CN206276491U

CN206276491U - For the device of the resolution element from printed circuit board

Info

Publication number: CN206276491U
Application number: CN201590000471.0U
Authority: CN
Inventors: 朴在九; 金成民; 朴昇洙; 权锡帝; 郑仁相; 文乡; 徐阿榄; 韩盛琇; 孔志荣; 赵婀滥
Original assignee: Hanyang Hak Won Co Ltd
Current assignee: Hanyang Hak Won Co Ltd; Industry University Cooperation Foundation IUCF HYU
Priority date: 2014-04-21
Filing date: 2015-04-08
Publication date: 2017-06-27
Anticipated expiration: 2025-04-08
Also published as: WO2015163606A1

Abstract

The utility model is related to a kind of device for the resolution element from printed circuit board, more particularly, to a kind of device for the resolution element from PCB, easily element can be separated from the PCB for be provided with multiple element.The device includes the first feeder, and the PCB for will thereon be provided with element inserts the first feeder；Spiral second feeder, second feeder is arranged in the drive shaft of driver element, and allows to convey PCB in one direction by the rotation of drive shaft；Element separative element, element separative element being longitudinally arranged along the drive shaft for being provided with the second feeder receives the PCB conveyed by the second feeder, and the separately installed element on PCB；And heating unit, the heating unit is to the PCB heat supplies for being directed to element separative element, and along being longitudinally arranged for element separative element, simultaneously with element separative element arranged for interval, wherein the discharge path of the PCB with element separate by element separative element and the discharge path of the element separated from PCB can be formed respectively.

Description

For the device of the resolution element from printed circuit board

Technical field

The utility model embodiment is related to a kind of device for from resolution element on printed circuit board (PCB), more specifically Ground, is related to a kind of device for the resolution element from PCB, can be easily by element from being provided with the PCB of multiple element Separate.

Background technology

Generally, for the printed circuit board (PCB) of signal transacting in electronic circuit or mounted printed circuit Board component (PCBA, hereinafter referred to as PCBA) is substantially applied to the electrically or electronically product along with a large amount of productions and a large amount of consumption In.

It is electric for what is be mass produced, consume and discard because depletion of natural resources all over the world is increasingly severe Or the industrial activity of electronic product has been considered as the important aspect of the circulating resources of solution depletion of natural resources.Largely thrown In the electrically or electronically product waste material abandoned, the PCB employed for signal transacting in electronic circuit is substantially all.In addition, PCB A large amount of waste materials can be produced.

PCB is made up of substrate and the multiple element being attached on substrate, generally comprising about 30% including polyethylene (PE), the plastic components of polypropylene (PP), polyester fiber and makrolon, about 40% it is insoluble such as silica and aluminum oxide Property compound, such as common metal of copper (Cu), iron (Fe), nickel (Ni), tin (Sn), lead (Pb), aluminium (Al) or zinc (Zn), Yi Jiyue 30% such as the noble metal component of golden (Au), silver-colored (Ag) or palladium (Pd).Especially, every kilogram of PCB includes 300-600 milligrams Golden (Au) and 2000-3000 milligrams of silver (Ag), this is one suitable for the actual gold content compared with 7mg/Kg in gold ore Content high.Therefore, a kind of technology for reclaiming and circulating these PCB is actively proposed.

In the existing process for reclaiming noble metal from PCB, PCB is placed on non-ferrous metals smelting works together with concentrate High-temperature smelting pot in, to reclaim noble metal.Such case has the drawback that, the remaining valuable gold in addition to gold, silver and copper Category has been stayed in slag, has been dropped and has been failed to reclaim.Thus, the skill that element is separated from PCB has been improved at present Art, but particularly two-sided or small size PCB has the shortcomings that element, and separation is not good.In order to improve drawbacks described above, it is necessary to Element is separated from small size PCB with a kind of technology or device, and screens copper to expand range of application, by inciting somebody to action PCB and the element on PCB are separated and treatment PCB, used as a kind of preconditioning technique for being used to improve metal recovery rate.

Having made correspondingly modified prior art can be synoptically divided into six kinds：

1st, in using the method for ultraviolet and vibrator, PCB should be restrictively utilized according to corresponding description of equipment, It constitute an inconvenience in that, technical staff has to directly optionally divide with computer and CCD (charge coupled device) cameras From required element.

2 and 3, by utilizing infrared ray or impact or shearing force in a heated state, infrared ray and impact are used respectively, is added Heat and the method for shearing can separate the element being arranged on PCB.Both approaches need single pipeline and shifting Except line, thus equipment to be installed will be very big.In addition, be also additionally required one can collect respectively the element that separates and The equipment of PCB.

4th, there are above-mentioned 2 and 3 using the method for metal-stripping roller, and can only process PCB a face rather than It is two-sided.

5th, in the method using polishing machine, because abrasive action can produce substantial amounts of dust, and in small-sized component In the case of, they will together be polished with substrate and be difficult to reclaim.In addition, the two-sided PCB for the treatment of is also highly difficult.

6th, in the method using hot blast and centrifugal force, two-sided PCB can be processed, but PCB be limited to sheet material treatment with Cause it is very low in output, and the PCB to that can be processed finite thickness system.

Improved technology has following problem by this way：Due to the PCB being made up of piece, recycling member is from PCB It is discontinuous, and this technology can be influenceed by the type of PCB and size.

In order to solve such problem, Ebrean Registered Patent 100421591 is public as the example of prior art literature Open.

In above-mentioned registered patent, it is provided with the conical or frustoconical projection sensing on pivot The rotor of device, from multiple extensions that above-mentioned cone projection sensor levels extend, is attached to the multiple on above-mentioned extension Stud, the drive motor for making above-mentioned rotor rotation, for accommodating the cylindrical housings of above-mentioned rotor, and is attached to above-mentioned Multiple studs on the inner circumferential surface of cylindrical housings.

