CN206291525U - A kind of semiconductor thermostatic and temperature component - Google Patents

A kind of semiconductor thermostatic and temperature component Download PDF

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Publication number
CN206291525U
CN206291525U CN201621222804.7U CN201621222804U CN206291525U CN 206291525 U CN206291525 U CN 206291525U CN 201621222804 U CN201621222804 U CN 201621222804U CN 206291525 U CN206291525 U CN 206291525U
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CN
China
Prior art keywords
semiconductor
wind
wire
heating plate
component
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Expired - Fee Related
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CN201621222804.7U
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Chinese (zh)
Inventor
隋圣斌
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Individual
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Individual
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Priority to CN201621222804.7U priority Critical patent/CN206291525U/en
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Expired - Fee Related legal-status Critical Current
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Abstract

The utility model discloses a kind of semiconductor thermostatic and temperature component,Including component cases,The component cases are electrically connected by wire with semiconductor refrigerating and heating plate,The inside of the semiconductor refrigerating and heating plate is sequentially installed with insulating barrier from outside to inside,Metal level and semiconductor layer,The battery is electrically connected by wire with wind light mutual complementing power generation controller,The wind light mutual complementing power generation controller is by wire and wind-power electricity generation mechatronics,The upper end right side of the pole is installed with solar panel,The utility model devises a semiconductor thermostatic and temperature component,Power consumption is serious during semiconductor refrigerating and heating process are solved the problems, such as by installing wind-light complementing power generation device,Because semiconductor refrigerating and heating plate do not have any slide unit so its muting function is particularly good,Any chemical addition agent is not used in refrigeration and heating,Also freon is not produced,This scheme also has environmental protection,The big advantage of temperature-control range.

