CN206271692U - A kind of equipment cooling device - Google Patents
A kind of equipment cooling device Download PDFInfo
- Publication number
- CN206271692U CN206271692U CN201620808981.7U CN201620808981U CN206271692U CN 206271692 U CN206271692 U CN 206271692U CN 201620808981 U CN201620808981 U CN 201620808981U CN 206271692 U CN206271692 U CN 206271692U
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- China
- Prior art keywords
- heat
- phase
- apparatus casing
- change material
- radiating substrate
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Abstract
The utility model discloses a kind of equipment cooling device, master chip, PCB including apparatus casing and in apparatus casing, heat-radiating substrate, master chip is arranged on the PCB, and the master chip is contacted with heat-radiating substrate, heat-radiating substrate is arranged on the inwall of the apparatus casing and the inwall of heat-radiating substrate and apparatus casing forms closed cavity, phase-change material is filled with closed cavity, phase-change material is contacted with heat-radiating substrate, apparatus casing.Contacted with heat sink by phase-change material, can cause in master chip short-term warming, fast endothermic, so that phase-change material is changed into liquid from solid-state, and contacted by with apparatus casing, so that radiated by the apparatus casing in the case where master chip is in normal tasks or holding state, so that the phase-change material is changed into solid-state from liquid to continue to absorb heat.
Description
Technical field
The utility model embodiment is related to safety monitoring apparatus field, more particularly to a kind of equipment cooling device.
Background technology
Extensively, in intelligent monitoring application field, master chip is surpassed safety monitoring class products application according to multitask demand
Frequently, for example when intelligent transportation camera carries out License Plate Identification, vehicle flowrate size can significantly affect master chip and account in monitored picture
There is rate.Again for example in smart home product, when user is using functions such as voice and video and recognitions of face, master chip surpasses if necessary
Frequency is used.Master chip overclocking performance has much relations with temperature, to ensure the normal overclocking of master chip, it is necessary to assure master chip temperature
In the reasonable scope, existing most of master chip wants to play overclocking performance completely, and master chip junction temperature is no more than 70 DEG C.
Due to the master chip, power consumption is higher only under special scenes, and the most of the time is in significantly lower power consumption, therefore, need
Want a kind of effective short time radiating mode.
Utility model content
The utility model embodiment provides a kind of equipment cooling device, in the master chip short time for being used to realize monitoring device
Effectively radiating.
A kind of equipment cooling device that the utility model embodiment is provided, including：
Apparatus casing and the master chip in the apparatus casing, PCB (Printed Circuit Board, printing
Circuit board), heat-radiating substrate；
The master chip is arranged on the PCB, and the master chip is contacted with heat-radiating substrate；
The heat-radiating substrate is arranged on the inwall of the apparatus casing and the heat-radiating substrate and the apparatus casing
Inwall forms closed cavity；
Phase-change material, the phase-change material and the heat-radiating substrate, the apparatus casing are filled with the closed cavity
Inwall contact.
It is preferred that the inwall of the apparatus casing has groove, the heat-radiating substrate covers the groove and forms the envelope
Close cavity.
It is preferred that the heat-radiating substrate has hollow radiating shell, the inwall of the apparatus casing is used as the radiating
The bottom surface of housing forms the closed cavity.
It is preferred that the heat-radiating substrate has multiple heat transmission fins, the phase-change material is filled in the multiple heat conduction wing
Between piece.
It is preferred that the multiple heat transmission fin is equidistantly arrangement.
It is preferred that the heat transmission fin be shaped as rectangle, cylinder or ripple struction.
It is preferred that texture is carved with the surface of the heat transmission fin.
It is preferred that the material of the heat transmission fin is good conductor.
It is preferred that the phase-change material is added with heat conduction particle.
It is preferred that the phase-change material is following any materials or combination：
Lauric acid/dodecanoic acid, paraffin, hexadecanol.