However, the problem of the prior art is, PCB and multiple elements separated from PCB are mixed, and when logical When crossing opening bottom discharge element, PCB is also discharged together.Thus, it constitute an inconvenience in that PCB and the multiple unit for being mixed discharge Part should be sorted separately.In addition, newly-increased technical need is, can be by element from the compact electronic product such as such as mobile phone Efficiently separated on small size PCB.

Simultaneously in twentieth century, due to a large amount of productions and a large amount of consumption of electronic product, substantial amounts of electronic waste is generated. Especially, for example the generation quantity of the small-sized waste and old electrically or electronically product such as useless PC, waste mobile phone, waste printer is passed year by year Increase.

The PCB being included in these small-sized waste and old electrically or electronically products contains such as various useful metals of copper, iron, aluminium, And such as Au Ag Pt Pd noble metal, therefore these waste materials can be needed by Korea Spro of import by most metals raw material State is utilized as useful resources.According to the recovery present situation of waste and old electrically or electronically product, except some noble metals and high content The outer most metals of composition be not recovered.

Developed country has run a kind of industrial equipment, two while only will be contained in waste electrical equipment or electronic product In tenth century, due to a large amount of productions and a large amount of consumption of electronic product, generate substantial amounts of electronic waste.Especially, for example give up PC The generation quantity of the small-sized waste and old electrically or electronically product such as machine, waste mobile phone, waste printer is just in cumulative year after year.

Developed country has run a kind of industrial equipment, only will be contained in PCB in waste electrical equipment or electronic product from product Separated on product, the PCB that will be separated without any treatment is placed in high temperature melting, and the useful of noble metal is included to reclaim Metal, but they make great efforts to be devoted to developing and combine the environmentally friendly of mechanical pretreatment technology and hydrometallurgic recovery technology recently Recovery technology.However, the recovery technology almost not got the nod in worldwide, and for the country that technology is seized exerts Power and competition are very fierce.

For the PCB played an important role in waste electrical equipment or electronic product, most of useful metals by comprising wherein but Gross weight accounting is less than 10%, so that pretreatment is extremely important.Especially, in the high temperature melting method for carrying out at present, quilt Seldom, most of useful metals need by other hydrometallurgic recovery technology the metal types of recovery.In order to make up this shortcoming, need A kind of can implementation the electronic component comprising a large amount of useful metals is wanted to pre-process and the electronic component is separated from PCB Technology and a kind of copper that weight accounting 30% can be efficiently reclaimed from the PCB for removed electronic component.

When these recovery technologies are developed, can efficiently process what is reclaimed from small-sized waste and old electrically or electronically product Metal on PCB, and can use pretreatment and triage techniques in order to from contain a large amount of metals various waste materials or similar The recovery of thing.

Five classes can be synoptically divided into by correspondingly modified prior art.

1st, in comminuting method, PCB is ground into powder, is then divided into strong metal powder and weak metal dust.On not considering State powder type how, element contains the mixture of brominated epoxy resin, glass fibre and metal, so as to cause to reclaim Difficulty and impurity effect in journey.Especially, after collection brominated epoxy resin and the recycle value of glass fibre are just It is being ignored.

2nd, in direct burning method, PCB is directly burnt to be fused into the mixture of glass fibre and metal, then through cold But extracting underlying metal.The technique not only consumes mass energy, and is made due to poisonous hydrogen bromide (BrH) byproduct Into environmental pollution.In addition, used as the metal mixture of low level, the material of collection should be refined to purify recovery again, thus Its direct value is very low.

3rd, in heat resolve method, heat resolve process can produce a large amount of poisonous hydrogen bromide (BrH) gases, thus to ring Border is breakneck.In addition to can be by sorting the metal for reclaiming, such as brominated epoxy resin, the residue such as glass fibre Material can not be recovered and they may pollute environment.

4th, in chemolysis method, the metal for being placed in PCB intermediate layers can not be completely dissolved in course of dissolution, thus Brominated epoxy resin mixes with heavy metal after course of dissolution, and there may be reprocessing and problem of environmental pollution.

5th, in molten salt method, PCB is placed in collect and reclaim metal and glass fibre in the inorganic salts of melting, But including following shortcoming.

Tin in a.PCB, lead and copper are mixed into alloy due to 400 DEG C or higher for the treatment of temperature, therefore they turn into Low level metal mixture, so as to cause too high cost, and needs to spend time and efforts to be refined.

B. it is more than the proportion of PCB due to the proportion of the inorganic salts for melting, PCB is swum on the inorganic salts of melting, therefore difficult To be directly stirred separation process.

C. after the inorganic salts dissolving of melting, PCB is softened with active, so that be difficult to stirring separating Journey.

D. finished product PCB by with pad more than through hole plate bonding part interconnect, therefore PCB glass fibre quilt It is closely attached.Because the separation process of glass fibre is difficult, therefore poor effect.

E. when in the PCB for a long time inorganic salts in melting, glass fibre will be destroyed.In mixing process and The operating time in extraction process can not be controlled and discontinuous again, therefore it is a task for difficulty to collect glass fibre. On the other hand, the probability that pulverized glass fibre is successfully reclaimed is very low.

Improved technology has a problem that by crushing PCB to screen copper by this way, removal process it is difficult and Because of brominated epoxy resin and caused by environmental pollution.

In order to solve these problems, Ebrean Registered Patent 10-0926801 has been disclosed as the example of prior art.

In the registered patent, the supply container for placing and supplying PCB powder is provided with, under supply container Portion carries out the water tank of lock out operation, for opening or closing supply container so that the opening-closing plate of PCB flowings, revolves in supply container Turn the mobile stirring rod in ground, the injection nozzle of the PCB and water floated on the water tank is pushed up in the side of outlet, by scraping Except bottom conveys the transfer carrier of the metal of precipitation in water tank, the discharging transport of transfer transporter end is obliquely connected to Device, and the air supply pipe of bubble is produced in water tank.