Description

A kind of semiconductor thermostatic and temperature component
Technical field
The utility model is related to thermostatic assembly technical field, specially a kind of semiconductor thermostatic and temperature component.
Background technology
Semiconductor is material of the electric conductivity between conductor and insulator under a kind of normal temperature.
When electric current flows to p-type element by N-type element, joint absorbs heat turns into cold end to PN junction in semiconductor, When N-type element is flowed to by p-type element, joint release heat, as hot junction, system is used to by the electrode for changing power supply Cold and heating, but present semiconductor refrigerating and heater is not well combined together refrigeration and heating, is formed One thermostatic assembly, and existing semiconductor refrigerating and the serious and present energy-saving consumption-reducing theory of heater consumption electric energy are not Symbol is this we have proposed a kind of semiconductor thermostatic and temperature component.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor thermostatic and temperature component, to solve what is proposed in above-mentioned background technology Problem.
To achieve the above object, the utility model provides following technical scheme:A kind of semiconductor thermostatic and temperature component, including device Box, the inner chamber bottom of the component cases is installed with connection circuit, and the connection circuit includes LCD display, green luminous two Pole pipe, Red LED1, triode, digital temperature sensor, single-chip microcomputer and the time relay, the LCD display it is upper The embedded preceding surface installed in component cases in end, is installed with green light emitting diode and red luminous below the LCD display Diode, and green light emitting diode is located at the left side of Red LED1, the green light emitting diode and Red LED1 Installed in the preceding surface of component cases, the component cases are electrically connected by wire with semiconductor refrigerating and heating plate, institute for upper end insertion The inside for stating semiconductor refrigerating and heating plate is sequentially installed with insulating barrier, metal level and semiconductor layer, the metal from outside to inside The side of layer connects with anode power cord and cathode power supply line, and anode power cord is located at the right side of cathode power supply line, described half Conductor freezes and the left surface of heating plate is installed with cool guiding block, and the right surface fixation of the semiconductor refrigerating and heating plate is pacified Equipped with heat-conducting block, the right surface of the heat-conducting block is installed with fan, and the component cases are connected by wire with storage battery, The battery is electrically connected by wire with wind light mutual complementing power generation controller, the wind light mutual complementing power generation controller by wire with Wind-power electricity generation mechatronics, are installed with pole, the fixed peace in upper end right side of the pole below the wind-driven generator Equipped with solar panel, and solar panel is located at the lower section of wind-driven generator, and the solar panel passes through wire Electrically connected with wind light mutual complementing power generation controller.
Preferably, the back side of the component cases offers louvre.
Preferably, the solar panel and level are in 45 degree of angle.
Compared with prior art, the beneficial effects of the utility model are:Refrigeration and heating of the utility model semiconductor Function is combined together well by the control of single-chip microcomputer, forms a semiconductor thermostatic and temperature component, and by installing scene Power consumption is serious during compensating generator solves the problems, such as semiconductor refrigerating and heating process, due to semiconductor refrigerating and heating plate There is no any slide unit so its muting function is particularly good, do not use any chemical addition agent in refrigeration and heating, Also freon is not produced, this scheme also has the big advantage of environmental protection, temperature-control range.
Brief description of the drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is semiconductor refrigerating and heating plate structural representation in the utility model;
Fig. 3 is the utility model semiconductor refrigerating and heating plate internal structure schematic diagram;
Fig. 4 is component electrical connection schematic diagram in the utility model.
In figure:1 component cases, 2 connection circuits, 21LCD displays, 22 green light emitting diodes, 23 Red LED1s, 24 numbers Word temperature sensor, 3 semiconductor refrigeratings and heating plate, 31 insulating barriers, 32 metal levels, 33 semiconductor layers, 34 anode power cords, 35 Cathode power supply line, 4 cool guiding blocks, 5 heat-conducting blocks, 6 fans, 7 batteries, 8 wind light mutual complementing power generation controllers, 9 wind-driven generators, 10 Bar, 11 solar panels.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment for being obtained, belongs to the scope of the utility model protection.
Fig. 1-4 are referred to, the utility model provides a kind of technical scheme:A kind of semiconductor thermostatic and temperature component, including component cases 1, the inner chamber bottom of the component cases 1 is installed with connection circuit 2, and the connection circuit 2 includes LCD display 21, green hair Optical diode 22, Red LED1 23, digital temperature sensor 24, triode, single-chip microcomputer and the time relay, the numeral Temperature sensor 24 is used to detect ambient temperature value, when ambient temperature value is different from the temperature value set by single-chip microcomputer, Magnitude of voltage size is changed by triode, the sense of current is changed by the time relay, make semiconductor refrigerating and heating plate 3 Cold or heating, makes temperature return to setting value, and the upper end insertion of the LCD display 21 is arranged on the preceding surface of component cases 1, LCD display 21 is used to show real-time measurement temperature value that the lower section of the LCD display 21 to be installed with green light emitting diode 22 and Red LED1 23, and green light emitting diode 22 is located at the left side of Red LED1 23, the green light emitting diode 22 and Red LED1 23 upper end insertion installed in component cases 1 preceding surface, when cooling green light light, it is red when heated Lamp is lighted, and the component cases 1 are electrically connected by wire with semiconductor refrigerating and heating plate 3, and semiconductor is controlled by component cases 1 The inside of refrigeration and heating plate 3, the semiconductor refrigerating and heating plate 3 is sequentially installed with insulating barrier 31, metal level from outside to inside 32 and semiconductor layer 33, insulating barrier 31 is used to protect semiconductor refrigerating and heating plate 3, the side of the metal level 32 and negative electricity Source line 34 and cathode power supply line 35 connect, and anode power cord 34 is located at the right side of cathode power supply line 35, and metal level 32 is used to lead The left surface of galvanization, the semiconductor refrigerating and heating plate 3 is installed with cool guiding block 4, and the cold air for producing is passed through conduction cooling Block 4 is led on the article for needing refrigeration, and the right surface of the semiconductor refrigerating and heating plate 3 is installed with heat-conducting block 5, is used for Conductive semiconductor adds thermogenetic heat, and the right surface of the heat-conducting block 5 is installed with fan 6, and fan 6 is further from leading The heat that hot block 5 is transmitted through is distributed, and the component cases 1 are electrically connected by wire with battery 7, and the battery 7 passes through Wire is electrically connected with wind light mutual complementing power generation controller 8, and the wind light mutual complementing power generation controller 8 is by wire and wind-driven generator 9 Electrical connection, the lower section of the wind-driven generator 9 is installed with pole 10, and the upper end right side of the pole 10 is installed with too Positive energy cell panel 11, and solar panel 11 is located at the lower section of wind-driven generator 9, the solar panel 11 passes through wire Electrically connected with wind light mutual complementing power generation controller 8, wind-driven generator 9 and solar panel 11 and wind light mutual complementing power generation controller 8 It is in parallel, wind light mutual complementing power generation controller 8 is converted to the electric energy that wind-driven generator 9 and solar panel 11 are produced and is available for storing The electric energy that battery 7 charges, is stored in battery 7.
Specifically, the back side of the component cases 1 offers louvre, for being radiated to component cases 1, prevents component cases 1 Cause whole component cases 1 to overheat because of internal components operational heat, influence the normal work of each device.
Specifically, the solar panel 11 and level are in 45 degree of angle, and solar panel 11 is in 45 degree of angles It is more beneficial for receiving the irradiation of sunlight, more electric energy can be produced.
Operation principle:Wind-driven generator 9 and too can the composition wind-light complementing power generation device of cell panel 11, and by wire and wind Light complemental power-generation controller 8 is in parallel, and wind light mutual complementing power generation controller 8 produces wind-driven generator 9 and solar panel 11 Electric energy be converted to be available for battery 7 charge electric energy, battery 7 is powered to component cases 1, while digital temperature sensor 24 is examined Survey ambient temperature value, when ambient temperature value is different from the temperature value set by single-chip microcomputer, semiconductor refrigerating and heating plate 3 In insulating barrier 31 shield, metal level 32 is used for conduction, and anode power cord 34 and cathode power supply line 35 are provided respectively to be born Pole power supply and cathode power supply, the sense of current of power supply, the electricity in semiconductor layer 33 are changed by the Single-chip Controlling time relay When flow to p-type element by N-type element, joint absorbs heat turns into cold end to stream, by p-type element flow to N-type element when Wait, joint release heat, as hot junction, makes semiconductor refrigerating and heating plate 3 freeze or heat, by Single-chip Controlling three The watt level that pole pipe changes magnitude of voltage size to control to freeze and heat, and by the display measurement in real time of LCD display 21 Temperature value, when cooling green light emitting diode 22 light, Red LED1 23 is lighted when heated, by semiconductor refrigerating and Heating plate 3 makes temperature return to setting value, reaches constant temperature effect, and the refrigeration and heating function of semiconductor are passed through single by the utility model The control of piece machine is combined together well, forms a semiconductor thermostatic and temperature component, and is filled by installing wind light mutual complementing power generation Put power consumption in solving the problems, such as semiconductor refrigerating and heating process serious.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and And in the case of without departing substantially from spirit or essential attributes of the present utility model, can in other specific forms realize that this practicality is new Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation Involved claim.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each implementation method is only wrapped Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should Specification an as entirety, the technical scheme in each embodiment can also be formed into those skilled in the art through appropriately combined May be appreciated other embodiment.

