CN206271673U - Chip installation device and chip mounting apparatus - Google Patents
Chip installation device and chip mounting apparatus Download PDFInfo
- Publication number
- CN206271673U CN206271673U CN201621377515.4U CN201621377515U CN206271673U CN 206271673 U CN206271673 U CN 206271673U CN 201621377515 U CN201621377515 U CN 201621377515U CN 206271673 U CN206271673 U CN 206271673U
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- CN
- China
- Prior art keywords
- chip
- fixed
- slide rail
- air intake
- intake duct
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- Expired - Fee Related
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Abstract
The utility model is related to chip installation device and the chip mounting apparatus with the chip installation device, the chip installation device is used to be installed on chip the chip base of circuit board, and it includes slide rail, is positioned at the slide rail and the fixed plate relative to the slide rail vertical shift, the first detection means, second detection device and device for suction material.First detection means is used to determine the chip placement locations；Second detection device is used to determine the depth that the chip is placed；Device for suction material is used to draw the chip and the chip is placed on into the chip base；The second detection device includes support and distance measuring sensor, and described support one end is positioned on the slide rail, and the other end extends towards the side surface direction of the device for suction material；The distance measuring sensor is fixed on the other end of the support.The utility model avoids the damage of the excessive chip bottom soldered ball for causing of fixed plate vertical shift amount, improves the quality of repair welds.
Description
Technical field
The utility model is related to circuit board repair device, more particularly to a kind of chip installation device and is provided with the chip
The chip mounting apparatus of erecting device.
Background technology
General bga chip is mounted on chip base, is BGA contact points below chip base；To such BGA cores
, it is necessary to be positioned to chip base when piece is carried out with changing or installing, general positioning method is only in electricity to chip base
Position on the plate of road is detected, without the elevation information of detection chip pedestal, like this, when the chip changed is being placed extremely
When chip base, the damage of chip bottom soldered ball, shadow may be caused because of the error of chip amount of movement on vertical direction
Ring maintenance quality.
Utility model content
The purpose of this utility model is to provide a kind of chip installation device, it is intended to solve in the prior art to repair mainboard
When chip bottom solder ball damage, the maintenance relatively low problem of quality.
What the utility model was realized in：
The utility model provides a kind of chip installation device, its chip base for being used to be installed on chip circuit board.
The chip installation device includes slide rail, is positioned at the slide rail and relative to the fixed plate of the slide rail vertical shift；Also wrap
Include：
First detection means, is fixed on the fixed plate, and first detection means is used to detect the chip base
Position, so that it is determined that the chip placement locations；
Second detection device, is positioned at the slide rail, and the second detection device is used to detect the height of the chip base
Degree, so that it is determined that the depth that the chip is placed；And
Device for suction material, is positioned at a side of the fixed plate, and the device for suction material is used to draw the chip, and root
Be placed on the chip on the chip base by the depth placed according to the placement location of the chip and the chip；
The second detection device includes support and distance measuring sensor, and described support one end is positioned on the slide rail,
The other end extends towards the side surface direction of the device for suction material；The distance measuring sensor is fixed on the other end of the support.
Further, the device for suction material includes：
Air intake duct；
Suction nozzle, the suction nozzle is fixed on the air intake duct, and the suction nozzle is turned on the air intake duct；
Secured adjusted structure, the secured adjusted structure is used to position the position of the air intake duct；
The suction nozzle draws the chip and the chip is placed on the pedestal under the movement of the fixed plate.
Further, first detection means is camera.
Further, the distance measuring sensor is laser range sensor, its model LJ-V7080.
Further, the suction nozzle by the secured adjusted structure positioning in the fixed plate, the secured adjusted
Structure includes：
Cylinder, is fixed in the fixed plate；
Expansion link, described expansion link one end is connected with the cylinder, and expansion link is in vertical direction described in the air cylinder driven
It is upper flexible；
Fixed block, the fixed block is connected with the other end of the expansion link；And
Positioning head, described positioning head one end is fixed with the fixed block, and the other end is horizontal-extending and is set in the air-breathing
The outside of pipe, for being positioned to the air intake duct；
When expansion link described in the air cylinder driven stretches, the air intake duct in the vertical direction movement, so as to adjust described
The installation fixing position of suction nozzle is put.