However, the problem of the prior art is, some tiny metal ingredients (usually copper) are floated simultaneously with PCB powder And discharge together, causing the rate of recovery of metal ingredient (usually copper) reduces.

In addition, for small size that can efficiently by element from installed in compact electronic products such as mobile phones The technical need that PCB is separated constantly increases.

The content of the invention

Technical problem

The utility model purpose is to propose a kind of device and one kind for from resolution element on printed circuit board (PCB) The method for screening copper, easily can separate the element for being arranged on PCB so that be included in the PCB that element separate On copper can be screened because of difference in specific gravity, so as to improve the rate of recovery of copper.

Technical scheme

One side of the present utility model provides a kind of device for from resolution element on printed circuit board (PCB), Including：First feeder, the PCB that element is provided with thereon is fed to first feeder；Spiral second feeder, Second feeder is arranged in the drive shaft of the driver element being arranged in below first feeder, and passes through to be driven Conveying is fed to first feeder and the PCB being discharged in one direction for the rotation of moving axis；Element separates single Unit, the element separative element is longitudinally arranged along the drive shaft for being provided with second feeder, receives logical Cross the PCB of the second feeder conveying, and separately installed element on the pcb；Heating unit, the heating Unit is longitudinally arranged along the element separative element 140, at the same with the element separative element arranged for interval, and to quilt The PCB heat supplies of the element separative element are fed into, wherein being formed respectively by the element separative element and element point From PCB discharge path and the discharge path of the element separated from the PCB.

Here, the transport path for being fed to first feeder and the PCB for discharging can be different from by institute The side for stating the transport path of the PCB of the second feeder or element separative element conveying is upwardly formed.

Meanwhile, the element separative element can include cylindrical housings, wherein the cylindrical housings include being arranged in The drive shaft in it, and conducted with to the PCB conveyed by second feeder by the heating unit heats Heat；And multiple brushes, wherein the brush is located in the drive shaft being arranged in the housing, and to being fed Surface to the PCB of the housing applies external force.

Meanwhile, exhaust through the first discharge port of the PCB after being separated with the element and exhaust through described Multiple second outlets of element are formed in the housing.

Meanwhile, spiral wire can be protrudedly formed on the inner surface of the housing.

Meanwhile, the transporting velocity of the PCB or the element can be according to the pitch of the spiral wire or helical angle It is adjusted.

Meanwhile, the housing can be with the rotation direction of the drive shaft or with the rotation direction phase with the drive shaft Anti- direction rotates.

Meanwhile, the brush can be longitudinally formed to spirality along the drive shaft.

Meanwhile, the brush radially or can be arranged symmetrically relative to the drive shaft.

Meanwhile, the heating unit can be controlled in such a way, i.e., from the institute being fed by PCB its described The entrance of element separative element is stated, to described the first of the element separative element being discharged by PCB200 its described Outlet, the temperature of the heating unit is lowered.

Meanwhile, the heating unit may be arranged to the outer surface of the housing around the element separative element.

Meanwhile, the multiple brush can be formed as having the length touched less than second outlet.

Meanwhile, the multiple brush can be formed as being contacted with the steel wire.

Beneficial effect

According to the method for from the device of resolution element on printed circuit board (PCB) and screening copper of the present utility model, Being provided with the element separated on the PCB of the element from it can be easy to be classified and discharge, therefore not In the case of increasing sort operation, it is possible to reduce the classification time.

Meanwhile, according to the device for the resolution element from PCB of the present utility model and the method for screening copper, it is attached to institute Stating the electronic component on PCB can be efficiently separated, therefore the electronic component that separate from each and reclaims metal on the PCB and be Feasible, and compared with the PCB that element thereon not separate, improve metal recovery rate.In addition, being different from existing separation The device of element, advantage is that PCB can be constantly provided to enter units lock out operation.

Meanwhile, according to the device for the resolution element from PCB of the present utility model and the method for screening copper, in the unit Part is separated the path that the preceding PCB is fed and the path that the PCB is discharged after the element is separated and can be formed For orthogonal, so that the equipment miniaturization of the resolution element.

Meanwhile, according to the device for the resolution element from PCB of the present utility model and the method for screening copper, installed in institute State the element on PCB to be separated, the copper that the PCB after being separated with the element is included can be easy to by difference in specific gravity Screen, so as to improve the rate of recovery of copper, and economize on resources.

Meanwhile, according to the device for the resolution element from PCB of the present utility model and the method for screening copper, different from existing The device of some resolution elements, advantage is that the PCB can be constantly provided to enter units lock out operation.

Meanwhile, according to the device for the resolution element from PCB of the present utility model and the method for screening copper, with various The PCB of size can be sheared or be crushed with certain standard, so as to efficiently separate the element and without considering the PCB Size.

Brief description of the drawings

Fig. 1 is according to the embodiment for from the device of resolution element on printed circuit board (PCB) of the present utility model Stereogram；

Fig. 2 is the schematic cross sectional view for the inside of the device of resolution element from PCB in Fig. 1；

Fig. 3 to Fig. 5 is to show the element on PCB that the device by being used for the resolution element from PCB in Fig. 1 is classified Classification state profile；

Fig. 6 is the zoomed-in view of " A " part in Fig. 5；

Fig. 7 is the flow chart of the embodiment of the method according to the copper on screening PCB of the present utility model.

Specific embodiment

Below with reference to the accompanying drawings describe in detail a kind of for being sieved from the device of resolution element on printed circuit board (PCB) and one kind Select the embodiment of the method for copper.

Fig. 1 is according to the embodiment for from the device of resolution element on printed circuit board (PCB) of the present utility model Stereogram, Fig. 2 is the schematic cross sectional view for the inside of the device of resolution element from PCB in Fig. 1, and Fig. 3 to Fig. 5 is to show The profile of the classification state of element, Fig. 6 on PCB classified by the device for being used for the resolution element from PCB in Fig. 1 It is the zoomed-in view of " A " part in Fig. 5, and Fig. 7 is the embodiment of the method according to the copper on screening PCB of the present utility model Flow chart.

