for semiconductor laser on automatic bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621324676.7U CN206316557U (en) | 2016-12-05 | 2016-12-05 | A kind of fixture in the encapsulation for semiconductor laser on automatic bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206316557U true CN206316557U (en) | 2017-07-11 |
Family
ID=59265409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621324676.7U Active CN206316557U (en) | 2016-12-05 | 2016-12-05 | A kind of fixture in the encapsulation for semiconductor laser on automatic bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206316557U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107877014A (en) * | 2017-11-20 | 2018-04-06 | 张家港初恒激光科技有限公司 | A kind of adjustable coaxial laser welding wire fixture device |
| CN110238595A (en) * | 2019-07-19 | 2019-09-17 | 珠海格力新元电子有限公司 | A kind of novel welding device and its manufacture craft |
| CN111496443A (en) * | 2020-04-29 | 2020-08-07 | 东阳伸狄建筑科技有限公司 | Supporting mechanism for welding small-sized dozer blade for excavator |
| CN116913822A (en) * | 2023-09-05 | 2023-10-20 | Nano科技(北京)有限公司 | Optical assembly lead bonding tool |
-
2016
- 2016-12-05 CN CN201621324676.7U patent/CN206316557U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107877014A (en) * | 2017-11-20 | 2018-04-06 | 张家港初恒激光科技有限公司 | A kind of adjustable coaxial laser welding wire fixture device |
| CN107877014B (en) * | 2017-11-20 | 2019-11-15 | 张家港初恒激光科技有限公司 | A kind of adjustable coaxial laser welding wire fixture device |
| CN110238595A (en) * | 2019-07-19 | 2019-09-17 | 珠海格力新元电子有限公司 | A kind of novel welding device and its manufacture craft |
| CN111496443A (en) * | 2020-04-29 | 2020-08-07 | 东阳伸狄建筑科技有限公司 | Supporting mechanism for welding small-sized dozer blade for excavator |
| CN116913822A (en) * | 2023-09-05 | 2023-10-20 | Nano科技(北京)有限公司 | Optical assembly lead bonding tool |
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