Claims (3)

1. a kind of semiconductor thermostatic and temperature component, including component cases (1), it is characterised in that:The inner chamber bottom of the component cases (1) is fixed Connection circuit (2) is installed, connection circuit (2) includes LCD display (21), green light emitting diode (22), red luminous two Pole pipe (23), digital temperature sensor (24), triode, single-chip microcomputer and the time relay, the upper end of the LCD display (21) The embedded preceding surface installed in component cases (1), green light emitting diode (22) is installed with below the LCD display (21) With Red LED1 (23), and green light emitting diode (22) is positioned at the left side of Red LED1 (23), and described green luminous two Installed in the preceding surface of component cases (1), the component cases (1) pass through for the upper end insertion of pole pipe (22) and Red LED1 (23) Wire is electrically connected with semiconductor refrigerating and heating plate (3), and the inside of the semiconductor refrigerating and heating plate (3) is from outside to inside successively Insulating barrier (31), metal level (32) and semiconductor layer (33), the side of the metal level (32) and anode power cord are installed (34) connect with cathode power supply line (35), and anode power cord (34) is positioned at the right side of cathode power supply line (35), the semiconductor The left surface of refrigeration and heating plate (3) is installed with the right surface of cool guiding block (4), the semiconductor refrigerating and heating plate (3) Heat-conducting block (5) is installed with, the right surface of the heat-conducting block (5) is installed with fan (6), and the component cases (1) pass through Wire is electrically connected with battery (7), and the battery (7) is electrically connected by wire with wind light mutual complementing power generation controller (8), described Wind light mutual complementing power generation controller (8) is electrically connected by wire with wind-driven generator (9), and the lower section of the wind-driven generator (9) is consolidated Dingan County is equipped with pole (10), and the upper end right side of the pole (10) is installed with solar panel (11), and solar-electricity , positioned at the lower section of wind-driven generator (9), the solar panel (11) is by wire and wind light mutual complementing power generation control for pond plate (11) Device (8) electrical connection processed.
2. a kind of semiconductor thermostatic and temperature component according to claim 1, it is characterised in that:Open at the back side of the component cases (1) It is provided with louvre.
3. a kind of semiconductor thermostatic and temperature component according to claim 1, it is characterised in that:The solar panel (11) with Level is in 45 degree of angle.
CN201621222804.7U 2016-11-14 2016-11-14 A kind of semiconductor thermostatic and temperature component Expired - Fee Related CN206291525U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621222804.7U CN206291525U (en) 2016-11-14 2016-11-14 A kind of semiconductor thermostatic and temperature component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621222804.7U CN206291525U (en) 2016-11-14 2016-11-14 A kind of semiconductor thermostatic and temperature component

Publications (1)

Publication Number Publication Date
CN206291525U true CN206291525U (en) 2017-06-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621222804.7U Expired - Fee Related CN206291525U (en) 2016-11-14 2016-11-14 A kind of semiconductor thermostatic and temperature component

Country Status (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107975971A (en) * 2017-11-23 2018-05-01 中原工学院 A kind of small size using regenerative resource moves ice chest
CN111243209A (en) * 2020-01-16 2020-06-05 锐成科技(河源)有限公司 Infrared probe with automatic charging function and use method
CN111397269A (en) * 2020-04-01 2020-07-10 陈志明 Portable no compressor electron freezer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107975971A (en) * 2017-11-23 2018-05-01 中原工学院 A kind of small size using regenerative resource moves ice chest
CN111243209A (en) * 2020-01-16 2020-06-05 锐成科技(河源)有限公司 Infrared probe with automatic charging function and use method
CN111243209B (en) * 2020-01-16 2021-08-10 锐成科技(河源)有限公司 Infrared probe with automatic charging function and use method
CN111397269A (en) * 2020-04-01 2020-07-10 陈志明 Portable no compressor electron freezer

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GR01 Patent grant
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170630

Termination date: 20171114

CF01 Termination of patent right due to non-payment of annual fee