First, the device for the resolution element from PCB according to the utility model embodiment is described with reference to Fig. 1-Fig. 6 100。

The device 100 for the resolution element from PCB according to the utility model embodiment includes the first feeder 110, PCB200 is fed into the first feeder 110, and PCB200 has element mounted thereto；Spiral second feeder 120, if Put in the drive shaft 134 of the driver element 130 being arranged in below the first feeder 110, and by the rotation of drive shaft 134 Conveying in one direction is fed to the first feeder 110 and the PCB200 for discharging；Element separative element 140, along thereon The drive shaft 134 for being provided with second feeder 120 is longitudinally arranged, and receives the PCB200 conveyed by the second feeder 120, and And for the separately installed element 220 on PCB200；Heating unit 150, along being longitudinally arranged for element separative element 140, Simultaneously with the arranged for interval of element separative element 140, and to being fed to the PCB200 heat supplies of element separative element 140；And Deliverying unit 160, the PCB200 and element 220 that element 220 separate is discharged from deliverying unit 160.

Being fed into the PCB200 of the first feeder 110 can include the electronic component used in electronic equipment, and multiple Element 220 can mechanically or solder is mutually connected or is attached.Now, PCB200 can be crushed to preliminary dimension Or the first feeder 110 is fed in the state of frittering, while element 220 is arranged on PCB200.

First feeder 110 can be infundibulate, and be arranged in the top of the second feeder 120.It is big by preliminarily crushing Or medium PCB or by subtly crushing small PCB, acquisition is fed into the PCB200 of the first feeder 110.Preferably, The PCB200 for being fed into the first feeder 110 has a kind of size so that PCB200 cannot pass through the of element separative element 140 Two outlet 141c, this will be described below.

Other PCB200 is fed to and is formed in the opening on the top of the first feeder 110, and is discharged to and is formed in the In the opening of the bottom of one feeder 110, above-mentioned transport path is formed in different from by the second feeder 120 or element separative element On the direction of the transport path of the PCB200 of 140 conveyings.As reference, in embodiment of the present utility model, first is fed into The transport path of feeder 110 and the PCB200 being discharged can be formed as being separated perpendicular to by the second feeder 120 or element The transport path of the PCB200 of the conveying of unit 140.

Second feeder 120 may be connected to the opening for being formed in the bottom of the first feeder 110 in the way of it can connect, and With the PCB200 that the side arranged in element separative element 140 is delivered up being discharged from above-mentioned opening.Here, the PCB200 of crushing from The transport path that first feeder 110 reaches the second feeder 120 can be formed on vertical direction.On the other hand, press The broken PCB200 reaches the first deliverying unit of deliverying unit 160 by element separative element 140 from the second feeder 120 The transport path of 161 (can describe below) can be formed in the horizontal direction.

Can be minimized according to the device 100 for the resolution element from PCB of the present utility model, because being fed to first The PCB200 of feeder 110 reaches the transport path of the second feeder 120 and the PCB200 for having arrived at the second feeder 120 leads to The transport path for crossing the first deliverying unit 161 of arrival of element separative element 140 is orthogonal.Because, when being fed into first The PCB200 of feeder 110 reaches the transport path of the second feeder 120 and the PCB200 for having arrived at the second feeder 120 leads to The transport path for crossing the first deliverying unit 161 of arrival of element separative element 140 is mutual in the horizontal direction in the way of it can connect During connection, the entire length for the device 100 of the resolution element from PCB can relative increase.

Here, the second feeder 120 is it is so structured that spiral wing.Spiral wing can be fixedly mount to driver element 130 drive shaft 134, or be integrally formed on the outer surface of drive shaft 134 with drive shaft 134.Meanwhile, the second feeder 120 can be fixedly mount to or be formed in the single rotary shaft (not shown) that with the drive shaft 134 of driver element 130 separate On.So, single rotary shaft can be interconnected by chain or belt with the drive shaft 134 of driver element 130, and be passed through Drive shaft 134 is rotated and rotated.

Correspondingly, the PCB200 that the second feeder 120 can be discharged is with a direction (the i.e. cloth of element separative element 140 The direction put) it is delivered to the opening for being formed in the bottom of the first feeder 110.

Driver element 130 can make the second charging by transmitting power to the drive shaft 134 for being provided with the second feeder 120 Device 120 rotates.Driver element 130 may be mounted in the device 100 for the resolution element from PCB.

In embodiment of the present utility model, driver element 130 can include drive motor 131；First pulley 132, even It is connected in the rotary shaft of the rotation to be driven of drive motor 131；Second pulley 133, is fixedly provided at one end of drive shaft 134；With And belt 135, first pulley 132 and second pulley 133 are connected, and by the rotation of first pulley 132, drive second pulley 133 rotations, then drive drive shaft 134 to rotate.That is, as the driving source for rotating the second feeder 120, drive motor 131 can be by the extraneous power drive for providing.

First pulley 132 may be mounted at the rotatable one end of drive motor 131.

Specifically, first pulley 132 may be mounted in the rotary shaft being formed in drive motor 131, and by connecing Rotated by the power of rotary shaft offer.First pulley 132 mainly can drive rotation by drive motor 131.

Second pulley 133 can be arranged to be spaced apart with first pulley 132, and can be with the synchronous axial system of first pulley 132. Second pulley 133 can be formed as the height for having as the height of the second feeder 120.This is to not produce eccentric throw In the case of the drive shaft 134 that will be formed in the second feeder 120 be fixed to second pulley 133.

Drive shaft 134 can be fixed to second pulley 133, and be revolved with a direction by rotarily driving for second pulley 133 Turn.Drive shaft 134 can be formed as being longer than along short transverse along longitudinal direction, and one end of drive shaft 134 can be fixed to second pulley 133 and the other end can be fixed on around first discharge port 141b, first discharge port 141b can be described below.