The utility model additionally provides a kind of chip mounting apparatus, and the chip mounting apparatus include workbench, fixation
Delivery track and above-mentioned chip installation device on workbench, circuit board is positioned on the delivery track, described
Chip installation device is used for chip is attached into the circuit board.
The utility model has the advantages that：
The utility model chip installation device sets the first detection means and second detection device near device for suction material,
Wherein the first detection means is detected to the position of circuit board chip base horizontal plane, and the second detection device is to circuit
The vertical height of board chip pedestal is detected that the chip of absorption is moved to chip base by device for suction material according to horizontal level
Top, fixed plate drives device for suction material vertical shift that the chip of absorption is placed on the chip base according to vertical height.
For traditional mode detected just for chip base horizontal level, it is to avoid fixed plate vertical shift amount mistake
The damage of the big chip bottom soldered ball for causing, improves the quality of repair welds.
Brief description of the drawings
In order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the present utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 structural representation of the utility model chip mounting apparatus；
Fig. 2 is the utility model chip installation device side structure schematic view；
Fig. 3 is the utility model chip installation device dimensional structure diagram；
Fig. 4 is the utility model chip installation device partial structural diagram.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The all other embodiment for being obtained, belongs to the scope of the utility model protection.
Fig. 1 is referred to, the utility model discloses a kind of chip mounting apparatus, the chip mounting apparatus are installed including chip
Device 100, workbench 200 and delivery track 300 are, it is necessary to the circuit board 500 for changing chip is positioned over the delivery track
On 300, the delivery track 300 makes the circuit board 500 move into the chip installation for conveying the circuit board 500
In device 100；Delivery track 300 is installed on the workbench 200.The chip installation device 100 is fixed on the work
Make the top of platform 200, and can in the horizontal plane be moved relative to the workbench 200, so as to the chip that will be changed
It is moved to the top of the circuit board 500.
Fig. 2 and Fig. 3 is referred to, specifically, the chip installation device 100 is used to for chip to be installed on circuit board 500
On chip base, the chip installation device 100 includes slide rail 11, is positioned at the slide rail 11 and is erected relative to the slide rail 11
The dynamic fixed plate 12 of translation.The chip installation device 100 also includes：First detection means 13, second detection device 14 and
Device for suction material 15.First detection means 13 is fixed on the fixed plate 12, and first detection means 13 is used to detect institute
The position of chip base is stated, so that it is determined that the chip placement locations；Second detection device 14 is positioned at the slide rail 11, described
Second detection device 14 is used to detect the height of the chip base, so that it is determined that the depth that the chip is placed；Device for suction material
15 sides for being positioned at the fixed plate 12, the device for suction material 15 is used to draw the chip, and according to the chip
Placement location and the chip place depth the chip is placed on the chip base.The second detection device
14 include support 141 and distance measuring sensor 142, and the one end of the support 141 is positioned on the slide rail 11, and the other end is towards institute
The side surface direction for stating device for suction material 15 extends；The distance measuring sensor 142 is fixed on the other end of the support 141.
In the present embodiment, slide rail 11 itself can be moved in the horizontal plane, realize the positioning of two dimension, and fixed plate 12 is consolidated
It is scheduled on slide rail 11 and relative to the vertical shift of slide rail 11.Fixed plate 12 is moved in perpendicular, and slide rail 11 is in horizontal plane
Interior movement, it is achieved thereby that fixed plate 12 is three-dimensional mobile.
In the present embodiment, the first detection means 13 and second detection device 14 are positioned on slide rail 11, and with cunning
Rail 11 is moved in the horizontal plane, i.e., the first detection means 13 and second detection device 14 are respectively positioned on the top of workbench 200 and hang down
Directly moved in the horizontal plane in circuit board 500.Wherein, chip base position of first detection means 13 to the surface of circuit board 500
Detection, second detection device 14 is detected to the height of the chip base on the surface of circuit board 500 such that it is able to more accurate
Confirm that chip is placed on the position on chip base, be the mobile offer reference of slide rail 11, anti-anti-slip track 11 is moved in the horizontal plane
Dynamic position skew chip base, while when preventing fixed plate 12 to be slided in vertical plane, because the vertical plane of fixed plate 12
Interior amount of movement is excessive, and the soldered ball and the solder joint in chip base for causing chip bottom are extruded energetically, and the damage for causing improves dimension
Repair the quality of replacing.