The equipment cooling device that the utility model embodiment is provided, including apparatus casing and the master in apparatus casing
Chip, PCB, heat-radiating substrate, master chip are arranged on the PCB, and the master chip is contacted with heat-radiating substrate, and heat-radiating substrate sets
It is placed on the inwall of the apparatus casing and the inwall of heat-radiating substrate and apparatus casing forms filling in closed cavity, closed cavity
There is phase-change material, phase-change material is contacted with heat-radiating substrate, apparatus casing.Contacted with heat sink by phase-change material, can caused
In master chip short-term warming, fast endothermic so that phase-change material is changed into liquid from solid-state, and is contacted by with apparatus casing,
So that radiated by the apparatus casing in the case where master chip is in normal tasks or holding state, so that the phase-change material
It is changed into solid-state from liquid to continue to absorb heat.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the utility model embodiment, below will be to needed for embodiment description
The accompanying drawing to be used is briefly introduced, it should be apparent that, drawings in the following description are only some implementations of the present utility model
Example, for one of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings
Obtain other accompanying drawings.
A kind of structural representation of equipment cooling device that Fig. 1 is provided for the utility model embodiment；
A kind of structural representation of equipment cooling device that Fig. 2 is provided for the utility model embodiment；
A kind of stereogram of radiating shell that Fig. 3 is provided for the utility model embodiment；
A kind of structural representation of equipment cooling device that Fig. 4 is provided for the utility model embodiment；
A kind of structural representation of heat transmission fin that Fig. 5 is provided for the utility model embodiment；
A kind of structural representation of heat transmission fin that Fig. 6 is provided for the utility model embodiment；
A kind of structural representation of heat transmission fin that Fig. 7 is provided for the utility model embodiment；
A kind of structural representation of heat transmission fin that Fig. 8 is provided for the utility model embodiment；
A kind of structural representation of equipment cooling device that Fig. 9 is provided for the utility model embodiment；
A kind of structural representation of equipment cooling device that Figure 10 is provided for the utility model embodiment.
Specific embodiment
In order that the purpose of this utility model, technical scheme and advantage are clearer, below in conjunction with accompanying drawing to this practicality
It is new to be described in further detail, it is clear that described embodiment is only a part of embodiment of the utility model, rather than
Whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work
Under the premise of all other embodiment for being obtained, belong to the scope of the utility model protection.
Due to intelligent monitoring product master chip when normal tasks are processed main power consumption it is relatively low, when task processing requirements amount is big
Power consumption is dramatically increased, it is therefore desirable to a kind of radiating mode in short-term.
To achieve these goals, Fig. 1 shows a kind of knot of equipment cooling device that the utility model embodiment is provided
Structure.
As shown in figure 1, the device is specifically included：Apparatus casing 101 and the master chip in the apparatus casing 101
103rd, PCB102, heat-radiating substrate 104.Wherein, master chip 103 is arranged on the PCB102, and the master chip 103 and radiating base
Plate 104 is contacted, that is, is arranged on the PCB102 close to the side of the inwall of apparatus casing 101, the apparatus casing 101 it is interior
Wall is any inwall of apparatus casing 101, and above-mentioned heat-radiating substrate 104 is arranged on the inwall of the apparatus casing 101, specific position
In master chip 103 close to the side of the inwall of apparatus casing 101, and contacted with master chip 103, that is to say, that the heat-radiating substrate
104 are located between master chip 103 and the inwall of the apparatus casing 101, and being contacted with master chip 103 can be so that master chip 103 be produced
Raw heat is distributed by the heat-radiating substrate 104.
The inwall of the heat-radiating substrate 104 and apparatus casing 101 forms and phase transformation material is filled with closed cavity, the closed cavity
Material 106, the phase-change material 106 is contacted with the inwall of the heat-radiating substrate 104 and apparatus casing 101.Wherein, the heat-radiating substrate 104
With hollow radiating shell 105, the inwall of the apparatus casing 101 can form described as the bottom surface of the radiating shell 105
Closed cavity.
In order to preferably explain the position relationship of the radiating shell 105, stereogram as shown in Figure 2, radiating shell 105
Between the inwall of heat-radiating substrate 104 and apparatus casing 101, the radiating shell 105 is hollow, by the side welded or paste
Formula can cause that the inwall of heat-radiating substrate 104 and apparatus casing 101 forms closed cavity by the radiating shell 105.