Belt 135 can connect first pulley 132 and second pulley 133, and the revolving force of first pulley 132 is transmitted To second pulley 133.In the utility model, although belt 135 is illustrated to drive the conveying of the second feeder 120, But belt 135 can be changed to the miscellaneous part including chain etc., as long as the part can drive the second feeder 120 Conveying.

Element separative element 140 can be located at and be provided with the drive shaft 134 of the second feeder 120, and receive by the The PCB200 of the conveying of two feeder 120.That is, the second feeder 120 can be located at a part of the drive shaft 134 along longitudinal direction On, element separative element 140 is located on the remainder of drive shaft 134.

Element separative element 140 can include housing 141 and brush 142.Housing 141 can be formed as cylinder, drive Axle 134 can be arranged in housing 141.In addition, spiral wire 141d can be protrudedly formed on the inner surface of housing 141. Brush 142 can be located in drive shaft 134, and is rotated together with drive shaft 134.

The PCB200 for being wherein provided with element 220 to be separated may be accommodated in the housing 141 of element separative element 140 It is interior, and be transported at brush 142.Next, PCB200 can be subject to what steel wire 141d give to rub when being conveyed in the housing 141 Wipe power or shearing force.

In addition, PCB200 can be subject to the external force that brush 142 gives so that element 220 can be separated from PCB200.Namely Say, PCB200 can be conveyed in housing 141 by brush 142, and brush 142 and steel wire are then subject to while being conveyed The external force that 141d gives so that element 220 can be separated from PCB200.

Spiral wire 141d can adjust the transporting velocity of PCB200 according to the pitch of spiral wire 141d or helical angle. In order to element 200 is separated from the PCB200 being contained in element separative element 140, by adjusting PCB200 in housing The receiving time in 141, to increase the rate of recovery of element 200, such as control unit 170 described later.

Brush 142 can be located in the drive shaft 134 being arranged in housing 141.Brush 142 can be by steel or plastic material It is made, and multiple brushes 142 can be arranged along the longitudinal direction of drive shaft 134 and circumferentially with predetermined spacing.

Brush 142 can be contacted with the PCB200 of the conveying in housing 141, to clean the surface of PCB200, so that even The element 220 of small size can be separated from PCB200.Used as reference, in the utility model, brush 142 is illustrated Explanation is to apply external force to the surface of PCB200, but the utility model is not limited to this.That is, instead of brush 142 Multiple blade (not shown) can be set, and longitudinal direction along drive shaft 134 and circumferential be arranged with predetermined spacing.

Preferably, brush 142 is arranged in drive shaft 134, while having certain length, length can make brush 142 Touch the steel wire 141d being protrudedly formed on the inner surface of the housing 141 of element separative element 140.That is, when drive When moving axis 134 is driven in rotation, brush 142 can together be rotated with drive shaft 134, at the same with housing 141 on steel wire 141d is contacted.Now, being fed by the second feeder 120 can be by receiving from brush into the PCB200 in housing 141 142 external force and separated with element 220.It is additionally, since the housing that PCB200 is formed on steel wire 141d by brush 142 It is moveable on 141 inner surface direction, so element 220 can be by the cooperation of steel wire 141d and brush 142 effectively Separated from PCB200.

Meanwhile, as shown in figure 3, brush 142 can be located on the whole longitudinal direction of drive shaft 134.When being arranged on drive shaft 134 Whole longitudinal direction on when, brush 142 can have spirality.As above, longitudinal direction and week of the multiple brushes 142 along drive shaft 134 Arranged to predetermined spacing, so as to radially or be arranged symmetrically relative to drive shaft 134.The shape and quantity of brush 142 Various changes can be carried out according to required element separative efficiency.

The PCB200 conveyed by the second feeder 120 is fed to entrance 141a, and entrance 141a can be formed in housing 141 one end.First discharge port 141b that PCB200 can be discharged by it and the unit after being separated with PCB200 can be discharged by it Second outlet 141c of part 200 can be formed in housing 141.

First discharge port 141b can be formed in the opposite side of entrance 141a, the i.e. other end of housing 141.Second outlet 141c can be formed between steel wire 141d, wherein steel wire 141d along housing 141 the inner surface for being formed longitudinally in housing 141 On.That is, multiple second outlet 141c can be formed in the part for not forming steel wire 141d of housing 141.

It is preferred that one end for being located at drive shaft 134 of multiple brushes 142 can be connected with drive shaft, its other one The direction that end can be formed respectively along multiple second outlet 141c extends.Because the element for from PCB200 separate 220 can be directed by brush 142 along the projected direction of brush 142, and be easy to be discharged from the second outlet 141c.

Here, first discharge port 141b can be connected in the way of it can connect with the first deliverying unit 161 of deliverying unit 160 Connect, the second outlet 141c can be connected in the way of it can connect with the second deliverying unit 162 of deliverying unit 160.

First deliverying unit 161 can receive the PCB200 discharged by first discharge port 141b, and will receive PCB200 is guided to the outside of device 100 for the resolution element from PCB.

Next, the second deliverying unit 162 can be arranged in the lower section of element separative element 140, and receive and collect logical Cross the element 220 of the second outlet 141c discharges.

It is preferred here that the size being dimensioned so as to less than PCB200 of the second outlet 141c.This is to prevent It is separated fall element 220 PCB200 be fed in the second deliverying unit 162 by the second outlet 141c.Likewise it is preferred that Ground, the second outlet 141c is formed between spiral wire 141d.

The housing 141 of element separative element 140 can be rotated with the direction of rotation of drive shaft 134 or with drive shaft The opposite direction in 134 direction of rotation rotates, it is preferable that being rotated with the direction opposite with the direction of rotation of drive shaft 134.This makes The brush 142 that must be arranged in drive shaft 134 can be with the movement with the PCB200 conveyed along the direction of rotation of housing 141 Direction in opposite direction applies external force to the surface of PCB, so as to easily separate down the element 220 being arranged on PCB200 Come.