It is specific in the present embodiment, support 141 by the fixed rack 11 of distance measuring sensor 142, when slide rail 11 is moved to
When on chip base, support 141 drives distance measuring sensor 142 to be moved to chip base top, and distance measuring sensor 142 is by detection
The vertical height information of chip base, so as to judge the height of chip base.Wherein, height of the slide rail 11 according to chip base
Control fixed plate 12 drives the vertical shift of device for suction material 15, so as to prevent device for suction material 15 in the excessive amount of movement pair of vertical direction
The collision of chip bottom soldered ball, reduces the situation of wafer damage.
Further, first detection means 13 is camera.In the present embodiment, camera is to circuit board 500
Take pictures, according to the position of circuit board 500 in the photo taken pictures, and in photo, the position of the chip base of circuit board 500 determines
Current circuit board 500 relative to the device for suction material 15 position, so as to be the amount of moving horizontally of the movement of the device for suction material 15
Reference is provided, device for suction material 15 is accurately moved to directly over the chip base.
Further, the distance measuring sensor 142 is laser range sensor 142, its model LJ-V7080.
In the present embodiment, the laser range sensor 142 of LJ-V7080 models has two laser probes, and two are swashed
There is angle, the height to chip base is detected respectively between light probe, and contrasted according to the data of detection
Afterwards, the specific elevation information of chip base is confirmed, accuracy is higher.
Fig. 4 is referred to, further, the device for suction material 15 includes：Air intake duct 151, suction nozzle 152 and secured adjusted knot
Structure 153.Specifically, suction nozzle 152 is fixed on the air intake duct 151, the suction nozzle 152 is turned on the air intake duct 151；It is fixed to adjust
Nodule structure 153 is used to position the position of the air intake duct 151；Suction nozzle 152 draws the chip and in the fixed plate
The chip is placed on the pedestal under 12 movement.
In the present embodiment, air intake duct 151 is connected with air extractor, suction nozzle 152 in absorption chip, in suction nozzle 152
There is negative pressure in mouth, so as to chip be adsorbed.By way of gas negative pressure adsorbs chip, captured relative to traditional mechanical arm
Mode, it is not easy to damage chip.
In the present embodiment, secured adjusted structure 153 is mainly used in positioning air intake duct 151 and fixed, prevents
During fixed plate 12 is slided, particularly during suction nozzle 152 adsorbs chip or chip placement, air intake duct 151 is shaken,
So as to the problem for causing chip placement locations inaccurate or chip absorption fails.
Further, the suction nozzle 152 is positioned in the fixed plate 12 by the secured adjusted structure 153, described
Secured adjusted structure 153 includes：Cylinder 1531, expansion link 1532, fixed block 1533 and gland 1534.Cylinder 1531 is fixed
In in the fixed plate 12；The one end of expansion link 1532 is connected with the cylinder 1531, and the cylinder 1531 drives the expansion link
1532 in the vertical directions stretch；Fixed block 1533 is connected with the other end of the expansion link 1532；Positioning head one end with it is described
Fixed block 1533 is fixed, and the other end is horizontal-extending and is set in the outside of the air intake duct 151, for the air intake duct 151
Positioning；When cylinder 1531 drives the expansion link 1532 to stretch, the in the vertical direction of the air intake duct 151 movement, so as to adjust
The installation fixing position of the suction nozzle 152 is put.
In the present embodiment, air intake duct 151 is fixed on positioning head, and positioning head is positioned to air intake duct 151, prevents air-breathing
Pipe 151 is shaken, meanwhile, fixed block 1533 is fixed with positioning head, and when cylinder 1531 is moved, expansion link 1532 drives fixed block 1533
Mobile, fixed block 1533 adjusts the height of air intake duct 151 so as to drive positioning head to be slided relative on the vertical direction of slide rail 11.