As shown in figure 3, in order to preferably explain the phase-change material 106 in closed cavity, radiating shell 105 is portion in Fig. 3
Divide transparent, phase-change material 106 is located in the closed cavity in radiating shell 105.When master chip 103 is in low power operation,
Own temperature is relatively low, and now, phase-change material 106 is solid-state.After the power consumption of master chip 103 is substantially increased, phase-change material 106 starts
Fusing, the latent heat of phase-change material 106 absorbs the heat that master chip 103 is produced, due to phase-change material 106 in fusion process temperature
Relative constancy, thus master chip 103 temperature also relative constancy, and the latent heat of the fusing of phase-change material 106 is usually copper specific heat
Hundreds times, can maintain prolonged periods temperature stabilization, and effectively power consumption rises the temperature wave for causing to buffering master chip 103 in short-term
It is dynamic.When master chip 103 is in normal tasks to be processed or be standby, carried out by the apparatus casing 101 contacted with phase-change material 106
Radiating, constantly release heat is restored to curdled appearance to phase-change material 106, it is achieved thereby that in the short time of master chip 103
Radiation processes.
In order to preferably realize the radiating rate of master chip 103, as shown in figure 4, the heat-radiating substrate 104 has multiple
Heat transmission fin 107, phase-change material 106 is filled between the plurality of heat transmission fin 107, can be with by the plurality of heat transmission fin 107
Increase the contact area of heat-radiating substrate 104 and phase-change material 106, accelerate the speed that phase-change material 106 absorbs heat, so that plus
The fast radiating rate of master chip 103.
Above-mentioned multiple heat transmission fins 107 can be equidistantly arrangement, can so realize being filled between each heat transmission fin 107
Phase-change material 106 amount it is identical so that each several part phase-change material 106 absorb heat it is identical.
Preferably, in order to accelerate the speed that phase-change material 106 absorbs heat, the shape of above-mentioned heat transmission fin 107 can be
Rectangle, cylinder or ripple struction, the heat transmission fin 107 of rectangular configuration as shown in Figure 5 are as shown in Figure 6 cylindrical to lead
The heat transmission fin 107 of hot fin 107 and ripple struction as shown in Figure 7 and Figure 8.The structure of above-mentioned heat transmission fin 107 this practicality
New is only example effect, can freely be set during concrete application.
Further, in order to increase the contact area of phase-change material 106 and heat-radiating substrate 104, above-mentioned heat transmission fin 107
Surface can be carved with texture, so as to increase the contact area of phase-change material 106 and heat-radiating substrate 104.The material of the heat transmission fin 107
Material can be identical with the material of heat-radiating substrate 104, is the good conductor of heat.
Preferably, heat conduction particle can be added in above-mentioned phase-change material 106, there is provided the heat conductivility of phase-change material 106.
In order that obtaining phase-change material 106 has more preferable heat conductivility, above-mentioned phase-change material 106 can be lauric acid/dodecanoic acid, stone
One or more materials in wax, hexadecanol it is compound, by adjusting the component ratio of each material, regulation phase-change material 106
Melting temperature so that phase-change material 106 has good heat conductivility.
Based on identical technology design, Fig. 9 shows another equipment cooling device that the utility model embodiment is provided
Structure.
As shown in figure 9, the device is specifically included：Apparatus casing 101 and the master chip in the apparatus casing 101
103rd, PCB102, heat-radiating substrate 104.Wherein, master chip 103 is arranged on the PCB102, and the master chip 103 and radiating base
Plate 104 is contacted, that is, is arranged on the PCB102 close to the side of the inwall of apparatus casing 101, the apparatus casing 101 it is interior
Wall is any inwall of apparatus casing 101, and above-mentioned heat-radiating substrate 104 is arranged on the inwall of the apparatus casing 101, specific position
In master chip 103 close to the side of the inwall of apparatus casing 101, and contacted with master chip 103, that is to say, that the heat-radiating substrate
104 are located between master chip 103 and the inwall of the apparatus casing 101, and being contacted with master chip 103 can be so that master chip 103 be produced
Raw heat is distributed by the heat-radiating substrate 104.
The inwall of the heat-radiating substrate 104 and apparatus casing 101 forms and phase transformation material is filled with closed cavity, the closed cavity
Material 106, inwall of the phase-change material 106 respectively with the heat-radiating substrate 104 and apparatus casing 101 is contacted.Wherein, the equipment shell
The inwall of body 101 has groove, and the heat-radiating substrate 104 covers the groove and forms closed cavity.The heat-radiating substrate 104 is the groove
Cover plate, linked together with the inwall of apparatus casing 101 by welding or pasting, formed closed cavity.