Housing 141 may be coupled to single driving source (not shown) and is rotated with by driving source, and this construction can be with Implement out by those skilled in the art easily, therefore in this manual, omit its specific description.

Here, when housing 141 is rotated, the brush 142 rotated by the rotation of drive shaft 134 can alternately edge The inner surface for being formed with housing 141 on the inner surface portion of steel wire 141d and housing 141 and being formed with the second outlet 141c Partial turn.Therefore, the element 220 of PCB200 can be preliminarily by the cooperation of steel wire 141d and brush 142 from PCB200 Separate, and be easy to be fed to the second outlet 141c, while by the secondary pressurized of brush 142, wherein brush 142 is along it On be formed with the second outlet 141c housing 141 inner surface rotate.

Now, the length of each brush 142 protruded from drive shaft 134 can be formed to be contacted with steel wire 141d. On the other hand, as shown in figure 3, the length of each brush 142 protruded from drive shaft 134 can be preferably formed to touch less than the Two outlet 141c.This will form a gap, by the gap, the element 220 separate from PCB200 can because apply to The external force of brush 142 and steel wire 141d is fed to the second outlet during brush 142 and steel wire 141d are contacted with each other 141c。

Thus, when brush 142 and steel wire 141d are contacted with each other due to the rotation of drive shaft 134 and housing 141, element 220 can separate from PCB200, and when brush 142 along being formed with the housing 141 of the second outlet 141c thereon When circumferentially rotating, element 220 can be fed to the second outlet 141c, and this process can be repeated in housing 141 Carry out.

Heating unit 150 being longitudinally arranged along housing 141, that is, the conveying of the PCB200 being contained in housing 141 Direction, wherein, the arranged for interval of housing 141 of heating unit 150 and element separative element 140.Thus, heating unit 150 can be with By heated shell 141 come to the PCB200 heat supplies conveyed in housing 141.As heating unit 150, can use infrared (IR) heater etc..

In order to the element 220 that PCB200 will be easily connected to by solder is separated from PCB200, heating unit 150 can With heat supply until solder fusing.Preferably, PCB200 is heated to the temperature that PCB200 will not burn out or damage by heating unit 150 Degree, while PCB200 is heated until the fusing point or temperature higher of solder, so that solder can be melted.For example, heating unit 150 PCB200 to 250 DEG C or higher temperature can be heated.Heating unit 150 can be controlled to be maintained at fusing point or higher temperature and PCB200 will not impaired temperature.

Preferably, heating unit 150 can be controlled in such a way, i.e., from the unit being fed by its PCB200 The first discharge port 141b of the element separative element 140 that the entrance 141a of part separative element 140 is extremely discharged by its PCB200, The temperature of heating unit 150 is lowered.Because on PCB200 and being fed to the entrance of element separative element 140 The installment state of the element 220 of 141a is very strong, although and with high-temperature heating, solder also only melt to a certain extent so that The coupled situation of element 220 is slight deformation.Correspondingly, heating unit 150 can be heated with moderate temperature or low temperature, only Wanting solder can melt.Thus, when unwanted heat is minimized, heating unit 150 can be used for a long time.

According to the utility model, heating unit 150 is shown as being arranged in the upper of the housing 141 of element separative element 140 Side, with to the heat supply of housing 141, but heating unit 150 may be arranged to diversified forms, as long as have can be separated through element The structure of heat is conducted inside the housing 141 of unit 140 to PCB200.

That is, heating unit 150 may be arranged to surround the outer surface of the housing 141 of element separative element 140.Cause And, can be to PCB200 even distribution heatings, so as to melt solder along the whole heating unit 150 circumferentially of housing 141.

Deliverying unit 160 can include be connected in the way of it can connect on the first discharge port 141b of housing 141 the One deliverying unit 161, with the second deliverying unit being connected in the way of it can connect on the second outlet 141c of housing 141 162, as above.

As above, the PCB200 for element 220 separate can be arranged to the first deliverying unit 161 by first discharge port 141b. Next, element 220 can be arranged to the second deliverying unit 162 by the second outlet 141c.

First deliverying unit 161 and the second deliverying unit 162 can have infundibulate, and the second deliverying unit 162 can To be arranged in the lower section of housing 141 of element separative element 140.

One end of first deliverying unit 161 can connect with the first discharge port 141b of element separative element 140, and its The other end can be externally exposed.Can be dropped into from the PCB200 of the discharge of the first deliverying unit 161 and be arranged on the first deliverying unit 161 lower sections and with the spaced apart separate part of the first deliverying unit 161 in, and be collected.Second deliverying unit 162 can be with Be formed as being longer than the length of element separative element 140.This is to prevent by the second outlet of element separative element 140 The multiple element 220 of 141c discharges drops to outside.

Control unit 170 can with the arranged for interval of driver element 130, with control driver element 130 driving behavior and The temperature of heating unit 150.Control unit 170 can be arranged to be spaced from the drive motor 131 above with driver element 130 Open, while installed in the top of the device 100 for the resolution element from PCB.

Control unit 170 can control the driving behavior of driver element 130, and control to be driven by driver element 130 Second feeder 120 of conveying and velocity of rotation and direction (rotate forward or rotate backward) of brush 142.

As above, the device 100 for the resolution element from PCB according to the utility model embodiment can be efficiently separated It is attached to the element 220 on PCB200, therefore element 220 and PCB200 from after separation reclaims metal and is all possibly realized, so that Compared with the PCB200 without resolution element 220, metal recovery rate is improve.

Hereinafter, the method that refer to the attached drawing 7 describes the copper in the screening PCB according to embodiment of the present utility model.According to this The method of the copper in the screening PCB of utility model embodiment can include that shearing is provided with the PCB operation S100 of element, by element With shearing PCB separate the step of S200, crushing the PCB of resolution element the step of S300, crush crushing after PCB step The step of difference in specific gravity of the materials of S400, and utilization suddenly screens copper from the PCB after crushing S500.