Wherein, cylinder 1531 can adjust the height of air intake duct 151 when driving expansion link 1532 to move, so as to adjust suction nozzle 152 consolidate
Dingan County's holding position.
Preferred embodiment of the present utility model is these are only, is not used to limit the utility model, it is all in this practicality
Within new spirit and principle, any modification, equivalent substitution and improvements made etc. should be included in guarantor of the present utility model
Within the scope of shield.
Claims (6)
1. a kind of chip installation device, the chip base for chip to be installed on circuit board, the chip installation device bag
Slide rail is included, the slide rail is positioned at and relative to the fixed plate of the slide rail vertical shift, it is characterised in that the chip is installed
Device also includes：
First detection means, is fixed on the fixed plate, and first detection means is used to detect the position of the chip base,
So that it is determined that the chip placement locations；
Second detection device, is positioned at the slide rail, and the second detection device is used to detect the height of the chip base, from
And determine the depth that the chip is placed；And
Device for suction material, is positioned at a side of the fixed plate, and the device for suction material is used to draw the chip, and according to institute
Be placed on the chip on the chip base by the depth for stating placement location and the chip placement of chip；
The second detection device includes support and distance measuring sensor, and described support one end is positioned on the slide rail, another
The side surface direction towards the device for suction material is held to extend；The distance measuring sensor is fixed on the other end of the support.
2. chip installation device according to claim 1, it is characterised in that the device for suction material includes：
Air intake duct；
Suction nozzle, the suction nozzle is fixed on the air intake duct, and the suction nozzle is turned on the air intake duct；
Secured adjusted structure, the secured adjusted structure is used to position the position of the air intake duct；
The suction nozzle draws the chip and the chip is placed on the pedestal under the movement of the fixed plate.
3. chip installation device according to claim 1, it is characterised in that first detection means is camera.
4. chip installation device according to claim 1, it is characterised in that the distance measuring sensor is laser ranging sensing
Device, its model LJ-V7080.
5. chip installation device according to claim 2, it is characterised in that the suction nozzle is by the secured adjusted structure
It is positioned in the fixed plate, the secured adjusted structure includes：
Cylinder, is fixed in the fixed plate；
Expansion link, described expansion link one end is connected with the cylinder, and expansion link in the vertical direction is stretched described in the air cylinder driven
Contracting；
Fixed block, the fixed block is connected with the other end of the expansion link；And
Positioning head, described positioning head one end is fixed with the fixed block, and the other end is horizontal-extending and is set in the air intake duct
Outside, for being positioned to the air intake duct；
When expansion link described in the air cylinder driven stretches, the air intake duct in the vertical direction movement, so as to adjust the suction nozzle
Installation fixing position put.
6. a kind of chip mounting apparatus, it is characterised in that including workbench, the delivery track being fixed on workbench and
Chip installation device described in claim 1 to 5 any one, circuit board is positioned on the delivery track, the chip peace
Assembling device is used to for chip to be attached to the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621377515.4U CN206271673U (en) | 2016-12-15 | 2016-12-15 | Chip installation device and chip mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621377515.4U CN206271673U (en) | 2016-12-15 | 2016-12-15 | Chip installation device and chip mounting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206271673U true CN206271673U (en) | 2017-06-20 |
Family
ID=59045661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621377515.4U Expired - Fee Related CN206271673U (en) | 2016-12-15 | 2016-12-15 | Chip installation device and chip mounting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206271673U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116007686A (en) * | 2023-03-28 | 2023-04-25 | 四川华鲲振宇智能科技有限责任公司 | AI processing chip quality monitoring method, equipment and system |
-
2016
- 2016-12-15 CN CN201621377515.4U patent/CN206271673U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116007686A (en) * | 2023-03-28 | 2023-04-25 | 四川华鲲振宇智能科技有限责任公司 | AI processing chip quality monitoring method, equipment and system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170620 Termination date: 20181215 |