As shown in figure 9, phase-change material 106 is located in the closed cavity in radiating shell 105.When master chip 103 is in low
When power consumption is run, own temperature is relatively low, and now, phase-change material 106 is solid-state.After the power consumption of master chip 103 is substantially increased, phase transformation
Material 106 starts fusing, and the latent heat of phase-change material 106 absorbs the heat that master chip 103 is produced, because phase-change material 106 is molten
Temperature relative constancy during change, thus master chip 103 temperature also relative constancy, and the latent heat of the fusing of phase-change material 106 leads to
The hundreds times of Chang Weitong specific heats, can maintain prolonged periods temperature stabilization, and effectively buffering master chip 103 power consumption rising in short-term is drawn
The temperature fluctuation for rising.When master chip 103 is in normal tasks to be processed or be standby, the equipment by being contacted with phase-change material 106
Housing 101 is radiated, and constantly release heat is restored to curdled appearance to phase-change material 106, it is achieved thereby that master chip 103
Short time in radiation processes.
In order to preferably realize the radiating rate of master chip 103, as shown in Figure 10, the heat-radiating substrate 104 has many
Individual heat transmission fin 107, phase-change material 106 is filled between the plurality of heat transmission fin 107, can by the plurality of heat transmission fin 107
To increase the contact area of heat-radiating substrate 104 and phase-change material 106, the speed that phase-change material 106 absorbs heat is accelerated, so that
Accelerate the radiating rate of master chip 103.
Above-mentioned multiple heat transmission fins 107 can be equidistantly arrangement, can so realize being filled between each heat transmission fin 107
Phase-change material 106 amount it is identical so that each several part phase-change material 106 absorb heat it is identical.
Preferably, in order to accelerate the speed that phase-change material 106 absorbs heat, the shape of above-mentioned heat transmission fin 107 can be
Rectangle, cylinder or ripple struction, the heat transmission fin 107 of rectangular configuration as shown in Figure 5 are as shown in Figure 6 cylindrical to lead
The heat transmission fin 107 of hot fin 107 and ripple struction as shown in Figure 7 and Figure 8.The structure of above-mentioned heat transmission fin 107 this practicality
New is only example effect, can freely be set during concrete application.
Further, in order to increase the contact area of phase-change material 106 and heat-radiating substrate 104, above-mentioned heat transmission fin 107
Surface can be carved with texture, so as to increase the contact area of phase-change material 106 and heat-radiating substrate 104.The material of the heat transmission fin 107
Material can be identical with the material of heat-radiating substrate 104, is the good conductor of heat.
Preferably, heat conduction particle can be added in above-mentioned phase-change material 106, there is provided the heat conductivility of phase-change material 106.
In order that obtaining phase-change material 106 has more preferable heat absorption capacity, above-mentioned phase-change material 106 can be lauric acid/dodecanoic acid, stone
One or more materials in wax, hexadecanol it is compound, by adjusting the component ratio of each material, regulation phase-change material 106
Melting temperature so that phase-change material 106 has good heat absorption capacity.
The equipment cooling device that the utility model embodiment is provided, including apparatus casing 101 and positioned at apparatus casing 101
Interior master chip 103, PCB102, heat-radiating substrate 104, master chip 103 is arranged on the PCB102, and the master chip 103
Contacted with heat-radiating substrate 104, heat-radiating substrate 104 is arranged on the inwall of the apparatus casing 101 and heat-radiating substrate 104 and equipment
The inwall of housing 101 forms and phase-change material 106, phase-change material 106 and heat-radiating substrate is filled with closed cavity, closed cavity
104th, apparatus casing 101 is contacted.Contacted with heat sink by phase-change material 106, can caused in the short-term warming of master chip 103
When, fast endothermic so that phase-change material 106 is changed into liquid from solid-state, and is contacted by with apparatus casing 101 so that in main core
Piece 103 is radiated under being in normal tasks or holding state by the apparatus casing 101, so that the phase-change material 106
Solid-state is changed into from liquid, recovers heat absorption capacity.