The step of PCB is sheared in S100, the PCB200 thereon with element 220 can be sheared, and install thereon The PCB200 for having element 220 can be before PCB200 to be fed into the device 100 for the resolution element from PCB, using broken Broken machine is cut into horizontally and vertically size and reaches 40-60mm or smaller, wherein according to Fig. 1-Fig. 6 for being separated from PCB The step of device 100 of element is by resolution element S200 is used.

The step of resolution element in S200, what element 220 can be sheared from S100 the step of PCB is sheared Separated on PCB200, and element 220 on PCB200 can be using described in the utility model one embodiment Device 100 for the resolution element from PCB is separated.

The step of PCB is crushed in S300, the PCB200 that S200 with element 220 separate the step of resolution element can be by Crushing, and the PCB200 for element 220 separate can be crushed to horizontally and vertically size using crushing machine (not shown) is cut 1-7mm or smaller is reached, with separate metal and nonmetallic.

Cutting crushing machine can have using rotatable rotating vane and fixed blade to crush what is with element 220 separate The construction of PCB200, and now, it is preferable that the spacing between fixed blade and rotating vane can be adjusted to adjust PCB200 Size after crushing.

The step of the PCB200 after crushing is crushed in S400, the PCB200 that S300 is crushed the step of PCB is crushed Can be crushed, and it is 1-7mm or smaller PCB200 to be pressed into horizontally and vertically size in S300 the step of PCB is crushed It is 0.1-0.9mm or smaller that horizontally and vertically size can be ground into using grinding machine (not shown), to separate copper, plastics, pottery Porcelain etc..

Preferably, grinding machine can be designed to be able to produce fine powder, such as airflow type mill, wherein crushing and classification energy It is enough to carry out simultaneously.

Airflow type mill can be made up of grinding rotor and classification rotor, the revolution of each grinding rotor and classification rotor It is adjustable, so as to adjust the particle size of crushed material.Used as its mechanism, airflow type mill can have shearing Power, in airflow type mill, crushes the rotating vane and fixed blade that 2000rpm or higher can be up to by revolutions per minute Between minim gap carry out so that the separation of metal level and non-metallic layer can be smoothed out.

The step of copper is screened in S500, copper can be by the proportion (density) of material difference from the step of PCB is crushed Screened in the PCB200 being crushed in S400.

Specifically, difference in specific gravity can be utilized from the copper in the PCB200 after crushing, modeling by gravity concentrator (not shown) Copper is screened in the mixture of material and ceramics.

Two or more material, the copper for such as mixing, plastics and ceramics can have different proportion (density), and work as When applying external force to these materials, the different motion of storeroom can be shown by difference in specific gravity.Being screened using this principle is needed The material wanted is referred to as proportion screening method.

Proportion screening method can generally be used in a fluid, and water or air can serve as fluid.Here, entered using proportion The possibility of row screening depends on the particle size and density of material.Gravity concentrator can be centrifugal gravity concentrator, tool Dynamic unit and conically shaped, conically shaped is with the multiple grooves being formed thereon in a concave manner and quickly rotates.

Centrifugal gravity concentrator could be arranged to bowl-type, and centrifugal gravity concentrator can mainly use Nelson Ore separators.Operating process on centrifugal gravity concentrator, centrifugal gravity concentrator in the ban be connected to power source to transport Row the ore separators, while by feed entrance feed comprising 25%-35% particles mud when, can carry out screening simultaneously keep Ore separators runs up to the outside that particle is flushed to conically shaped by water completely.

Centrifugal gravity concentrator can utilize the principle for separating particle by difference in specific gravity under the influence of centrifugal force, and The parallel recessed multiple grooves of inwall including the conically shaped along the center for penetrating centrifugal gravity concentrator, and can adjust The revolutions per minute of conically shaped.Now, relatively heavy particle can be pushed to wall side and retaining clip shape between the grooves State, relatively light particle can be discharged to outlet with flowing water.Due to water apply pressure, can on conically shaped shape Surrounded by water jacket into water jacket, and groove so that water can be discharged by the hole being formed in conically shaped, to ensure weight stratum granulosum Flowing be maintained.Here, hydraulic pressure can serve as the power opposite with centrifugal force, and opposite power can consumingly be coagulated It is poly-, it is sufficient to the collected particle of interference.

Slight particle in fluidized bed can be substituted by the heavy particle for being promoted, therefore only weight particle can rest on cylinder It is interior.After the completion of the operation of centrifugal gravity concentrator, centrifugal gravity concentrator can be closed down, and can by conically shaped from Taken out in centrifugal gravity concentrator, therefore screened mineral aggregate can be obtained by weight particle cleaning out.

Such centrifugal gravity concentrator can obtain the particle that copper rank is up to 85% or higher, and such as plastics, Ceramics etc. are nonmetallic.In a furnace, can be with waste resource of the carrying package containing 30% or higher level copper, and unit purchase cost Raising with rank can also increase, therefore rank is expected to very up to the unit purchase cost of 85% or more process product It is high.Unlike other gravity concentrators, according in gravity concentrator of the present utility model, recyclable particle size range is very Width, and accordingly particle can be concentrated efficiently.

It is illustrated according to the method from PCB screening copper of the present utility model and screens copper using the difference in specific gravity of material, but It is that can also screen other metals such as iron, aluminium, as long as using material proportion difference.

While there has been shown and described that embodiment of the present utility model, it will be understood by those skilled in the art that： In the case where principle of the present utility model and objective is not departed from various changes, the utility model can be carried out to these embodiments Scope limited by claim and its equivalent.

Industrial applicibility

The utility model can be used in the fields such as recovery PCB, waste resource treatment.

Claims

1. one kind is for the device from resolution element on printed circuit board (PCB), it is characterised in that including：

First feeder, PCB is fed to first feeder, and the PCB has element mounted thereto；

Spiral second feeder, spiral second feeder is arranged on and is arranged in below first feeder In the drive shaft of driver element, and conveyed in one direction by the rotation of the drive shaft and be fed to described first and enter Glassware and the PCB being discharged；

Element separative element, the element separative element is along the vertical of the drive shaft for being provided with second feeder To arrangement, the PCB conveyed by second feeder, and separately installed element on the pcb are received；And

Heating unit, the heating unit is longitudinally arranged along the element separative element, while separating list with the element Unit is spaced apart, and to being fed to the PCB heat supplies of the element separative element,

Wherein it is formed separately the discharge path of the PCB with element separate by element separative element and from the PCB points From the discharge path of the element for getting off.

2. the device for the resolution element from PCB according to claim 1, it is characterised in that be fed to described The transport path of one feeder and the PCB for discharging is different from defeated by second feeder or the element separative element The side of the transport path of the PCB for sending is upwardly formed.

3. the device for the resolution element from PCB according to claim 1, it is characterised in that the element separates single Unit includes：

Cylindrical housings, the cylindrical housings include the drive shaft being arranged therein, and are added by the heating unit Heat conducts heat with to the PCB conveyed by second feeder；And

Multiple brushes, the multiple brush is located in the drive shaft being arranged in the housing, and to being fed to The surface for stating the PCB of housing applies external force.

4. the device for the resolution element from PCB according to claim 3, it is characterised in that first discharge port and many Individual second outlet is formed in the housing, and the PCB after being separated with the element is discharged by the first discharge port, The element is discharged by the multiple second outlet.

5. the device for the resolution element from PCB according to claim 3, it is characterised in that spiral wire is highlightedly It is formed on the inner surface of the housing.

6. the device for the resolution element from PCB according to claim 5, it is characterised in that the PCB or described The transporting velocity of element is adjusted according to the pitch or angle of the spiral wire.

7. the device for the resolution element from PCB according to claim 3, it is characterised in that the housing is described It is rotatable in the rotation direction of drive shaft or on the direction opposite with the rotation direction of the drive shaft.

8. the device for the resolution element from PCB according to claim 3, it is characterised in that the brush is along institute That states drive shaft is longitudinally formed to spirality.

9. the device for the resolution element from PCB according to claim 3, it is characterised in that the brush relative to The drive shaft radially or is arranged symmetrically.

10. the device for the resolution element from PCB according to claim 4, it is characterised in that the heating unit quilt Control in such a way：First discharge from the entrance of the element separative element to the element separative element Mouthful, the temperature of the heating unit is lowered, wherein, the PCB is fed by the entrance, and the PCB passes through described the One outlet is discharged.

11. devices for the resolution element from PCB according to claim 10, it is characterised in that the heating unit It is arranged around the outer surface of the housing of the element separative element.

A kind of 12. devices for the resolution element from PCB, it is characterised in that including：

Spiral second feeder, spiral second feeder is arranged on and is arranged in below first feeder In the drive shaft of driver element, and conveyed in one direction by the rotation of institute's drive shaft and be fed to first charging Device and the PCB being discharged；

Wherein, the element separative element includes：

Cylindrical housings, the cylindrical housings include the drive shaft being arranged therein, and are added by the heating unit Heat conducts heat, and first discharge port and multiple second outlet shapes with to the PCB conveyed by second feeder Into in the housing, the PCB after being separated with the element is discharged by the first discharge port, by the multiple the Two outlets discharge the element；And

Multiple brushes, the multiple brush is located in the drive shaft being arranged in the housing, and to being fed to The surface for stating the PCB of housing applies external force,

Wherein, the housing is rotated up in the side opposite with the rotation direction of the drive shaft so that the brush with institute State and apply external force to the surface of the PCB on the opposite direction of PCB moving directions,

Wherein the multiple second outlet is arranged between the spiral wire protruded from the inner surface of the housing, and Formed on the housing,

Wherein, the multiple brush is formed in such a way：It is same that one end of the multiple brush is connected to the drive shaft When the multiple brush along the drive shaft longitudinal direction being spaced from predetermined spacing, and its other end respectively formed The side of the multiple second outlet upwardly extends, and

Wherein, translational speeds of the PCB in the housing is adjusted according to the pitch or angle of the spiral wire.

A kind of 13. devices for the resolution element from PCB, it is characterised in that including：

Second feeder, second feeder conveys the PCB for being fed to first feeder in one direction；

Element separative element, the element separative element receives the PCB conveyed by second feeder, and separates Element on the pcb is installed；And

Heating unit, the heating unit to the PCB heat supplies for being fed to the element separative element,

Wherein, the element separative element includes housing, and first discharge port and multiple second outlets are formed in the housing, The PCB after being separated with the element is discharged by the first discharge port, institute is discharged by the multiple second outlet State element；And multiple brushes, the multiple brush applies external force to the surface of the PCB for being fed to the housing, with And

Wherein, the multiple brush shapes turns into the length for having and touching less than second outlet.

14. devices for the resolution element from PCB according to claim 13, it is characterised in that the multiple second Outlet is respectively formed between the spiral wire protruded from the inner surface of the housing, and the multiple brush shapes turn into The steel wire contact.

15. devices for the resolution element from PCB according to claim 14, it is characterised in that second charging Device is connected to the drive shaft of the driver element being arranged in below first feeder, and is rotated in one by institute's drive shaft Individual side is delivered up being supplied to the PCB of first feeder,

Wherein, element separative element being longitudinally arranged along the drive shaft,

Wherein, the drive shaft is arranged in the housing, and is formed as cylinder, and

Wherein, the multiple brush is formed in such a way：It is same that one end of the multiple brush is connected to the drive shaft When the multiple brush be spaced from along the longitudinal direction of the drive shaft, and its other end respectively formed the multiple second The side of outlet upwardly extends.