Although having been described for preferred embodiment of the present utility model, those skilled in the art once know substantially
Creative concept, then can make other change and modification to these embodiments.So, appended claims are intended to be construed to bag
Include preferred embodiment and fall into having altered and changing for the utility model scope.
Obviously, those skilled in the art can carry out various changes and modification without deviating from this practicality to the utility model
New spirit and scope.So, if it is of the present utility model these modification and modification belong to the utility model claim and
Within the scope of its equivalent technologies, then the utility model is also intended to comprising these changes and modification.
Claims (10)
1. a kind of equipment cooling device, it is characterised in that including：Apparatus casing and the main core in the apparatus casing
Piece, printing board PCB, heat-radiating substrate；
The master chip is arranged on the PCB, and the master chip is contacted with heat-radiating substrate；
The heat-radiating substrate be arranged on the inwall of the apparatus casing and the heat-radiating substrate and the apparatus casing inwall
Form closed cavity；
Phase-change material is filled with the closed cavity, in the phase-change material and the heat-radiating substrate, the apparatus casing
Wall is contacted.
2. device as claimed in claim 1, it is characterised in that the inwall of the apparatus casing has groove, the radiating base
Plate covers the groove and forms the closed cavity.
3. device as claimed in claim 1, it is characterised in that the heat-radiating substrate has hollow radiating shell, described to set
The inwall of standby housing forms the closed cavity as the bottom surface of the radiating shell.
4. device as claimed in claim 1, it is characterised in that the heat-radiating substrate has multiple heat transmission fins, the phase transformation
Material is filled between the multiple heat transmission fin.
5. device as claimed in claim 4, it is characterised in that the multiple heat transmission fin is equidistantly arrangement.
6. device as claimed in claim 4, it is characterised in that the heat transmission fin is shaped as rectangle, cylinder or ripple
Structure.
7. device as claimed in claim 4, it is characterised in that be carved with texture in the surface of the heat transmission fin.
8. device as claimed in claim 4, it is characterised in that the material of the heat transmission fin is good conductor.
9. device as claimed in claim 1, it is characterised in that the phase-change material is added with heat conduction particle.
10. the device as described in any one of claim 1 to 9, it is characterised in that the phase-change material is following any materials：
Lauric acid/dodecanoic acid, paraffin, hexadecanol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620808981.7U CN206271692U (en) | 2016-07-27 | 2016-07-27 | A kind of equipment cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620808981.7U CN206271692U (en) | 2016-07-27 | 2016-07-27 | A kind of equipment cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206271692U true CN206271692U (en) | 2017-06-20 |
Family
ID=59035603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620808981.7U Expired - Fee Related CN206271692U (en) | 2016-07-27 | 2016-07-27 | A kind of equipment cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206271692U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107975895A (en) * | 2017-11-07 | 2018-05-01 | 浙江大学 | Composite energy-saving devices and methods therefor based on radiation refrigeration and phase-change accumulation energy |
| CN111651020A (en) * | 2018-05-24 | 2020-09-11 | 华为技术有限公司 | Heat dissipation device, manufacturing method thereof and server |
| WO2021180038A1 (en) * | 2020-03-12 | 2021-09-16 | 中兴通讯股份有限公司 | Heat dissipation tooth piece and preparation method therefor, heat dissipation apparatus and electronic device |
-
2016
- 2016-07-27 CN CN201620808981.7U patent/CN206271692U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107975895A (en) * | 2017-11-07 | 2018-05-01 | 浙江大学 | Composite energy-saving devices and methods therefor based on radiation refrigeration and phase-change accumulation energy |
| CN107975895B (en) * | 2017-11-07 | 2020-10-23 | 浙江大学 | Composite energy-saving device and method based on radiation refrigeration and phase-change energy storage |
| CN111651020A (en) * | 2018-05-24 | 2020-09-11 | 华为技术有限公司 | Heat dissipation device, manufacturing method thereof and server |
| WO2021180038A1 (en) * | 2020-03-12 | 2021-09-16 | 中兴通讯股份有限公司 | Heat dissipation tooth piece and preparation method therefor, heat dissipation apparatus and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170620 Termination date: 20210727 |